Intel has reportedly delayed the launch of its next-generation Core Ultra 200K series "Arrow Lake-S" desktop processors by a week. Originally slated for an October 17, 2024 launch, these chips are now releasing on October 24, according to HKEPC. There's no reason cited for the delay, it probably has to do with retailer stocking. The delay isn't significant. The Core Ultra 200K introduce a new CPU socket, the LGA1851, which means these chips need to launch alongside new motherboards based on the Intel 800-series.

The initial wave of processors is expected to include only SKUs targeting overclockers and enthusiasts. These include the Core Ultra 9 285K (8P+16E), the Core Ultra 7 265K (8P+12E), and the Core Ultra 5 245K (6P+8E), and their "KF" variants that lack integrated graphics. It's also expected that the first wave of compatible motherboards will only come with the premium Intel Z890 chipset, which supports CPU overclocking. Intel will likely expand its processor model selection, along with more affordable chipsets, such as the B860, around the 2025 International CES.

Intel may have debuted its Hybrid (heterogeneous multicore) architecture for the desktop with the 12th Gen Core "Alder Lake-S," but the value-ended Core i3 series SKUs throughout the 12th, 13th, and 14th Gen Core processors have remained 4-core/8-thread traditional multicore chips, with just four P-cores. Intel is about to change this with the Core Ultra 200 series "Arrow Lake-S." According to OneRaichu, a reliable source with Intel leaks, the company is giving finishing touches to a pair of Core Ultra 3 series desktop processor SKUs based on the "Arrow Lake" microarchitecture. These will be 8-core chips, a doubling in core-count form the past generations, but the nature of these 8 cores is not yet known.

Among the SKUs in the leak are the Core Ultra 3 205, and the Core Ultra 3 215, both of which are 8-core chips. The two are probably differentiated in a similar manner to past generations of Intel Core i3 desktop did, using cache sizes (eg: Core i3-10100 and i3-10300). The chips probably feature a 4P+4E core configuration, as a "2P+6E" configuration might not be possible, as the E-core clusters are indivisible, although we don't know if the same rule applies to the "Skymont" E-core clusters. The dedicated L2 caches of both the P-cores and E-core clusters could be smaller than on Core Ultra 5 and above SKUs. The Core Ultra 200V "Lunar Lake" processor uses "Lion Cove" P-cores with 2.5 MB of L2 cache per core, while the Core Ultra 9 285K probably has "Lion Cove" P-cores with 3 MB of L2 cache per core.

With AMD having launched its new processor generation, all eyes are now on the Core Ultra 200 series "Arrow Lake." We finally have some idea about its launch date, thanks to a leak by Benchlife.info. Apparently, Intel is launching the Core Ultra 200 "Arrow Lake-S" series processor family on October 10, 2024. At this point it's not known if this will be a low-key media event, or a completely online launch, since Intel has pulled the plug on the Innovation 2024 event, which would have been the launchpad for these processors. The October 10 date aligns with past rumors that pointed to a Q4-2024 launch for at least the -K and -KF desktop processor SKUs targeting PC enthusiasts and gamers; with the series putting on bulk in 2025. We've gone into the probable SKUs Intel will launch in its first wave in our older article, here.

Intel is preparing at least twelve Core Ultra 200-series "Arrow Lake-S" desktop processor SKUs for the consumer segment, with more variants possible for the commercial desktop segment in the future. Q4 2024 could see the company debut its first SKUs targeting the PC enthusiast and gamer crowd with as many as five unlocked K or KF series SKUs. These, and finer details such as clock speeds, were revealed in a massive info dump by Jaykihn, a reliable source with Intel leaks. Intel is expected to debut the series later this year with the Core Ultra 9 285K, the Core Ultra 7 265K and 265KF; and the Core Ultra 5 245K and 245KF. The company is skipping a KF SKU for its top Core Ultra 9 part.

As has been consistent for several past generations of Intel processors, the top Core Ultra 9 (formerly Core i9) tier gets Thermal Velocity Boost, Turbo Boost Max 3.0, and classic Turbo Boost 2.0. The 285K maxes out the "Arrow Lake-S" B0 silicon, enabling all 8 "Lion Cove" P-cores, and all 16 "Skymont" E-cores. It comes with a P-core base frequency of 3.70 GHz, and an impressive 3.20 GHz E-core base frequency. The maximum P-core boost frequency achievable for up to two cores is 5.70 GHz, and 3-6 as well as 7-8 cores boost up to 5.40 GHz, making it the all-P-core boost frequency for this chip. The four E-core clusters are assured an all-E-core boost frequency of 4.60 GHz. The iGPU has 64 execution units, and ticks at up to 2.00 GHz.

Intel Core Ultra "Arrow Lake-S" desktop processors are expected to debut later this year, and introduce the new Lion Cove P-cores, along with Skymont E-cores to the desktop platform. Engineering samples and qualification samples with specs close to retail chips seem to already be in the hands of PC OEMs and motherboard vendors, given the volume of leaks over the past few days. Jaykihn0, one of the more influential sources of these leaks, revealed a few interesting details of the maximum boost frequencies of these chips.

The QS of a top Core Ultra 9 "Arrow Lake-S" SKU, probably the flagship model that succeeds the current Core i9-14900K, is described as having a maximum P-core boost frequency of 5.70 GHz, and an all-P-core boost frequency of 5.40 GHz. The maximum E-core boost frequency, which is also the all-E-core boost frequency, is said to be 4.60 GHz. Let's unpack this. "Arrow Lake" uses the same mix of "Lion Cove" P-cores and "Skymont" E-cores as "Lunar Lake," albeit arranged along a ringbus, and sharing an L3 cache, unlike on "Lunar Lake," where the P-cores have their own exclusive L3 cache, and the E-cores are arranged in a low-power island, with the fabric of the SoC tile connecting the two.

A CPU-Z screenshot of an alleged Intel Core Ultra 9 285K "Arrow Lake-S" desktop processor engineering sample is doing rounds on social media, thanks to wxnod. CPU-Z identifies the chip with an Intel Core Ultra case badge with the deep shade of blue associated with the Core Ultra 9 brand extension, which hints at this being the top Core Ultra 9 285K processor model, we know it's the "K" or "KF" SKU looking at its processor base power reading of 125 W. The chip is built in the upcoming Intel Socket LGA1851. CPU-Z displays the process node as 7 nm, which corresponds with the Intel 4 foundry node.

Intel is using the same Intel 4 foundry node for "Arrow Lake-S" as the compute tile of its "Meteor Lake" processor. Intel 4 offers power efficiency and performance comparable to 4 nm nodes from TSMC, although it is physically a 7 nm node. Likewise, the Intel 3 node is physically 5 nm. If you recall, the main logic tile of "Lunar Lake" is being built on the TSMC N3P (3 nm) node. This means that Intel is really gunning for performance/Watt with "Lunar Lake," to get as close to the Apple M3 Pro as possible.

A picture of a bare PCB of an upcoming GIGABYTE Z890 AORUS Pro Ice motherboard confirms that Intel will use the Core Ultra branding for its next-generation desktop processors based on the "Arrow Lake-S" microarchitecture. The picture reveals the CPU socket area, where the Socket LGA1851 will be installed, besides the CPU VRM component, the BIOS ROM, and the DDR5 DIMM slots, among other minor components. Although incompatible with LGA1700, the new LGA1851 socket has an identical cooler mount layout to it, and retains cooler compatibility, much like LGA1200 did with LGA1151. The AORUS Pro Ice comes with four DDR5 DIMM slots, as that's the only memory standard supported by "Arrow Lake" (no DDR4 support); and the CPU VRM solution uses DrMOS.

Our older article details the I/O aspects of "Arrow Lake-S." It is almost identical to the LGA1700, except it has four additional PCIe Gen 5 lanes from the CPU, for a total of 20 Gen 5 lanes, and 12 Gen 4 lanes. All Z890 motherboards will come with an M.2 Gen 5 NVMe slot that doesn't eat into the PCI-Express 5.0 x16 PEG slot's bandwidth; and an additional Gen 4 x4 that can either be wired out as an M.2 slot, or be used to drive bandwidth-hungry onboard devices, such as discrete Thunderbolt 4 or USB4 controllers. The chipset bus continues to be DMI 4.0 x8, or 128 Gbps per direction.

Intel is preparing a complete refresh of its desktop platform this year, with the introduction of the Core Ultra 200 series processors based on the "Arrow Lake" microarchitecture. The company skipped a desktop processor based on "Meteor Lake," probably because it didn't meet the desired multithreaded performance targets for Intel as it maxed out at 6P+8E+2LP, forcing Intel to come up with the 14th Gen Core "Raptor Lake Refresh" generation to see it through 2H-2023 and at least three quarters of 2024. The company, in all likelihood, will launch the new "Arrow Lake-S" Core Ultra 200 series toward late-Q3 or early-Q4 2024 (September-October). The first wave will include the overclocker-friendly K- and KF SKUs, alongside motherboards based on the top Intel Z890 chipset. 2025 will see the series ramp to more affordable processor models, and mainstream chipsets, such as the B860. These processors require a new motherboard, as Intel is introducing the new Socket LGA1851 with them.

Core configurations of the "Arrow Lake-S" chip surfaced on the web thanks to Jaykihn, a reliable source with Intel leaks. In its maximum configuration, the chip is confirmed to feature 8 P-cores, and 16 E-cores. There are no low-power island E-cores. Each of the 8 P-cores is a "Lion Cove" featuring 3 MB of dedicated L2 cache; while each the E-cores are "Skymont," arranged in 4-core modules that share 4 MB L2 caches among them. Intel claims that the "Lion Cove" P-core offers a 14% IPC increase over the "Redwood Cove" P-core powering "Meteor Lake," which in turn had either equal or a 1% IPC regression compared to "Raptor Cove." This would put "Lion Cove" at a 13-14% IPC advantage over the "Raptor Cove" cores. It's important to note here, that the "Lion Cove" P-cores lack HyperThreading, so Intel will be banking heavily on the "Skymont" E-cores to shore up generational multithreaded performance increase. "Skymont" was a show-stopper at Intel's Computex event, with a nearly 50% IPC gain over previous generations of Intel E-cores, which puts it at par with the "Raptor Cove" cores in single-thread performance.

An unnamed Intel Core Ultra "Arrow Lake-S" desktop processor engineering sample (ES) made it to the hands of someone willing to post its CPU-Z Bench screenshot. The processor allegedly scores a whopping 1143.2 points in the CPU-Bench single-thread benchmark; and 12922.4 points in the multithreaded benchmark. When compared with the internal Intel Core i9-13900K reference scores of CPU-Z, the single-thread benchmark score is a staggering 26.71% increase over that of the i9-13900K (902 points); while the multithreaded score is 22% lower.

Since we don't know which processor model this "Arrow Lake-S" ES is, we have no way of telling if it is the top SKU with its rumored 8P+16E core configuration, or a mid-tier Core i5 SKU with the expected 6P+8E configuration. The single-threaded test only loads one P-core, and here the IPC of one of the chip's "Lion Cove" P-cores is able to trounce one of the "Raptor Cove" P-cores of the i9-13900K reference score. You also have to understand that the Hyper-Threading plays no role in this thread. Where it could play a role is the multithreaded test. "Lion Cove" lacks HTT support unlike "Raptor Cove," and the i9-13900K is a 24-core/32-thread processor. It's important to note here, that "Arrow Lake" doesn't just have up to 8 "Lion Cove" P-cores, but also up to 16 "Skymont" E-cores that Intel claims to have achieved a massive IPC gain over its predecessor, bringing its IPC in the league of past-generation P-cores such as the "Raptor Cove" or "Golden Cove."

Intel's first three generations of client processors implementing hybrid CPU cores, namely "Alder Lake," "Raptor Lake," and "Meteor Lake," have them arranged along a ringbus, sharing an L3 cache. This usually sees the larger P-cores to one region of the die, and the E-core clusters to the other region. From the perspective of the bidirectional ringbus, the ring-stops would follow the order: one half of the P-cores, one half of the E-core clusters, iGPU, the other half of E-cores, the other half of the P-cores, and the Uncore, as shown in the "Raptor Lake" die-shot, below. Intel plans to rearrange the P-cores and E-core clusters in "Arrow Lake-S."

With "Arrow Lake," Intel plans to disperse the E-core clusters between the P-cores. This would see a P-core followed by an E-core cluster, followed by two P-cores, and then another E-core cluster, then a lone P-core, and a repeat of this pattern. Kepler_L2 illustrated what "Raptor Lake" would have looked like, had Intel applied this arrangement on it. Dispersing the E-core clusters among the P-cores has two possible advantages. For one, the average latency between a P-core ring-stop and an E-core cluster ring-stop would reduce; and secondly, there will also be certain thermal advantages, particularly when gaming, as it reduces the concentration of heat in a region of the die.

Intel's upcoming Core Ultra "Arrow Lake-S" desktop processor introduces a new socket, the LGA1851, alongside the new Intel 800-series desktop chipset. We now have some idea what the 151 additional pins on the new socket are used for, thanks to a leaked platform map on the ChipHell forums, discovered by HXL. Intel is expanding the number of PCIe lanes from the processor. It now puts out a total of 32 PCIe lanes.

From the 32 PCIe lanes put out by the "Arrow Lake-S" processor's system agent, 16 are meant for the PCI-Express 5.0 x16 PEG slot to be used for discrete graphics. Eight are used as chipset bus, technically DMI 4.0 x8 (these are eight lanes that operate at Gen 4 speed for 128 Gbps per direction of bandwidth). There are now not one, but two CPU-attached M.2 NVMe slots possible, just like on the AMD "Raphael" and "Granite Ridge" processors. What's interesting, though, is that not both are Gen 5. One of these is Gen 5 x4, while the other is Gen 4 x4.

As Intel gears for the launch of Lunar Lake and Arrow Lake processors, the company appears to be preparing a new line of high-performance processors for gaming laptops. Recent developments suggest that the company is adapting its desktop-grade Arrow Lake-S chips for use in ultra-high-performance notebooks. The buzz began when X user @InstLatX64 spotted Intel testing a peculiar motherboard labeled "Arrow Lake Client Platform/ARL-S BGA SODIMM 2DPC." This discovery hints at the possibility of Intel packing up to 24 cores into laptop processors, eight more cores compared to the 16 cores expected in standard Arrow Lake-H mobile chips. By utilizing the full potential of Arrow Lake-S silicon in a mobile form factor, Intel aims to deliver desktop-class performance to high-end notebooks in a BGA laptop CPU.

The leaked chip would likely feature eight high-performance Lion Cove P-cores and 16 energy-efficient Skymont E-cores, along with an integrated Xe2 GPU. This configuration could provide the raw power needed for demanding games and professional applications in a portable package. However, implementing such powerful hardware in laptops presents challenges. The processors are expected to have a TDP of 45 W or 55 W, with actual power consumption potentially exceeding these figures to maintain high clock speeds. Success will depend not only on Intel's chip design but also on the cooling solutions and power delivery systems developed by laptop manufacturers. As of now, specific details about clock speeds and performance metrics remain under wraps. The test chip that surfaced showed a base frequency of 3.0 GHz, notably without AVX-512 support.

Intel, in its Computex 2024 event unveiled its Core Ultra 300 "Lunar Lake" processor, along with a Q3 2024 date for the processors. It now turns out that the processors won't arrive until Fall 2024, specifically September, when the various notebook OEMs will merely announce their products based on the chips, followed by market availability of these notebooks through Holiday 2024, according to a DigiTimes report. The report also says that Intel's Core Ultra "Arrow Lake-S" desktop processors could see an October 2024 announcement and availability for at least the Unlocked K- and KF SKUs, along with compatible Socket LGA1851 motherboards based on the top Intel Z890 chipset.

The DigiTimes report invited a clarification from Intel through Digital Trends. The company in a statement reaffirmed that the chips will be available "starting in Q3 2024, as noted at Computex." This statement aligns with the timeline that the company would commence shipments of "Lunar Lake" processors to OEMs starting in June, followed by product announcements and market availability in the following months.

AMD's upcoming Ryzen 9000 "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture won't beat the Ryzen 7000X3D series at gaming workloads, said Donny Woligroski, the company's senior technical marketing manager, in an interview with Tom's Hardware. The new "Zen 5" chips, such as the Ryzen 7 9700X and Ryzen 9 9950X, will come close to the gaming performance of the 7800X3D and 7950X3D, but won't quite beat it. The new processors, however, will offer significant generational performance uplifts in productivity workloads, particularly multithreaded workloads that use vector extensions such as VNNI and AVX512. The Ryzen 7 7800X3D remains the fastest gaming desktop processor you can buy, it edges out even Intel's Core i9-14900KS, in our testing.

Given this, we expect the gaming performance of processors like the Ryzen 7 9700X and Ryzen 9 9950X to end up closer to those of the Intel Core i9-13900K or i9-14900K. Gamers with a 7000X3D series chip or even a 14th Gen Core i7 or Core i9 chip don't have much to look forward to. AMD confirmed that it's already working on a Ryzen 9000X3D series—that's "Zen 5" with 3D V-cache technology, and is sounds confident of holding on to the title of having the fastest gaming processors. This doesn't seem implausible.

ASRock at the 2024 Computex presented a massive lineup of gaming and overclocking motherboards based on the Intel Z890 chipset. The company is not allowed to use the term "Z890," and refers to it as "next-gen Intel," but for convenience's sake, we will use Z890 in this article. Z890 is the highest tier desktop chipset for Socket LGA1851, which will power the Core Ultra "Arrow Lake-S" desktop processors that launch in Q4 2024. With the Z890 generation, ASRock stratified its coveted Taichi brand of high-end motherboards further up, clubbing its enthusiast-grade OC Formula brand along with it.

There are now Taichi OCF motherboards with either 1-DIMM per channel memory configurations (best dual-channel topology for memory overclocking), or with a new CAMM2 slot. There's also a mainline Taichi Lite, which is a no-frills variant with less bling, and essential high-end features such as a strong VRM and good onboard audio; and there's also the new Taichi Aqua, targeting the creator crowd, with its liquid-cooled VRM+SSD heatsink setup.

At the BIOSTAR booth at Computex, we found two new Intel Socket LGA1851 motherboards built around the Intel Z890 chipset, both ready to receive the new Core Ultra "Arrow Lake-S" processors. The two motherboards in question are the Z890 Valkyrie and Z890A-Silver. They use the ATX form factor (305 x 244 mm) and have 4x DDR5 slots, DP, HDMI, and SATA 3 connectors. Both motherboards use the same Realtek ALC 1220 7.1 channels HD for audio and come equipped with 1x 12 V RGB and 4x 5 V ARGB LED headers.

BIOSTAR Z890 Valkyrie sports 23 phases VRD, features 3x PCIe 5.0 x16 slots, USB 4 40 Gbps ports, 6x M.2 (M Key), 1x PCIe Gen 5 and 5x PCIe Gen 4 slots, and also dual Realtek 5 GbE + 2.5 GbE LAN ports. The slightly more common model, Z890A-Silver features 15 phases VRD, 1x PCIe 5.0 x16, 1 (x4) PCIe 4.0 x16, and 2x PCIe x1 slots, plenty of USB 3.2 Gen 2, Gen 1, and USB 2.0 ports but no USB 4. Also on the connectivity side, it has a single Realtek 2.5 GbE port.

Intel Socket LGA1851 will be the new infrastructure driving at least the next two generations of Intel desktop processors, and the new Core Ultra "Arrow Lake-S" will be the first processor generation to use it. These chips pack new "Lion Cove" P-cores, "Skymont" E-cores, an updated PCIe Gen 5 I/O, and new Xe2 "Battlemage" integrated graphics; with generational performance leaps to be had. At the ASUS Computex 2024 booth, we spotted some of the company's first high-end gaming PC motherboards for the platform, based on what could be the Intel Z890 chipset.

Our first find is the ROG Maximus Z890 Hero, or at least a variant of it featuring the ASUS BTF backside I/O connectivity. There will be a regular variant with conventional front-facing I/O, too. The LGA1851 socket looks almost identical to the LGA1700. In fact the two have the same physical dimensions, and are cooler compatible—your LGA1700-compatible coolers will work on LGA1851 motherboards. Intel added to the pin-count by tweaking the pin pitch, and reducing the size of the "courtyard" (the central void in the land grid meant for SMDs). LGA1851 is a pure-DDR5 platform, and has more PCIe Gen 5 connectivity than LGA1700, such as CPU-attached Gen 5 NVMe slots that don't subtract lanes from the x16 PEG slot. The ROG Maximus Hero appears to be a feature-packed motherboard geared for CPU overclocking, as well as connectivity galore. It also comes with Thunderbolt 4, Wi-Fi 7, USB4, 5 GbE, and next-generation SupremeFX onboard audio.

GIGABYTE in its Computex 2027 booth showcased a huge lineup of next-generation Socket LGA1851 motherboards based on the top Intel Z890 chipset, which are ready for Intel's Core Ultra "Arrow Lake-S" desktop processors. GIGABYTE has taped out the motherboard model names, so all mentions of Z890 in this article are based on our assumption that it's the name of the next-gen Intel chipset. These chips are expected to bring generational IPC increases from their "Lion Cove" P-cores, "Skymont" E-cores, a more complete PCIe Gen 5 I/O (including for the CPU-attached NVMe slots), and other innovations. If the socket looks similar to the LGA1700, it's because it's identical in physical dimensions, and you can use your LGA1700 cooler on the LGA1851, but the processors are not inter-compatible. The company also showcased a few AMD Socket AM5 motherboards based on the new AMD X870E chipset.

The first motherboard to catch our eye is the Z890 AORUS Tachyon. This board is geared for record-seeking CPU overclocking. The processor is wired to just two DDR5 memory slots (1 DIMM per channel, the best configuration for memory OC); and the CPU-attached NVMe slots being close to the socket, with a combined heatsink. The only expansion slots are a PCI-Express 5.0 x16, and what could be a Gen 4 x8. There are plenty of overclocker-friendly controls, voltage measurement points, diagnostic LEDs, and status displays, scattered all over the board.

We've known for a while that the Z890 will be Intel's next-generation high-end desktop motherboard chipset for the Core Ultra "Arrow Lake-S" desktop processors in the LGA1851 package, and that Intel's first wave of processors and motherboards will target PC enthusiasts like they usually do—with just the unlocked K/KF processor SKUs and motherboards based on the Z890. We are now learning that the B860 will indeed be the company's mid-tier chipset for the processor. MSI has registered at least four motherboard models based on the B860, which showed up on Device Report.

These four motherboard models are the MPG B860M Edge Ti WiFi, the MPG B860I Edge WiFi, the MAG B860 Tomahawk WiFi, and the MAG B860M Mortar WiFi, with MSI internal product numbers 7E38, 7E39, 7E40, and 7E43, respectively. There's no word on whether B860 will even be available when the processors debut. Going by past trends, the mid-tier chipset and 65 W-class processor SKUs usually come out in the Q1 following a new processor generation launch, which means we could see these sometime early-2025. The B860 will lack CPU overclocking capabilities, and probably feature a narrower chipset bus, and fewer PCIe general purpose lanes than the Z890. As for MSI's Z890 motherboard lineup, there are at least eight models recorded—the MEG Z890 GODLIKE, the MEG Z890 Ace, MEG Z890 Unify-X, MPG Z890 Carbon WiFi, MPG Z890 Edge Ti WiFi, MPG Z890I Edge Ti WiFi, MAG Z890 Tomahawk WiFi, and the PRO Z890-P WiFi.

Intel is giving its next-generation desktop processor lineup the Core Ultra 200 series processor model numbering. We detailed the processor numbering in our older report. The Core Ultra 200 series would be the company's first desktop processors with AI capabilities thanks to an integrated 50 TOPS-class NPU. At the heart of these processors is the "Arrow Lake" microarchitecture. Its development is the reason the company had to refresh "Raptor Lake" to cover its 2023-24 processor lineup. The company's "Meteor Lake" microarchitecture topped off at CPU core counts of 6P+8E, which would have proven to be a generational regression in multithreaded application performance over "Raptor Lake." The new "Arrow Lake-S" desktop processor has a maximum CPU core configuration of 8P+16E, which means consumers can expect at least the same core-counts at given price-points to carry over.

According to a report by Chinese tech publication Benchlife.info, the introduction of "Arrow Lake" would see Intel's desktop processor model numbering align with that of its mobile processor numbering, and incorporate the Core Ultra brand to denote the latest microarchitecture for a given processor generation. Since "Arrow Lake" is a generation ahead of "Meteor Lake," processor models in the series get numbered under Core Ultra 200 series.

Hardware leaker Raichu, known for accurately predicting Intel's moves, has unveiled intriguing details about the company's forthcoming desktop CPU lineup. According to the leaks, Intel is supposed to introduce a big shift in its desktop CPU naming convention with the arrival of the Core Ultra 200 series, codenamed Arrow Lake-S. This next-generation lineup promises to deliver one of the most significant performance leaps for desktop processors in recent years, marking a substantial departure from Intel's current naming strategy—a change that hasn't been witnessed in over a decade. The Core Ultra 200 series is expected to encompass a diverse range of tiers and variants, catering to various user needs. This includes the overclockable K models for enthusiasts, F variants without integrated graphics, and potentially low-power T models for energy-efficient SKUs. According to Raichu's leaks, the unlocked K-Series models are rumored to include the high-end Core Ultra 9 285K, the mid-range Core Ultra 7 265K, and the budget-friendly Core Ultra 5 245K. While the absence of a 290K part has raised eyebrows, these names resemble Intel's mobile CPU naming conventions.

To enjoy the Core Ultra 200 series, users will need to upgrade to new motherboards featuring the 800-series chipsets and the LGA-1851 socket. Unlike the Core Ultra 200V Lunar Lake models for mobile devices, details about the desktop version have remained scarce, shrouding the impending launch in an air of mystery. While Raichu's leaks carry significant weight, it's essential to approach such information cautiously. There's a possibility that SKUs like the 290K may still be introduced, as a new KS version, aligning with Intel's traditional naming conventions. The Core Ultra 200 series promises to cater to a wide range of desktop users, from the performance-hungry enthusiasts eyeing the Core Ultra 9 285K to budget-conscious consumers seeking the value proposition of the Core Ultra 5 245K. The Core Ultra 7 265K is expected to strike a balance between performance and affordability, targeting the mid-range segment. As more leaks and official information surface, we will continue to provide updates on this release from Intel.

Intel is rumored to be preparing to tease its Core Ultra 2-series "Arrow Lake" processor at the 2024 Computex, which gets underway this June. The series itself isn't expected to launch before Q4-2024, but Computex is the only major global event between June and January for Intel to unveil or tease its next-generation processor, so here we are. At this point we don't know which exact platform of "Arrow Lake" Intel is planning to tease—whether these are the mobile variants, or the Socket LGA1851 desktop "Arrow Lake-S." An unveiling of the latter would almost definitely entail PC motherboard vendors being allowed to show off their first compatible motherboards at Computex—the perfect platform for them to do so.

The Core Ultra "Arrow Lake" retains a Foveros Tiled (chiplet) construction of "Meteor Lake," but with advancements to the chip's Compute tile, which is built on the Intel 20A foundry node, and rocks new "Lion Cove" P-cores and "Skymont" E-cores; an updated I/O tile, and an iGPU based on the updated Xe-LPG+ graphics architecture. Since the processor now serves practically all PCH functions, the mobile "Arrow Lake" is a single-chip solution, whereas the desktop "Arrow Lake-S" is expected to remain 2-chip. There will be more I/O from the CPU, though, which is why the socket has 151 more pins than the LGA1700.

Over the weekend, there have been a series of leaks from sources such as Golden Pig Upgrade, and High Yield YT, surrounding Intel's next-generation desktop processor, the Core Ultra 2-series "Arrow Lake-S." The lineup is likely to continue the new client processor naming scheme Intel introduced with the Core Ultra 1-series "Meteor Lake" on the mobile platform. "Arrow Lake-S" is rumored to debut the new Socket LGA1851, which retains cooler-compatibility with LGA1700. Although Intel has nucleated all I/O functions of the traditional PCH to "Meteor Lake," making it a single-chip solution on the mobile platform; and although the mobile "Arrow Lake" will continue to be single-chip; the desktop "Arrow Lake-S" will be a 2-chip solution. This is mainly because the desktop platform demands a lot more PCIe lanes, for a larger number of NVMe storage devices, or high bandwidth devices such as Thunderbolt and USB4 hubs, etc.

Another key finding in this latest series of leaks, is that unlike "Meteor Lake," the desktop "Arrow Lake-S" will do away with low-power island E-cores located in the SoC tile of the processor. All CPU cores are located in the Compute tile, which is expected to be built in the Intel 20A foundry node—the company's first node to implement GAAFETs (nanosheets), with backside power delivery; as well as an advanced 2nd generation EUV lithography. Intel's 1st Gen EUV is used on the current FinFET-based Intel 4 and Intel 3 foundry nodes.

Toward the end of 2024, Intel will update its client processor product stack with the introduction of the new "Arrow Lake" microarchitecture targeting both the desktop and mobile segments. On the desktop side of things, this will herald the new Socket LGA1851 with more SoC connectivity being shifted to the processor; and on the mobile side of things, there will be a much-needed increase in CPU core counts form the current 6P+8E+2LP. This low maximum core-count for "Meteor Lake" is the reason why Intel couldn't debut it on the desktop platform, and couldn't use it to power enthusiast HX-segment mobile processors, either—it had to tap into "Raptor Lake Refresh," and use the older 14th Gen Core nomenclature one last time.

All hopes are now pinned on "Arrow Lake," which could make up Intel's second Core Ultra mobile lineup; its first desktop Core Ultra, and possibly push "Meteor Lake" to the non-Ultra tier. "Arrow Lake" carries forward the Xe-LPG graphics architecture for the iGPU that Intel debuted with "Meteor Lake," but there's a key difference between the desktop- and mobile "Arrow Lake" chips concerning this iGPU, and it has not just to do with the Xe core counts. It turns out, that while the desktop "Arrow Lake-S" processor comes with an iGPU based on the Xe-LPG graphics architecture; the mobile "Arrow Lake" chips spanning the U-, P-, and H-segments will use a newer version of this architecture, called the Xe-LPG+.

An interesting Intel document leaked out last month—it contained detailed pre-release information that covered their upcoming 15th Gen Core Arrow Lake-S desktop CPU platform, including a possible best scenario 8+16+1 core configuration. Thorough analysis of the spec sheet revealed a revelation—the next generation Core processor family could "lack Hyper-Threading (HT) support." The rumor mill had produced similar claims in the past, but the internal technical memo confirmed that Arrow Lake's "expected eight performance cores without any threads enabled via SMT." These specifications could be subject to change, but tipster—InstLatX64—has uprooted an Arrow Lake-S engineering sample: "I spotted (CPUID C0660, 24 threads, 3 GHz, without AVX 512) among the Intel test machines."

The leaker had uncovered several pre-launch Meteor Lake SKUs last year—with 14th Gen laptop processors hitting the market recently, InstLatX64 has turned his attention to seeking out next generation parts. Yesterday's Arrow Lake-S find has chins wagging about the 24 thread count aspect (sporting two more than the fanciest Meteor Lake Core Ultra 9 processor)—this could be an actual 24 core total configuration—considering the evident lack of hyper-threading, as seen on the leaked engineering sample. Tom's Hardware reckons that the AVX-512 instruction set could be disabled via firmware or motherboard UEFI—if InstLatX64's claim of "without AVX-512" support does ring true, PC users (demanding such workloads) are best advised to turn to Ryzen 7040 and 8040 series processors, or (less likely) Team Blue's own 5th Gen Xeon "Emerald Rapids" server CPUs.