According to the Linux Kernel Mailing List, AMD started to enable next-generation processors by submitting patches to the Linux kernel. Codenamed Family 1Ah or Family 26 in decimal notation, the set of patches corresponds to the upcoming AMD Zen 5 core, which is the backbone of the upcoming Ryzen 8000 series processors. The patches have a few interesting notes, namely few of them being: added support for the amd64_edac (Error Detection and Correction) module and temperature monitoring; added PCI IDs for these models covering 00h-1Fh and 20h; added required support in k10temp driver.

The AMD EDAC driver also points out that the Zen 5 server CPUs will max out with 12-channel memory. Codenames 0-31 correspond to next-generation EPYC, while 40 to 79 are desktop and laptop SKUS. Interestingly, these patches are just the start, as adding PCI IDs and temperature drivers are basic enablement. With the 2024 launch date nearing, we expect to see more Linux kernel enablement efforts, especially with more complicated parts of the kernel.

Newegg is currently running a time limited offer on AMD's flagship Ryzen 9 7950X3D CPU—the base price sits at $662, but a promotional voucher can be applied at checkout that removes $105. Amazon USA price matched the competition earlier today—via their own voucher system—but stock allocation of the powerful desktop processor appears to be sold out. North American customers eager to acquire an attractively priced Ryzen 9 7950X3D soon-ish will have to do business with Newegg.

The latest $557 deal is certainly more generous when compared to a campaign run by the American online retailer back in May, albeit via their Ebay store—several Ryzen 7000X3D-series CPUs were discounted at the time, perhaps in reaction to bad publicity swirling around the product lineup (referring to accounts of hardware burnouts). The Ryzen 9 7950X3D was reduced to a previous all-time low of $629.99. Perhaps public perception of AMD's top flight models has not improved all that much since then (plus other economical factors), and very deep discounts are necessary to attract customers. A Newegg mini-store page recently revealed a forthcoming "Starfield Game Bundle Promotion," that will apply to all Ryzen 7000-series CPUs. The AMD + Bethesda initiative will probably kick in closer to the game's September 6 launch date.

Oracle founder and Chairman Larry Ellison last week announced a substantial spending spree on new equipment as he prepares his business for a cloud computing service expansion that will be aimed at attracting a "new wave" of artificial intelligence (AI) companies. He made this announcement at a recent Ampere event: "This year, Oracle will buy GPUs and CPUs from three companies...We will buy GPUs from NVIDIA, and we're buying billions of dollars of those. We will spend three times that on CPUs from Ampere and AMD. We still spend more money on conventional compute." His cloud division is said to be gearing up to take on larger competition—namely Amazon Web Services and Microsoft Corp. Oracle is hoping to outmaneuver these major players by focusing on the construction of fast networks, capable of shifting around huge volumes of data—the end goal being the creation of its own ChatGPT-type model.

Ellison's expressed that he was leaving Team Blue behind—Oracle has invested heavily in Ampere Computing—a startup founded by ex-Intel folks: "It's a major commitment to move to a new supplier. We've moved to a new architecture...We think that this is the future. The old Intel x86 architecture, after many decades in the market, is reaching its limit." Oracle's database software has been updated to run on Ampere's Arm-based chips, Ellison posits that these grant greater power efficiency when compared to AMD and NVIDIA enterprise processors. There will be some reliance on "x86-64" going forward, since Oracle's next-gen Exadata X10M platform was recently announced with the integration of Team Red's EPYC 9004 series processors—a company spokesman stated that these server CPUs offer higher core counts and "extreme scale and dramatically improved price performance," when compared to older Intel Xeon systems.

A group of researchers in China have used a new approach to AI to create a full RISC-V processor from scratch. The team set out to answer the question of whether an AI could design an entire processor on its own without human intervention. While AI design tools do already exist and are used for complex circuit design and validation today, they are generally limited in use and scope. The key improvements shown in this approach over traditional or AI assisted logic design are the automated capabilities, as well as its speed. The traditional assistive tools for designing circuits still require many hours of manual programming and validation to design a functional circuit. Even for such a simple processor as the one created by the AI, the team claims the design would have taken 1000x as long to be done by humans. The AI was trained by observing specific inputs and outputs of existing CPU designs, with the paper summarizing the approach as such:

(...) a new AI approach, which generates large-scale Boolean function with almost 100% validation accuracy (e.g., > 99.99999999999% as Intel) from only external input-output examples rather than formal programs written by the human. This approach generates the Boolean function represented by a graph structure called Binary Speculation Diagram (BSD), with a theoretical accuracy lower bound by using the Monte Carlo based expansion, and the distance of Boolean functions is used to tackle the intractability.

ASRock Industrial is introducing new choices in industrial motherboards powered by 13th Gen Intel Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads that boost computer-intensive edge performance. They come equipped with Intel W680, Q670, and H610 chipsets, and offer support for up to DDR5-5600 memory modules and PCIe Gen 5, allowing expanded possibilities and seamless integration within industry-specific applications.

By harnessing the power of the 13th Gen Intel Core Processors, they leap up to 1.04x/1.34x/1.25x faster in single-thread, multi-thread, and CPU image classification inference performance, respectively, compared to the preceding 12th Gen Intel Core processors. The new 13th Gen Intel CPU motherboards with DDR5 support, available in Mini-ITX, Micro-ATX, and ATX form factors, have been specifically designed to cater to the unique requirements of the Edge AIoT applications in commerce, automation, robot, entertainment, and security industries.

Intel's Birch Stream-AP socket will provide an LGA7529 socket with as many as 7529 pins to power the next generation of CPUs. Today, thanks to Yuuki_Ans on Twitter, we have another set of pictures that highlight the massive scale that these processors offer. We got similar pictures in the past; however, these are more representative of how big the next-generation Xeon processors are. In 2024, Intel plans to split its Xeon lineup into E-core and P-core powered models. However, both CPUs will utilize the same platform to reduce the overall ecosystem's complexity. Thanks to the new pictures, we can see the processor with its heatsink present, with labeling indicating an engineering sample based on little info printed on the metal surface.

Below are the pictures of the Granite Rapids-AP and the LGA7529 socket, along with the specification table. The third image shows current generation Xeon Platinum processor in the LGA7529 socket.

Intel China has taken to Weibo and Bilibili in a new effort to explain how things will pan out for 14th generation CPU lineups, with emphasis on its new branding and naming conventions for 2023 and beyond. These announcements contain the company's first official acknowledgement of Raptor Lake-U, Raptor Lake-S and Raptor Lake-HX SKUs getting a refresh. Team Blue's branding scheme is set to become even more convoluted with Meteor Lake premiering with "Core Ultra" instead of the old "i" labelling system. The China office's product rundowns indicate that the Raptor Lake Refresh series will be split into Core # and Core i# families, which complicates matters further.

It seems that Raptor Lake-U & H Refresh (mobile) and the entire Meteor Lake lineup will be assuming the new Core # branding scheme, but the latter series will be more performant—hence the adding of Ultra (e.g Ultra Core 5/7/9), so customers can tell the difference between product lines lumped into the same generation! Desktop Raptor Lake-S Refresh and high-end mobile Raptor Lake-HX Refresh processors will retain the company's traditional "Core i" naming convention, this will eventually be retired with the 14th gen family.

What's New: The Aurora supercomputer at Argonne National Laboratory is now fully equipped with all 10,624 compute blades, boasting 63,744 Intel Data Center GPU Max Series and 21,248 Intel Xeon CPU Max Series processors. "Aurora is the first deployment of Intel's Max Series GPU, the biggest Xeon Max CPU-based system, and the largest GPU cluster in the world. We're proud to be part of this historic system and excited for the groundbreaking AI, science and engineering Aurora will enable."—Jeff McVeigh, Intel corporate vice president and general manager of the Super Compute Group

What Aurora Is: A collaboration of Intel, Hewlett Packard Enterprise (HPE) and the Department of Energy (DOE), the Aurora supercomputer is designed to unlock the potential of the three pillars of high performance computing (HPC): simulations, data analytics and artificial intelligence (AI) on an extremely large scale. The system incorporates more than 1,024 storage nodes (using DAOS, Intel's distributed asynchronous object storage), providing 220 terabytes (TB) of capacity at 31TBs of total bandwidth, and leverages the HPE Slingshot high-performance fabric. Later this year, Aurora is expected to be the world's first supercomputer to achieve a theoretical peak performance of more than 2 exaflops (an exaflop is 1018 or a billion billion operations per second) when it enters the TOP 500 list.

TrendForce reports that explosive growth in generative AI applications like chatbots has spurred significant expansion in AI server development in 2023. Major CSPs including Microsoft, Google, AWS, as well as Chinese enterprises like Baidu and ByteDance, have invested heavily in high-end AI servers to continuously train and optimize their AI models. This reliance on high-end AI servers necessitates the use of high-end AI chips, which in turn will not only drive up demand for HBM during 2023~2024, but is also expected to boost growth in advanced packaging capacity by 30~40% in 2024.

TrendForce highlights that to augment the computational efficiency of AI servers and enhance memory transmission bandwidth, leading AI chip makers such as Nvidia, AMD, and Intel have opted to incorporate HBM. Presently, Nvidia's A100 and H100 chips each boast up to 80 GB of HBM2e and HBM3. In its latest integrated CPU and GPU, the Grace Hopper Superchip, Nvidia expanded a single chip's HBM capacity by 20%, hitting a mark of 96 GB. AMD's MI300 also uses HBM3, with the MI300A capacity remaining at 128 GB like its predecessor, while the more advanced MI300X has ramped up to 192 GB, marking a 50% increase. Google is expected to broaden its partnership with Broadcom in late 2023 to produce the AISC AI accelerator chip TPU, which will also incorporate HBM memory, in order to extend AI infrastructure.

Broadcom Inc. today announced sample availability of its second generation of wireless connectivity chipset solutions for the Wi-Fi 7 ecosystem, spanning Wi-Fi routers, residential gateways, enterprise access points, and client devices. The new chips build on the ecosystem of products with Broadcom's first-generation Wi-Fi 7 chips while delivering additional functionality to a wider market.

The first chip, the BCM6765, is a highly-optimized residential access point chip that supports 320 MHz 2-stream Wi-Fi operation. This new platform system-on-chip (SoC) allows the productization of Wi-Fi 7 mass-market access points and smart repeater solutions which span the spectrum of cost, form factor, and performance. The second chip, the BCM47722, is an enterprise access point chip that also supports 320 MHz 2-stream operation along with dual IoT radios that support simultaneous operation for Bluetooth Low Energy (BLE), Zigbee, Thread, and Matter protocols. This SoC addresses the growing needs of Internet of things (IoT) applications in the enterprise Wi-Fi market. The third chip, the BCM4390, is a low-power Wi-Fi, Bluetooth, and 802.15.4 combo chip designed for use in mobile devices such as handsets and tablets. It supports 160 MHz 2-stream Wi-Fi operation, dual Bluetooth, and Zigbee, Thread, and Matter protocols to service a broad set of mobile markets.

Gamers Nexus has uploaded a video feature dedicated to the history of AMD's Zen CPU architecture—editor-in-chief and founder Stephen Burke ventured to Team Red's Austin, Texas-based test and engineering campus. Longer and more in-depth coverage of his lab tour will be released at a later date, but today's upload included an interesting segment covering unreleased hardware. The Gamers Nexus crew spent some time looking at several examples of current and past generation AMD 3D V-Cache CPUs. Prototype Ryzen 7000-series Zen 4 designs were shown off by principal engineer Amit Mehra and technical team member Bill Alverson. They also brought out older 5000-series Zen 3 units that never reached retail—the 16-core Ryzen 9 5950X3D was demonstrated as having a 3.5 GHz base clock, and it can boost up to 4.1 GHz. The 12-core Ryzen 9 5900X3D had 3.5 GHz base and 4.4 GHz boost clocks.

Team Red only sells one AM4 3D V-Cache model at the moment, in the form of its well received Ryzen 7 5800X3D CPU. It was released over a year ago, but recent price cuts have resulted in increased unit sales—system builders looking to maximize the potential of their older generation Ryzen 5000-series compatible mainboards are snapping up 5800X3Ds. AMD could be readying a cheaper alternative, with previous reports proposing that a "Ryzen 5 5600X3D" is positioned to take on Intel's 13th Gen Core i5 series (with DDR4). The unreleased Ryzen 9 5950X3D and 5900X3D have 3D V-Cache stacks on both of their CCDs (granting 192 MB of L3 cache), which is unique given that all retail 3D V-Cache CPUs (released so far) restrict this to a single CCD stack. Apparently AMD decided to stick with the latter setup due to it offering the best balance of performance and efficiency, plus gaming benchmarks demonstrated that there was not much of a difference between the configurations.

Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, today announced support for the latest 4th Gen AMD EPYC processors. The new processors, based on "Zen 4c" architecture and featuring AMD 3D V-Cache technology, enhance Giga Computing's enterprise solutions, enabling superior performance and scalability for cloud native computing and technical computing applications in GIGABYTE enterprise solutions. To date, more than thirty unique GIGABYTE systems and platforms support the latest generation of AMD EPYC 9004 processors. As time goes on Giga Computing will roll out more new GIGABYTE models for this platform, including more SKUs for immersion-ready servers and direct liquid cooling systems.

"For every new generation of AMD EPYC processors, GIGABYTE has been there, offering diverse platform options for all workloads and users," said Vincent Wang, Sales VP at Giga Computing. "And with the recent announcement of new AMD EPYC 9004 processors for technical computing and cloud native computing, we are also ready to support them at this time on our current AMD EPYC 9004 Series platforms."

Intel has informed customers that it is adjusting the retail packaging for two 13th Generation Raptor Lake processors—the Core i9-13900K and Core i9-13900KS are popular choices for extreme gamers who demand the best from their CPUs, but did the presence of a premium protective shell also attract certain buyers who enjoy displaying silicon-related mantelpieces? Team Blue will be introducing a more sober looking boxed solution for the aforementioned SKUs - effective in universal and Chinese markets. Intel reasons that it wants to save on the volumetric storage of processors during the shipment process—the smaller box designs will result in a unit increase per pallet. By their estimation this redesign could quadruple the number of boxes in each shipping package - from the previous 324 to a new goal of around 1620.

The Core i9-13900K and Core i9-13900KS were shipped (until recently) in "Tier 4" boxes, but Intel's new cost and space saving drive has the two processors destined to sit in their "Tier 2" retail package which appears to be a standard folding paperboard carton (as seen containing Core i7 and lower end SKUs). The announcement included a set of preview renders, but actual boxed dimensions were not shared in the Product Change Notification (PCN) document. The new packaging regime looks smaller when compared to the older combination of a "premium silver tinted plastic wafer package" plus box sleeve. Team Blue will ultimately shave off a few bucks for themselves in the process, but there is no indication that these savings will be passed onto the end user. Tom's Hardware reckons that a late adjustment to retail packaging could foreshadow the arrival of a successor CPU range—Raptor Lake Refresh is speculated to form the next desktop lineup, since the future of Meteor Lake-S is alleged to be in a precarious state.

ASUS today announced ESC N8-E11, its most advanced HGX H100 eight-GPU AI server, along with a comprehensive PCI Express (PCIe) GPU server portfolio—the ESC8000 and ESC4000 series empowered by Intel and AMD platforms to support higher CPU and GPU TDPs to accelerate the development of AI and data science.

ASUS is one of the few HPC solution providers with its own all-dimensional resources that consist of the ASUS server business unit, Taiwan Web Service (TWS) and ASUS Cloud—all part of the ASUS group. This uniquely positions ASUS to deliver in-house AI server design, data-center infrastructure, and AI software-development capabilities, plus a diverse ecosystem of industrial hardware and software partners.

Hardware tipster momomo_us has once again discovered unannounced AMD gear - today's tweet points to a pair of Ryzen Threadripper 7000 CPU families. Team Red's "Storm Peak" processors received some attention at the tail end of May, thanks to CPUID releasing version 2.06 of CPU-Z which contained newly updated "preliminary support" for the Ryzen Threadripper 7000 series. Industry experts anticipate that this Zen 4-based product range will shake up the workstation and HEDT markets upon arrival - with predictions of a Q3 2023 launch window. According to the leaked listings posted by momomo_us on social media—future workstation PCs will be catered for with AMD's PRO "79x5WX" family, and HEDT systems will be best served by non-PRO "79x0X" variants.

Prior leaks allege that the Ryzen Threadripper PRO 7905WX "workstation" range will be compatible with AMD's SP5 socket. This high end platform should support 8-channel DDR5 memory, and be capable of running up to 128 PCIe Gen 5 lanes and 8 PCIe Gen 3 lanes, although it lacks CPU and memory overclocking functions. In contrast the Ryzen Threadripper 7900X HEDT range is expected to offer full overclocking support for CPU and memory—but tipsters reckon its appeal could be limited by the platform's SP6 socket being restricted to 4-channel DDR5 memory configurations and a maximum 64 PCIe Gen 5.0 lanes—as seen on AMD's EPYC 8004 "Siena" family.

Primate Labs has released the newest update to its cross-platform CPU and GPU benchmark that measures your system's performance, Geekbench 6.1. The latest version brings new features and improvements, including the upgrade to Clang 16, an increased workload gap that should minimize thermal throttling on some devices, as well as introduces support for SVE and AVX 512- FP 16 instructions, and support for fixed-point math. The update also improves multi-core performance.

These changes result in Geekbench 6.1 single-scores to be up to 5 percent higher and multi-core scores up to 10 percent higher, compared to Geekbench 6.0 scores. Due to these differences, Primate Labs recommends that users do not compare scores between Geekbench 6.0 and Geekbench 6.1. Geekbench 6.1 is also a recommended update, according to Primate Labs.

AMD made its upcoming Ryzen 8000 CPU series official earlier this week during a "Meet the Experts" presentation - a roadmap demonstrates that this next-generation "Zen 5" + "Navi 3.5" mainstream desktop processor lineup is expected to arrive in 2024. Leaked information (from last month) points to "Granite Ridge" being AMD's codename for the upcoming processor product range, with high-end examples maxing out at 16 CPU cores across two CCDs. Benchleaks has recently spotted a pair of curious looking AMD engineering samples - entries have appeared on the einstein@home and LHC@home distributed computing platforms.

The mystery SKU seems to be a prototype CPU model that sports 8 cores and 16 threads - the AMD product number (OPN) for this unit is "00-000001290-11_N" which does not correspond to anything currently on the market. A Family ID of 26 is specified - Benchleaks theorizes that this number assignment is "Zen 5" specific - given that the existing Family 25 (19H) identifier was assigned to Zen 3 and 4. It should be noted that one of AMD's alleged test systems appears to have been running unreleased graphics hardware - a non-specific Radeon unit (with 12 GB of VRAM) is mentioned within einstein@home's information dump, this could be a potential mid-range RX 7000-series card. A Radeon RX 7900 GRE GPU with an unusually low video memory allocation of 16 GB is listed in LHC@home's entry.

Intel is in the process of discontinuing its eleventh generation Tiger Lake-U CPU lineup according to the company's own Product Change Notification (PCN) system. Team Blue's database points to the final batch of (x86 Willow Cove architecture) processors getting shipped out on December 29, with an October 2023 cutoff point for last orders. These 11th Gen Core units (with Iris Xe iGPUs) have been part of laptops, mobile devices and small-form-factor (SFF) systems since launching in 2020. Intel started the end-of-life (EOL) for more powerful variants (some Tiger Lake-H models and the entire Tiger Lake-B range) back in April of this year.

Tiger Lake was an early example of a 10 nm++ SuperFin product, with improved production yields leading to the creation of high performance gaming laptop CPUs (the aforementioned H and B models), alongside the basic low power U-series. Intel has also added Tiger Lake-H35 models to the discontinuance list (totaling 42 models), and a trio of 500-series chipsets that were designed to accommodate their embedded 11th generation processor family: RM590E, HM570E and QM580E. Plenty of Tiger Lake-based stock still exists on the market, but Intel will be very keen to clear that excess - in favor of making way for its 12th and 13th generation product ranges.

Alphacool at Computex presented a few new products that highlighted what the company has been working on. First off, we have the Apex Stealth Metal fan among the latest products introduced by the brand, hailed as the world's first computer fan designed with entirely decoupled propellers, bearings, and motors from the chassis. The design minimizes both the vibration and the noise generated by the fan. The fan frame is constructed entirely of metal, showcasing the fresh Apex design. Additionally, it employs a 6-pole motor. The fan is touted as being silent due to its HDB (Hydro Dynamic Bearing) design. The fan blades are also fine-tuned to achieve maximum airflow and pressure, though specific details will still be released. The Apex Stealth Metal fan will be accessible in black, chrome, and white variants. Also in the pipeline is a unique variant called Alphacool ES Stealth Metal Fan Black, specifically designed for "Enterprise Solutions," featuring an integrated ventilation grill. The Apex Metal fan SKUs will be available for around $30 or less.

Mark Zuckerberg just announced Meta Quest 3, our next-generation virtual and mixed reality headset, which launches later this year. It features higher resolution, stronger performance, breakthrough Meta Reality technology, and a slimmer, more comfortable form factor. Quest 3 will ship in all countries where Meta Quest is currently supported this fall. The 128 GB headset starts at $499.99 USD, and we'll offer an additional storage option for those who want some extra space. Mark your calendars because we'll have lots more to share at Meta Connect, which returns this year on September 27.

Quest 3 is the supercharged all-in-one headset you've been waiting for—no wires required. Sign up to be the first to learn about Meta Quest 3.

Newegg has been running various discount promotions on Ryzen 7000-series desktop processors over the past month, but their latest offer finally affects one of AMD's lower end models. The Ryzen 5 7600X CPU is on offer over at the American e-tailer - by using a time limited promo code (MDSCS2342) when checking out you can get the price down to $209 - resulting in a saving of about $31 (from the normal $240). The Ryzen 5 7600 (non-X) CPU is not part of this Memorial Weekend promotion - it is currently listed at $223, with no active Newegg promo code granting a generous saving.

Both of these Zen 4 (Raphael) Ryzen 5 processors were awarded TPU's Editor's Choice accolade - despite receiving criticism for "high platform costs," so it is nice to see that the 7600X is available for just north of $200 in the United States - this saving can offset the added premium of an AM5 motherboard, DDR5 RAM and necessary CPU cooling solution (no Wraith unit is included in the slimline box). Customers in China are fortunate to get an even better online deal - the Ryzen 5 7600X and 7600 are available for way below MSRP via JD.com, with both CPUs priced at an all-time low of $183 (1299 RMB) each.

CPUID recently released version 2.06 of the globally popular free CPU-Z utility which includes updates to support reporting of a variety of recent or obscure CPU and GPU models. Intel's "Alder Lake-N", AMD's recently released "Dragon Range" mobile Zen 4 processors, Zhoaxin's KH-40000 and KX-6000G, and of course NVIDIA's RTX 4060 Ti as well as AMD's RX 7600. Most interesting of all is a small addition down at the very bottom of the list, "Preliminary support for AMD Storm Peak platform." "Storm Peak" is AMD's yet to be announced Ryzen Threadripper 7000 series which will feature "Zen 4" and hopefully heat up competition in the HEDT market. No detailed specifications or information on SKUs have been released yet with "Storm Peak" expected to receive a proper announcement sometime in Q3 2023. The mention on CPU-Z suggests that the platform is nearing market readiness, and possibly that the folks at CPUID have been seeded samples or specifications to prepare with. Threadripper 7000 is expected to be released on yet another new socket, TR5, and has been rumored to be coming in both HEDT and workstation variants.

Intel brought competition to the HEDT market for the first time in nearly 4 years with the release of their Sapphire Rapids Xeon W range of processors back in February. Xeon W features unlocked SKUs tackling AMD's Threadripper 5000 series from top to bottom; going as high as the 56-core Xeon w9-3495X at a blistering $5,889 USD to as low as ~$1,000 USD for the 12-core Xeon w5-2455X. Intel also interspersed some lower cost locked SKUs to allow system integrators to offer the new platform as workstations to the prosumer market that generally cares little about overclocking. With Intel competing directly with Threadripper again it was expected that it wouldn't be long before AMD would be cooking up a response with their latest and greatest.

Edge sensors, such as LiDAR, radar and 3D surround-view camera systems, are becoming more prevalent in the automotive market, especially with the growing adoption in autonomous driving. As more sensors are needed for autonomy, there are increasing needs for faster signal processing, reduced device costs and smaller form factors. Functional safety is also critical for many of these autonomous applications.

To address these market needs, we're introducing two additions to our AMD Automotive XA Artix UltraScale+ family: the XA AU10P and XA AU15P cost-optimized processors, which are automotive-qualified and optimized for use in advanced driver-assistance systems (ADAS) sensor applications. The Artix UltraScale+ devices extend the AMD portfolio of automotive-grade, functional-safety proven and highly scalable FPGA and adaptive SoCs, joining the automotive-grade Spartan 7, Zynq 7000 and Zynq UltraScale+ product families.

A hardware tipster - Benchleaks - has highlighted an interesting new entry for an Intel Meteor Lake Client Platform CPU on the PugetBench site - it seems that early platform validation results have been uploaded by mistake (prior to embargo restrictions). The MTL-P CPU in question appears to be a laptop/mobile variant given its "H" designation. We are also looking at another example of Team Blue's new SKU naming system with this Core Ultra 7 1003H processor - the company has confirmed that revised branding will debut as part of the Meteor Lake family.

The previously leaked Core model (5 1003H) also sported an "Ultra" tag, so it is possible that only high-end examples have been outed online over the past month. Puget System Lightroom Classic benchmark results that were produced by the Core Ultra 7 1003H CPU were not exactly next level - scoring only 534.5 points overall - this could indicate that a prototype unit was benched. An older Core i7-8665U laptop processor only lagged behind by 32.5 points. The test platform was fitted with 16 GB (2 x 8 GB) of DDR5-5600 memory, and ran in a Windows 11 Enterprise (22621) OS environment. Intel's latest marketing spiel is bigging up the potential of Meteor Lake's AI acceleration capabilities, via the built-in neural VPU.

During the ISC High Performance 2023 international conference, Intel announced interesting roadmap updates to its high-performance computing (HPC) and artificial intelligence (AI). With the scrapping of Rialto Bridge and Lancaster Sound, Intel merged these accelerator lines into Falcon Shores processor for HPC and AI, initially claiming to be a CPU+GPU solution on a single package. However, during the ISC 2023 talk, the company forced a change of plans, and now, Falcon Shores is GPU only solution destined for a 2025 launch. Originally, Intel wanted to combine x86-64 cores with Xe GPU to form an "XPU" module that powers HPC and AI workloads. However, Intel did not see a point in forcing customers to choose between specific CPU-to-GPU core ratios that would need to be in an XPU accelerator. Instead, a regular GPU solution paired with a separate CPU is the choice of Intel for now. In the future, as workloads get more defined, XPU solutions are still a possibility, just delayed from what was originally intended.

Regarding Intel's Gaudi accelerators, the story is about to end. The company originally paid two billion US Dollars for Habana Labs and its Gaudi hardware. However, Intel now plans to stop the Gaudi development as a standalone accelerator and instead use the IP to integrate it into its Falcon Shores GPU. Using modular, tile-based architecture, the Falcon Shores GPU features standard ethernet switching, up to 288 GB of HBM3 running at 9.8 TB/s throughput, I/O optimized for scaling, and support for FP8 and FP16 floating point precision needed for AI and other workloads. As noted, the creation of XPU was premature, and now, the initial Falcon Shores GPU will become an accelerator for HPC, AI, and a mix of both, depending on a specific application. You can see the roadmap below for more information.