AMD today announced the appointment of five technical leaders to the role of AMD Corporate Fellow. These appointments recognize each leader's significant impact on semiconductor innovation across various areas, from graphics architecture to advanced packaging. "David, Nathan, Suresh, Ben and Ralph - whose engineering contributions have already left an indelible mark on our industry - represent the best of our innovation culture," said Mark Papermaster, chief technology officer and executive vice president of Technology and Engineering at AMD. "Their appointments to Corporate Fellow will enable AMD to innovate in new dimensions as we work to deliver the most significant breakthroughs in high-performance computing in the decade ahead."

Appointment to AMD Corporate Fellow is an honor bestowed on the most accomplished AMD innovators. AMD Corporate Fellows are appointed after a rigorous review process that assesses not only specific technical contributions to the company, but also involvement in the industry, mentoring of others and improving the long-term strategic position of the company. Currently, only 13 engineers at AMD hold the title of Corporate Fellow.

AMD has announced the immediate availability of its Ryzen 7045 HX-series (Dragon Range) processors for high performance laptop devices. In a Youtube video released on March 10, AMD's Jason Banta has announced the availability of the world's most powerful mobile processor, the Ryzen 9 7945HX. He listed the OEM partners who have integrated the 7945HX into flagship level laptop models. He also declared that this range topping CPU is a competition beater. Gaming benchmark tests have demonstrated that the Ryzen 9 7945HX beats Intel's Raptor Lake Core i9-13950HX by an average margin of 10%.

When Intel announced the appearance of the 4th generation Xeon-W processors, the company announced that the clock multiplier was left unlocked, available for overclockers to try and push these chips even harder. However, it was only a matter of time before we saw the top-end Xeon-W SKU take a chance at beating the world record in Cinebench R23. The Intel Xeon W9-3495X SKU is officially the world record score holder with 132,484 points in Cinebench R23. The overclocker OGS from Greece managed to push all 56 cores and 112 threads of the CPU to 5.4 GHz clock frequency using liquid nitrogen (LN2) cooling setup. Using ASUS Pro WS W790E-SAGE SE motherboard and G-SKILL Zeta R5 RAM kit, the OC record was set on March 8th.

The previous record holder of this position was AMD with its Threadripper Pro 5995WX with 64 cores and 128 threads clocked at 5.4 GHz. Not only did Xeon W9-3495X set the Cinebench R23 record, but the SKU also placed the newest record for Cinebench R20, Y-Cruncher, 3DMark CPU test, and Geekbench 3 as well.

One of the biggest drawbacks of modern CPUs is that adding more cores doesn't equal more performance in a linear fashion. Parallelism in CPUs offer limited scaling for most applications and even none for some. A South Korean company called Morumi is now taking a stab at solving this problem and wants to develop a CPU that can offer more or less infinite processing scaling, as more cores are added. The company has been around since 2018 and focused on various telecommunications chips, but has now started the development on what it calls every one period parallel processor (EOPPP) technology.

EOPPP is said to distribute data to each of the cores in a CPU before the data is being processed, which is said to be done over a type of mesh network inside the CPU. This is said to allow for an almost unlimited amount of instructions to be handled at once, if the CPU has enough cores. Morumi already has an early 32-core prototype running on an FPGA and in certain tasks the company has seen a tenfold performance increase. It should be noted that this requires software specifically compiled for EOPPP and Moumi is set to release version 1.0 of its compiler later this year. It's still early days, but it'll be interesting to see how this technology develops, but if it's successfully developed, there's also a high chance of Morumi being acquired by someone much bigger that wants to integrate the technology into their own products.

EK, the premium water-cooling gear manufacturer, is launching a new distro plate for the Lian Li O11D XL chassis. The distro has a built-in EK-Quantum Lumen screen, a 7" IPS monitor that can be seen from the front of the case. It is designed to provide advanced water cooling with the latest 3rd-generation SATA-powered D5 pump, removing the need for additional 4-pin Molex cables. The Reflection² series distribution plates are EK-Matrix7 compliant.

The EK-Quantum Reflection² PC-O11D XL D5 PWM D-RGB - Screen Edition is a custom water-cooling reservoir, routing, and pump solution that seamlessly fits into the front of the case showing off a beautiful 7" IPS screen with an aluminum frame. This waterway is also equipped with six innovative push-in ports that come with female G1/4" threaded adapters. The idea is that users can easily assemble the whole radiator + fittings + tubing combo and use these push-in adapters to simply slide it into the distribution plate. The bottom radiator is mounted via a special metal bracket.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the latest addition to its revolutionary ultra-high performance, high-density petascale class all-flash NVMe server family. Supermicro systems in this high performance storage product family will support the next-generation EDSFF form factor, including the E3.S and E1.S devices, in form factors that accommodate 16- and 32 high-performance PCIe Gen 5 NVMe drive bays.

The initial offering of the updated product line will support up to one-half of a petabyte storage space in a 1U 16 bay rackmount system, followed by a fully petabyte storage space in 2U 32 bay rackmount system for both Intel and AMD PCIe Gen 5 platforms.

Looking back at 2H22, as server OEMs slowed down the momentum of their product shipments, Chinese server buyers also held a conservative outlook on future demand and focused on inventory reduction. Thus, the flow of orders for enterprise SSDs remained sluggish. However, NAND Flash suppliers had to step up shipments of enterprise SSDs during 2H22 because the demand for storage components equipped in notebook (laptop) computers and smartphones had undergone very large downward corrections. Compared with other categories of NAND Flash products, enterprise SSDs represented the only significant source of bit consumption. Ultimately, due to the imbalance between supply and demand, the QoQ decline in prices of enterprise SSDs widened to 25% for 4Q22. This price plunge, in turn, caused the quarterly total revenue from enterprise SSDs to drop by 27.4% QoQ to around US$3.79 billion. TrendForce projects that the NAND Flash industry will again post a QoQ decline in the revenue from this product category for 1Q23.

Once upon a time, the data center market represented a duopoly of x86-64 makers AMD and Intel. However, in recent years companies started developing custom Arm-based processors to handle workloads as complex within smaller power envelopes and doing it more efficiently. According to Counterpoint Research firm, we have the latest data highlighting a significant new player called Ampere Computing in the data center world. With the latest data center revenue share report, we get to see Intel/AMD x86-64 and AWS/Ampere Arm CPU revenue. For the first time, we see that a 3rd party company, Ampere Computing, managed to capture as much as 1.54% market revenue share of the entire data center market in 2022. Thanks to having CPUs in off-the-shelf servers from OEMs, enterprises and cloud providers are able to easily integrate Ampere Altra processors.

Intel, still the most significant player, saw a 70.77% share of the overall revenue; however, that comes as a drop from 2021 data which stated an 80.71% revenue share in the data center market. This represents a 16% year-over-year decline. This reduction is not due to the low demand for server processors, as the global data center CPU market's revenue registered only a 4.4% YoY decline in 2022, but due to the high demand for AMD EPYC solutions, where team red managed to grab 19.84% of the revenue from 2022. This is a 62% YoY growth from last year's 11.74% revenue share. Slowly but surely, AMD is eating Intel's lunch. Another revenue source comes from Amazon Web Services (AWS), which the company filled with its Graviton CPU offerings based on Arm ISA. AWS Graviton CPUs accounted for 3.16% of the market revenue, up 74% from 1.82% in 2021.

The four major North American cloud service providers (CSPs) have made cuts to their server procurement quantities for this year because of economic headwinds and high inflation. Turning to server OEMs such as Dell and HPE, they are observed to have scaled back the production of server motherboards at their ODM partners. Given these developments, TrendForce now projects that global server shipments will grow by just 1.31% YoY to 14.43 million units for 2023. This latest figure is a downward correction from the earlier estimation. The revisions that server OEMs have made to their outlooks on shipments shows that the demand for end products has become much weaker than expected. They also highlight factors such as buyers of enterprise servers imposing a stricter control of their budgets and server OEMs' inventory corrections.

ASUS today announced availability of a BIOS update for its X670 and X670E motherboards that enables full compatibility with the latest AMD Ryzen 7000 Series X3D CPUs featuring AMD 3D V-Cache technology.

The proven gaming performance of the AMD Ryzen 7 5800X3D CPU made it a long-standing favorite for PC builders. ASUS motherboards gave those builders high-performance, feature-rich options for assembling a potent gaming machine built around one of these chips. Now, AMD is upping its game with two new Ryzen 7000 Series CPUs with AMD 3D V-Cache technology: the Ryzen 9 7950X3D and the Ryzen 9 7900X3D. Combining a 3D vertical cache and all the advantages of the cutting-edge X670 platform, these chips are poised to seize the gaming performance crown.

For more than a decade, Intel and its partners have been on a mission to virtualize the world's networks, from the core to the RAN (radio access network) and out to the edge, moving them from fixed-function hardware onto programmable, software-defined platforms, making networks more agile while driving down their complexity and cost.

Now operators are looking to cross the next chasm in delivering cloud-native functionality for automating, managing and responding to an increasingly diverse mix of data and services, providing organizations with the intelligence needed at the edge of their operations. Today, Intel announced a range of products and solutions driving this transition and broad industry support from leading operators, original equipment manufacturers (OEMs) and independent software vendors (ISVs).

AMD and Arm have been gaining up on Intel in the server CPU market in the past few years, and the margins of the share that AMD had won over were especially large in 2022 as datacenter operators and server brands began finding that solutions from the number-2 maker growing superior to those of the long-time leader, according to Frank Kung, DIGITIMES Research analyst focusing primarily on the server industry, who anticipates that AMD's share will well stand above 20% in 2023, while Arm will get 8%.

Prices are one of the three major drivers that resulted in datacenter operators and server brands switching to AMD. Comparing server CPUs from AMD and Intel with similar numbers of cores, clockspeed, and hardware specifications, the price tags of most of the former's products are at least 30% cheaper than the latter's, and the differences could go as high as over 40%, Kung said.

EK, the leading liquid cooling gear manufacturer, launches a workstation and a 1U rack-compatible high-performance liquid cooling solution for AMD Zen 4-based EPYC server processors. Code-named "Genoa," these AMD CPUs come with up to 96 cores and 192 threads and have a TDP of up to 360W. These specifications render these processors perfect for liquid cooling, especially in a dual-socket motherboard environment.

EK-Pro CPU WB SP5 Ni + Acetal
This is a dedicated enterprise-grade water block developed specifically for AMD processors. It features three standard G1/4" threaded ports located on the top of the water block and is intended for workstations and taller server racks.

AMD's upcoming Ryzen 9 7950X3D processor will bring 16 cores and 32 threads along with 16 MB of L2 cache and 128 MB of L3 cache for 144 MB of 3D V-cache present on the package. Today, we get to see it in action for the first time in benchmarks like Blender for 3D content creation and Geekbench 5 for synthetic benchmarks, where we get to compare the scores to the already existing models. In Blender, the new AMD Ryzen 9 7950X3D scores 558.59 points, while the regular Ryzen 9 7950X scores 590.28 points. This represents a 5.4% regression from the original model; however, we are yet to see how other content creation benchmarks suit the new CPU.

For Geekbench 5 synthetics, the upcoming Ryzen 9 7950X3D scores 2,157 points in the single-core score and 21,841 points in the multi-core score. The regular Ryzen 9 7950X can reach around 2246 points for single-core and 25,275 points for multi-core score, which is relatively faster than the new cache-enhanced Ryzen 9 7950X3D design. Of course, some of these benchmark results show that the 4.2 GHz base frequency of Ryzen 9 7950X3D plays a significant role in the overall performance comparison, given that the regular Ryzen 9 7950X is set to a 4.5 GHz base clock. Both designs share the same 5.7 GHz boost speed, so we have yet to see more benchmarks showing other differences induced by larger cache sizes.

iBUYPOWER, a leading manufacturer of high-performance custom gaming PCs, today announced the new RDY Ouro Kronii system featuring the special edition Y60 Ouro Kronii PC case.

"It's been an incredible journey collaborating with Kronii and hololive Engish," said King Perez de Tagle, Marketing Executive Producer of HYTE and iBUYPOWER. "It's about time The Warden of Time gets a high-performance gaming PC and the RDY Ouro Kronii limited edition systems are ready to ship. stay tuned for even more!" The RDY Ouro Kronii will boast the latest Intel Core i9 13900K or KF CPU, NVIDIA RTX 4070 Ti GPU, Z790 motherboard, and the custom Y60 Ouro Kronii PC case. The RDY Ouro Kronii will provide users with maximum performance in virtually any application with reliable components and iBUYPOWER's expert assembly.

Antec Inc., a Californian supplier of high-performance computer components and accessories for the gaming, PC upgrade and Do-It-Yourself market, presents the AX90, a model oft he new budget-friendly AX series of Gaming cases. The mid-tower is equipped with three 120 mm ARGB fans in the front as well as one in the rear and is now available at a very affordable price of € 99.99 (recommended retail price including VAT).

The new AX series from Antec offers a large selection of gaming cases with LED lighting and eye-catching front panel designs - all at an affordable price. The new AX90 case has a side panel made of tempered glass and puts the built-in components in the limelight. Diamond-shaped frames in a mesh front panel create not only a visual highlight but also allow for excellent airflow.

HP Inc. announced its new Z by HP high-performance workstation desktop lineup, engineered to change what is possible within complex, data rich workflows. HP is advancing hybrid workforce management with the HP Anyware Remote System Controller, a device that gives IT departments the management capabilities to support high performance devices from anywhere.

The complex workflows in industries spanning media and entertainment, data science, and engineering mean increased time pressure and the need for more compute power to deliver faster results. They also highlight a need to iterate with remote teams and push creative boundaries to deliver more accurate results. The new Z by HP Z4, Z6, Z8, and Z8 Fury desktops, powered by Intel, deliver the scalable balance of CPU and GPU compute needed to fuel new levels of speed, accuracy, and creativity.

Intel today announced the new Intel Xeon W-3400 and Intel Xeon W-2400 desktop workstation processors (code-named Sapphire Rapids), led by the Intel Xeon w9-3495X, Intel's most powerful desktop workstation processor ever designed. Built for professional creators, these new Xeon processors provide massive performance for media and entertainment, engineering and data science professionals. With a breakthrough new compute architecture, faster cores and new embedded multi-die interconnect bridge (EMIB) packaging, the Xeon W-3400 and Xeon W-2400 series of processors enable unprecedented scalability for increased performance.

"For more than 20 years, Intel has been committed to delivering the highest quality workstation platforms - combining high-performance compute and rock-solid stability - for professional PC users across the globe. Our new Intel Xeon desktop workstation platform is uniquely designed to unleash the innovation and creativity of professional creators, artists, engineers, designers, data scientists and power users - built to tackle both today's most demanding workloads as well as the professional workloads of the future." -Roger Chandler, Intel vice president and general manager, Creator and Workstation Solutions, Client Computing Group

EK, the leading liquid cooling gear manufacturer, is announcing the availability of two high-performance liquid cooling solutions for the AMD Ryzen processor family based on the AMD AM5 socket. These single-socket AM5 water blocks are available in both the standard and the 1U-compatible format designed specifically for server racks.

EK-Pro CPU WB AM5 Ni + Inox
Being a dedicated workstation-grade water block for AMD AM5 processors, the EK-Pro CPU WB AM5 Ni + Inox water block features two standard G1/4" threaded ports on its top. Built with performance, reliability, serviceability, and no compromises in mind, this enterprise-grade cooling solution is intended for desktops, workstations, and taller server racks. The water block's top is CNC-machined from durable black POM Acetal, and the hold-down bracket is made of laser-cut stainless steel.

Powerful coolers for large processors on Intel Socket LGA 4677! With the new Enterprise Solution Jet and Stream CPU coolers, Alphacool presents progressive solutions for CPU cooling in server and workstation systems.

The Alphacool ES Jet CPU Cooler is equipped with a new complex 4-nozzle technology. For the first time, it distributes water evenly over the cooler base via four nozzles incorporated into the cooler. Thereby, all cores of the high-performance processor are optimally supplied and thus effectively and precisely cooled. The organic water flow ensures a disturbance-free water flow and thus increases the cooling performance. This method makes it possible to optimally dissipate waste heat of up to 800 watts. The chrome-plated cooler base is made of copper and is ideally suited for server and workstation systems with its extremely high thermal conductivity.

The global PC market has been experiencing a demand downtrend after the cooling down of COVID-19 in 2022. The market saw its shipments decline 15% YoY in 2022 and is expected to see another high single-digit decline in 2023, according to Counterpoint Research's data. However, among all the PC sub-sectors, Arm-based laptops are expected to show a comparatively resilient demand throughout the coming quarters thanks to Apple's success with the MacBook series, increasing ecosystem support and vanishing performance gap with x86 offerings.

Intel's upcoming Meteor Lake processor family is supposedly looking good with the new performance/efficiency targets. According to the @OneRaichu Twitter account, we have a potential performance estimate for the upcoming SKUs. As the latest information notes, Intel's 14th-generation Meteor Lake will feature around a 50% increase in efficiency compared to the 13th-generation Raptor Lake designs. This means that the processor can use half the power at the same performance target at Raptor Lake, increasing efficiency. Of course, the design also offers some performance improvements besides efficiency that are significant and are yet to be shown. The new Redwood Cove P-cores will be combined with the new Crestmont E-cores for maximum performance inside U/P/H configurations with 15-45 Watt power envelopes.

For integrated graphics, the source notes that Meteor Lake offers twice the performance of iGPU found on Raptor Lake designs. Supposedly, Meteor Lake will feature 128 EUs running 2.0+GHz compared to 96 EUs found inside Raptor Lake. The iGPU architecture will switch from Intel Iris to Xe-LPG 'Xe-MTL' family on the 14th gen models, confirming a giant leap in performance that iGPU is supposed to experience. Using the tile-based design, Intel combines the Intel 4 process for the CPU tile and the TSMC 5 nm process for the GPU tile. Intel handles final packaging for additional tuning, and you can see the separation below.

Samsung Electronics today unveiled the Galaxy Book3 series, its latest flagship PC lineup featuring the Galaxy Book3 Ultra, Book3 Pro 360 and Book3 Pro. The Galaxy Book3 Ultra—Samsung's new premium PC—features ultra-high-performance computing, the Galaxy Book3 Pro 360 features a 2-in-1 convertible form factor with S Pen functionality, and the Galaxy Book3 Pro features thin and light, mobility-first clamshell design. The Galaxy Book3 series is designed for those who need seamless multi-device connectivity and premium hardware to supercharge their productivity and creativity.

"Today, we're seeing an increasing number of people using multiple devices to perform efficiently. These new workflows are made possible thanks to our open and extensive Galaxy ecosystem," said TM Roh, President and Head of Mobile eXperience Business at Samsung Electronics. "The latest Galaxy Book3 series further enriches our connected offerings. It is tailor-made for Galaxy enthusiasts looking for ultra-high computing performance and seamless connected Galaxy experiences to maximize their productivity and creativity."

Qualcomm has been working on its Snapdragon SoCs for quite some time now, with massive success in the mobile phone space. However, the company's processors needed to be up to the task regarding laptops. For a user to not look at x86 offerings, the only remaining performant alternatives are Apple's M processors. In 2021 Qualcomm purchased the Nuvia team that was developing massively efficient and high-performance IP for laptops, similar to Apple M processors. Today, according to the insights from Kuba Wojciechowski (@Za_Raczke) on Twitter, we have some potential information about the upcoming Nuvia-powered SoC codenamed Hamoa.

According to the Twitter thread, Qualcomm's Hamoa processors are part of the Snapdragon 8xc Gen 4 compute platform and feature up to eight high-performance P-cores and four low-power E-cores, all based on Nuvia's IP. Allegedly the P-cores are being tested at 3.4 GHz, while the E-cores are tested at 2.5 GHz. The SoC splits CPU cores into blocks, each being a four-core group with 12 MB of shared L2 cache. There is also an 8 MB L3 cache structure; it needs to be clarified whether it is per core block or for the entire SoC. The chip employs 12 MB of system-level cache, with 4 MB of memory for graphics-related tasks handled by iGPU. The iGPU of choice is Adreno 740, with all modern APIs supported. Discrete graphics solutions are supported by the top-end SKUs, which allow eight PCIe 4.0 lanes to be directed toward dGPU, along with an additional four PCIe 4.0 lanes for NVMe SSD. For RAM, the chip uses up to 64 GBs of LPDDR5X eight-channel memory with up to 4.2 GHz speeds. Chip's media engines are structured to support decoding up to 4K120 and encode up to 4K60 with AV1.

SUS IoT, the global AIoT solution provider, today announced PE3000G—the industry's first edge AI system to support Mobile PCI Express Module (MXM) GPUs from both NVIDIA and Intel. Specifically, the all-new industrial PC works seamlessly with NVIDIA Ampere/Turing or Intel Arc A-series MXM GPUs. Powered by a 12th Gen Intel Core processor and up to 64 GB of DDR5 4800 MHz memory, and combining a proven power design, guaranteed and fanless thermal performance, and superior physical and mechanical ruggedness, PE3000G brings unprecedented longevity, computing power, flexibility and reliability to AI computing at the edge—making it an ideal option for scenarios where resilience, longevity and both CPU and GPU scalability are paramount.

"PE3000G is ASUS IoT's response to the burgeoning demand for accelerating AI inference and extreme deployment in industrial settings," commented KuoWei Chao, General Manager of the ASUS IoT business unit. "With robust power, thermal and mechanical design, it pushes versatile edge-AI-inference applications to business-critical applications. PE3000G is an ideal fit to accelerate edge AI inference in SWaP-constrained applications, such as machine vision in factory automation, outdoor surveillance system and AI-inference systems for autonomous vehicles."