A Reddit user has shared their experience of passively cooling an AMD Ryzen 9 7950X, with some modifications to the setup. Using the Streacom DB4 passively cooled case, the user u/AromaticImpress7778 pulled off cooling a processor with 16 cores and 32 threads with a TDP of 170 Watts. Interestingly, the Streacom DB4 case rates CPU support for only 65 Watts, meaning some modifications were in place. To support the high-TDP CPU, the user used two of the one-kilogram copper bars and attached them to the case. Heat is transferred to the two one-kilogram blocks using the case's default plate and an additional 233-gram copper plate for the CPU and motherboard. These big copper blocks are not soldered to the case, but instead, the user puts Thermal Grizzly Conductonaut liquid metal between copper parts and Arctic MX-6 between the case and copper.

To cool the AMD Ryzen 9 7950X and MSI B650I board, accompanied by HDPlex GaN 250 W and 64 GB of memory, the system did well enough for a passive build. After running the system at full load, the CPU reached 95 degrees Celsius for CCD1 and 95 degrees Celsius for CCD2. The external panels of the Streacom DB4 case were getting 50C to 60C of heat. Additionally, the user noted that the usage of this system will be more relaxed, as it will not run under full load for a prolonged period. Regarding the system's total weight, the entire build weighs around 13 KG, with 4.4 KG of that being only copper. The case weighs 7.5 KG, and the other parts weigh about one kilogram.

Cooler Master, a global frontrunner in cutting-edge cooling technologies, today announced the Hyper 622 Halo, a new entry in the longstanding Hyper Series that propels Cooler Master's innovative and high-performance technology to new heights.

"I am thrilled to introduce the Hyper 622 Halo, a true testament to Cooler Master's commitment to innovation and uncompromising quality," said Jimmy Sha, CEO of Cooler Master. "This groundbreaking dual tower design not only doubles the cooling power, but also exemplifies our mission to empower enthusiasts and gamers with the ultimate performance and customization options."

A strong growth in AI server shipments has driven demand for high bandwidth memory (HBM). TrendForce reports that the top three HBM suppliers in 2022 were SK hynix, Samsung, and Micron, with 50%, 40%, and 10% market share, respectively. Furthermore, the specifications of high-end AI GPUs designed for deep learning have led to HBM product iteration. To prepare for the launch of NVIDIA H100 and AMD MI300 in 2H23, all three major suppliers are planning for the mass production of HBM3 products. At present, SK hynix is the only supplier that mass produces HBM3 products, and as a result, is projected to increase its market share to 53% as more customers adopt HBM3. Samsung and Micron are expected to start mass production sometime towards the end of this year or early 2024, with HBM market shares of 38% and 9%, respectively.

AI server shipment volume expected to increase by 15.4% in 2023
NVIDIA's DM/ML AI servers are equipped with an average of four or eight high-end graphics cards and two mainstream x86 server CPUs. These servers are primarily used by top US cloud services providers such as Google, AWS, Meta, and Microsoft. TrendForce analysis indicates that the shipment volume of servers with high-end GPGPUs is expected to increase by around 9% in 2022, with approximately 80% of these shipments concentrated in eight major cloud service providers in China and the US. Looking ahead to 2023, Microsoft, Meta, Baidu, and ByteDance will launch generative AI products and services, further boosting AI server shipments. It is estimated that the shipment volume of AI servers will increase by 15.4% this year, and a 12.2% CAGR for AI server shipments is projected from 2023 to 2027.

Intel Foundry Services (IFS) and Arm today announced a multigeneration agreement to enable chip designers to build low-power compute system-on-chips (SoCs) on the Intel 18A process. The collaboration will focus on mobile SoC designs first, but allow for potential design expansion into automotive, Internet of Things (IoT), data center, aerospace and government applications. Arm customers designing their next-generation mobile SoCs will benefit from leading-edge Intel 18A process technology, which delivers new breakthrough transistor technologies for improved power and performance, and from IFS's robust manufacturing footprint that includes U.S.- and EU-based capacity.

"There is growing demand for computing power driven by the digitization of everything, but until now fabless customers have had limited options for designing around the most advanced mobile technology," said Pat Gelsinger, CEO of Intel Corporation. "Intel's collaboration with Arm will expand the market opportunity for IFS and open up new options and approaches for any fabless company that wants to access best-in-class CPU IP and the power of an open system foundry with leading-edge process technology."

In the latest Linux Kernel patches, Intel engineers are submitting initial support for Meteor Lake processor generation, with some interesting potential features. In a patch submitted yesterday, the Intel engineer noted, "On MTL, GT can no longer allocate on LLC - only the CPU can. This, along with the addition of support for ADM/L4 cache, calls a MOCS/PAT table update." What this translates to is that starting from Meteor Lake, the integrated graphics can no longer allocate on the last-level cache (LLC), the highest numbered cache accessed by the cores before fetching from memory. Instead, only the CPU cores can allocate to it. Even more interesting is the mention of the Meteor Lake platform's level 4 (L4) cache. For the first time since Haswell and Broadwell, Intel may be planning to bring back the L4 cache and integrate it into the CPU.

Usually, modern processors use L1, L2, and L3 caches where the L1 version is the fastest and smallest, while the others are larger but slower. The inclusion of L4 caches often is unnecessary, as this type of cache can consume a big area on the processor die while bringing little benefit, translating to the cost of manufacturing drastically soaring. However, with Meteor Lake and its multi-die tile design, we wonder where the L4 cache will end up. We could see integration into the base tile, which holds the compute cores and essential compute elements. This makes the most sense since the logic needs access to fast memory, and L4 could improve the performance in specific applications.

Personal computers (PCs) based on Arm architecture will grow in popularity and their market share will almost double from 14% now to 25% by 2027, according to Counterpoint Research's latest projections. The ability of Arm-based hardware to run Mac OS has allowed Apple to capture 90% of the Arm-based notebook computer market. However, the full support of Windows and Office365 and the speed of native Arm-based app adoption are also critical factors in determining the Arm SoC penetration rate in PCs. Once these factors are addressed, Arm-based PCs will become a viable option for both daily users and businesses.

As more existing PC OEMs/ODMs and smartphone manufacturers enter the market, they will bring their expertise in Arm-based hardware and software, which will further boost the popularity of Arm-based PCs. The availability of more native Arm-based apps will also increase user comfort and familiarity with the platform. Overall, the trend towards Arm-based PCs is expected to continue and their market share will likely increase significantly in the coming years.

ENDORFY, the European manufacturer of CPU coolers, power supplies, PC cases and lifestyle products, has announced the release of its latest addition to the liquid cooling system line-up - the Navis F240 ARGB and NAVIS F360 ARGB. The new models combine features like the ultra-silent PWM-controlled ceramic-bearing block-pump and a high-quality radiator with new ARGB-illumination. The ARGB-backlight is embedded in the cooler-block and goes exceptionally well with the pre-installed and very silent Fluctus 120 PWM ARGB fans.

Designed to cater to the needs of the most demanding users, the NAVIS F240 ARGB and NAVIS F360 ARGB series offer exceptional cooling efficiency and an improved acoustic experience. ENDOFY achieves this by utilizing the the award-winning Fluctus 120 PWM fans, which are now equipped with impressive ARGB illumination and can be controlled using PWM-signal in the extended range of 250 to 1.800 RPM.

The Meteor Lake codename has been linked to the fourteenth generation of Intel's Core lineup for a while, following several significant leaks in 2022 and 2023. According to newly unearthed internal documentation and benchmark data, Intel has confirmed that the Meteor Lake family of CPUs will form its upcoming 14th Gen Core lineup - with laptop variations expected to arrive mid-2023 and heavily speculated desktop units in the fourth quarter, although a middle of the year refresh of Raptor Lake could push the entire Meteor Lake range's release window into 2024.

Meteor Lake is anticipated to be Intel's debuting of a "disaggregated" design - the most advanced laptop CPU variant features a top-of-the-line 6P+8E core configuration. Intel is solely responsible for fabrication of an IOE (I/O) tile (the company's own term for a chiplet) with PCIe 5.0 plus Thunderbolt 4, as well as an SoC tile. The GPU part of the design is rumored to be based on their own Arc Alchemist architecture, and TSMC has been contracted to manufacture this graphics tile - not a big surprise since Intel has also placed substantial manufacturing orders for discrete Arc cards with the Taiwanese foundry.

Amid the push for technology independence, Chinese companies are pushing out more products to satisfy the need for the rapidly soaring demand for domestic data processing silicon. Today, we have information that Chinese Loongson has launched a 3D5000 CPU with as many as 32 cores. Utilizing chiplet technology, the 3D5000 represents a combination of two 16-core 3C5000 processors based on LA464 cores, based on LoongArch ISA that follows the combination of RISC and MIPS ISA design principles. The new chip features 64 MB of L3 cache, supports eight-channel DDR4-3200 ECC memory achieving 50 GB/s, and has five HyperTransport (HT) 3.0 interfaces. The TDP configuration of the chip is officially 300 Watts; however, normal operation is usually at around 150 Watts, with LA464 cores running at 2 GHz.

Scaling of the new chip goes beyond the chiplet, and pours over into system, as 3D5000 supports 2P and 4P configurations, where a single motherboard can become a system of up to 128 cores. To connect them, Loongson uses a 7A2000 bridge chip that is reportedly 400% faster than the previous solution, although we have no information about the last chip bridge. Based on the LGA-4129 package, the chip size is 75.4x58.5×6.5 mm. Regarding performance, Loongson compares it to the average Arm chip that goes into smartphones and claims that its designs are up to four times faster. In SPEC2006, performance reaches 425 points, while maintaining a single TeraFLOP at dual-precision 64-bit format. On the other hand, the processor was built for security, as the chip has a custom hardware-baked security to prevent Spectre and Meltdown, has an on-package Trusted Platform Module (TPM), and has a secret China-made security algorithm with an embedded custom security module that does encryption and decryption at 5 Gbps.

Steam's latest March survey has put NVIDIA's GeForce RTX 3060 at the top, reaching over 10 percent and surpassing both the GTX 1060 and the RTX 2060. NVIDIA has been holding the crown with over 80 percent of users running on their GPUs, while AMD held just over 10 percent. This means that the NVIDIA RTX 3060 almost has more users on Steam than all AMD Radeon graphics cards combined. Intel holds just over 6 percent. Bear in mind that Intel and AMD numbers also include integrated GPUs.

When it comes to CPUs, there are 74.46 percent running on Intel CPUs and 25.54 percent on AMD. Most users use a 6-core CPU, 45.76, with 8-core CPUs taking 18.45 percent. The memory amount has obviously risen, as 56.92 percent run on 16 GB, and 22.41 percent have 32 GB systems. When it comes to OS, most users are running on Windows 10, 73.95 percent, while Windows 11 OS takes 22.41 percent. While some might argue that the Steam Survey is not exactly precise as it is apparently based on a random survey, it does give a general idea and shows the big picture.

Tenstorrent hosted their "Nerds Talking to Nerds About RISC-V" event this week in India where a dozen high profile industry experts hosted technical talks and panels about every facet of the RISC-V landscape and future. Among these are some familiar names to anyone who's been keeping up on the CPU industry; Raja Koduri of his own AI Generative Gaming startup company, Lars Bergstrom of Google, Naveed Sherwani of Rapid Silicon, and of course Jim Keller the CEO of Tenstorrent itself. On the first day of the event a mere 42 minutes into the YouTube live stream during his keynote talk, Jim Keller is providing an overview of Tenstorrent's latest silicon design goals. He presents a slide showing a wide comparison of various competitor's integer performance in SPEC CPU 2017 INT wherein a raw performance value for AMD's yet released "Zen 5" is listed, as well as the operating frequency and TDP of the supposed sample.

The slide shows all of AMD's recent architectures starting with the original "Zen" (Naples) and the improvements each successive generation has made. Also shown is one of Intel's latest "Sapphire Rapids" Xeons, a projected performance point of NVIDIA's in-house CPU architecture "Grace", Amazon's "Graviton" series with a projected result for "Graviton 3," and Tenstorrent's own 8-wide RISC-V architecture as it currently performs in their labs. While all of these are fascinating results in their own right, we're going to narrow in on the "Zen 4" (Genoa) and "Zen 5" results. We can see from the Frequency and TDP charts that "Zen 4" is clocked at 3.8 GHz as it's equal to the Xeon Platinum 8480+ (which itself boosts to 3.8 GHz in light threaded workloads such as this) so is therefore likely a variant of EPYC 9354 or 9454 with its TDP configured at the minimum 240 W. The unnamed "Zen 5" CPU is shown to be running at around 4.0 GHz with the same 240 W TDP, a tiny 5% bump in core clock, while delivering a substantial 30% jump in performance. The most interesting detail here is that nowhere is it listed—as with "Grace" and "Graviton 3"—that this is a projected result.

[Editor's note: Our in-depth review of Antec Performance 1 FT Case is now live]

With outstanding cooling performance and lots of useful features, Antec Inc. presents the latest flagship of full towers, the new Performance 1 FT. Featuring an airflow-enhanced front panel design, magnetic front filter, and four pre-installed PWM fans, this new chassis provides efficient airflow and great cooling performance. The case is now commercially available from MSRP US$159.99.

The new Antec flagship supports the latest RTX 40 Series GPUs. Considering the increasing demands for CPU and GPU cooling, Antec designed the Performance 1 FT to enhance the air intake, improve the cable routing, and enable an easy installation with various options. The new temperature display function allows to keep control of the components. The display screen located on the case top allows users to check the temperature of the GPU and CPU at a glance. It addresses the need for temperature monitoring without purchasing expensive cooling kits.

Microsoft has implemented two new features into its DirectX 12 API - GPU Upload Heaps and Non-Normalized sampling have been added via the latest Agility SDK 1.710.0 preview, and the former looks to be the more intriguing of the pair. The SDK preview is only accessible to developers at the present time, since its official introduction on Friday 31 March. Support has also been initiated via the latest graphics drivers issued by NVIDIA, Intel, and AMD. The Microsoft team has this to say about the preview version of GPU upload heaps feature in DirectX 12: "Historically a GPU's VRAM was inaccessible to the CPU, forcing programs to have to copy large amounts of data to the GPU via the PCI bus. Most modern GPUs have introduced VRAM resizable base address register (BAR) enabling Windows to manage the GPU VRAM in WDDM 2.0 or later."

They continue to describe how the update allows the CPU to gain access to the pool of VRAM on the connected graphics card: "With the VRAM being managed by Windows, D3D now exposes the heap memory access directly to the CPU! This allows both the CPU and GPU to directly access the memory simultaneously, removing the need to copy data from the CPU to the GPU increasing performance in certain scenarios." This GPU optimization could offer many benefits in the context of computer games, since memory requirements continue to grow in line with an increase in visual sophistication and complexity.

Creating, consuming and collaborating in a hybrid world just got easier with Lenovo's latest generation of Windows 11 Yoga laptops that deliver impressive performance, incredible versatility, and easy mobility in a sleek and portable design:

"We know that digital content creators continue to embrace the hybrid lifestyle to create anytime, anywhere, from making videos to designing graphics on the move," says Jun Ouyang, Lenovo's vice president and general manager of the Consumer Business Segment, Intelligent Devices Group. "Lenovo's latest new premium Yoga Pro laptops are made for creators. Combining performance and portability, including an impressive new Mini-LED PureSight Pro display and an upgraded keyboard, creators will revel in the exceptional user experience to create whenever inspiration strikes."

Introducing the CHIONE P3 high-performance liquid cooler - the next-generation cooling solution designed to offer top-notch performance on any setup. The CHIONE P3 AIO features a highly customizable IPS LCD display to show off your own style, a high-performance motor pump to offer extreme cooling, and fine-tuned AEOLUS M3 PWM fans to provide superior airflow. Available with 360 mm and 240 mm radiator sizes, the CHIONE P3 is the ultimate cooling solution for gamers and enthusiasts.

PERSONALIZED LCD DISPLAY
Equipped with a customizable IPS LCD display, the CHIONE P3 allows you to monitor your system performance statistics in real-time, while also personalizing the screen with any images or animated GIFs as the background. The pump head features a stunning ARGB lighting ring with pre-installed lighting modes for a dazzling display of lighting effects.

Softbank, the owner of Arm Ltd., is preparing everything it can to ensure a successful initial public offering (IPO) of Arm. However, ahead of the IPO, we have more information about Arm's plans to change its licensing and pricing structures to collect more royalties and ensure higher cash flow for future investors. Currently, Arm licenses technology in the form of intellectual property (IP), usually in different flavors of Cortex-A CPU cores that go inside processors for phones and laptops. Chipmakers that use the IP have additional expenses such as Arm ISA license fee and per-chip royalty, which is based on the chip's average selling price.

However, according to Financial Times, we have a new pricing structure that changes how Arm bills its partners and customers. From now on, Arm will grant licenses to chipmakers and ask them to only ship to device makers with an agreement with Arm. Additionally, these device makers now pay per-device royalty based on the device's average selling price (ASP). This ensures that Arm's fee applies to the higher margin product, which means that ultimately Arm will collect more cash flow from its customers and partners. Currently, the old model charges around 1-2 percents per chip in each smartphone, considering the ASP of smartphone chips to be $40 for Qualcomm, $17 for MediaTek, and $6 for Unisoc. However, taking the ASP of a mobile phone at $335, as recorded in 2022, the fee would be much higher. People familiar with the matter noted that Arm will apply this pricing structure as early as 2024. Apple and Samsung are not impacted by this change, as both companies enjoy their own agreements with Arm.

Apple's engineering team is rumored to be adjusting performance targets set for its next generation mobile SoC - the A17 Bionic - due to issues at the TSMC foundry. The cutting edge 3 nm process is proving difficult to handle, according to industry tipsters on Twitter. The leaks point to the A17 Bionic's overall performance goals being lowered by 20%, mainly due to the TSMC N3B node not meeting production targets. The factory is apparently lowering its yield and execution targets due to ongoing problems with FinFET limitations.

The leakers have recently revealed more up-to-date A17 Bionic's Geekbench 6 scores, with single thread performance at 3019, and multi-thread at 7860. Various publications have been hyping the mobile SoC's single thread performance as matching that of desktop CPUs from Intel and AMD, more specifically 13th-gen Core i7 and 'high-end' Ryzen models. Naturally the A17 Bionic cannot compete with these CPUs in terms of multi-thread performance.

AMD's EPYC lineup already features the new Zen 4 core designed for better performance and efficiency. However, since the release of EPYC Milan-X processors with 3D V-cache integrated into server offerings, we wondered if AMD will continue to make such SKUs for upcoming generations. According to the report from Wccftech, we have a leaked table of specifications that showcase what some seemingly top-end Genoa-X SKUs will look like. The two SKUs listed here are the "100-000000892-04" coded engineering sample and the "100-000000892-06" coded retail sample. With support for the same SP5 platform, these CPUs should be easily integrated with the existing offerings from OEM.

As far as specifications, this processor features 384 MBs of L3 cache coming from CCDs, 768 MBs of L3 cache from the 3D V-Cache stacks, and 96 MBs of L2 cache for a total of 1248 MBs in the usable cache. A 3 MB stack of L1 cache is also dedicated to instructions and primary CPU data. Compared to the regular Genoa design, this is a 260% increase in cache sizes, and compared to Milan-X, the Genoa-X design also progresses with 56% more cache. With a TDP of up to 400 Watts, configurable to 320 Watts, this CPU can boost up to 3.7 GHz. AMD EPYC Genoa-X CPUs are expected to hit the shelves in the middle of 2023.

If you were one of those that were waiting with bated breath for AMD's Zen 4 based "Phoenix" line-up of mobile CPUs, you're going to be waiting a little longer. Late on Friday afternoon AMD announced that they have delayed the launch of their Ryzen Mobile 7040HS series of CPUs, pushing the expected launch window from late March to some time in April. Speculation abound as to why this may be, but the direct correspondence from AMD's PR department is sparse:

To align with platform readiness and ensure the best possible user experience, we now expect our OEM partners to launch the first notebooks powered by Ryzen 7040HS Series processors in April.

As a refresher on the "Phoenix" line of CPUs these are the next-generation Zen 4 based monolithic SoCs built on TSMC's 4 nm process first announced back in January. These chips feature up to 8 Zen 4 cores with turbo clocks reaching 5 to 5.2 GHz, an RDNA3 based integrated GPU with clocks as high as 3 GHz, and AMD's first AI coprocessor dubbed Ryzen AI. Despite being Zen 4 these SoCs are still using PCI-E Gen 4 but are not hamstrung by a lack of lanes like some previous generations. We've already seen substantial leaks over the past few days hinting at the performance of these chips which suggests they will offer good competition to Intel's shipping 13th Gen Raptor Lake mobile offerings.

Qualcomm Technologies, Inc. announced the new Snapdragon 7+ Gen 2 Mobile Platform—delivering premium experiences brand new to the Snapdragon 7-series. Snapdragon 7+ Gen 2 provides exceptional CPU and GPU performance fueling swift, nonstop gaming, dynamic low-light photography and 4K HDR videography, AI-enhanced experiences and high-speed 5G and Wi-Fi connectivity.

"Snapdragon is synonymous with premium mobile experiences. Today's launch of the Snapdragon 7+ Gen 2 illustrates our ability to bring some of the most in-demand flagship features to our Snapdragon-7 series—making them accessible to more people," said Christopher Patrick, senior vice president and general manager of mobile handsets, Qualcomm Technologies, Inc. "We are committed to delivering the most innovative solutions to meet the needs of consumers, our customers, and the industry at large."

Kernel information for a chipset code-named 'Quadra' has been leaked by Home IT. It appears that this SoC is under development at Samsung Electronics, and could be featured in the company's next generation flagship smartphone range. The recently released Galaxy S23 smartphone series is powered by Qualcomm's cutting-edge Snapdragon 8 Gen 2 processor, which ended up being a fine choice for the end user. This was not an ideal partnership for the semiconductor giant, considering its constant push to promote internally developed hardware.

Industry experts have praised Samsung for not integrating an Exynos processor into this generation of devices, including regional model variations, but that has not stopped the company's persistent development cycle of proprietary mobile CPUs. Rumors point to a collaboration with Google, and the Exynos 2300 SoC looks to form the basis of the latter's next generation Tensor G3 chipset. The leak reveals that the standard 2300 has been designed as a 1+4+4 core configuration, comprised of four performance cores, four efficiency cores, and one super core.

Intel's latest Xeon processors based on Sapphire Rapids uArch have arrived in the hands of overclockers. Last week, we reported that the Intel Xeon W9-3495X is officially a world record holder for achieving the best scores in Cinebench R23 and R20, Y-Cruncher, 3DMark CPU test, and Geekbench 3. However, today we have another extreme overclocking attempt to beat the world record, with little more details about power consumption and what the new SKU is capable of. Elmor, an overclocker working with ASUS, has tried to break the world record and overclocked the Intel Xeon W9-3495X CPU to 5.5 GHz on all 56 cores. What is more impressive is the power that the processor can consume.

With a system powered by two Superflower Leadex 1,600 Watt power supply units, the CPU consumed almost 1,900 Watts of power from the wall. To manage to cool this heat output, liquid nitrogen was used, and the CPU stayed at a cool negative 95 degrees Celsius. The motherboard of choice for this attempt was ASUS Pro WS W790E-SAGE SE, paired with eight GSKILL Zeta R5 DDR5 R-DIMMs modules. And results were incredible, as the CPU achieved 132,220 points in Cinebench R23. However, the world record of the previous week has remained intact, as Elmor 's result is a bit behind last week's score of 132,484 points. Check the video below for more info.

A new benchmark of the AMD Radeon 780M RDNA3-based iGPU has now been spotted in Geekbench, showing it to be on par with the NVIDIA GeForce GTX 1650. The benchmark was done on the announced AMD Ryzen 7 7840HS CPU, which is a part of AMD's 4 nm Ryzen 7040 "Phoenix" lineup. The CPU in question is an 8-core/16-thread SKU with 40 MB of cache. It works at 3.8 GHz base and 5.1 GHz boost clocks and has a TDP of 35 W to 45 W. The same CPU comes with Radeon 780M RDNA3 iGPU with 12 Compute Units (CUs), for a total of 768 Stream Processors, and works at 2700 MHz.

The Geekbench OpenCL benchmark was fired up on a Chinese laptop with 32 GB of RAM and running on the Windows balanced power plan, where it scored a decent 36,757 points. This score puts it somewhere around the NVIDIA GeForce GTX 1650 and AMD Radeon RX 480 discrete graphics cards. This is an impressive result considering that this is a mid-SKU in the announced Ryzen 7040 series. Of course, we still do not know the specified TDP for this laptop, or what memory was used, so results might be slightly different. Since these laptops are yet to appear in retail, AMD is probably still tweaking the drivers, so we expect these numbers could be even higher for the full release.

AIC today announced its EB202-CP is ready to support newly launched 4th Gen AMD EPYC Embedded 9004 processors. By leveraging the five-year product longevity supported by AMD EPYC Embedded processors, EB202-CP provides customers with stable and long-term support. AIC and AMD will join forces to showcase EB202-CP at Embedded World in AMD stand No. 2-411 from 14th to 16th March, 2023 in Nuremberg, Germany.

AIC EB202-CP, a 2U rackmount server designed for AI and edge appliances, is powered by the newly released 4th Gen AMD EPYC Embedded processors. Featuring the world's highest-performing x86 processor and PCIe 5.0 ready, the 4th Gen AMD EPYC Embedded processors enable low TCO and delivers leadership energy efficiency as well as state-of-the-art security, optimized for workloads across enterprise and edge. EB202-CP, with 22 inch in depth, supports eight front-serviceable and hot-swappable E1.S/ E3.S and four U.2 SSDs. By leveraging the features of the 4th Gen AMD Embedded EPYC processors, EB202-CP is well suited for broadcasting, edge and AI applications, which require greater processing performance and within the most efficient, space-saving format.

AMD today announced it is bringing world-class performance and energy efficiency to embedded systems with AMD EPYC Embedded 9004 Series processors. The new 4th generation EPYC Embedded processors powered by "Zen 4" architecture provide technology and features for embedded networking, security/firewall and storage systems in cloud and enterprise computing as well as industrial edge servers for the factory floor.

Built on the "Zen 4" 5 nm core, the processors combine speed and performance while helping reduce both overall system energy costs and TCO. The series is comprised of 10 processor models with performance options ranging from 16 to 96 cores, and a thermal design power (TDP) profile ranging from 200 W to 400 W. The performance and power scalability afforded with AMD EPYC Embedded 9004 Series processors make them an ideal fit for embedded system OEMs expanding their product portfolios across a range of performance and pricing options. The AMD EPYC Embedded 9004 Series processors also include enhanced security features to help minimize threats and maintain a secure compute environment from power-on to run time, making them well suited for applications with enterprise-class performance and security needs.