With Intel Raptor Lake-S desktop processors around the corner, we see an ever-increasing number of entries to the popular synthetic benchmark databases. Yesterday we had an Intel Core i5-3600K CPU, while today, we are presented with Core i7-13700K SKU. The new 13th generation Core i7-13700K CPU features eight P-cores and eight E-cores. Compared to the 12th generation Core i7-12700K, this is a step up with eight P-cores and four E-cores. According to Geekbench 5 benchmark, the new Qualification Sample (QS) of Core i7-13700K CPU was running at the minimum clock of 5.289 GHz, maximum clock of 5.381 GHz, and average speed of 5.36 GHz. It was tested on the same configuration as yesterday's i5 SKU with ASRock Z690 Steel Legend WiFi 6E motherboard with 32 GB of DDR4 memory.

As far as the results are concerned, the 13th gen i7-13700K SKU scored 2090 points in the single-core test, while the multi-core score totaled 16542 points. If we compare this to the 12th gen i7-12700K CPU that it replaces, the new model leads by about 10% and 17% in single-core and multi-core tests, respectively.

Intel's upcoming Sapphire Rapids processors will not only be present in the server sector but will also span the high-end desktop (HEDT) platform. Today, according to the findings of a Twitter user, @InstLatX64, we have an appearance of Intel's upcoming Sapphire Rapids HEDT SKU in Kernel.org boot logs. Named Intel Xeon W9-3495, this model features 56 cores and 112 threads. While there is no specific information about base and boost frequencies, we know that the SKU supports AVX-512 and AMX instructions. This is a welcome addition, as we have seen Intel disable AVX-512 on consumer chips altogether.

With a high core count and additional instructions for Deep Learning, this CPU will power workstations sometimes in the future. With the late arrival of Sapphire Rapids for servers, a HEDT variant should follow.

According to the latest report from Nikkei Asia, Intel will raise its CPU pricing structure starting this fall. Citing concerns of increased electricity, raw materials, and labor costs, Intel has informed its clients that the company will add additional overhead to its existing pricing structure to make up for that difference. The report indicates that most of its microprocessors and peripheral chip products will be affected. However, the main target of the inflating costs is the company's Core and Xeon processor families. If you are wondering just how much will this price hike be, the current speculations point to anywhere from a 10 to 20 percent increase.

Of course, this information should be taken with a grain of salt. However, it is quite possible to see this price hike in the upcoming fall season, and we have to wait and see if it plays out.

In recent years, consumer storage products have seen rapid developments. This year, the industry will officially be entering the first year of Gen5 SSDs. In response to risen temperatures caused by the high transfer speeds of PCIe Gen 5 SSDs, T-FORCE, the gaming sub-brand of Team Group, has launched the world's first all-in-one ARGB liquid cooling system to reduce heat generated by both the CPU and SSD, allowing PCIe Gen5 SSDs to maintain optimal temperatures and stable, high-speed operations for sustained periods. With the new cooling solution, consumers can fully experience the efficient storage performance of next-generation SSDs without any compromises.

Beginning in the 2000s, as the consumer market demanded higher read and write speeds for storage devices, solid-state drives (SSDs) began to replace mechanical hard drives (HDDs) in large numbers. SATA SSDs eventually became the go-to choice for storage upgrades. With the demand for high-speed storage driven by big data and the spread of transmission technology, PCIe became the standard interface for high-speed transmission. In the past few years, read speeds of PCIe SSDs have increased from 3,500 MB/s in Gen3 to 7,000 MB/s in Gen4. PCIe Gen5 SSDs now have over 12,000 MB/s read and write speeds. The large leaps in transfer speeds of each successive generation of SSDs have led to increased power wattage, which in turn have resulted in higher operating temperatures. When SSDs experience rising operating temperatures at high transfer speeds, an automatic throttling mechanism is activated to protect components from damage caused by the high temperatures. With power consumption of approximately 12 W on a PCIe Gen4 SSD running at 7,000 MB/s, the controller temperature can reach over 110℃. When PCIe Gen5 SSDs have speeds of over 12,000 MB/s and consume 14 W or above, one can expect controller temperatures to rise sharply. Therefore, Team Group is committed to providing the best thermal solutions for stable, high-speed operation of SSDs over sustained periods.

Hyperscalers such as Microsoft, Google, Amazon, etc., all run their cloud divisions with a specific goal. To provide their hardware to someone else in a form called instance and have the user pay for it by the hour. However, instances are usually bound by a specific CPU and memory configuration, which you can not configure yourself. But instead, you can only choose from the few available options that are listed. For example, when selecting one virtual CPU core, you get two GB of RAM and can go as high as you want with CPU cores. However, the available RAM will also double, even though you might not need it. When renting an instance, the allocated CPU cores and memory are yours until the instance is turned off.

And it is precisely this that hyperscalers are dealing with. Many instances don't fully utilize their DRAM, making the whole data center usage inefficient. Microsoft Azure, one of the largest cloud providers, measured that 50% of all VMs never touch 50% of their rented memory. This makes memory stranded in a rented VM, making it unusable for anything else.

At Azure, we find that a major contributor to DRAM inefficiency is platform-level memory stranding. Memory stranding occurs when a server's cores are fully rented to virtual machines (VMs), but unrented memory remains. With the cores exhausted, the remaining memory is unrentable on its own, and is thus stranded. Surprisingly, we find that up to 25% of DRAM may become stranded at any given moment.

When designing integrated circuits, engineers aim to produce an efficient design that is easier to manufacture. If they manage to keep the circuit size down, the economics of manufacturing that circuit is also going down. NVIDIA has posted on its technical blog a technique where the company uses an artificial intelligence model called PrefixRL. Using deep reinforcement learning, NVIDIA uses the PrefixRL model to outperform traditional EDA (Electronics Design Automation) tools from major vendors such as Cadence, Synopsys, or Siemens/Mentor. EDA vendors usually implement their in-house AI solution to silicon placement and routing (PnR); however, NVIDIA's PrefixRL solution seems to be doing wonders in the company's workflow.

Creating a deep reinforcement learning model that aims to keep the latency the same as the EDA PnR attempt while achieving a smaller die area is the goal of PrefixRL. According to the technical blog, the latest Hopper H100 GPU architecture uses 13,000 instances of arithmetic circuits that the PrefixRL AI model designed. NVIDIA produced a model that outputs a 25% smaller circuit than comparable EDA output. This is all while achieving similar or better latency. Below, you can compare a 64-bit adder design made by PrefixRL and the same design made by an industry-leading EDA tool.

Intel's upcoming family of Arc Alchemist mobile graphics cards is just around the corner, and we are already starting to spot the company's reference systems utilizing the latest dedicated graphics. Thanks to the findings of @momomo_us, we have information that Intel is readying the NUC X15 laptop reference system codenamed "Alder Country." There are two SKUs, LAPAC71G and LAPAC71H, each with similar CPU and GPU configurations. Carrying an Intel Core i7-12700H processor with 14 cores and 20 threads, the CPU is paired with either Arc A550M on the LAPAC71G SKU or Arc A730M on LAPAC71H SKU.

As a reminder, Intel already made such NUC X15 reference laptop designs with Tiger Lake processors. However, they came with NVIDIA GeForce RTX 30 graphics instead of Intel Arc Alchemist. Implementations of NUC X15 appeared with partners such as ADATA XPG Xenia laptop. We could expect to see more OEMs adapt Alder Country if the performance of Arc Alchemist graphics proves good.

Mobileye, an Intel company, has launched the EyeQ Kit - its first software development kit (SDK) for the EyeQ system-on-chip that powers driver-assistance and future autonomous technologies for automakers worldwide. Built to leverage the powerful and highly power-efficient architecture of the upcoming EyeQ 6 High and EyeQ Ultra processors, EyeQ Kit allows automakers to utilize Mobileye's proven core technology, while deploying their own differentiated code and human-machine interface tools on the EyeQ platform.

"EyeQ Kit allows our customers to benefit from the best of both worlds — Mobileye's proven and validated core technologies, along with their own expertise in delivering unique driver experiences and interfaces. As more core functions of vehicles are defined in software, we know our customers will want the flexibility and capacity they need to differentiate and define their brands through code."
- Prof. Amnon Shashua, Mobileye president and chief executive officer

Intel is preparing to launch its next-generation desktop platform codenamed Rocket Lake-S. According to the presentation held by Intel today in Shenzen, China, we have official information regarding some of the platform features that Raptor Lake is bringing. Starting with memory support, Raptor Lake is still carrying the transitional DDR4 and DDR5 support, as the full swing towards DDR5 is still in progress. Unlike the previous generation Alder Lake, which brought DDR5-4800 support, Raptor Lake's integrated memory controller can drive DDR5 modules with a 5600 MT/s configuration. As DDR4 support remains, it is limited to 3200 MT/s speed.

Interesting information from the leaked slide points out that support for CPU-attached NVMe storage remains PCIe Gen4. While AMD will provide an AM5 socket with CPU-attached NMVe storage on PCIe Gen5 protocol, Intel is taking a step back and holding on to Gen4. The CPU is outputting 16 PCIe Gen5 lanes on its own. Motherboard vendors for the upcoming 700-series boards for Raptor Lake can still provide a PCIe Gen5 NVMe slot; however, it will have to subtract eight Gen5 lanes from the PCI Express Graphics (PEG) slot and route them to NVMe storage. As our testing shows, this will affect GPU's performance by a few percent. AMD's upcoming AM5 platform has no such issues, as the CPU provides both the PEG and CPU-attached NVMe storage with sufficient PCIe Gen5 bandwidth.

DeepComputing and Xcalibyte today opened pre-orders for the industry's first native RISC-V development laptop. The hotly anticipated ROMA development platform features an unannounced quad-core RISC-V processor with a companion NPU/GPU for the fastest, seamless RISC-V native software development available.

"Native RISC-V compile is a major milestone," said Mark Himelstein, Chief Technology Officer for RISC-V International. "The ROMA platform will benefit developers who want to test their software running natively on RISC-V. And it should be easy to transfer code developed on this platform to embedded systems."

This time last year, I wrote about how digital experiences had never been more important, from personal to business devices - they helped us stay connected and entertained at a time when we needed it most. Compute continues to define our experiences in the modern world, and now these experiences are becoming even more visual.

Smartphones are at the center of our connected lives. From gaming to productivity, through video calling, social media or virtual environments, it is the device that provides us the connection to everyone and everything, in real time. For developers, making these immersive real-time 3D experiences even more compelling and engaging requires more performance. Arm sets the standard for performance and efficient compute, and our latest suite of compute solutions for consumer devices will continue to raise the threshold of what's possible in the mobile market, shaping the visual experiences of tomorrow.

Intel is set to launch its 13th generation Raptor Lake processor lineup for desktop users sometime in September or October. However, the market is already supplied with early-stage engineering samples of Raptor Lake-S SKUs used for testing and software optimization. Today, we have the first listing of the upcoming flagship Intel Core i9-13900K processor with eight P-cores and 16 E-Cores on the CPU. The anonymous seller claims that the CPU is working with ASUS Z690 ROG Apex motherboards, boots up, and can be overclocked, which means that this is one of the newer engineering sample revisions. The sample was listed for 2850 Chinese Yuan, translating to about 426 USD. This price should be close to the final MSRP, and the CPU is already sold.

What is interesting is the appearance of this CPU on the black market way ahead of the launch. We can expect to see more details emerge as we get closer to the launch time later this year.

AMD is preparing to update its mobile sector with the latest IP in the form of Zen4 CPU cores and RDNA3 graphics. According to Red Gaming Tech, we have specifications of upcoming processor families. First, we have AMD Dragon Range mobile processors representing a downsized Raphael design for laptops. Carrying Zen4 CPU cores and RDNA2 integrated graphics, these processors are meant to power high-performance laptops with up to 16 cores and 32 threads. Being a direct competitor to Intel's Alder Lake-HX, these processors also carry an interesting naming convention. The available SKUs include AMD Ryzen 5 7600HX, Ryzen 7 7800HX, Ryzen 9 7900HX, and Ryzen 9 7980HX design with a massive 16-core configuration. These CPUs are envisioned to run along with more powerful dedicated graphics, with clock speeds of 4.8-5.0+ GHz.

Next, we have AMD Phoenix processors, which take Dragon Range's design to a higher level thanks to the newer graphics IP. Having Zen4 cores, Phoenix processors carry upgraded RDNA3 graphics chips to provide a performance level similar to NVIDIA's GeForce RTX 3060 Max-Q SKU, all in one package. These APUs will come in four initial configurations: Ryzen 5 7600HS, Ryzen 7 7800HS, Ryzen 9 7900HS, and Ryzen 9 7980HS. While maxing out at eight cores, these APUs will compensate with additional GPU compute units with a modular chiplet design. AMD Phoenix is set to become AMD's first chiplet design launching for the laptop market, and we can expect more details as we approach the launch date.

The Exascale supercomputing race is now well underway, as the US-based Frontier supercomputer got delivered, and now we wait to see the remaining systems join the race. Today, during 79th HPC User Forum at Oak Ridge National Laboratory (ORNL), Terri Quinn at Lawrence Livermore National Laboratory (LLNL) delivered a few insights into what El Capitan exascale machine will look like. And it seems like the new powerhouse will be based on AMD's Instinct MI300 APU. LLNL targets peak performance of over two exaFLOPs and a sustained performance of more than one exaFLOP, under 40 megawatts of power. This should require a very dense and efficient computing solution, just like the MI300 APU is.

As a reminder, the AMD Instinct MI300 is an APU that combines Zen 4 x86-64 CPU cores, CDNA3 compute-oriented graphics, large cache structures, and HBM memory used as DRAM on a single package. This is achieved using a multi-chip module design with 2.5D and 3D chiplet integration using Infinity architecture. The system will essentially utilize thousands of these APUs to become one large Linux cluster. It is slated for installation in 2023, with an operating lifespan from 2024 to 2030.

Intel's high-end desktop (HEDT), usually reserved for workstation and enterprise applications, is due for an update, and the company is readying an entire family of updated products. Today, we found a leak of what appears to be an Intel Sapphire Rapids design made for desktops. Called Xeon W5-3433, the CPU appears in the SiSoftware Sandra benchmark database. It carries a configuration of 16 cores and 32 threads and is equipped with 32 MB of L2 cache and 45 MB of L3 cache. Having 2 MB of L2 cache per core suggests that the design is not an Alder Lake variation. This specific SKU is clocked at 1.99 GHz, meaning an early engineering sample.

The Sapphire Rapids HEDT platform is codenamed FishHawk Falls. Intel is supposed to offer Alder Lake-X processors with higher core counts and the FishHawk Falls. Both will be running on the same W790 chipset; however, the Sapphire Rapids implementation will carry more cores in a Xeon package designed for professionals. There was an Ice Lake-X Xeon processor called Xeon W-3335 with 16 cores and 32 threads, meaning that the leaked Xeon W5-3433 is its direct successor.

With the launch of Apple Silicon for Mac computers, Apple has established itself as a great user of the Arm instruction set. Starting with M1, the company released an entirely new family of products running Apple Silicon. Today, thanks to the research of Strategy Analytics company, we have information that Apple is capturing as much as 90% of the revenue share present in the Arm PC market. The Arm PC market is a tiny subset of the entire PC market, mainly equipped with one-off Windows-on-Arm devices, Chromebook PCs, and Apple Macs. With the naturally low prices of the remaining Arm PCs, Apple Arm PCs offer a relatively high price point and a much more incredible selection of products.

On the global scale, Arm PCs now account for 9% of the total PC market share, where x86 vendors are dominating the field. "Apple's M-series family of processors set the benchmark and gave Apple a 2-3-year lead over the rest of the Arm-based PC processor vendors. Qualcomm captured just 3% revenue share in the Arm-based notebook PC processor market in 2021 and lags Apple in CPU performance," said Sravan Kundojjala, Director of Handset Component Technologies service at Strategy Analytics. This points to a particular case of Apple's better product and feeding the demand with higher-performing processors. Qualcomm's acquisition of Nuvia should yield different results in the coming years, as the new IP is yet to appear in Qualcomm SoCs.

The recently announced Apple M2 processor which is set to feature in the new MacBook Air and 13-inch MacBook Pro models has been benchmarked. The processor appeared in numerous Geekbench 5 CPU & GPU tests where the chip scored a maximum single-core result of 1919 points and 8928 points in multi-core representing an 11% and 18% CPU performance improvement respectively from the M1. The chip brings significant GPU performance increases achieving a Geekbench Metal score of 30627 points which is a ~42% increase from the M1 partially due to a larger 10-core GPU compared to the 8-core GPU on the M1. These initial numbers largely align with claims from Apple of an 18% CPU and 35% GPU improvement over the original M1.

In 2017, the semiconductor world was shocked to discover new vulnerabilities in modern Intel, AMD, and Arm processors. Dubbed Spectre and Meltdown, these exploits used cache-based side-channel attacks to steal information from the system. Today, we are getting a more advanced side-channel vulnerability hidden in every CPU capable of boosting frequencies. Interestingly called "Heartzbleed," the new exploit can steal secret AES cryptographic keys when observing CPU's boost frequencies. The attack works by monitoring the power signature of any cryptographic workload. As with any other element in a CPU, the workload's power varies according to the processor's frequency scaling in different situations. Observing this power information can be converted into timing data, allowing an attacker to steal cryptographic keys. This is done using Dynamic Voltage Frequency Scaling (DVFS), a part of any modern processor.

Intel and AMD already published that their systems are vulnerable and affected by Heartzbleed exploit. It is labeled Intel-SA-00698 ID and CVE-2022-24436 ID for Intel CPUs and CVE-2022-23823 for AMD CPUs. It affects all Intel processors, and Zen 2 and Zen 3 AMD CPUs. The attacker can exploit this vulnerability remotely without requiring physical access. Intel and AMD will not offer microcode mitigations that should prevent this type of exploit from executing successfully. Additionally, Intel stated that this attack is not very practical outside of laboratory research, as it allegedly takes hours to days to steal cryptographic keys. The performance penalty for mitigating this attack ranges from high to low, depending on the type of implementation.

Based on a report in the Taiwanese media, AMD is quickly becoming a key customer for TSMC and is expected to become its third largest customer in 2023. This is partially due to new orders that AMD has placed with TSMC for its 5 nm node. AMD is said to become TSMC's single largest customer for its 5 nm node in 2023, although it's not clear from the report how large of a share of the 5 nm node AMD will have.

The additional orders are said to be related to AMD's Zen 4 based processors, as well as its upcoming RDNA3 based GPUs. AMD is expected to be reaching a production volume of some 20,000 wafers in the fourth quarter of 2022, although there's no mention of what's expected in 2023. Considering most of AMD's products for the next year or two will all be based on TSMC's 5 nm node, this shouldn't come as a huge surprise though, as AMD has a wide range of new CPU and GPU products coming.

Apple M1 chips are a part of the Apple Silicon family that represents a new transition to Arm-based cores with new power and performance targets for Apple devices. A portion of building a processor is designing its security enclave, and today we have evidence that M1 processors got a new vulnerability. The PACMAN is a hardware attack that can bypass Pointer Authentication (PAC) on M1 processors. Security researchers took an existing concept of Spectre and its application in the x86 realm and now applied it to the Arm-based Apple silicon. PACMAN exploits a current software bug to perform pointer authentication bypass, which may lead to arbitrary code execution.

The vulnerability is a hardware/software co-design that exploits microarchitectural construction to execute arbitrary codes. PACMAN creates a PAC Oracle to check if a specific pointer matches its authentication. It must never crash if an incorrect guess is supplied and the attack brute-forces all the possible PAC values using the PAC Oracle. To suppress crashes, PAC Oracles are delivered speculatively. And to learn if the PAC value was correct, researchers used uArch side channeling. In the CPU resides translation lookaside buffers (TLBs), where PACMAN tries to load the pointer speculatively and verify success using the prime+probe technique. TLBs are filled with minimal addresses required to supply a particular TLB section. If any address is evicted from the TLB, it is likely a load success, and the bug can take over with a falsely authenticated memory address.

Jon Peddie Research reports that the global PC-based graphics processor units (GPU) market reached 96 million units in Q1'22 and PC GPUs shipments decreased 6.2% due to disturbances in China, Ukraine, and the pullback from the lockdown elsewhere. However, the fundamentals of the GPU and PC market are solid over the long term, JPR predicts GPUs will have a compound annual growth rate of 6.3% during 2022-2026 and reach an installed base of 3.3 million units at the end of the forecast period. Over the next five years, the penetration of discrete GPUs (dGPU) in the PC market will grow to reach a level of 46%.

AMD's overall market share percentage from last quarter increased 0.7%, Intel's market share decreased by -2.4%, and Nvidia's market share increased 1.69%, as indicated in the following chart.

Amazon's AWS division has been making Graviton processors for a few years now, and the company recently announced its Graviton3 design will soon to available in the cloud. Today, we are witnessing a full launch of the Graviton3 CPUs with the first instances available in the AWS Cloud. In theC7g instances, AWS customers can now scale their workloads across 1-64 vCPU instance variants. Graviton3's 64 cores run at 2.6 GHz clock speed, 300 GB/sec maximum memory bandwidth, DDR5 memory controller, 64 cores, seven silicon die chiplet-based design, 256-bit SVE (Scalable Vector Extension), all across 55 billion transistors. Paired with up to 128 GiB of DDR5 memory, these processors are compute-intensive solutions. AWS noted that the company used a monolithic computing and memory controller logic design to reduce latency and improve performance.

One interesting thing to note is the motherboard that AWS hosts Graviton3 processors in. Usually, server motherboards can be single, dual, or quad-socket solutions. However, AWS decided to implement a unique solution with three sockets. This tri-socket setup is designed to see each CPU as an independent processor, managed by a Nitro Card, which can handle exactly three CPUs. The company notes that the CPU is now in general availability with C7g instances and you can see it below.

Many companies, including Intel and AMD, have stopped product shipments to Russia amidst the war in Ukraine in the past few months. This has left the Russian state without any new processors from the two prominent x86 designers, thus slowing down the country's technological progress. To overcome this issue, it seems like the solution is embedded in the Chinese Zhaoxin x86 CPUs. According to the latest report from Habr, a motherboard designer called Dannie is embedding Chinese Zhaoxin x86 CPUs into motherboards to provide the motherland with an x86-capable processor. More precisely, the company had designed a BX-Z60A micro-ATX motherboard that embeds Zhaoxin's KaiXian KX-6640MA SoC with eight cores based on LuJiaZui microarchitecture. The SoC is clocked at a frequency range of 2.1-2.7 GHz, carries 4 MB of L2 cache, 16 lanes of PCIe 3.0, and has integrated graphics, all in a 25 Watt TDP.

As far as the motherboard is concerned, it supports two DDR4 memory slots, two PCIe x16 connectors, M.2-2280 and M.2-2230 slots, and three SATA III connectors for storage. For I/O you have USB ports, DisplayPort, HDMI, VGA/D-Sub, GbE, 3.5-mm audio, and additional PS/2 ports. This is a pretty decent selection; however, we don't know the pricing structure. A motherboard with KaiXian KX-6640MA SoC like this is certainly not cheap, so we are left to wonder if this will help Russian users deal with the newly imposed restriction on importing US tech.

Today we got information that AMD's upcoming Instinct MI300 will be allegedly available as an Accelerated Processing Unit (APU). AMD APUs are processors that combine CPU and GPU into a single package. AdoredTV managed to get ahold of a slide that indicates that AMD Instinct MI300 accelerator will also come as an APU option that combines Zen4 CPU cores and CDNA3 GPU accelerator in a single, large package. With technologies like 3D stacking, MCM design, and HBM memory, these Instinct APUs are positioned to be a high-density compute the product. At least six HBM dies are going to be placed in a package, with the APU itself being a socketed design.

The leaked slide from AdoredTV indicates that the first tapeout is complete by the end of the month (presumably this month), with the first silicon hitting AMD's labs in Q3 of 2022. If the silicon turns out functional, we could see these APUs available sometime in the first half of 2023. Below, you can see an illustration of the AMD Instinct MI300 GPU. The APU version will potentially be of the same size with Zen4 and CDNA3 cores spread around the package. As Instinct MI300 accelerator is supposed to use eight compute tiles, we could see different combinations of CPU/GPU tiles offered. As we await the launch of the next-generation accelerators, we are yet to see what SKUs AMD will bring.

It appears that one of AMD's partners has a Ryzen 7000 CPU or APU, with integrated graphics up and running in Linux. Based on details leaked, courtesy of the partner testing the chip using the Phoronix Test Suite and submitting the results to the OpenBenchmarking database. The numbers are by no means impressive, suggesting that this engineering sample isn't running at the proper clock speeds. For example, it only scores 63.1 FPS in Enemy Territory: Quake Wars, where a Ryzen 9 6900HX manages 182.1 FPS, where both GPUs have been allocated 512 MB of system memory as the minimum graphics memory allocation.

The integrated GPU goes under the model name of GFX1036, with older integrated RDNA2 GPUs from AMD having been part of the GFX103x series. It's reported to have a clock speed of 2000/1000 MHz, although it's presumably running at the lower of the two clock speeds, if not even slower, as it's only about a third of the speed or slower, than the GPU in the Ryzen 9 6900HX. That said, the GPU in the Ryzen 7000-series is as far as anyone's aware, not really intended for gaming, since it's a very stripped down GPU that is meant to mainly be for desktop use and media usage, so it's possible that it'll never catch up with the current crop of integrated GPUs from AMD. We'll hopefully find out more in less than two weeks time, when AMD has its keynote at Computex.