When AMD and Sony collaborated on making the next generation console chip, AMD has internally codenamed it Flute, while Sony codenamed it Oberon or Ariel. This PlayStation 5 SoC die has today been pictured thanks to the Fritzchens Fritz and we get to see a closer look at the die internals. Featuring eight of AMD's Zen2 cores that can reach frequencies of up to 3.5 GHz, the CPU is paired with 36 CU GPU based on the RDNA 2 technology. The GPU is capable of running at speed of up to 2.23 GHz. The SoC has been made to accommodate all of that hardware, and bring IO to connect it all.

When tearing down the console, the heatsink and the SoC are connected by liquid metal, which is used to achieve the best possible heat transfer between two surfaces. Surrounding the die there is a small amount of material used to prevent liquid metal (a conductive material) from possibly spilling and shorting some components. Using a special short wave infrared light (SWIR) microscope, we can take a look at what is happening under the hood without destroying the chip. And really, there are a few distinct areas that are highlighted by the Twitter user @Locuza. As you can see, the die has special sectors with the CPU complex and a GPU matrix with plenty of workgroups and additional components for raytracing.

Intel announced their 11th Generation Tiger Lake-H processors for high-end gaming laptops at CES 2021. The three models announced are now shipping in slim gaming machines and target the AMD Ryzen 5000H series processors. The Intel models compete favorably in single-core performance but only feature four cores and eight threads while the Ryzen 5000H series processors include up to 8 cores and 16 threads giving them the clear advantage in multi-core performance.

Intel is planning to close this performance gap with the launch of three new 45 W 8 core 11th Generation H-series processors in Q2 2021 with a possible announcement at Computex. The three models include the unlocked Core i9-11980HK, Core i9-11900H, and the Core i7-11800H along with the Core i5-11400H with six cores. These new processors will compete directly with the Ryzen 9 5980HX, Ryzen 9 5900H, and Ryzen 7 5800H with the Core i9-11980HK likely to feature a boost clock of 5 GHz on multiple cores.

Intel has apparently begun discounting its desktop CPUs, perhaps in a bid to try and maintain market share earning momentum the company garnered in the last few months. As AMD struggles to keep up with consumer demand for its latest Ryzen 5000 series, Intel looks to be capitalizing on its vertical integration (as well as the fact that Intel owns its own fabs and fabricates in a more than mature 14 nm process). A interesting move by the blue giant, who has generally opted out of a price reduction strategy - a move that might make Intel look on the back foot, and as an alternative budget brand, to the incommensurately smaller AMD.

Various retailers have been carrying Intel inventory with much reduced prices over their official MSRP. Amazon, for example, is offering the Intel Core i7-10700K for $344, down from its average pricing of $383. In the same retailer, the iGPU-less i7-10700F processor is down from $315 one month ago to just $229. Odds are that this is an Intel decision because if one considers the amount of demand on PC products and components due to COVID-19, it's very likely that consumers who can't get an AMD 5000-series CPU will still choose to purchase hardware - even if it has to be from Intel. So retailers eschewing part of their profits at a time like this seems slightly off-character.

Applications such as data analytics, autonomous-driving and medical diagnostics are driving extraordinary demands for machine learning and hyperscale compute infrastructure. To meet these demands, Microchip Technology Inc. today announced the world's first PCI Express (PCIe) 5.0 switch solutions—the Switchtec PFX PCIe 5.0 family—doubling the interconnect performance for dense compute, high speed networking and NVM Express (NVMe ) storage. Together with the XpressConnect retimers, Microchip is the industry's only supplier of both PCIe Gen 5 switches and PCIe Gen 5 retimer products, delivering a complete portfolio of PCIe Gen 5 infrastructure solutions with proven interoperability.

"Accelerators, graphic processing units (GPUs), central processing units (CPUs) and high-speed network adapters continue to drive the need for higher performance PCIe infrastructure. Microchip's introduction of the world's first PCIe 5.0 switch doubles the PCIe Gen 4 interconnect link rates to 32 GT/s to support the most demanding next-generation machine learning platforms," said Andrew Dieckmann, associate vice president of marketing and applications engineering for Microchip's data center solutions business unit. "Coupled with our XpressConnect family of PCIe 5.0 and Compute Express Link (CXL ) 1.1/2.0 retimers, Microchip offers the industry's broadest portfolio of PCIe Gen 5 infrastructure solutions with the lowest latency and end-to-end interoperability."

AMD is readying its upcoming EPYC processors based on the refined Zen 3 core. Codenamed "Milan", the processor generation is supposed to bring the same number of PCIe lanes and quite possibly similar memory support. The pricing, along with the specifications, has been leaked and now we have information on every model ranging from eight cores to the whopping 64 cores. Thanks to @momomo_us on Twitter, we got ahold of Canadian pricing leaked on the Dell Canada website. Starting from the cheapest design listed here (many are missing here), you would be looking at the EPYC 7543 processor with 32 cores running at 2.8 GHz speed, 256 MB of L3 cache, and a TDP of 225 Watts. Such a processor will set you back as much as 2579.69 CAD, which is cheaper compared to the previous generation EPYC 7542 that costs 3214.70 CAD.

Whatever this represents more aggressive pricing to position itself better against the competition, we do not know. The same strategy is applied with the 64 core AMD EPYC 7763 processor (2.45 GHz speed, 256 MB cache, 280 W TDP) as the new Zen 3 based design is priced at 8069.69 CAD, which is cheaper than the 8180.10 CAD price tag of AMD EPYC 7762 CPU.

Today, Elon Musk, the founder of Tesla, Inc., has announced an update to the Tesla Model S automobile. The new car has seen a design revision for the first time since 2012, and it looks like something straight from the future. The interior has seen a complete revamp, and now it looks very futuristic and minimalistic. The specs of the car are also impressive. It can accelerate from 0-60 mph in just under two seconds. The starting price of the car is 80K USD, and it will be available in March. However, the speed and the price is not the main character found inside the car.

Tesla has announced that the updated Model S design has a new infotainment system that has a Tesla Arcade gaming platform with 10 TeraFLOPs of power. According to Mr. Musk, you will be able to play Witcher 3 and Cyberpunk on the Tesla Arcade, a new gaming platform for Tesla vehicles. Right now, it is undefined what is the exact configuration inside the new Tesla Model S car. However, it is speculated that AMD Radeon Navi 23 GPU is powering the platform. When it comes to the CPU choice, speculations are pointing out that Tesla is most likely using an Intel Atom chip paired with the aforementioned AMD Radeon GPU. All we know is that the GPU is clocked at 2.44 GHz, and possibly has 32 CUs. To play Cyberpunk and Witcher 3, you are would need to own one of these new Model S autos and the whole software stack is running locally. We are expecting to hear more about the final specifications once the car arrives in March.

Apple has today patented a new approach to how it uses memory in the System-on-Chip (SoC) subsystem. With the announcement of the M1 processor, Apple has switched away from the traditional Intel-supplied chips and transitioned into a fully custom SoC design called Apple Silicon. The new designs have to integrate every component like the Arm CPU and a custom GPU. Both of these processors need good memory access, and Apple has figured out a solution to the problem of having both the CPU and the GPU accessing the same pool of memory. The so-called UMA (unified memory access) represents a bottleneck because both processors share the bandwidth and the total memory capacity, which would leave one processor starving in some scenarios.

Apple has patented a design that aims to solve this problem by combining high-bandwidth cache DRAM as well as high-capacity main DRAM. "With two types of DRAM forming the memory system, one of which may be optimized for bandwidth and the other of which may be optimized for capacity, the goals of bandwidth increase and capacity increase may both be realized, in some embodiments," says the patent, " to implement energy efficiency improvements, which may provide a highly energy-efficient memory solution that is also high performance and high bandwidth." The patent got filed way back in 2016 and it means that we could start seeing this technology in the future Apple Silicon designs, following the M1 chip.

Update 21:14 UTC: We have been reached out by Mr. Kerry Creeron, an attorney with the firm of Banner & Witcoff, who provided us with additional insights about the patent. Mr. Creeron has provided us with his personal commentary about it, and you can find Mr. Creeron's quote below.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, is excited to announce that the Pacific V-RTX 3070 GPU Water Block and Pacific V-RTX 3080/3090 GPU Water Block are both ready to sell.

The Pacific V-RTX 3070 GPU Water Block and Pacific V-RTX 3080/3090 GPU Water Block are both RGB designed waterblocks for ASUS ROG STRIX RTX 3070 and 3080/3090 graphic cards; these transparent water blocks are part of the TT RGB ecosystem and support the TT RGB Plus software, displaying 16.8M RGB lighting effects to create the best visual effects for the users' builds. They also support various motherboards with a 5 V addressable RGB header allowing users to control the lighting effects through the synchronized software, such as ASUS Aura Sync and MSI Mystic Light Sync. Their high-water flow design, mirror-finished CU base, and micro-channel structure guarantee these water blocks' performance and visual aesthetics. Therefore, if you happen to get an ASUS ROG STRIX RTX 3070 or a 3080/3090 graphics card, come try out our latest Pacific V-RTX 3070 GPU Water Block or the Pacific V-RTX 3080/3090 GPU Water Block.

At the beginning of 2021, MSI, a would-leading motherboards brand, had announed the latest Intel 500 series platforms will launch soon. Through few weeks of waiting, on January 27th, MSI Intel 500 series motherboards are officially launched.

As MSI official announcement mentioned, all of MSI 500 series motherboards with 11th Gen Intel Core processors support PCIe 4.0, and all of Z590 Wi-Fi motherboards have at least one 2.5G LAN and the latest Wi-Fi 6E solution which extends to 6 GHz spectrum providing remarkble user experience when streaming, gaming and even working from home.

When Apple introduces its lineup of devices based on the custom Apple Silicon, many people have thought that it represents the end for any further device customization and that Apple is effectively locking-up the ecosystem even more. That is not the case we have today. Usually, developers working on Macs are always in need of another operating system to test their software and try it out. It means that they have to run some virtualization software like virtual machines to test another OS like Linux and possibly Windows. However, it would be a lot easier if they could just boot that OS directly on the device and that is exactly why we are here today.

Researchers from Corellium, a startup company based in Florida, working on ARM device virtualization, have pulled off an incredible feat. They have managed to get Linux running on Apple's M1 custom silicon based devices. The CTO of Corellium, Mr. Chris Wade, has announced that Linux is now fully usable on M1 silicon. The port can take full advantage of the CPU, however, there is no GPU acceleration for now, and graphics are set to the software rendering mode. Corellium also promises to take the changes it made upstream to the Linux kernel itself, meaning open-source and permissive license model. Below you can find an image of Apple M1 Mac Mini running the latest Ubuntu OS build.

With the launch of its 500 series chipsets, Intel has officially laid the groundwork for the launch of its Rocket Lake-S CPU lineup. And with the new platform, there are some new features to be expected. The surprising news today is that Intel has enabled memory overclocking on a non-Z chipset like the upcoming H570 and B560 chipsets designed for mid-range motherboards that provide a budget option compared to the Z series that is designed for overclocking. The H570 and B560 chipsets now only lack the support for CPU overclocking, however, with Intel's history of limiting any overclocking exclusively to Z chipsets, this represents good progress nonetheless. However, for any frequencies above 2666 MHz, you need to use a Core i5 processor and above. The Core i3 and Celeron models are not going to support any higher speeds than 2666 MHz.

Intel has today quietly launched its newest generation of Next Unit of Computing (NUC) devices with some nice upgrades over the prior generation. Codenamed the "Phantom Canyon", the latest NUC generation brings a major improvement for the "enthusiast" crowd, meant mostly at gamers who would like to use a small form-factor machine and have decent framerates. This is where the Enthusiast NUC 11 comes in. With its 28 Watt Intel Core i7-1165G7 Tiger Lake CPU, which features four cores and eight threads clocked at the maximum of 4.70 GHz, this Enthusiast NUC 11 mini-PC is rocking the latest technologies inside it.

To pair with the CPU, Intel has decided to put a discrete GPU, besides the Integrated Xe model, to power the frames needed. The dGPU in question is NVIDIA's GeForce RTX 2060 model with 6 GB of GDDR6 VRAM, based on the last generation "Turing" architecture. For I/O, Intel has equipped these machines with quite a lot of ports. There is Intel AX201 Wi-Fi 6 plus Bluetooth 5 module, a quad-mic array with beam-forming, far-field capabilities, and support for Alexa. There is a 2.5 Gb Ethernet port, along with two Thunderbolt 4.0 ports for internet connectivity and other purposes (TB ports support fast charging). When it comes to display output, the Enthusiast NUC 11 has HDMI 2.0b and a mini DisplayPort 1.4 port. You can run four monitors in total when using the Thunderbolt ports. On the front side, there is also an SD card reader, and the PC has six USB 3.1 Gen2 ports in total. You can find out more about the Enthusiast NUC 11 mini-PCs here.

The PC has never been more essential, so this year at CES 2021, HP Inc. is launching computing innovations essential to how and where people experience work and life. HP today unveiled new devices and solutions designed to power hybrid work environments and growing personal creative studios.

With half of the global workforce still working remotely due to the COVID-19 pandemic, new use cases for the PC are emerging for both consumers and employees remaining at home. Since COVID, there has been a seven hour increase in time spent on personal PCs. In some cases, this has resulted in an increase in everyday creativity - with photography, writing stories or articles, and live streaming being the top three activities among consumers. But working and staying at home isn't always simple, with only 30% of people having a space where they can shut the door. Yet 72% of knowledge workers want a hybrid remote-office model moving forward and 48% of Gen Z are considering an expansion of their freelance business in the future, requiring solutions with enhanced collaboration and micro-mobility features.

AMD is expected to announce its upcoming EPYC lineup of processors for server applications based on the new Zen 3 architecture. Codenamed "Milan", AMD is continuing the use of Italian cities as codenames for its processors. Being based on the new Zen 3 core, Milan is expected to bring big improvements over the existing EPYC "Rome" design. Bringing a refined 7 nm+ process, the new EPYC Milan CPUs are going to feature better frequencies, which are getting paired with high core counts. If you are wondering how Zen 3 would look like in server configuration, look no further because we have the upcoming AMD EPYC 7543 32-core processor benchmarked in Geekbench 4 benchmark.

The new EPYC 7543 CPU is a 32 core, 64 thread design with a base clock of 2.8 GHz, and a boost frequency of 3.7 GHz. The caches on this CPU are big, and there is a total of 2048 KB (32 times 32 KB for instruction cache and 32 times 32 KB for data cache) of L1 cache, 16 MB of L2 cache, and as much as 256 MB of L3. In the GB4 test, a single-core test produced 6065 points, while the multi-core run resulted in 111379 points. If you are wondering how that fairs against something like top-end Intel Xeon Platinum 8280 Cascade Lake 28-core CPU, the new EPYC Milan 7543 CPU is capable of fighting two of them at the same time. In a single-core test, the Intel Xeon configuration scores 5048 points, showing that the new Milan CPU has 20% higher single-core performance, while the multi-core score of the dual Xeon setup is 117171 points, which is 5% faster than AMD CPU. The reason for the higher multi-core score is the sheer number of cores that a dual-CPU configuration offers (32 cores vs 56 cores).

Thermaltake, the leading PC component brand offering premium solutions for cooling, gaming peripherals, and enthusiast memory, today is proud to announce the TOUGHLIQUID Series, the newest member of the Thermaltake AIO liquid cooler line up. TOUGHLIQUID ULTRA and TOUGHLIQUID ARGB Sync are built using the TOUGHFAN 12 high-performance fans to deliver superior cooling performance and stability for system builders. Offering a variety of models, supporting radiators sizes including 240mm, 280mm and 360mm, equipped with a LED display or RGB on the pump.

"Intuitive hardware monitoring and advanced personalization are what the THOUGLIQUID ULTRA series brings to the market," said Kenny Lin, the CEO of Thermaltake. "The important information like CPU temperature, frequency, and performance usage can be displayed in real-time on the smart 2.1" LCD monitor. Users can also personalize the display with GIF pictures or with custom RGB lighting modes through our RGB software. Thermaltake is giving PC builders even more customization options with this next-gen AIO watercooler."

AMD has applied for a United States Patent that describes a CPU design with FPGA (Field-Programmable Gate Array) elements integrated into its core design. Titled "Method and Apparatus for Efficient Programmable Instructions in Computer Systems", the patent application describes a CPU with FPGA elements inscribed into its very core design, where the FPGA elements actually share CPU resources such as registers for floating-point and integer execution units. This patent undoubtedly comes in the wake of AMD's announced Xilinx acquisition plans, and brings FPGA and CPU marriages to a whole other level. FPGA,as the name implies, are hardware constructions which can reconfigure themselves according to predetermined tables (which can also be updated) to execute desired and specific functions.

Intel have themselves already shipped a CPU + FPGA combo in the same package; the company's Xeon 6138P, for example, includes an Arria 10 GX 1150 FPGA on-package, offering 1,150,000 logic elements. However, this is simply a CPU + FPGA combo on the same substrate; not a native, core-integrated FPGA design. Intel's product has severe performance and latency penalties due to the fact that complex operations performed in the FPGA have to be brought out of the CPU, processed in the FPGA, and then its results have to be returned to the CPU. AMD's design effectively ditches that particular roundabout, and should thus allow for much higher performance.

On December 31st, AMD's Radeon group has filed a patent for a chiplet architecture of the GPU, showing its vision about the future of Radeon GPUs. Currently, all of the GPUs available on the market utilize the monolithic approach, meaning that the graphics processing units are located on a single die. However, the current approach has its limitations. As the dies get bigger for high-performance GPU configurations, they are more expensive to manufacture and can not scale that well. Especially with modern semiconductor nodes, the costs of dies are rising. For example, it would be more economically viable to have two dies that are 100 mm² in size each than to have one at 200 mm². AMD realized that as well and has thus worked on a chiplet approach to the design.

AMD reports that the use of multiple GPU configuration is inefficient due to limited software support, so that is the reason why GPUs were kept monolithic for years. However, it seems like the company has found a way to go past the limitations and implement a sufficient solution. AMD believes that by using its new high bandwidth passive crosslinks, it can achieve ideal chiplet-to-chiplet communication, where each GPU in the chiplet array would be coupled to the first GPU in the array. All the communication would go through an active interposer which would contain many layers of wires that are high bandwidth passive crosslinks. The company envisions that the first GPU in the array would communicably be coupled to the CPU, meaning that it will have to use the CPU possibly as a communication bridge for the GPU arrays. Such a thing would have big latency hit so it is questionable what it means really.

Intel has just released its "Architecture Instruction Set Extensions and Future Features Programming Reference" manual, which serves the purpose of providing the developers' information about Intel's upcoming hardware additions which developers can utilize later on. Today, thanks to the @InstLatX64 on Twitter we have information that Intel is bringing on-package High Bandwidth Memory (HBM) solution to its next-generation Sapphire Rapids Xeon processors. Specifically, there are two instructions mentioned: 0220H - HBM command/address parity error and 0221H - HBM data parity error. Both instructions are there to address data errors in HBM so the CPU operates with correct data.

The addition of HBM is just one of the many new technologies Sapphire Rapids brings. The platform is supposedly going to bring many new technologies like an eight-channel DDR5 memory controller enriched with Intel's Data Streaming Accelerator (DSA). To connect to all of the external accelerators, the platform uses PCIe 5.0 protocol paired with CXL 1.1 standard to enable cache coherency in the system. And as a reminder, this would not be the first time we see a server CPU use HBM. Fujitsu has developed an A64FX processor with 48 cores and HBM memory, and it is powering today's most powerful supercomputer - Fugaku. That is showing how much can a processor get improved by adding a faster memory on-board. We are waiting to see how Intel manages to play it out and what we end up seeing on the market when Sapphire Rapids is delivered.

Tachyum Inc. today announced that it is signing early adopter customers for the software emulation system for its Prodigy Universal Processor, customers may begin the process of native software development (i.e. using Prodigy Instruction Set Architecture) and porting applications to run on Prodigy. Prodigy software emulation systems will be available at the end of January 2021.

Customers and partners can use Prodigy's software emulation for evaluation, development and debug, and with it, they can begin to transition existing applications that demand high performance and low power to run optimally on Prodigy processors. Pre-built systems include a Prodigy emulator, native Linux, toolchains, compilers, user mode applications, x86, ARM and RISC-V emulators. Software updates will be issued as needed.

The release of Cyberpunk 2077 has brought a rather large controversy around it, with many gamers being disappointed with their purchases. The game has generated massive hype before it was released, and when it dropped, gamers from all around the world found themselves disappointed in the quality of the game itself. Most notably, the game developer, CD Project RED, has made a massive game and discovered many bugs along the way. That buggy release was shipped to customers. However, the game developer is not going to watch it remain like that and has issued a hotfix release 1.05 that is supposed to iron out a few major bugs and bring many improvements.

On PC, the game was underperforming on AMD Ryzen CPUs, and now the patch is applied: "[AMD SMT] Optimized default core/thread utilization for 4-core and 6-core AMD Ryzen (tm) processors. 8-core, 12-core and 16-core processors remain unchanged and behaving as intended. This change was implemented in cooperation with AMD and based on tests on both sides indicating that performance improvement occurs only on CPUs with 6 cores and less." For a full list of gameplay, UI, visual, and quest updates, please check out this hotfix list here. Update is now available on all platforms and you should download it.

With the launch of the Ryzen 5000 series of processors, AMD has set a goal to put its Zen 3 cores everywhere. Starting from desktop, mobile, and soon server space, AMD is delivering its best products. However, AMD is also preparing to satisfy another segment. The OEMs are in need of processors that are specifically designed for their purposes and their clients, that don't require as many features as the desktop segment does. Usually, that means some overclocking capability is cut off. Today, thanks to the two hardware leakers Patrick Schur and Momomo_US we get to see the first sightings of AMD's upcoming Zen 3 offerings for OEMs.

The first in the lineup is the Ryzen 9 5900 processor. It features 12 cores with 24 threads, running at unknown frequencies for now. All we know is that the CPU is a bit lower-clocked than its 105 W "X" Ryzen 9 5900X variant. Unlike the "X" variant, this CPU is supposed to bring TDP down to 65 Watts. Another differentiator is the cache configuration. The Ryzen 9 5900 features 64 MB of L3 cache and 2 MB of L2 cache. The "X" version for desktops features 64 MB of L3, however, there is 6 MB of L2 cache present there. Next up comes the smaller eight-core variant - Ryzen 7 5800. Featuring 8 cores and 16 threads running at an also unknown frequency. The chip features a TDP of 65 Watts and cache configuration with 32 MB of L3 cache and 4 MB of L2, with the only difference from the Ryzen 7 5800X being the lower frequency.

When AMD introduced its Smart Access Memory (SAM) technology, it was used as one of the key advertising points for its 5000 series of Ryzen processors based on Zen 3 architecture. At the time of launch, it was believed that only the latest generation of Ryzen processors can support it and only AMD GPUs can see a benefit in performance. However, later on, many of the motherboard makers have been playing with BIOS updates and have found a way to enable resizable BAR, the technology used for SAM, on non-AMD platforms. Today, thanks to the Reddit user Merich98 we have found out that ASUS has enabled resizable BAR support via BIOS update.

The user has used BIOS version 2409, released just a few days ago, on ASUS B450-PLUS motherboard. The feat is no extraordinary because it works on a B450 motherboard, it has been supported for a long time, but rather the feat is impressive because it works with the first generation AMD Ryzen 7 1700 processor. This contradicts the theory that SAM only needs 5000 series AMD Ryzen processors to run. However, the gains were not that great. On average, the average frame rate number has increased by a small +0.839%. This could be attributed to some margin of error, so it seems like SAM is not giving much performance uplift in this case.

Today, at Intel's Memory and Storage 2020 event, the company highlighted six new memory and storage products to help customers meet the challenges of digital transformation. Key to advancing innovation across memory and storage, Intel announced two new additions to its Intel Optane Solid State Drive (SSD) Series: the Intel Optane SSD P5800X, the world's fastest data center SSD, and the Intel Optane Memory H20 for client, which features performance and mainstream productivity for gaming and content creation. Optane helps meet the needs of modern computing by bringing the memory closer to the CPU. The company also revealed its intent to deliver its 3rd generation of Intel Optane persistent memory (code-named "Crow Pass") for cloud and enterprise customers.

"Today is a key moment for our memory and storage journey. With the release of these new Optane products, we continue our innovation, strengthen our memory and storage portfolio, and enable our customers to better navigate the complexity of digital transformation. Optane products and technologies are becoming a mainstream element of business compute. And as a part of Intel, these leadership products are advancing our long-term growth priorities, including AI, 5G networking and the intelligent, autonomous edge." -Alper Ilkbahar, Intel vice president in the Data Platforms Group and general manager of the Intel Optane Group.

AMD's Zen 3 core has seen some major performance uplift, with the first products based on it being the 5000 series desktop processors codenamed "Vermeer". With the efficiency that this new core brings and IPC increase, it is only a matter of time before it scales down to mobile processors. Today, thanks to the findings of TUM APISAK, we get to see some performance results of AMD's upcoming Ryzen 7 5800H "Cezanne" processors. Benchmarked in the Geekbench 5 test suite, the CPU was spotted running at the base frequency of 3.20 GHz, and boost frequency of 4.44 GHz. This is only an engineering sample so the real product may have different clock speeds.

The CPU managed to score 1475 points in single-threaded results while having 7630 points in a multi-threaded scenario. If you wonder how does it fare to the last generation that it replaces, the Ryzen 7 4800H scored 1194 points for ST, and 7852 points for MT. That means that the new Ryzen 7 5800H CPU has a 23% performance boost for ST workloads, showing the Zen 3 capability. The MT score is not representative as we do not have the final product yet, so we have to wait and see how it performs when reviews arrive.

Taiwan Semiconductor Manufacturing Company (TSMC), one of the largest semiconductor manufacturers in the world, is reportedly ending its volume discounts. The company is the maker of the currently smallest manufacturing nodes, like 7 nm and 5 nm. For its biggest customers, TSMC used to offer a discount - when you purchase 10s or 100s of thousands of 300 mm (12-inch) wafers per month, the company will give you a deal of a 3% price decrease per wafer, meaning that the customer is taking a higher margin off a product it sells. Many of the customers, like Apple, NVIDIA, and AMD, were a part of this deal.

Today, thanks to a report from the Taiwanese Central News Agency, TSMC is terminating this type of discount. Now, every customer will pay full price for the wafer, without any exceptions. For now, it is unclear what drove that decision at TSMC's headquarters, but the only thing that we could think is that the demand is too high to keep up with the discounts and the margins are possibly lower. What this means for consumers is a possible price increase in products that are manufactured at TSMC's facilities. The consumer market is already at a drought of new PC components like CPUs and GPUs due to high demand and scalping. This could contribute a bit to the issue, however, we do not expect it to be of any major significance.