The demand for data is insatiable, from 5G to the cloud to smart cities. As a society we want more autonomy, information to fuel our decisions and habits, and connection - to people, stories, and experiences.

To address these demands, the cloud infrastructure of tomorrow will need to handle the coming data explosion and the effective processing of evermore complex workloads … all while increasing power efficiency and minimizing carbon footprint. It's why the industry is increasingly looking to the performance, power efficiency, specialized processing and workload acceleration enabled by Arm Neoverse to redefine and transform the world's computing infrastructure.

Super Micro Computer, Inc. (SMCI), a global leader in enterprise computing, storage, networking solutions, and green computing technology, is announcing its most advanced GPU server, incorporating eight NVIDIA H100 Tensor Core GPUs. Due to its advanced airflow design, the new high-end GPU system will allow increased inlet temperatures, reducing a data center's overall Power Usage Effectiveness (PUE) while maintaining the absolute highest performance profile. In addition, Supermicro is expanding its GPU server lineup with this new Universal GPU server, which is already the largest in the industry. Supermicro now offers three distinct Universal GPU systems: the 4U,5U, and new 8U 8GPU server. The Universal GPU platforms support both current and future Intel and AMD CPUs -- up to 400 W, 350 W, and higher.

"Supermicro is leading the industry with an extremely flexible and high-performance GPU server, which features the powerful NVIDIA A100 and H100 GPU," said Charles Liang, president, and CEO, of Supermicro. "This new server will support the next generation of CPUs and GPUs and is designed with maximum cooling capacity using the same chassis. We constantly look for innovative ways to deliver total IT Solutions to our growing customer base."

During Evercore ISI TMT conference, Intel announced that the company would continue to lose market share, with a possible bounce back in the coming years. According to the latest report, Intel's CEO Pat Gelsinger announced that he expects the company to continue to lose its market share to AMD as the competition has "too much momentum" going for it. AMD's Ryzen and EPYC processors continue to deliver power and efficiency performance figures, which drives customers towards the company. On the other hand, Intel expects a competing product, especially in the data center business with Sapphire Rapids Xeon processors, set to arrive in 2023. Pat Gelsinger noted, "Competition just has too much momentum, and we haven't executed well enough. So we expect that bottoming. The business will be growing, but we do expect that there continues to be some share losses. We're not keeping up with the overall TAM growth until we get later into '25 and '26 when we start regaining share, material share gains."

The only down years that are supposed to show a toll of solid competition are 2022 and 2023. As far as creating a bounceback, Intel targets 2025 and 2026. "Now, obviously, in 2024, we think we're competitive. 2025, we think we're back to unquestioned leadership with our transistors and process technology," noted CEO Gelsinger. Additionally, he had a say about the emerging Arm CPUs competing for the same server market share as Intel and AMD do so, stating that "Well, when we deliver the Forest product line, we deliver power performance leadership versus all Arm alternatives, as well. So now you go to a cloud service provider, and you say, 'Well, why would I go through that butt ugly, heavy software lift to an ARM architecture versus continuing on the x86 family?"

Starting next year, AMD will move to a new model number scheme for its mobile processors and it appears that the company has decided to use the first digit to represent the model year, which should alleviate some past confusion. The second digit in the model name will represent where in the product stack the specific chip will sit and here we're potentially getting some new 6 and 8 models, although nothing guarantees that AMD will actually implement these segments into real products. The third digit represents the architecture, so a four equals Zen 4 for example.

The last digit in the model names is a new addition where AMD has sub SKUs that offer some performance advantage of the base SKU of a specific model and this digit will apparently only be represented by a 0 or a 5. Finally AMD has added a new suffix too, where C stands for Chromebook. This translates to 15-28 Watt chips that have been designed specifically for Chromebook usage. The current HX, HS and U suffix lettering will carry over, alongside the lower-case e for 9 W versions the U SKUs. AMD has also segmented it's mobile CPUs according to the chart below, to try and deliver a clearer use case for its various CPU models. The chart is pretty self explanatory, although some of the segmentation will apply to updated models of current designs, whereas others will only apply to new laptop designs. The new model numbering scheme will apply to at least 2025.

Qualcomm Technologies, Inc. announces Snapdragon 6 Gen 1 and Snapdragon 4 Gen 1 Mobile Platforms, providing advanced technology solutions to address the mid-tier and mass-volume segment. The Snapdragon 6 Gen 1 provides illuminating capture, hard-hitting game play, and intuitive AI assistance. It extends users' reach with expansive connectivity and sustained, efficient power and performance across the board. The latest 4-series platform, Snapdragon 4 Gen 1, offers impressive performance and AI to make interactions seamless and intuitive. Plus, this platform provides advanced photography features to enable striking capture, as well as improved connectivity so users can share endlessly.

"Both Snapdragon 6 and Snapdragon 4 provide upgrades in their respective series to enable advancements in capture, connectivity, entertainment, and AI. These new mobile platforms help our customers to deliver advanced solutions for consumers," said Deepu John, senior director, product management, Qualcomm Technologies, Inc.

A Cinebench R23 picture of AMD's recently announce Ryzen 9 7950X CPU having been put through its paces have appeared online via a post on Baidu, which has been taken down since the picture was posted. However, courtesy of @harukaze5719 it lives on, on Twitter and gives us a first glimpse into the Cinebench R23 performance of the upcoming CPU. The CPU is said to have been air cooled, so it's possible that we'll see even higher benchmark numbers with better cooling, so take these numbers with a pinch of sodium chloride, just to be on the safe side. The test system was also using Windows 10, so there's the potential of some extra performance by changing to Windows 11 here as well.

In the single score test, the Ryzen 9 7950X scores 2,205 points, which is in line with Cinebench R23 leaks for Intel's upcoming Core i9-13900K CPU, if a smidgen slower. The multi-core score is obviously not going to compete with Intel's Core i9-13900K due to the overall lower core count, but at 29,649, but it's ahead of the Core i9-12900K by a decent margin. It'll be interesting to see how AMD positions the 7000-series of CPUs, as although it seems like the company has done a good job in improving the overall performance compared to the 5000-series, it's not quite enough to take the performance crown this time around, if these early benchmark leaks from both sides are anything to go by.

Update 10:27 UTC: A new picture hjas appeared where the CPU has been kitted out with better cooling at the multi-core score has jumped from 29,649 to 36,256, which makes it competitive with the Core i9-13900K scores that have leaked in the past.

Microsoft is announcing the general availability of the latest Azure Virtual Machines featuring the Ampere Altra Arm-based processor. The new virtual machines will be generally available on September 1, and customers can now launch them in 10 Azure regions and multiple availability zones around the world. In addition, the Arm-based virtual machines can be included in Kubernetes clusters managed using Azure Kubernetes Service (AKS). This ability has been in preview and will be generally available over the coming weeks in all the regions that offer the new virtual machines.

Earlier this year, we launched the preview of the new general-purpose Dpsv5 and Dplsv5 and memory optimized Epsv5 Azure Virtual Machine series, built on the Ampere Altra processor. These new virtual machines have been engineered to efficiently run scale-out, cloud-native workloads. Since then, hundreds of customers have tested and experienced firsthand the excellent price-performance that the Arm architecture can provide for web and application servers, open-source databases, microservices, Java and.NET applications, gaming, media servers, and more. Starting today, all Azure customers can deploy these new virtual machines using the Azure portal, SDKs, API, PowerShell, and the command-line interface (CLI).

The next-generation flagship AMD GENOA EPYC CPU has recently appeared on Geekbench 5 in a dual-socket configuration for a total of 192 cores and 384 threads. The processors were installed in an unknown Suma 65GA24 motherboard running at 3.51 GHz and paired with 768 GB of DDR5 memory. This setup achieved a single-core score of 1460 and multi-core result of 96535 which places the processor approximately 17% ahead of an equivalently clocked 128 core EPYC 7763 in single-threaded performance. The Geekbench listing also includes an OPN code of 100-000000997-01 which most likely corresponds to the flagship AMD EPYC 9664 with a max TDP of 400 W according to existing leaks.

Qualcomm is a company well known for designing processors going inside a vast majority of smartphones. However, the San Diego company has been making attempts to break out of its vision to focus on smartphones and establish new markets where it could show its potential for efficient processor design. According to Bloomberg's insights, Qualcomm is planning to re-enter the server market and try again to compete in the now very diverse space. In 2014, Qualcomm announced that the company is developing an Arm ISA-based CPU that will target servers and be an excellent alternative for cloud service providers looking at efficient designs called Centriq. Later on, in November of 2017, the company announced the first CPU Centriq 2400, which had 48 custom Falkor cores, six-channel DDR4 memory, and 60 MB of L3 cache.

What happened later is that the changing management of the company slowly abandoned the project, and the Arm CPU market was a bit of a dead-end for many projects. However, in recent years, many companies began designing Arm processors, and now the market is ready for a player like Qualcomm to re-enter this space. With the acquisition of Nuvia Inc., which developed crazy fast CPU IPs under the leadership of industry veterans, these designs could soon see the light of the day. It is reported that Qualcomm is in talks with Amazon's AWS cloud division, which has agreed to take a look at Qualcomm's offerings.

Tachyum today announced that it has responded to a U.S. Department of Energy Request for Information soliciting Advanced Computing Ecosystems for DOE national laboratories engaged in scientific and national security research. Tachyum has submitted a proposal to create a 20-exaflop supercomputer based on Tachyum's Prodigy, the world's first universal processor.

The DOE's request calls for computing systems that are five to 10 times faster than those currently available and/or that can perform more complex applications in "data science, artificial intelligence, edge deployments at facilities, and science ecosystem problems, in addition to the traditional modeling and simulation applications."

For those of you that are eagerly awaiting the Ryzen 7000-series CPUs, details of the potential pricing has appeared over at Canadian e-tailer DirectDial. @momomo_us was first to post the details on Twitter, but didn't provide any details of who the e-tailer was, but some sleuthing using the AMD ordering codes soon brought us to DirectDial. The company has listed the all four expected CPU models with pricing and it appears that AMD has decided to stop providing coolers entirely, as none of the four upcoming CPUs appear to be available with a cooler in the box. All the model names ending WOF are retail packaged CPUs and the ones missing WOF at the end of the product number are tray CPUs from what we can tell.

As for the pricing, the Ryzen 5 7600X is listed at CA$435 or about US$340, with the Ryzen 7 7700X coming in at CA$631 or US$494. The Ryzen 9 7900X is CA$798/US$625 and finally the Ryzen 9 7950X is a steep CA$1158/US$907. @momomo_us also found some tray pricing from a different retailer and these CPUs are priced a few bucks cheaper, but we were unable to locate who the retailer is. Note that electronics and computer parts appear to be priced a fair bit higher in Canada than the US on average. As such, these prices should only be taken as an indication of what the retail price in Canada might end up being and not what the actual MSRP will land at, when AMD decides to launch these CPUs. Currently the retail date is expected to be on the 15th of September.

Update 10:49 UTC: The tray CPU retailer is PC-Canada.

Remember that Xe-HPG Scavenger Hunt that Intel hosted last year? If you somehow missed it, Intel was maybe giving away some Arc graphics cards to 300 lucky winners. There were two different tiers of prizes, grand prize and first prize, which later ended up translating to an Arc A770 and an Arc A750 graphics card respectively. Now news via VideoCardz are suggesting that Intel is trying to get out of giving these 300 people their prize, well, at least the promised graphics card, in exchange for an Alder Lake CPU.

Intel has apparently sent out an email to the winners, asking them to accept an Intel Core i7-12700K if they were a grand prize winner or a Core i5-12600K if they were a first prize winner, instead of the promised graphics card. The winners have until Friday the 19th of August to decide if they want a CPU instead of a GPU, although Intel is apparently still allowing them to wait for a GPU, the company just doesn't say how long the wait will be. As the prize has to have a similar retail price, it's also possible to get a ballpark figure of the MSRP of Intel's supposedly upcoming Arc 700-series graphics cards. The Arc A770 should end up at around the $410 mark and the A750 around the $290 mark, as this is the ballpark MSRP for the CPU's that are being offered. It would be interesting to know how many people would be willing to do the trade, but sadly we're unlikely to ever find out.

AMD Ryzen Threadripper Pro 5000 series processors have been available since March in Lenovo systems. In the meantime, system integrators and OEMs got their hands on these processors and started selling systems based around them. However, today the DIY channel is equipped with these monstrous CPUs. With up to 64 cores and 128 threads of Zen3 IP, these processors can boost up to 4.5 GHz and have 128 PCIe 4.0 lanes and an eight-channel DDR4 integrated memory controller with 280 Watt TDP across all models. AMD has noted that the non-Pro Threadripper 5000 series is ceasing production in favor of these Pro models and justifying the increased price point by adding more L3 cache and more cores.

The 24C/48T Threadripper Pro 5965WX comes with a 3.8 GHz base and 4.5 GHz boost frequency with 128 MB of L3 cache, and it is priced at 2399 USD. The bigger Threadripper Pro 5975WX is equipped with 32C/64T configuration, has a 3.6 GHz base and 4.5 GHz boost speed, and carries 128 MB of L3 cache while priced at 3299 USD. The top-end Threadripper Pro 5995WX is a monstrous 64C/128T design with a base frequency of 2.7 GHz and a boost of 4.5 GHz. It has 256 MB of L3 cache and costs a staggering 6499 USD. Additionally, all of the new Ryzen Threadripper Pro 5000 series CPUs require a WRX80-based motherboard chipset, which is an additional expense of its own.

It's pretty clear that we're getting very close to the launch of AMD's AM5 platform and the Ryzen 7000-series CPUs, with spec details and even pricing brackets tipping up online. Wccftech has posted what the publication believes will be the lineup we can expect to launch in just over a month's time, if rumours are to be believed. The base model is said to be the Ryzen 5 7600X, which the site claims will have a base clock of 4.7 GHz and a boost clock of 5.3 GHz. There's no change in processor core or thread count compared to the current Ryzen 5 5600X, but the L2 cache appears to have doubled, for a total of 38 MB of cache. This is followed by the Ryzen 7 7700X, which starts out a tad slower with a base clock of 4.5 GHz, but it has a slightly higher boost clock of 5.4 GHz. Likewise here, the core and thread count remains unchanged, while the L2 cache also gets a bump here for a total of 40 MB cache. Both these models are said to have a 105 W TDP.

The Ryzen 9 7900X is said to have a 4.7 GHz base clock and a 5.6 GHz boost clock, so a 200 MHz jump up from the Ryzen 7 7700X. This CPU has a total of 76 MB of cache. Finally the Ryzen 9 7950X is said to have the same base clock of 4.5 GHz as the Ryzen 7 7700X, but it has the highest boost clock of all the expected models at 5.7 GHz, while having a total of 80 MB cache. These two SKUs are both said to have a 170 W TDP. Price wise, from top to bottom, we might be looking at somewhere around US$700, US$600, US$300 and US$200, so it seems like AMD has adjusted its pricing downwards by around $100 on the low-end, with the Ryzen 7 part fitting the same price bracket as the Ryzen 7 5700X. The Ryzen 9 7900X seems to have had its price adjusted upwards slightly, while the Ryzen 9 7950X seems to be expected to be priced lower than its predecessors. Take these things with the right helping of scepticism for now, as things can still change before the launch.

During this year's Flash Memory Summit, Phison, a company known for SSD controllers and now flash drives, demonstrated a system running AMD Ryzen 7000 series processors based on Zen 4 architecture. What is interesting about the shown specification is that the system was running an engineering sample of an upcoming Zen 4-based CPU with the latest storage technologies at impressive speeds. Using a Phison PS5026-E26 SSD controller, also called E26, the PCIe 5.0 SSD is powered by Micron's latest 232-layer TLC NAND flash. This new NAND technology will also bring greater densities to the market by promising higher endurance, higher read/write speeds, and better efficiency.

With AMD's upcoming AM5 platform, support for PCIe 5.0 SSDs is a welcome addition. And we today have some preliminary tests that show just how fast these SSDs can run. In CrystalDiskMark 8.0.4, it achieved over 10 GB/s in both read and write. We know that the E26 controller is capable of 12 GB/s speeds, so more fine-tuning is needed. Being an early sample, we expect final specifications to be better. The system is powered by an engineering sample of a six-core, twelve-threaded Zen 4 CPU running at unknown clocks, codenamed 100-000000593-20_Y. We can expect to see more of this technology once AMD's AM5 platform lands and Phison-powered SSDs hit the shelves in September.

Intel yesterday confirmed its plans to extend its Meteor Lake architecture towards shores other than general processing. According to Phoronix, Intel posted a new driver that lays the foundations for VPU (Versatile Processing Unit) support under Linux. The idea here is that Intel will integrate this VPU within its 14th Gen Meteor Lake architecture, adding AI inferencing acceleration capabilities to its silicon. A sure-fire way to achieve enormous gains in AI processing, especially in performance/watt. Interestingly, Intel is somewhat following Apple's footsteps here, as the company already includes AI-dedicated processing cores in its desktop/laptop Apple Silicon processors since the M1 days.

Intel's VPU architecture will surely be derived from Movidius' designs, which Intel acquired back in 2016 for a cool $400 million. It's unclear which parts of Movidius/Intel IP will be included in the VPU units to be paired with Meteor Lake: whether a full-blown, SoC (System on Chip)-like VPU design such as the Myriad X VPU, or if Intel will take select bits of the architecture (plus the equivalent of five additional years of research and development), sprinkling them on top of their upcoming architecture. We do know the VPU itself will include a memory management unit, a RISC-based microcontroller, a Neural Compute System (what exactly entails this compute system and its slices is the mysterious part) and network-on-chip capabilities.

Super Micro Computer, Inc., a global leader in enterprise computing, storage, networking, and green computing technology, is announcing future Total IT Solutions for availability with Android Cloud Gaming and Media Processing & Delivery. These new solutions will incorporate the Intel Data Center GPU, codenamed Arctic Sound-M, and will be supported on several Supermicro servers. Supermicro solutions that will contain the Intel Data Center GPUs codenamed Arctic Sound-M, include the 4U 10x GPU server for transcoding and media delivery, the Supermicro BigTwin system with up to eight Intel Data Center GPUs, codenamed Arctic Sound-M in 2U for media processing applications, the Supermicro CloudDC server for edge AI inferencing, and the Supermicro 2U 2-Node server with three Intel Data Center GPUs, codenamed Arctic Sound-M per node, optimized for cloud gaming. Additional systems will be made available later this year.

"Supermicro will extend our media processing solutions by incorporating the Intel Data Center GPU," said Charles Liang, President, and CEO, Supermicro. "The new solutions will increase video stream rates and enable lower latency Android cloud gaming. As a result, Android cloud gaming performance and interactivity will increase dramatically with the Supermicro BigTwin systems, while media delivery and transcoding will show dramatic improvements with the new Intel Data Center GPUs. The solutions will expand our market-leading accelerated computing offerings, including everything from Media Processing & Delivery to Collaboration, and HPC."

As we approach the launch of Intel's upcoming Raptor Lake desktop processors, we are getting more leaks of testing performed by system integrators and 3rd parties that have early access to the engineering sample (ES) chips. A few days ago, we saw an Intel Core i7-13700K CPU run Geekbench 5 benchmark with the older DDR4 memory on ASRock Z690 Steel Legend WiFi 6E. Today, we are seeing a similar test performed on the same processor, with ASRock Z690 Steel Legend WiFi 6E/D5 equipped with DDR5 memory. While the previous DDR4 testing used modules running at 3200 MT/s, the DDR5 testing uses 5200 MT/s rated DRAM with unknown timings and setup.

As far as performance goes, the single-core result of the 16-core Intel Core i7-13700K processor was 2090 points with DDR4, while DDR5 showed a slight regression of 2069 points. Of course, this could be attributed to the margin of error. As far as multi-core performance goes, the DDR4 testing managed to produce 16542 points, whereas the DDR5-equipped platform scored 19811 points. This is an immediate 20% performance uplift in multi-core score. It shows that all the cores present in Raptor Lake processors are starving for bandwidth, and a faster memory protocol can bring quite an improvement. As usual, we have to wait to confirm this information with our testing so that we can draw more conclusions.

With Intel Raptor Lake-S desktop processors around the corner, we see an ever-increasing number of entries to the popular synthetic benchmark databases. Yesterday we had an Intel Core i5-3600K CPU, while today, we are presented with Core i7-13700K SKU. The new 13th generation Core i7-13700K CPU features eight P-cores and eight E-cores. Compared to the 12th generation Core i7-12700K, this is a step up with eight P-cores and four E-cores. According to Geekbench 5 benchmark, the new Qualification Sample (QS) of Core i7-13700K CPU was running at the minimum clock of 5.289 GHz, maximum clock of 5.381 GHz, and average speed of 5.36 GHz. It was tested on the same configuration as yesterday's i5 SKU with ASRock Z690 Steel Legend WiFi 6E motherboard with 32 GB of DDR4 memory.

As far as the results are concerned, the 13th gen i7-13700K SKU scored 2090 points in the single-core test, while the multi-core score totaled 16542 points. If we compare this to the 12th gen i7-12700K CPU that it replaces, the new model leads by about 10% and 17% in single-core and multi-core tests, respectively.

Intel's upcoming Sapphire Rapids processors will not only be present in the server sector but will also span the high-end desktop (HEDT) platform. Today, according to the findings of a Twitter user, @InstLatX64, we have an appearance of Intel's upcoming Sapphire Rapids HEDT SKU in Kernel.org boot logs. Named Intel Xeon W9-3495, this model features 56 cores and 112 threads. While there is no specific information about base and boost frequencies, we know that the SKU supports AVX-512 and AMX instructions. This is a welcome addition, as we have seen Intel disable AVX-512 on consumer chips altogether.

With a high core count and additional instructions for Deep Learning, this CPU will power workstations sometimes in the future. With the late arrival of Sapphire Rapids for servers, a HEDT variant should follow.

According to the latest report from Nikkei Asia, Intel will raise its CPU pricing structure starting this fall. Citing concerns of increased electricity, raw materials, and labor costs, Intel has informed its clients that the company will add additional overhead to its existing pricing structure to make up for that difference. The report indicates that most of its microprocessors and peripheral chip products will be affected. However, the main target of the inflating costs is the company's Core and Xeon processor families. If you are wondering just how much will this price hike be, the current speculations point to anywhere from a 10 to 20 percent increase.

Of course, this information should be taken with a grain of salt. However, it is quite possible to see this price hike in the upcoming fall season, and we have to wait and see if it plays out.

In recent years, consumer storage products have seen rapid developments. This year, the industry will officially be entering the first year of Gen5 SSDs. In response to risen temperatures caused by the high transfer speeds of PCIe Gen 5 SSDs, T-FORCE, the gaming sub-brand of Team Group, has launched the world's first all-in-one ARGB liquid cooling system to reduce heat generated by both the CPU and SSD, allowing PCIe Gen5 SSDs to maintain optimal temperatures and stable, high-speed operations for sustained periods. With the new cooling solution, consumers can fully experience the efficient storage performance of next-generation SSDs without any compromises.

Beginning in the 2000s, as the consumer market demanded higher read and write speeds for storage devices, solid-state drives (SSDs) began to replace mechanical hard drives (HDDs) in large numbers. SATA SSDs eventually became the go-to choice for storage upgrades. With the demand for high-speed storage driven by big data and the spread of transmission technology, PCIe became the standard interface for high-speed transmission. In the past few years, read speeds of PCIe SSDs have increased from 3,500 MB/s in Gen3 to 7,000 MB/s in Gen4. PCIe Gen5 SSDs now have over 12,000 MB/s read and write speeds. The large leaps in transfer speeds of each successive generation of SSDs have led to increased power wattage, which in turn have resulted in higher operating temperatures. When SSDs experience rising operating temperatures at high transfer speeds, an automatic throttling mechanism is activated to protect components from damage caused by the high temperatures. With power consumption of approximately 12 W on a PCIe Gen4 SSD running at 7,000 MB/s, the controller temperature can reach over 110℃. When PCIe Gen5 SSDs have speeds of over 12,000 MB/s and consume 14 W or above, one can expect controller temperatures to rise sharply. Therefore, Team Group is committed to providing the best thermal solutions for stable, high-speed operation of SSDs over sustained periods.

Hyperscalers such as Microsoft, Google, Amazon, etc., all run their cloud divisions with a specific goal. To provide their hardware to someone else in a form called instance and have the user pay for it by the hour. However, instances are usually bound by a specific CPU and memory configuration, which you can not configure yourself. But instead, you can only choose from the few available options that are listed. For example, when selecting one virtual CPU core, you get two GB of RAM and can go as high as you want with CPU cores. However, the available RAM will also double, even though you might not need it. When renting an instance, the allocated CPU cores and memory are yours until the instance is turned off.

And it is precisely this that hyperscalers are dealing with. Many instances don't fully utilize their DRAM, making the whole data center usage inefficient. Microsoft Azure, one of the largest cloud providers, measured that 50% of all VMs never touch 50% of their rented memory. This makes memory stranded in a rented VM, making it unusable for anything else.

At Azure, we find that a major contributor to DRAM inefficiency is platform-level memory stranding. Memory stranding occurs when a server's cores are fully rented to virtual machines (VMs), but unrented memory remains. With the cores exhausted, the remaining memory is unrentable on its own, and is thus stranded. Surprisingly, we find that up to 25% of DRAM may become stranded at any given moment.

When designing integrated circuits, engineers aim to produce an efficient design that is easier to manufacture. If they manage to keep the circuit size down, the economics of manufacturing that circuit is also going down. NVIDIA has posted on its technical blog a technique where the company uses an artificial intelligence model called PrefixRL. Using deep reinforcement learning, NVIDIA uses the PrefixRL model to outperform traditional EDA (Electronics Design Automation) tools from major vendors such as Cadence, Synopsys, or Siemens/Mentor. EDA vendors usually implement their in-house AI solution to silicon placement and routing (PnR); however, NVIDIA's PrefixRL solution seems to be doing wonders in the company's workflow.

Creating a deep reinforcement learning model that aims to keep the latency the same as the EDA PnR attempt while achieving a smaller die area is the goal of PrefixRL. According to the technical blog, the latest Hopper H100 GPU architecture uses 13,000 instances of arithmetic circuits that the PrefixRL AI model designed. NVIDIA produced a model that outputs a 25% smaller circuit than comparable EDA output. This is all while achieving similar or better latency. Below, you can compare a 64-bit adder design made by PrefixRL and the same design made by an industry-leading EDA tool.

Intel's upcoming family of Arc Alchemist mobile graphics cards is just around the corner, and we are already starting to spot the company's reference systems utilizing the latest dedicated graphics. Thanks to the findings of @momomo_us, we have information that Intel is readying the NUC X15 laptop reference system codenamed "Alder Country." There are two SKUs, LAPAC71G and LAPAC71H, each with similar CPU and GPU configurations. Carrying an Intel Core i7-12700H processor with 14 cores and 20 threads, the CPU is paired with either Arc A550M on the LAPAC71G SKU or Arc A730M on LAPAC71H SKU.

As a reminder, Intel already made such NUC X15 reference laptop designs with Tiger Lake processors. However, they came with NVIDIA GeForce RTX 30 graphics instead of Intel Arc Alchemist. Implementations of NUC X15 appeared with partners such as ADATA XPG Xenia laptop. We could expect to see more OEMs adapt Alder Country if the performance of Arc Alchemist graphics proves good.