Microsoft has finally updated its Surface Laptop and Surface Pro 2-in-1. The refreshed Surface Laptop 11 is now powered by Intel's Lunar Lake chips, up to the Core Ultra 7 268V with 32 GB of LPDDR5X memory and the Arc 140V iGPU. The laptop continues to be available in 13.8-inch and 15-inch sizes, with hardly any updates to the exterior compared to the Arm-powered variants we witnessed last year. Interestingly, the laptop will now feature support for 5G connectivity, which is a welcome upgrade for those frequently on the go.

The Surface Pro 7 also received an update, boasting up to the Core Ultra 7 268V with 32 GB of memory and NFC support. Like the Surface Laptop, the Surface Pro 2-in-1 misses out on the Core Ultra 9 chip, although it does feature the option for an OLED display, which the Surface Laptop does not, for whatever reason. Both the Surface Laptop and Surface Pro get 120 Hz displays, although the Surface Pro enjoys a higher pixel density. Microsoft claims 10 hours of web surfing for the Surface Pro, and 12/14 hours for the 13.8/15-inch Surface Laptop. Both the devices start at $1,499 for the base variants, with shipping scheduled to start from the 18th of February.

ASUS today announced the ExpertBook B3 series, an all-new lineup of AI-powered laptops that offers extensive customization to empower daily business needs. Equipped with up to the latest Intel Core Ultra 7 processor (Series 2) with Intel vPro, Intel AI Boost NPU and Intel Arc graphics, ExpertBook B3 delivers solid performance to tackle a wide range of tasks seamlessly. These new laptops also feature powerful AI tools such as ASUS AI ExpertMeet], Microsoft Copilot and AI noise-canceling technology, delivering unmatched productivity experiences.

With a build that's as lightweight as 1.4 kg, a 180° lay-flat hinge, military-grade durability, comprehensive connectivity, and advanced security features, the latest ExpertBook B3-series AI PCs ensure flexibility and efficiency on the go. In addition, with long battery life, exceptional visuals and audio, and an eco-friendly design, ExpertBook B3 series supports streamlined workflows - keeping employees productive, wherever they work.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is announcing the release of low latency DDR5-6400 CL30-39-39-102 memory specification in high-capacity kit configurations, up to 96 GB (2x 48 GB) kit capacity. This high performance memory kit specification will be available under the Trident Z5 RGB and Trident Z5 Royal series, with Intel XMP 3.0 memory overclock profile support.

The G.SKILL DDR5-6400 CL30 memory kit at 96 GB (2x 48 GB) combines high-capacity and low-latency to enable higher performance for memory intensive platforms and uses. The screenshot below shows this 96 GB (2x 48 GB) memory kit operating at DDR5-6400 CL30-39-39-102 with the ASUS ROG Maximus Z890 Hero motherboard and Intel Core Ultra 7 265K desktop processor.

LG Electronics has announced its 2025 Gram laptop lineup at CES 2025, featuring Intel's latest processors and a new AI system that combines on-device EXAONE language processing with cloud-based GPT-4o capabilities. The flagship Gram Pro (17Z90TR) features a 17-inch WQXGA LCD display with 2,560 x 1,600 resolution and a 31-144 Hz variable refresh rate. Powered by Intel Core Ultra 9 or Ultra 7 processors and an NVIDIA RTX 4050 with 6 GB GDDR6 memory, it supports up to 32 GB of LPDDR5X RAM at 8,533 MHz. The device includes dual SSD slots supporting up to 2 TB Gen 4 NVMe storage and a 90Wh battery, all within a 3.26-pound chassis.

The Gram Pro 2-in-1 (16T90TP) employs a 16-inch WQXGA+ OLED panel with 2,880 x 1,800 resolution and a 48-120 Hz refresh rate. Running on Intel Core Ultra 7 or Ultra 5 processors with Intel Arc graphics, it features up to 32 GB of LPDDR5X memory at 8,400 MHz. The convertible weighs 3.08 pounds and includes a 77Wh battery and a mega dual cooling system. At 2.73 pounds, the Gram Pro 16Z90TS combines Intel Core Ultra 7 processors with Intel Arc graphics, featuring a 16-inch WQXGA LCD display and 77Wh battery. All Pro models include dual USB4 Gen3x2 Type-C ports with Thunderbolt 4 support and HDMI 2.1 outputs capable of 4K@60 Hz.

Courtesy of serial leaker @momomo_us, who dug up the product pages for Intel's two new retail boxed CPU coolers, we now know what they'll look like ahead of them shipping. The two coolers are known as the Laminar RH2 and Laminar RM2, with the RH2 being the higher-end model of the two. The RH2 has a copper heat column that attaches to aluminium fins and it's decorated with an aRGB LED ring, as well as a white Intel LED logo. It stands 71 mm tall from the base of the heatsink to the top of the fan and is overall 103 x 103 mm and it weighs in at 450 grams. It's rated for CPUs up to 65 W TDP and the fan operates between 1000 and 3000 rpm and supports variable speed via PWM control. It will output 23 dBA at 1600 RPM with the CPU at 40 degrees C, according to the specs. It appears to come with some kind of back plate and it's screwed in place. It will only ship with the Intel Core Ultra 9 Processor 285 for now.

The much more basic RM2 cooler is designed for 65 W TDP CPUs and it measures 100 x 100 mm, but it only stands 47 mm tall. Here only the base of the cooler is made out of copper, the fins are once again made from aluminium and this results in a lower weight of 340 grams. The fan speed range is 600 to 3250 rpm and we're looking at a PWM controlled fan here too. The downside is that the fan has to run at 2400 rpm to produce the same 40 degrees at the inlet with a 65 W CPU underneath it, which results in a noise level of 30 dBA, which is a lot louder than the RH2. Unlike the RH2, the RM2 uses standard Intel socket push-pins for mounting. The RM2 will ship with the Intel Core Ultra 5 Processor 225, 225F, 235, 265 and 265F CPUs, but according to the product page, it will also ship with some Core Ultra 7 desktop chips. Both coolers come with a three-year warranty. Design wise, both of the new coolers are a lot less flashy compared to the previous generation of Intel CPU coolers.

Today's gamers are not just players; we are the innovators and leaders of tomorrow's workforce. As someone who recognizes the incredible potential within our gaming community, I'm committed to supporting your journey both in and out of the game. In our latest announcements focusing on the future of play and work, we've shared exciting updates across various fronts, including some major innovations in gaming. I'm thrilled to introduce even more gear designed to enhance your gaming experience. From the powerful OMEN 16 Laptop and the compact OMEN 16L Desktop to our stunning new OMEN displays and precise HyperX mice, I can't wait to dive into the details and show you how these products will elevate your play and keep you ahead of the curve. We're not just creating innovations; we're shaping the future of play.

Power and Performance for All: The OMEN 16 Laptop and OMEN 16L Desktop
At HP, your feedback is our guiding star. You told us you want smooth, immersive gameplay on machines that stay cool and quiet; we created the third-generation OMEN 16 to be our coolest and quietest version yet. The OMEN 16 elevates your gaming experience with cutting-edge technology and thoughtful design, keeping performance at its peak. Let's dive into the technical specifics.

Intel today launched "locked" 65 W variants of its Core Ultra "Arrow Lake-S" desktop processors in the Socket LGA1851 package. The company also announced more affordable motherboard chipset models, namely the Intel B860 mid-range chipset, and the Intel H810 value-ended chipset. The processor lineup is led by the Intel Core Ultra 9 285 (8P+16E, up to 5.60 GHz P-core boost), followed by the Core Ultra 7 265 (8P+12E, up to 5.30 GHz P-core boost); and the Core Ultra 5 245 (6P+8E, up to 5.10 GHz P-core boost). All three come with suitable boxed cooling solutions in the retail channel.

The Intel B860 chipset comes with a 4-lane DMI 4.0 chipset bus (half the bandwidth of the 8-lane chipset bus of the Intel Z890). The PCH puts out 14 PCI-Express 4.0 general purpose lanes, exactly half the number put out by the Z890. Storage connectivity, besides the configurability of the PCIe GPP lanes, include four SATA 6 Gbps ports. Networking includes a 1 GbE MAC, and Wi-Fi 6E integrated MAC, with Bluetooth 5.3. You can have up to 16 USB 3.2 lanes (each worth 5 Gbps), which can be configured as 5 Gbps, 10 Gbps, or 20 Gbps ports. The B860 lacks CPU overclocking support, but retains memory overclocking, including the ability to apply XMP 3.0 profiles.

The Core Ultra 200H series of mobile processors is designed to cover the majority of mobile device use-cases from the next-generation. These chips are very much based on the latest "Arrow Lake" microarchitecture, but with a few clever design changes. This is a tile-based processor, just like the 200HX series; but the various tiles are different. The Compute tile, which packs the main CPU complex, is noticeably smaller, with 6 "Lion Cove" P-cores, and two "Skymont" E-core clusters with 8 E-cores sharing a 24 MB L3 cache, and a ringbus interconnect. Things get interesting with the SoC tile, which now contains two Low-power Island E-cores. At this point, it is unclear if these are "Skymont," or are older generation "Crestmont" cores, which would mean that Intel has carried over the SoC tile from "Meteor Lake-H."

The SoC tile also contains at 13 TOPS-class NPU, which means these chips miss out on Microsoft Copilot+ AI PC logo. The idea behind this could be that Intel is trying to promote the Core Ultra 200V series "Lunar Lake," which comes with a powerful 45 TOPS NPU. The company is announcing several new models of "Lunar Lake" today, including vPro ones. Switching focus back to "Arrow Lake-H," and our attention is drawn back to the SoC and I/O tiles, which miss out on the number of PCIe lanes, particularly Gen 5 ones, which the Core Ultra 200HX chips come with. The game changer for this chip, however, is the large Graphics tile. The iGPU of "Arrow Lake-H" is based on the same Xe-LPG graphics architecture as the one on "Meteor Lake," and not Xe2 "Battlemage" like on "Lunar Lake." However, this iGPU is vastly different from the one the "Arrow Lake-HX" comes with.

Intel kicked off a slew of 2025 International CES announcements with the Core Ultra 200HX series. The HX segment of mobile processors covers a range of premium gaming notebooks and mobile workstations. These chips tend to be essentially the desktop S-segments of processors but redesigned for the mobile BGA package, letting the platform have the highest possible CPU core count from a client architecture. The same is the case with the Core Ultra 200HX series. It is based on the same chiplet based "Arrow Lake" die with a maximum CPU core count of 8P+16E. AI acceleration comes from a 13 TOPS-class NPU—this won't power Copilot+, but is enough for a few entry-level local AI acceleration workloads. The iGPU is the smallest "Arrow Lake" has to offer, but the idea is that its target platform will have discrete graphics.

The series is led by the Core Ultra 9 285HX, with the maximum 8P+16E core count, a maximum P-core boost frequency of 5.50 GHz. Next up, is the Core Ultra 9 275HX. This chip has the same 8P+16E core CPU configuration has the 285HX, but at slightly lower frequencies, with its P-core boost reaching up to 5.40 GHz. After this, is the Core Ultra 7 265HX, featuring an 8P+12E core CPU configuration, and 5.30 GHz maximum P-core boost. Positioned right below is the Core Ultra 7 255HX, with the same core configuration as the 265HX, but with 100 MHz lower clocks. The 275HX and 255HX appear to be designed for greater volumes.

Minisforum is a consumer hardware brand that is well known for its impressive lineup of SFF/Mini PCs. However, what might not be as well-known, might be the fact that the brand also makes a plethora of other computing hardware and accessories. The company had recently announced the V3 and the more affordable V3 SE 3-in-1 tablet PCs with a design that is reminiscent of the Microsoft Surface. The V3 SE is now available to purchase, starting at $799.

At its heart, the Minisforum V3 SE is powered by the 28 W Ryzen 7735U "Rembrandt R" APU based on the Zen 3+ microarchitecture paired with 16 GB of LPDDR5-6400 memory. The APU is a decently powerful one, with multicore performance that is roughly in the same league as the Core Ultra 7 258V "Lunar Lake" processor. Unsurprisingly, any kind of discrete graphics is absent from the PC tablet, thereby making it rely solely on the 12-CU Radeon 680M iGPU for graphically demanding tasks. Storage is taken care of by its 1 TB M.2 SSD, which is housed in a 2280 slot.

Here are some of the first pictures of the retail boxes of the Intel Core Ultra 200-series "Arrow Lake-S" 65 W desktop processors. Intel debuted the series with Unlocked K-series SKUs in October 2024, and will expand it in January 2025 with 65 W models that lack unlocked multipliers. The unlocked models lack any included stock cooling solution, while the 65 W models come with them. There's no word on what the coolers look like, but if we were to guess, Intel will reuse its Laminar series fan-heatsinks that it debuted with its 12th Gen Core "Alder Lake."

The new Socket LGA1851 retains cooler compatibility with the previous LGA1700, which is why the company could reuse the Laminar series. The Core Ultra 9 65 W retail box appears the largest, and so it could include the Laminar RH1 cooler that's capable of cooling the processor as it draws its maximum turbo power. This cooler comes with some blue LED illumination. The Core Ultra 7 and Core Ultra 5 65 W retail boxes appear to have the same thickness, which means the two could include the mid-tier Laminar RM1 cooler. The RM1 has a slightly thinner heatsink, but comes with an illuminated ring along the bore of the fan-frame. If Intel launches a Core Ultra 3 series (successor to the Core i3), Intel will likely include the Laminar RS1, the lightest variant, which lacks any lighting. The first three pictures (below) show boxes of the standard variants of the 65 W SKUs, the 4th and 5th pics show the boxes of the "F" SKUs which lack integrated graphics.

Intel is significantly expanding its desktop Core Ultra 200 "Arrow Lake-S" lineup with new 65 W models along the sidelines of the 2025 International CES, but more importantly, it is bringing the "Arrow Lake" microarchitecture to the mobile space. The company is planning to launch at least 22 processor models this January, but not all of them are based on "Arrow Lake." Tom's Hardware reports that the lineup broadly revolves around the "Core 2-series" processor model numbering.

The Core Ultra 200H series consists of H-segment (conventional thickness notebook) processors in the 28 W to 45 W class, and are based on the "Arrow Lake-H" silicon. The Core Ultra 200HX series targets premium gaming notebooks and portable workstations, and consists of 55 W to 65 W class processors, including CPU overclocking capabilities on certain models. Things get interesting with the Core Ultra 200U series. These chips are based on the "Meteor Lake Refresh" silicon—an older microarchitecture—targeting the 7 W to 28 W segments for ultraportables. Lastly, there's the Core H 200 and Core U 200 series (no "Ultra" in the branding), which are based on the older "Raptor Lake" monolithic silicon, targeting mainstream notebooks.

Dynabook has introduced the Protégé X30W powered by up to an Intel Core Ultra 7 165H processor. At first glance, that hardly seems impressive, but a closer look at the device reveals that the laptop weighs a feather-light 989 grams, or roughly 2.2 lbs. The device is also a convertible, which means that the hinge allows for 360° rotation, effectively converting the laptop into a tablet.

Apart from its lightweight design, there is little else about the laptop that is worth noting. The highest-end variant sports a Core Ultra 7 165H, which is a plenty-powerful chip, featuring 6 performance cores and 8 efficiency cores for a total of 14 cores and 22 threads, since the Crestmont cores do not support Hyper-Threading. An 8-core Arc iGPU handles the graphics, and delivers decent performance that nearly matches the RTX 2050 Mobile in certain cases. The system features up to 32 GB of DDR5-5200 memory, and up to a 2 TB PCIe Gen 4 SSD.

Team Group Inc.'s gaming brand T-FORCE launched the highly anticipated XTREEM CKD DDR5 8800 2x24GB Desktop Memory, designed with advanced Client Clock Driver (CKD) technology to enhance data transfer stability. With overclocking capabilities reaching up to 9600 MT/s, this memory module redefines overclocking potential with the groundbreaking CUDIMM platform, delivering exceptional performance and setting new industry milestones.

In close collaboration with leading motherboard manufacturers, the T-FORCE XTREEM CKD DDR5 is designed for stability at an exclusive frequency of 9600 MT/s on 2 DIMM motherboards. Featuring a premium 2 mm-thick aluminium alloy heat spreader and high thermal conductivity silicone, it significantly improves heat dissipation by 10%. Its CNC cutting technology, matte sandblasting, and black anodizing processes create a refined, understated aesthetic. Paired with the iconic T-FORCE logo, it offers gamers a product combining high performance and premium design. Utilizing patented IC classification and verification technology, the module integrates a power management chip for stable power consumption. It also supports on-die ECC for error detection and correction, ensuring exceptional system stability.

Gear up for unparalleled mobile gaming with the new MSI Claw 8 AI+& Claw 7 AI+ refresh. Powered by the next-gen Intel Core Ultra 7 processor (Series 2), these two compact powerhouses combine exceptional performance with outstanding efficiency. Enjoy stunning visuals on vibrant displays, available in two sizes: 7-inch and the new 8-inch, enhanced by AI-driven precision.

Upgraded with larger batteries for longer gaming sessions and optimized power consumption for smoother performance. Designed for optimal comfort during intense gameplay, the Claw 8 AI+ and Claw 7 AI+ feature sleek ergonomic designs, advanced cooling technology, and comprehensive I/O ports for seamless connectivity. As the Copilot+ PC-capable handhelds available, they set a new standard for portable gaming.

Intel is expanding its Core Ultra 200S lineup with seven new SKUs, a recent leak by @momomo_us shows. The leak gives details on non-K, T, and F versions across the Core Ultra 5 7, and 9 families. The top-end Core Ultra 9 285 will come in 65 W and 35 W versions. These match the 285K's 24-core setup but run at lower speeds. The 285T keeps the 4-core Xe built-in graphics.

The Core Ultra 7 series adds three models: 265 265F, and 265T. All share a 30 MB L3 cache being differentiated by different clock speeds. The T version has much lower base clocks. For the Core Ultra 5 series, the leak shows two models: 225 and 225F. Both have 10 cores running at 3.3/4.9 GHz (P-cores) and 2.7/4.4 GHz (E-cores), with 2 Xe GPU cores and a 65 W TDP. Unlike their higher-end models, this tier doesn't plan to have a T version right now.

Starforge Systems, the leading pre-built PC manufacturer preferred by streamers, has released CPU upgrades to several of their top gaming PCs this week including the Explorer Pro, Explorer Elite, Voyager Pro and Voyager Elite. Through the latest upgrades, the Explorer Pro and Explorer Elite, the sleek wood-trimmed PC geared toward creatives and gamers, now features Intel Arrow Lake via Intel Core Ultra 7 265K on the Explorer Pro ($2,6949.99) and Intel Core Ultra 9 285K on the Explorer Elite ($4,699.99). With these upgrades, customers can expect added productivity performance, making these the perfect workstation PCs for those looking for a PC that can do it all.

Additionally, the Voyager Pro ($3,299.99) and Voyager Elite ($4,699.99) have been upgraded to include AMD's Ryzen 7 9800X3D CPU, bringing added productivity and gaming performance to the powerhouse PCs. Starforge Systems' Voyager line can be customized with a variety of case print bundle designs including the recently released Dragonlight case.

Kovan Yang set a new memory frequency record of DDR5-12196 (6097.6 MHz). This was possible with an Intel Core Ultra 7 265K with 2P+0E configuration running at a low 400 MHz, an MSI MEG Z890 Unify-X motherboard, and a single Kingston FURY Renegade 24 GB CKD module. The sub-timings achieved were 48-120-120-127-2. Not much else is known about the feat, such as the cooling or DRAM voltages used. The 5°C CPU temperature reading in the CPU-Z validation page suggests that an extreme cooling solution is being used. The Core Ultra "Arrow Lake-S" processor and Z890 platform, when paired with CUDIMMs (DDR5 DIMMs with client clock drivers) yield extreme memory overclocking capabilities, with several initial memory OC records breaching the 12000 MT/s mark. The HWBOT page can be accessed here, and the CPU-Z Validation page here.

As we await the launch of Intel's "Arrow Lake-S" Core Ultra 200S series of processors for desktops, we are getting some new leaks about Intel's mainstream mobile "Arrow Lake-H" update. A month ago, we got the specification table of the high-end mobile "Arrow Lake-HX," and now, thanks to Jaykihn X, we have the mainstream laptop chip specifications as well. The top-of-the-line includes Intel Core Ultra 9 285H, a 45 W TDP SKU with six P-cores, eight E-cores, and two LPE cores. The CPU packs integrated Xe2 graphics with eight cores and 24 MB of total L3 cache and has a maximum boost of 5.4 GHz for P-cores.

Moving down the stack, there are Core Ultra 7 265H and Core Ultra 5 255H SKUs, which feature the same P/E/LPE core configuration. However, these SKUs are rated for 28 W TDP, having lower maximum frequencies and the same iGPU configuration. This time, we also have two Core Ultra 3 SKUs, with Core Ultra 3 235H and 225H bringing four P-cores, eight E-cores, and two LPE-cores in the 28 W package. The Core Ultra 3 235H has eight Xe2 cores in its iGPU, while the lowest-end Core Ultra 3 225H has only seven Xe2 iGPU cores. For a complete set of specifications, including all clock speeds in base and boost, please check out the table below.

Corsair announces broad compatibility across its extensive component ranges designed to realize the potential of the Intel Core Ultra series processors. Intel Core Ultra processors feature a new socket, LGA 1851, and Corsair is ready with a full lineup of compatible CPU coolers. All our CPU coolers compatible with the previous LGA1700 socket are compatible with the new LGA 1851 socket, from our A115 air cooler to our best-performance TITAN RX RGB series of AIO coolers. From our 120 mm single fan radiators to our class-leading 360 mm and 420 mm radiators, we have a solution for you no matter which Core Ultra processor you choose or what case you're using.

To unleash the performance of the new Core Ultra series processors, we have a wide range of DOMINATOR and VENGEANCE series DDR5 memory kits available. These cutting-edge kits are designed to deliver award-winning performance, with XMP certification providing easy overclocking and improved memory bandwidth. Whether you're a gamer, content creator, or professional, Corsair DDR5 memory is the premiere option for reliable high-speed DRAM. With speeds up to 8,200 MT/s and densities up to 128 GB per kit, you can choose from attractive and compact VENGEANCE modules to the aesthetically elite DOMINATOR TITANIUM with RGB lighting that can be controlled through our iCUE software.

BOXX Technologies, the leading innovator of high-performance computer workstations, rendering systems, and servers, today announced that its best-selling APEXX S-Class workstations now feature Intel Core Ultra 7 and Ultra 9 processors. The new CPUs deliver outstanding performance for CAD, 3D design, motion media, and other professional software applications. BOXX is first to market with workstations featuring the new Intel Core Ultra processors and is accepting orders now.

"Intel Core Ultra processors unlock new levels of performance with features like AI optimization, increased PCIe lanes, and maximized peripheral connectivity," said BOXX founder and Chief Technology Officer Tim Lawrence. "Whether you're 3D modeling, video editing, engineering, designing, or utilizing AI enhancements, BOXX APEXX S-class systems powered by Intel Core Ultra processors will accelerate your creative applications and render engines through their most demanding tasks."

MSI proudly introduces the next generation of motherboards, designed to pair seamlessly with Intel brand-new Core Ultra Processors. The Z890 MEG Series, MPG Series, MAG Series, and PRO Series motherboards are designed to harness the power of Intel's latest technology, delivering enhanced AI computing efficiency compared to previous generations. These boards provide exceptional performance with advanced features, MSI innovations, premium components, and improved connectivity. But what truly sets them apart is their user-friendly DIY solutions, empowering you to take control of your computing experience. Built with gamers, creators, and all users in mind, MSI's Z890 motherboards offer the very best in computing power. On launch, there will be 5 models available, which are the Intel Core Ultra 9 285K, Intel Core Ultra 7 265K / 265KF, and Intel Core Ultra 5 245K / 245KF processors.

With the introduction of MSI's Z890 motherboards, designed to push performance boundaries and with a completely redesigned, more intuitive BIOS, users can now maximize motherboard performance with ease. Powered by MSI's Ultra Engine, memory design optimization enables overclocking up to 9200+ MT/s across the entire Z890 motherboard lineup. And with the returning of the MEG Z890 UNIFY-X, built with overclocking in mind, takes memory frequencies even higher, reaching up to 9600 MT/s. The Z890 motherboards incorporate a number of powerful features like AI Boost with the ability to overclock the NPU further for AI enhancement capabilities, Game Boost, Performance Preset, enhanced XMP Memory Profiles, and Memory Try It!, allowing users to elevate their system's performance to new heights.

Intel's Arrow Lake-S launch line-up has been confirmed courtesy of serial leaker @9550pro on X/Twitter and although the leaked Intel product slide doesn't contain any real surprises by now, it does confirm that Intel will launch five different SKUs later this month. The Core 200S-series should be unveiled on Thursday by Intel, but retail availability isn't expected until the 24th of October. The Initial five CPU SKUs will be the Core Ultra 9 285K, the Core Ultra 7 265K and 265KF and finally the Core Ultra 5 245K and 245KF. As noted earlier today in the performance leak of the Core Ultra 9 285K, the entire Arrow Lake-S series will lack Hyper-Threading in favour of more E-cores. The Core Ultra 9 285K features eight Lion Cove P-cores and 16 Skymont E-cores, followed by the Core Ultra 7 265 SKUs which retain the Lion Cove core count, but ends up with only 12 Skymont cores. Finally, the Core Ultra 5 SKUs have six Lion Cove P-cores and eight Skymont E-cores. All the upcoming SKUs feature Intel's Thermal Velocity Boost, a feature that used to be exclusive to the Core i9 tier of CPUs in the past, but only the Core Ultra 9 and Ultra 7 SKUs support Intel Turbo Boost Max Technology 3.0. The Core Ultra 9 and Ultra 7 SKUs have a maximum TDP of 250 W, with the Core Ultra 5 SKUs peaking at 159 W. All five processors have a base power of 125 W.

As such, we're looking at boost speeds of up to 5.7 GHz for the Core Ultra 9, 5.5 GHz for the Core Ultra 7 and 5.2 GHz for the Core Ultra 5 processors. The Core Ultra 5 has the highest base frequency of the three SKUs with the P-cores clocking in at 4.2 GHz and the E-cores at 3.6 GHz. The Core Ultra 7 follows at 3.9 GHz for the P-Cores and 3.3 GHz for the E-cores and finally the Core Ultra 9 has a base frequency of 3.7 GHz for the P-Cores and 3.2 GHz for the E-cores. Intel has upped the JEDEC memory support to DDR5-6400, which is an 800 MHz jump in the officially supported memory speed from its 14th Gen Core i processors. Up to 192 GB of RAM is supported, which is the same as the previous generation of desktop CPUs from Intel. The IGP sports four Xe-cores across the board of the K SKU CPUs, with a base clock of 300 MHz and a boost clock of up to 2 GHz, although the Core Ultra 5 SKUs end up with an IGP that only boosts to 1.9 GHz. All SKUs also feature a third generation NPU capable of 13 TOPS, which is a lot weaker than the mobile Core Ultra 200V Lunar Lake CPUs which have an NPU capable of up to 48 TOPS, depending on the SKU. As this leak appears to be from the same original source as the performance figures that leaked earlier, we'd assume the information is correct, especially as it lines up with earlier leaks, but it should still be taken with a pinch of salt until everything has been confirmed by Intel.

Canadian online retailer ShopRBC put up listings of unreleased Intel Core Ultra 200-series "Arrow Lake-S" desktop processors. While the availability listed is zero, you can backorder these chips at the prices listed, so they are shipped when available. The flagship Intel Core Ultra 9 285K (8P+16E) processor is listed at CAD $852 (around USD $628). There is no "KF" variant of this part unlike with past generations of Intel flagship SKUs. The Core Ultra 7 265K (8P+12E) is next up, at CAD $589 (USD $435). Its KF variant, which lacks integrated graphics, is up for CAD $22 less than that (CAD $567 or USD $418).

Intel's middle-of-the-market part for this generation, the Core Ultra 5 245K (6P+8E) is next up, listed at CAD $450, or USD $331. You can back-order its KF variant for CA $23 less, at CA $427 (USD $315). The Core Ultra 200 "Arrow Lake-S" introduces the new Socket LGA1851, and so online retailers around the world should begin putting up compatible motherboards based on the Intel Z890 chipset, which is rumored to be the only chipset option available with these chips until Q1-2025, when Intel fleshes out the series with non-K SKUs and value chipsets such as the B860.

While the upcoming desktop versions of Intel's "Arrow Lake" processors are stealing all the hype, we are getting a leak about the high-performance "Arrow Lake-HX" chips for laptop space. Thanks to Jaykihn on X, we learn that Intel has prepared six SKUs for laptop enthusiasts to power workstations and gaming. The upcoming Core Ultra 200 series SKUs are 285HX, 275HX, 265HX, 255HX, 245HX, and 235HX. Starting with the lower-end Core Ultra Core Ultra 5 245HX / 235HX, we get six P-cores running at 3.1 and 2.9 GHz base speeds, respectively. For both SKUs, E-cores are clocked at 2.6 GHz at the base. Boosing the P-cores yields a maximum of 5.1 GHz, while E-cores top out at 4.5 GHz. For graphics, the 48 EUs inside the iGPU are clocked at 1.8 GHz on the 235 HX, while 245 HX runs at 1.9 GHz. THese models don't support Thermal Velocity Boost and Turbo Boost Max 3.0, while of the remaining SKUs support both features.

Moving to the middle of the stack, there are two SKUs: Core Ultra 7 265HX / 255HX. Both feature eight P-cores and twelve E-cores. The differentiator here is the clock speed. P-cores on the 255HX run at 2.4 GHz base and 5.2 GHz boost, while the P-cores on 265HX run at 2.6 GHz base and 5.3 GHz boost. E-cores have a wider gap with the 255HX running at 1.8 GHz base and 4.5 GHz boost, while 265HX has E-cores pinned at 2.3 GHz base and 4.6 GHz boost. Both of these SKUs have iGPU with 64 EUs set at 1.9 GHz.