Intel's mainstream market implementation of the Nehalem architecture will come in the form of monolithic quad-core a dual-core chips that have northbridge machinery integrated. Based on the Lynnfield (quad-core) and Arandale (dual-core) designs, Intel will place the processors on a common system design dubbed the "Ibex-Peak". The processors are likely to be branded as Core i5, Core i4 or even Core i3 depending on a lot of factors. Additionally, Intel plans enterprise variants of the said chips.

To seat these chips, Intel is designing new sockets: LGA-1155, LGA-1156 the two can be classified into the sockets for the desktop variants, with another LGA-1167 socket most likely to be exclusive for the Xeon variants. PCGH sourced some images from Intel's Design Development Tools (DDT) portal (found here), which tell that Intel names its new series of sockets as "socket H". Pictured below is a processor package viewed from its business-end. The other three you can see, are interposer-boards. These are devices that resemble the actual product packages that sit on the sockets. You can see a grid of leads over the "IHS" of the package. The leads serve to help in the technical development of products based on the package design, hence it is found on the DDT portal. It should give you an idea of what an LGA-1155, LGA-1156 and LGA-1167 processor should look like, sans the leads on the IHS. The images below in the same order. Finally, pictured much earlier, is the Ibex-Peak platform motherboard that demonstrates the design.

Leading CPU makers Intel and AMD have adopted memory standards in fairly quick succession in the past. This however, doesn't seem to be the case with DDR3. AMD is yet to release a CPU that supports DDR3 memory, and is two years behind Intel with its DDR3 implementation plans. Intel on the other hand has managed 100% DDR3 dependency with only its premium Core i7 platform, with DDR3 not completely replacing DDR2 in any of its mainstream or value lineups.

Market factors, namely the DRAM manufacturing industry, are increasingly posing difficulties to CPU makers to bring DDR3 memory at a consumer-friendly price point. With manufacturing costs refusing to come down and the Core i7 not able generate the expected demand that justifies selling triple channel kits at sub-$100 price-points, CPU makers are rethinking their large-scale DDR3 standard transition plans for their entire lineups. Intel on its part is contemplating on postponing its 5-series mainstream platform for the Intel Core i5 series processors. AMD on the other hand, is still struggling with technical difficulties in achieving stability and compatibility with DDR3 memory on its DDR3-supportive memory controllers the upcoming AM3-socket CPUs come with. So the company is also unlikely to transition to DDR3 until it is able to come out with a workable BIOS, sources add. It could be as long as 2010 by when a 100% industry-wide implementation of DDR3 can take place.

i5? i5! Core i5 would be the brand name Intel's mainstream desktop derivatives of the Nehalem architecture based on the Lynnfield core would carry. It is similar to its big brother, the Core i7 for the most of the part except for a few differences:

• A current generation Direct Media Interface (DMI) Interconnect as chipset interface
• A 128-bit wide DDR3 memory interface (Dual Channel) instead of triple-channel
• Some more machinery from the northbridge migrated to the CPU, such as the PCI-Express root complex
• The newer LGA 1160 socket

Lynnfield continues to have four x86 processing cores with HyperThreading enabled, with 256 KB of L2 cache per core and a shared 8 MB L3 cache. Chiphell got its hands on not only the processor, but also a compatible motherboard and run a quick preliminary evaluation of the processor. The processor, clocked at 2,127 MHz, was put though SuperPi, wPrime, Cinebench, Fritz Chess, and 3DMark Vantage. The processor is expected to release in the second half of 2009.