MSI, the global leading brand in motherboards, announced the launch of the upgraded version of IM-QM67 with the 2nd Generation Intel Core processor family (formerly codenamed "Sandy Bridge") to the Industrial Platform Computing (IPC) market segment. This motherboard supports multiple display outputs in a mini-ITX form factor board and utilizes Intel's 32nm process technology products for the highest HD graphic quality.

MSI debuts the IM-QM67 based on the Intel Core i7 and Core i5 processors and the Intel QM67 Express chipset to provide the latest slim form factor for embedded applications. The IM-QM67 supports 6 kinds of display outputs, including LVDS, eDP, VGA, DVI, HDMI, and DP and it has great 3D graphics performance and support for up to 1080P high definition video. The IM-QM67 also features support for Intel Active Management Technology 7.0, Direct-X 10 shader model 4.0, and full hardware acceleration.

G.Skill has announced the development of its brand new RipjawsX series memory modules, designed specifically for Intel Sandy Bridge LGA1155 processors, and H67 and P67 motherboard platforms. The new RipjawsX series consists of a complete range of memory solution, from DDR3 1,333MHz, 1,600MHz, 1,866MHz, 2,133MHz, 2,200MHz to 2,300MHz. Combined with the Intel's highly anticipated Sandy Bridge platform, G.Skill RipjawsX series memory kits deliver more bandwidth and performance than ever. The following screen shows ultimate 25K MB/s bandwidth at extreme memory speed of 2300MHz CL7.

Building on the strong success of the first generation Ripjaws brand in performance memory kits, every single RipjawsX memory kit is hand-tested on an Intel Sandy Bridge platform in accordance with G.Skill's strict internal testing procedure, to ensure the best in class performance, compatibility and reliability across a range of popular motherboards. It is the perfect memory solution for PC gamers, performance workstations, enthusiast power users and anyone who loves the cutting-edge of technology! The following list shows the detail specifications of G.Skill RipjawsX family.

Memory major Kingston Technology is ready to greet Intel's 2011 Core processor family with a new line of DDR3 memory kits tailored for it. The HyperX Genesis, as it's called, combines faster, lower-latency, and lower-voltage DDR3 memory with a new sporty-looking heatsink design that keeps the modules cool while maintaining standard module height. The heatsink is basically two sheets of metal interlocked at the top, with rows of holes to draw in convectional air currents, to cool the heatsink. Kingston's new HyperX Genesis series is expected to be out in early January, 2011.A video presentation showing the modules from almost all angles follows.

OEM major Foxconn's very own channel brand is ready with its first high-end socket LGA1155 motherboard based on the Intel P67 Express chipset, supporting upcoming "Sandy Bridge" processors. The motherboard falls into Foxconn Channel's gamer and overclocker oriented Quantum Force brand. The Quantum Force P67 from Foxconn uses bleeding-edge components such as digital PWM offering precise voltage control for the processor, multi-phase VRM for the four DDR3 memory slots, and is rich in connectivity options.

The LGA1155 socket is powered by a 14-phase digital PWM circuit using independent single-phase PWM inductors made by CPL, and memory using a 2-phase VRM. Expansion slots include two PCI-Express 2.0 x16 (electrical x8/x8 with both populated), three PCI-E x1, and one PCI. Both ATI CrossFireX and NVIDIA SLI are sure to be supported. Storage connectivity includes two internal SATA 6 Gb/s, four internal SATA 3 Gb/s, two eSATA 3 Gb/s, and one ATA connector supporting up to two IDE devices.

Mushkin Enhanced (Mushkin) released two new DDR3-1600 MHz (PC3-12800) memory kits bearing the company's Radioactive-themed FrostByte heatspreaders. The release includes a 4 GB (2x 2 GB) dual-channel kit best suited for socket LGA1156 systems, and a 6 GB (3x 2 GB) triple-channel kit, best suited for LGA1366 systems. The modules operate at 1600 MHz with timings of 7-9-7-24, with module voltage of 1.65V. Backed by a lifetime warranty, the 4 GB kit is priced at US $67.49, and the 6 GB one at $101.49.

Patriot Memory, a global pioneer in high-performance memory, NAND flash, storage and enthusiast computer products, today announces two new memory series' designed for the 2nd Generation Intel Core processor platforms - Viper Xtreme Series, Division 2 Edition and the G2 Series high-speed DDR3 memory kits.

The Patriot Memory Viper Xtreme, Division 2 memory kits are designed for the extreme enthusiast looking to push the limits of DDR3 memory technology and is the perfect companion for lightning-fast 2nd Generation Intel Core processor platforms. G2 Series memory kits are also created for the 2nd Generation Intel Core processor platform but are intended for the serious PC gamer looking for increased system performance for the gaming edge at a cost conscious price.

The world-famous DRAM module manufacturer KINGMAX presented overclocking DDR3 2400MHz Nano Gaming RAM. It is the unique and the only one DRAM module can be operated at 2400MHz without conventional heat sink. Instead of adding conventional heat sink, Nano Gaming RAM adopts the nano thermal dissipation technology（NTD Tech）to improve thermal performance by 10%. Its bandwidth can reach up to 19.2GB/sec under low voltage which means the performance will be more conspicuously improved in 3D shooting games that involve more rigorous requirements for speed.

Heat dissipation is always the key issue for the stability of system operation. Particularly in overclocking or 3D games, high temperature may easily cause the instability of operation. Targeting the overclocking and game market, KINGMAX DDR3 Nano Gaming Ram adopting NTD Tech increases the effect of heat radiation, it not only keeps the working temperature far lower than conventional heat sinks, but improves thermal dissipation performance by 10%, thereby effectively maintaining low temperature and high stability. In other words, only NTD Tech can replace conventional heat sinks and only Nano Gaming Ram can allow overclocking enthusiasts and gamers to feel free to challenge the overclocking limit.

A-Data expanded its high-performance notebook memory lineup with a new XPG Gaming Series DDR3 SODIMM module that's capable of PC3-12800 specifications, with low DRAM voltage. The 4 gigabyte module can operate at DDR3-1600 MHz speeds with latencies of 9-9-9-24, and voltage ranging between 1.35V and 1.4V. The module packs its PC3-12800 settings into an XMP profile, which can be activated on notebooks that support XMP. It is available as a 4 GB single piece, or in an 8 GB (2x 4 GB) dual-channel kit. The company did not give out pricing information.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced it has begun sample shipments of its newly developed 30nm process 4-gigabyte DDR3 SO-DIMM. The new memory module was built using currently available advanced 30nm process DRAM manufacturing technology and is composed of sixteen 2-gigabit DDR3 SDRAMs. It achieves a high density of 4 gigabytes.

Compared with Elpida's 40nm DRAM module, the new product uses 20% less operating current and 30% less standby current consumed by PC systems, and as a DRAM module it achieves one of the lowest levels of current consumption in the industry. The new eco-friendly DRAM product provide an effective power-saving response to today's need for a longer battery life for notebook PCs, netbooks, tablet PCs and other handheld electronic devices.

Intel's next-generation 2011 Core Processor Family "Sandy Bridge" isn't very far from launch. Among several interesting architectural features surfacing about the new generation of processors, fresh reports suggest that the dual-channel DDR3 memory controller supports twice the amount of memory as the previous generation. A user has been able to populate each of the four DDR3 DIMM slots on a MSI P67A-GD65 motherboard with high-density 8 GB modules to achieve 32 GB of total memory. The memory controller is able to detect the memory amount and run it properly on a Windows 64-bit variant that supports over 16 GB of memory (Professional/Server series/Ultimate). If the trend keeps up, future LGA2011 processors with their massive quad-channel DDR3 memory controllers will give consumers access to 64 GB of memory, capacities that are the luxury of only high-end servers.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-P830 Pico-ITX board for advanced portable and network connected embedded applications. The VIA EPIA-P830 features the VIA Nano E-Series processor and the latest VIA VX900 media system processor with additional support for dual Mini-PCIe modules, bringing a wealth of 3G and wireless connectivity options.

"Modern enterprise environments in healthcare, logistics and fleet management require more connected and portable devices that don't hold back on multimedia ability," said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. "The VIA EPIA-P830 addresses these needs, creating the most complete Pico-ITX board on the market with great HD video performance and a variety of display and network connectivity options."

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the launch of a new, highly overclocked, low voltage memory kit. This 4GB Dominator GT memory kit, implemented using a matched pair of 2 GB DIMMs, is guaranteed to operate at 2133MHz, with latency settings of 9-11-9-27, and at a memory voltage of only 1.5V.

"We have seen an increasing number of requests from overclockers for memory that can achieve high clock speeds at lower voltages," stated Thi La, Vice President of Memory Products at Corsair. "At 2133MHz, this 4GB memory is the world's fastest commercially available memory at 1.5 volts."

Gigabyte introduced a new Radeon HD 5670 based graphics card that is intended to be cost-effective. Carrying the model number GV-R567D3-1GI, it makes use of 1 GB of DDR3 memory instead of GDDR5. The 1 GB of memory is clocked at 800 MHz (1600 MHz DDR), installed across a 128-bit wide memory interface. The standard HD 5670 features 1 GB of GDDR5 memory clocked at 1000 MHz (4000 MHz GDDR5 effective). The HD 5670 GPU is clocked at 775 MHz. Based on the 40 nm Redwood core, it features 400 stream processors. Other features specific to Gigabyte's design include a silent double-slot cooler that makes use of an 80 mm fan, and display connectivity that includes one each of DVI, D-Sub, and a gold-plated HDMI port. Gigabyte did not give out a price, though one can expect it to be a little lower than that of the standard HD 5670.

The popular Crucial Ballistix line just stepped up a gear. Announcing Crucial Ballistix with Thermal Sensor memory modules now in speeds of DDR3-1866 MHz in capacities of 2GB, 4GB kits (2x 2GB) and 6GB kits (3x 2GB), and DDR3-2133 MHz modules in capacities of 2GB or 4GB kits (2x 2GB). This high performance RAM incorporates the new thermally improved finned design and built-in thermal sensor. Available in dual and three channel kits, these memory modules are designed for the Intel Core i5 and Core i7 systems. And coupled with the recently announced Crucial Ballistix Active Cooling Fan, this is one "cool" kit of memory.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of an eight gigabyte (GB) registered dual inline memory module (RDIMM) based on its advanced Green DDR3 DRAM. The new memory module, which has just been successfully tested by major Samsung customers, delivers superior performance, in particular because of its use of a three-dimensional (3D) chip stacking technology referred to as 'through silicon via' (TSV).

"At Samsung, we're well positioned to accommodate early market demand for our state-of-the-art TSV technology as the industry continues to forge forward with even further advances in bonding technology to enable greater performance and operational efficiency," said Dr. Chang-Hyun Kim, senior vice president and Samsung fellow, memory product planning & application engineering at Samsung Electronics. "Our 40nm-class* RDIMM being announced today marks the introduction of a more advanced eco-friendly 'Green Memory' product line up utilizing 3D-TSV technology that is expected to enhance the leadership of Samsung and our allies in server and enterprise storage."

MSI, the global leading brand in motherboard, announces the latest mini-ITX motherboard, IM-PV-C, to IPC market. IM-PV-C is designed the latest Intel Atom processors N455/ N475/ D425/ D525 and the Intel ICH8M chipset which is an ideal low power and high performance solution for industrial applications.

MSI IM-PV-C comes to meet the requirements of a low power platform, especially in power input design. MSI IM-PV-C supports ATX and wide range DC 12V ~ 24V inputs as the different BOM option. For supporting high resolution video, MSI debuts IM-PV-C with great 3D graphics performance for a high definition up to 1080P videos.

AMD rolled out three new processors today, the six-core Phenom II X6 1100T Black Edition, Athlon II X3 455, and the Phenom II X2 565 Black Edition. The new flagship of AMD's processor lineup, the Phenom II X6 1100T, is based on the AM3 socket, supporting DDR3 and DDR2 memory on older AM2+ motherboards. It carries a nominal clock speed of 3.30 GHz, is based on the 45 nm "Thuban" silicon, features 512 KB of L2 cache per core, and 6 MB of L3 between all six cores. It features the TurboCore technology, which bumps clock speed by a few hundred MHz when it senses high load. As a Black Edition chip, it features an unlocked bus multiplier. Despite its increased clock speed, the 1100T has a TDP of 125W. This chip goes for US $265.

Next up, is the Phenom II X2 565 Black Edition. Clocked at 3.40 GHz, the X2 565 is based on the Callisto silicon (which is Deneb with two cores locked), featuring 512 KB of cache per core, and 6 MB shared L3 cache. This one has a TDP of 80W, and is priced at US $115. Lastly, there's the Athlon II X3 455, a triple-core chip based on the "Rana" silicon (which is Propus with one core locked), it lacks an L3 cache, but features 512 KB L2 per core. With a TDP of 95W, this one goes for $87.

Rambus Inc., one of the world's premier technology licensing companies, today announced that it has renewed their patent license agreement with Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM). This agreement covers Elpida's range of memory products including SDR, DDR, DDR2, DDR3, LPDDR, LPDDR2, GDDR3 and GDDR5 DRAM.

"We are extremely pleased to have licensed another one of the top three memory companies. This agreement continues our licensing momentum and renews a winning partnership that has produced best-in-class memory solutions for customers," said Sharon Holt, senior vice president and general manager of the Semiconductor Business Group at Rambus. "Elpida's customers now have the full benefit of licensed products using our patented innovations to enrich the consumer experience of electronic systems."

ASUS unveiled its new workstation-grade socket LGA1155 motherboard that supports 2011-series Core i3/5/i7 processors, as well as, upcoming Xeon LGA1155 processors, the P8P67 WS Revolution. It is packed to the brim with features. To begin with, the CPU is powered by a 16+2 phase digital VRM, the socket is wired to four DDR3 DIMM slots for dual-channel memory, supporting speeds of over DDR3-2200 MHz. There are four PCI-Express 2.0 x16 slots, supporting 3-way SLI/CrossFireX, probably using a bridge chip such as the NVIDIA nForce 200, and three PCI-E x1.

Storage features include four SATA 6 Gb/s ports, and four SATA 3 Gb/s. Connectivity features include two Intel GbE controllers, 8+2 channel HD audio, two USB 3.0 ports, and a number of USB 2.0 ports. Other features include a system diagnostics card, EPU energy-efficiency processor, TurboV Processing Unit (TPU), and Quick Gate instant-on OS. ASUS will announce pricing when it most probably releases this board in January.

Rambus Inc., one of the world's premier technology licensing companies, today announced it has filed a complaint with the United States International Trade Commission (ITC) requesting the commencement of an investigation pertaining to products from Broadcom Corporation, Freescale Semiconductor, Inc., LSI Corporation, MediaTek Inc., NVIDIA Corporation and STMicroelectronics N. V. The complaint seeks an exclusion order barring the importation, sale for importation, or sale after importation of products from Broadcom, Freescale, LSI, NVIDIA and STMicroelectronics that infringe certain patents from the Dally1 family of patents, and of products from Broadcom, Freescale, LSI, MediaTek and STMicroelectronics that infringe certain patents from the Barth family of patents. In an earlier investigation requested by Rambus, the ITC found that these same Barth patents were valid and infringed by NVIDIA products, and issued an exclusion order in July of this year.

"We have been attempting to license these companies for some time to no avail. One of the respondents frankly told us that the only way they would get serious is if we sued them. Others pursued a strategy of delay rather than negotiate a reasonable resolution," said Harold Hughes, president and chief executive officer at Rambus. "Rambus has invested hundreds of millions of dollars developing a portfolio of technologies that are foundational for many digital electronics. There is widespread knowledge within the industry about our patents including their use in standards-compatible products accused in these actions. In fairness to our shareholders and to our paying licensees, we take these steps to protect our patented innovations and pursue fair compensation for their use."

Transcend Information Inc., a worldwide leader in memory and storage products, today launched an 8GB aXeRam DDR3-2000 memory kit that contains two identically matched 4GB memory modules. With a combination of high capacity, high clock speed and exceptionally low voltage of just 1.6V, the new modules are ideal for hardcore gamers, overclockers and professional users reap the benefits of a 64-bit operating system.

64-bit processors have become mainstream in mid-range and high-end systems due to their ability to support memory capacities larger than 4GB, which is essential for memory-hungry applications such as HD video editing, large databases, virtual server farms, etc. With 8GB of total capacity, a clock frequency of 2000MHz and timings of 9-11-9-24, Transcend's newly released dual-channel kit is a comprehensive memory upgrade solution-especially for systems with modern processors running more advanced operating systems.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the Vengeance series of high performance DDR3 memory modules for enthusiasts and system builders.

Vengeance memory modules use carefully selected RAMs to enable excellent overclocking results on current and future generation Intel and AMD platforms. All initial Vengeance memory modules have a low 1.5V supply voltage for maximum compatibility and for energy-efficient operation. Vengeance DDR3 memory kits are available in single, dual, or triple module kits, with sizes ranging from 4GB all the way up to 16GB. All Vengeance modules are equipped with aluminum heat spreaders for thermal performance as well as aggressive appearance.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had begun sample shipments of its new 2-gigabit DDR3 SDRAM (product names: EDJ2116DEBG and EDJ2108DEBG) geared for use in consumer electrical appliances. The new SDRAM is the industry's smallest 2-gigabit DDR3 that supports an x16-bit I/O interface.

The new 2-gigabit DDR3 SDRAM is well suited to consumer electrical appliances. It meets the high-speed DDR3-1600 (1600Mbps) standard likely to become the mainstream memory speed standard in 2011, uses energy-efficient 1.35V for the DDR3L-1333 memory speed and is compliant with DDR3-Plus (seamless BL4 access) for upgrading the performance of consumer electrical appliances.

ASRock is known to mix and match sockets and chipsets to come up with some interesting hybrids that give users access to latest features offered by the chipset. A recent example of this is a socket 939 motherboard based on the AMD 785G chipset (read here), which gives users of socket-939 Athlons access to a fast IGP and PCI-Express 2.0. The company's latest such innovation is the P67 Transformer. This is a socket LGA1156 motherboard, it supports existing Core i5/Core i7 "Lynnfield", and Core i3/Core i5 "Clarkdale" processors, but is based on the Intel P67 Express chipset. The board gives users access to some advanced features of the P67 chipset, but won't support LGA1155 processors.

So what's in it for you? Well, the P67 PCH embeds a PCI-Express 2.0 hub compared to P55/H55, which pack an older PCI-Express 1.1 hub. The older hub is known to heavily bottleneck devices such as USB 3.0 and SATA 6 Gb/s controllers that use only a single PCI-E lane (since PCI-E 1.1 has 250 MB/s per direction bandwidth, compared to 500 MB/s on the PCI-E 2.0). So significant is this bottleneck, that some motherboard designers even used bridge chips that convert the P55's PCI-E 1.1 x4 port to two PCI-E 2.0 x1, for USB 3.0 and SATA 6 Gb/s controllers. The PCI-E x16 slots however, are wired to the processor and are Gen 2. ASRock's board hence gives you two USB 3.0 and two SATA 6 Gb/s with an alleviated bus bottleneck.

Apacer, one of the world's leading brands of memory modules, announced today its ARES DDR3 Overclocking Memory Module. The newly-unveiled memory module is named after the god of war "ARES." Features include advanced memory chips, zero noise heat pipe cooling system with a large red aluminum heat dissipation fin. It is able to operate at a blazing-fast clock rate of 2400MHz, allowing not only overclockers to create overclocking miracles but hardcore gamers to achieve their optimum performance during the games.

ARES, the god of war, clad in armor dashing in the ferocious battlefield, is thought to have been invincible in Greek mythology. After the previous launch of second-to-none Aeolus equivalent, Apacer again named its DDR3 memory module from the mythology. Just as its name suggested, ARES DDR3 Overclocking Memory Module promises to deliver amazing and stable overclocking performances that feed the needs of the overclocking experts.