Exceleram - the Highend Memory based in Landau, Germany, announces the availability of the first four Rippler Memory Kits. The name Rippler stands for a new Heatsink designed especially for the overclocking community. The German Exceleram Team completed the development and the Rippler Series is ready to ship now. First shipments are leaving the German warehouse this week. The Rippler Series will be expanded during the next weeks.

"We already have customer requests for other Rippler Kits and we will consider them of course." said Martim Reis Silva - Sales Director Exceleram. As a goody, there are also 2 highend kits with black 8layer PCB available. In the beginning the memory will be delivered in a noble aluminiumbox instead of plastic blister.

Mushkin, a global leader in high-performance computer products, announced today the release of 'Redline Ridgeback', a new variation on a heatsink that has become a staple in the high-performance and overclocking communities. Because of its aggressive yet sleek design and incredible heat dissipation qualities, enthusiasts the world over have demanded the Ridgeback heatsink for their memory cooling needs. Now, this exciting piece of technology has been prepared for Mushkin's world-renowned Redline Series with an engaging and strong blood-red appearance.

"The Ridgeback Project has been an exciting project for both myself and our marketing department. Because of Ridgeback's success, we wanted to offer the cooling technology with a sharp new look, and to give customers new aesthetic options. Case modders and system builders now have a striking new look available to them when using Ridgeback. Redline has always been Mushkin's premier memory line, and we're happy to add Ridgeback to its mix. Our new blood-red Ridgeback heatsinks scream 'performance' and offer it in every respect." - Brian Flood, director of product development.

Corsair introduced a new line of PC3-12800 (DDR3-1600 MHz) memory kits based its latest memory module design, the Corsair Vengeance. The Vengeance modules make use standard height DIMM PCBs, making use of a 'light' heatsink that goes on to be slightly taller than the PCB. 'Light', because unlike the heatsinks on the Dominator modules, Vengeance's heatsink looks to consist of just thick metal plates of the heatspreader elongating into a few heatsink fins, much like G.Skill's RipJaws modules.

The Vengeance modules can operate at 1600 MHz speeds with DRAM voltage of 1.5V, with CL8 and CL9 timings available in the lineup. The modules come in densities of 2 GB and 4 GB, making up single-channel (single module), dual-channel, and triple-channel memory kits, in capacities of 4 GB (single module), 8 GB (2x 4 GB) dual-channel, 6 GB (3x 2 GB) triple-channel, and 12 GB (3x 4 GB) triple-channel.A list of models follows.

OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) and memory modules for computing devices and systems, unveils new Xtreme Thermal Exchange (XTE) and Blade 2 high-speed desktop memory, providing the optimal balance of blazing DDR3 performance and cooling efficiency in one solution. Committed to staying ahead of the curve in the high performance segment of the memory market, OCZ is offering high-end memory that keeps pace with intensive overclocking, gaming, and other high-productivity computing environments.

"Building on our previous lines of enthusiast overclocking memory, the new XTE and Blade 2 DDR3 memory series are designed to set the benchmark once again and deliver the ultimate in performance and stability," said Alex Mei, CMO of OCZ Technology Group. "Featuring new compact, yet highly efficient heatspreader designs, these hand-tested kits are the ideal solution for overclockers gaming and productivity applications, and are optimized for the latest generation of platforms from Intel and AMD."

MSI has unveiled its all-new 15.6-inch F Series FX610MX laptop, featuring AMD's new generation Phenom II triple-core processor and the ATI Mobility Radeon HD5470 discrete graphics card (512MB DDR3 VRAM). It comes with MSI's exclusive GPU Boost and ECO technologies which switch display and power management modes to meet your current needs, allowing you to strike the ideal balance between powerful multimedia performance and battery life.

MSI Marketing Director Sam Chern explains that the FX610MX employs a cinema-class 16:9 ratio power-saving LED display, ideal for viewing films, as well as MSI's Cinema Pro multimedia technology to enhance display color and clarity. What's more, the exterior of the FX610MX is sheathed in MSI's own raised totem seal coating to give it an extra touch of class and protect it against scratching, wear, and smudging. It also comes with a seamless, multipoint touchpad. You won't want to go anywhere without it.

Viking Modular Solutions, a division of Sanmina-SCI Corporation (Nasdaq: SANM), and leading manufacturer of innovative DRAM modules and Solid State Drive (SSD) solutions, today announced its DDR3 8GB Very Low Profile (VLP) Registered DIMM is available for immediate qualification. Suitable for the most demanding environmental conditions, this high-density VLP RDIMM is optimal for Original Equipment Manufacturer (OEM) customers in the telecommunications, enterprise, cloud and embedded computing markets that need the benefit of high density in a very low profile form factor.

Viking Modular is a leader in creating innovative DRAM packaging solutions that offer excellent signal integrity and thermal management. This latest DDR3 8GB VLP RDIMM uses mainstream 2Gbit DDR3 DRAM to deliver a cost effective, reliable, high-density solution, ideally suited for blade servers, storage bridge bay (SBB), AdvancedTCA (ATCA) and multiple space constrained high performance computing environments.

PNY Technologies introduced a couple of DDR3-1333 MHz dual-channel memory kits for desktops, and a couple of DDR3-1066 MHz dual-channel kits for notebooks, under its Optima series. The kits are available in capacities of 4 GB (2x 2 GB), and 8 GB (2x 4 GB), costing US $69.99 and $129.99, respectively, both for the notebook and desktop lines.

ASRock unveiled its socket LGA1155 motherboard lineup in grand style, showing off eight models, including four value-thru-enthusiast grade motherboards based on the Intel P67 chipset, and four essential-thru-mainstream motherboards based on the Intel H67 chipset. The series is topped by the P67 Extreme6, which packs no less than six SATA 6 Gb/s ports, four external and two internal USB 3.0 ports, three PCI-Express x16 slots, 18-phase CPU VRM making use of high-grade capacitors, and a huge set of connectivity features. Next up is the P67 Extreme4, which is a notch lower than the Extreme6, but it still gives you four SATA 6 Gb/s and four USB 3.0 ports (two external, two internal via header), the same expansion slot layout as the Extreme6, and a slightly slimmer connectivity feature set.

The two Extreme boards are trailed by mid-range ones, starting with the P67 Pro3. The P67 Pro3 has a simple layout and offers not much more than the chipset's feature-set. There are two SATA 6 Gb/s and two USB 3.0 (rear) ports, expansion slots that include just one PCI-Express 2.0 x16, three PCI-E x1, and three PCI. The CPU is powered by an impressive (for this category) 10-phase VRM. Further down the line is the P67 Pro, which is further slimmed down. It does away with USB 3.0 but retains SATA 6 Gb/s. A simpler 4+1 phase CPU VRM is used. Most other features are the same as the Pro3.

AMD's next-generation PC processor architecture that seeks to challenge the best Intel has, codenamed "Bulldozer", is set to make its desktop PC debut in 2Q next year, with a desktop processor die codenamed "Zambezi". AMD is seeking to target all market segments, including an enthusiast-grade 8-core segment, a performance 6-core segment, and a mainstream 4-core segment. The roadmap reveals that Zambezi will make its entry with the enthusiast-grade 8-core models first, starting with 125W and 95W models, trailed by 6-core and 4-core ones.

Another couple of architectural details revealed is that Zambezi's integrated memory controller (IMC) supports DDR3-1866 MHz as its standard memory type, just like Deneb supports DDR3-1333 MHz as its standard. DDR3-1866 MHz, or PC3-14900 as it's technically known, will churn out 29.8 GB/s in dual-channel mode, that's higher than triple-channel DDR3-1066 MHz (25.6 GB/s), which is Intel Core i7 LGA1366 processors' official memory standard. The 8-core and 6-core Zambezi models feature 8 MB of L3 cache, while the 4-core ones feature 4 MB. Another tidbit you probably already knew is that existing socket AM3 processors are forwards-compatible with AM3+ (Zambezi's socket), but Zambezi processors won't work on older AM3/AM2(+) socket motherboards.

A-Data expanded its XPG-Gaming Series V2.0 series with a new 8 GB (2x 4 GB) dual-channel DDR3-2000 MHz kit. The modules are capable of DDR3-2000 MHz speeds with DRAM timings of 9-11-9-27T and module voltage of 1.55~1.75V. They make use of 2 oz. copper PCBs and aluminum heat-speaders making use of Thermal Conductive Technology (TCT). A-Data's new kit is backed by a lifetime warranty. Its pricing remains to be known.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced it had begun sample shipments of its new 32-gigabyte Load Reduced Dual In-Line Memory Module (LRDIMM), the DRAM industry's highest density memory module. The LRDIMM consists of 72 advanced 40nm process 4-gigabit DDR3 SDRAMs in a Double Density Package (DDP).

LRDIMM is a new standard for server memory modules that reduces I/O bus capacity by buffering the I/O bus line with the memory buffer (MB) to simultaneously enable higher system density and faster speed. JEDEC, a standardization body for the semiconductor industry, is studying the adoption of LRDIMM standards. Elpida is actively engaged in promoting its own standard.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced they've begun shipping their new 8GB Registered-ECC DDR3 DRAM modules to support low-voltage Intel Westmere platforms. Our JEDEC standard 1.35V DDR3 ECC/R-DIMM 8GB module running at 1333MHz with latencies of 9-9-9.

Reducing the costs associated with the Enterprise Data Center has become an important goal for the Enterprise server market. Our DDR3 memory product runs at 1.35v instead of the traditional 1.5v. The lower operating voltage reduces memory power consumption by over 20%, in comparison with the standard 1.5V DDR3 memory modules, and translates directly into lower power, less cooling, lower electrical bills, and less CO2 emissions for the data center.

Silicon Power, the world's leading manufacturer in flash memory and DRAM module, announced the launch of the pioneering DDR3 1600MHz standard memory module. With this brand-new product, general users can easily reach greater performance without overclocking it. Consistent and compatible with JEDEC standards and DDR3 systems, Silicon Power DDR3 1600MHz standard memory module is definitely perfect for increasing system efficiency.

Silicon Power DDR3 1600MHz standard memory module is consistent and compatible with JEDEC (Joint Electron Device Engineering Council) standards with 1600MHz clock rate, CL9 CAS latency, and 1.5V operating voltage. It adopts new fly-by topology design for more efficient commands, addresses, control signals, and clocks signals. It also supports On-DIE Termination (ODT) to dramatically reduce unwanted reflection signals and maximize speed rate. Meanwhile, Silicon Power insists on using original memory modules and FBGA packaging technology for excellent heat dissipation and accurate data transferring. Silicon Power single / dual / triple-channel memory kits are 100% tested to guarantee high performance of stability, durability and compatibility.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, announced a boost to its XPG Gaming Series DDR3 lineup with a 2400G 4GB dual channel kit to satisfy computer gamers' increasingly stringent demands for high capacity and performance DRAM Modules.

The new XPG DDR3 2400G runs at an operating voltage of 1.65 volts with CL value 9-11-9-27, allowing for predicted bandwidth up to 38.4GB per second. Each XPG Gaming v2.0 Series memory chip is selected through a strict filtering process, complete with superior 8-layer PCB (Printed Circuit Board) and unique TCT (Thermal Conductive Technology) that effectively lowers module temperature. Each memory chip is in direct contact with the heat spreaders for better heat dissipation, improved power consumption, and prolonged lifespan. The XPG DDR3 2400G also supports the Intel XMP (Extreme Memory Profiles) which help provide easy configuration for power users.

Patriot Memory, a global pioneer in high-performance memory, NAND flash, storage and enthusiast computer products, today expanded the product lineup of their recently announced Viper Xtreme Series of DDR3 memory solutions. New Sector 7 (tri-channel) kits are available in 12GB and 6GB capacities with speeds of 2000MHz and 1600MHz. New Sector 5 (dual-channel) kits are available in 8GB and 4GB capacities with 1600MHz speed. The Viper Xtreme Series of products utilize a custom developed aluminum and copper heat shield to achieve improved cooling and stability.

Patriot Viper Xtreme Series modules have a custom designed heatshield with a hefty copper insert (6 grams) across the DRAM chips and a slim profile extruded anodized aluminum outer piece. This unique design offers enhanced thermal performance in heat dissipation over aluminum based heatshields. Viper Xtreme modules pass a thorough qualification and screening process on multiple high-performance motherboards to ensure performance and reliability for overclocking. These modules are targeted and designed specifically for performance enthusiasts and overclockers looking for an edge in benchmark efforts and to push the boundaries of computing performance.

Exceleram announced refreshed memory kit lineup better tuned for overclocking, under the SpeedSlider series. Modules are equipped with a new 8-layer black PCB that provides higher electrical stability. There are eight new kits in all, with capacities ranging from 4 GB (2x 2 GB) to 6 GB (3x 2 GB). Of these four are of a higher grade, marked by a red culvert heatspreader, these include the EB3102A (4 GB, 1600 MHz, 6-8-7-24, 1.65V); EB3103A (6 GB, 1600 MHz, 6-8-7-24, 1.65V); EB3100A (4 GB, 1600 MHz, 6-9-8-24, 1.65V); and EB3104A (6 GB, 1600 MHz, 6-9-8-24, 1.65V).

Marked by the blue culvert heatspreader, the remaining four are slightly more value-oriented. These include the EB3120A (4 GB, 1600 MHz, 7-8-7-24, 1.65V); EB3121A (6 GB, 1600 MHz, 7-8-7-24, 1.65V); EB3117A (4 GB, 1333 MHz, 7-7-7-21, 1.50V); and EB3118A (6 GB 1333 MHz, 7-7-7-21, 1.50V). "We act on the suggestions from many customers with this step," said Torsten Düker, CEO of Exceleram. The company did not reveal pricing, but said that these will reach stores very soon.

Stealth.Com Inc., a leader in the industrial computer and peripherals market has released a new ultra small PC designed specifically for in-vehicle/mobile/embedded applications. Stealth's model LPC-100M is a rugged small form PC that operates from 10-26 VDC power input making it ideal for DC powered applications typically found in vehicles and remote applications.

According to Stealth CEO, Ed Boutilier; "One of the unique attributes the LPC-100M mobile computer possesses is a user selectable smart power control interface. Start-up and shut-down times are user definable allowing for safe application launching along with a controlled shutdown period. This is absolutely critical in preventing data corruption when power sources are interrupted in mobile and field environments."

The original N4200 made huge waves in the hardware community with its innovative features and functionality. Today, Thecus Technology, the Creator in Storage, is proud to announce its successor: the N4200PRO. Packing an all-new Intel Atom processor and DDR3 memory, the N4200PRO takes the original Zero-Crash NAS and puts performance into overdrive.

Performance freaks are going to love the new N4200PRO. Plentiful storage management options including RAID 0, 1, 5, 6,10, JBOD are present, as are convenient features such as hot-swap, hot-spare, online RAID migration and expansion, as well as auto-rebuild.

Earlier this year, Gigabyte surprised us by displaying its first motherboards that use a black-colored PCB, the higher end of its socket LGA1155 motherboard lineup based on the P67 Express chipset, the GA-P67A-UD5 and GA-P67A-UD7; the company's mid-thru-entry range of P67 and H67 based motherboards got their photo-shoot. Pictured below (in order) are the P67A-UD3R, P67A-UD3, and H67MA-UD2H. The P67A-UD3R is the third Gigabyte motherboard to be pictured with a black PCB, it is decked in black overall (slots and connectors), with a dash of white. The LGA1155 socket is wired to four DDR3 DIMM slots for dual-channel memory. Expansion slots include three PCI-E x1, one PCI-E 2.0 x16, one PCI-E x16 (electrical x4), and two PCI.

The P67A-UD3 marks a return to blue PCB (indicating that lower-mainstream Gigabyte motherboards will retain the blue color-scheme. It's is a slightly skimpier version of the UD3R, and probably has the SATA RAID function disabled. Connectivity of this, and the UD3R are nearly identical: 8+2 channel HD audio, two USB 3.0 ports, a number of USB 2.0 ports, two SATA 6 Gb/s and four SATA 3 Gb/s ports. The H67MA-UD2H is a micro-ATX motherboard optimized for processors with on-die graphics, it features the flexible display interface (FDI), with display connectivity including one each of DVI, D-Sub, DisplayPort, and HDMI. Expansion slots include two PCI-E x16 (electrical x16, x4); and two PCI-E x1. Connectivity includes two SATA 6 Gb/s, three SATA 3 Gb/s, one eSATA, 8 channel HD audio with optical SPDIF, two USB 3.0 and a number of USB 2.0 ports. Gigabyte's P67 and H67 series motherboard will launch in early 2011, in time for Intel's latest processor lineup.

Kingston announced a new HyperX Limited Edition DDR3-1600 MHz (PC3-12800) dual-channel memory kit, which sports black heat-spreaders. This kit includes two 2 GB modules, and carries the model number KHX1600C9D3X1K2/4G. The modules achieve 1600 MHz speeds with timings of 9-9-9-24, and DRAM voltage of 1.65V, making it compatible with Core i5/i7 LGA1156 platform. Backed by a lifetime warranty, it is priced at around €75.

German memory maker Exceleram announced a pair of low-voltage, dual-channel, 4 GB DDR3 memory kits for use in mainstream PCs. The first kit, ELV001A, consists of two 2 GB modules that run at PC3-10600 (1333 MHz) DDR speeds with timings of 7-7-7-21, and DRAM voltage of 1.35V; while the second kit, the ELV002A, gives you two modules that run at PC3-12800 (1600 MHz) DDR speeds with timings of 9-9-9-24, at 1.35V. Both kits are estimated by the manufacturer to draw 10% lesser power compared to conventional 1.5V modules. The modules are decked up by "Blue Culvert" heatspreaders to keep cool. While the company did not give out prices, it mentioned that they will be reasonable.

Power Quotient International (PQI) has released a series of DDR3 server memory modules in response to the advent of cloud computing. DDR3 Registered/ECC server memory modules are powerful additions to PQI's Power Memory product range and symbolize the technical strength and product integrity of PQI memory modules for enterprise applications. DDR3 Registered/ECC server memory modules continuously undergo complete, complex, and rigorous integrity tests to provide both stable and compatible memory solutions that increase performance and ensure the stability of servers and workstations under year-round, high-speed data processing conditions.

DDR3 Registered/ECC server memory modules consist of carefully selected, originally manufactured DRAM IC's paired with PLL (Phase-Lock Loop) chips made by a well-known manufacturer, as well as high specification PCB's, in order to achieve PQI's main objective: high quality. In particular, the DDR3 1333's 32GB/s (tri-channel mode) transmission bandwidth server memory module is capable of meeting the most demanding server environments and enhancing the overall performance of high-end computing systems.

The Xtreem DRAMs from Team Group Inc have always been the first choice of PC gamers. Tailored specifically for power users, the Xtreem LV DDR3 1866 and Xtreem LV DDR3 2000 with high capacity 8GB dual-channel kit officially launched this month will be sensational! The next-generation Xtreem LV series is equipped with high-speed 256x8 chips manufactured through new process. These low-voltage (LV) modules work only at 1.65V and deliver a low latency at 9-11-9-27. Moreover, the compatibility with dual-channel platforms using next-generation chipsets helps bring power users the ultimate smooth OC experience.

Demand for high-capacity memory continues to rise as multimedia software and games become more sophisticated and realistic. Team thus launches the next-generation Xtreem LV DDR3 1866 and Xtreem LV DDR3 2000 modules in the 4GB Kit (2GB x 2) and 8GB Kit (4GB x 2) to meet consumer demand. These super capacity kits not only can fulfill consumer's demand, furthermore its powerful performance will significantly enhance efficiency for games, art and multimedia editing.

Mushkin, a global leader in high-performance computer products, announces the availability of new Radioactive memory kits tailored for the gaming and enthusiast markets. This new Radioactive Series launches with DDR3-1600 CL6 memory kits for Intel's LGA1366 and LGA1156 platforms, as well as a 2000 MHz 6GB CL8 triple kit. In the near future, more kits with different specifications will be available.

"We're elated to offer viscerally engaging products for our friends in the gaming and high performance sectors. We have many plans to cater to enthusiasts, and this kit release is just the tip of the iceberg." - Wade Shiflett, Mushkin, Inc. marketing director. These new high performance memory kits are available now at mushkin.com and our partners around the globe. Shortly, these kits will be bundled at newegg.com with Bethesda Softworks's "Fallout: New Vegas" PC video game titled for great savings.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced it is currently manufacturing the world's first 24GB triple channel DDR3 running at 2000MHz. Usually overclocking comes at the cost of capacity. Most over-clocked modules are only available in small capacities and require that you only "half-load" the DRAM bus. This new large capacity kit enables you to "fully load" the DRAM bus.

Super Talent's new 24GB triple channel kit enables a fully loaded configuration consisting of a Kit of 6 (4GB) modules in 6 slots (DDR3-2000-CL9) at 1.65V. Super Talent's has once again moved beyond industry limitations and produced a DDR3 capable of overclocking to an incredible 2000 MHz.