GIGABYTE has a little surprise as it just listed a new B850 motherboard on its website, named B850M Force. This standard microATX form-factor AM5 motherboard marks the return of GIGABYTE's SOC Force series (i.e., GA-Z170X-SOC Force or GA-Z97X-SOC Force) that "eons ago" delighted Intel users with its striking orange aesthetics. Going from the cold, full white designs of its B850 Ice motherboards such as B850 Aorus Stealth Ice or B850M Eagle Ice series launched in January, this newly launched Force motherboard series packs a complete set of features tailored for a variety of users as well as retro enthusiasts from the Intel Z97 and Z170 times a decade ago.

The GIGABYTE B850 Force microATX motherboard is built around AMD's B850 chipset and supports the full range of AMD Ryzen processors for the AM5 socket, including the latest 9000 series CPUs. The board has an 8+2+2 phase digital VRM with heatsinks and supports up to 128 GB of DDR5 memory across two DIMM slots, with speeds up to overclocked 9600 MT/s (including AMD EXPO and XMP profiles). Storage connectivity consists of three M.2 slots supporting different PCIe configurations alongside four SATA 6 Gb/s connectors. Expansion capabilities include a PCIe x16 slot that supports PCIe 5.0 and an additional PCIe x4 slot from the chipset. Connectivity features include integrated Wi-Fi 6E with Bluetooth 5.3 (for the Wi-Fi 6E model), a 2.5 Gigabit Ethernet controller, and multiple USB ports including USB 3.2 Gen 2 and USB-C connections. Alongside its orange appearance, the motherboard has another surprise: a PS/2 port for those who are truly into the retro theme. Display outputs consist of HDMI 2.1 supporting 4K at 60 Hz and DisplayPort 1.4 capable of 4K at 144 Hz (depending on the iGPU capabilities of the installed processor).

Silicon Power brought an extensive lineup of memory products to Computex 2025. We begin our tour with the company's DDR5 CUDIMMs and CSODIMMs. The company's baseline DDR5 CKD lineup sees CUDIMMs and CSODIMMs tick at DDR5-6400, with 16 GB density, CL52, and 1.1 V. The XPower Storm RGB is a premium gaming PC memory series, which comes in 16 GB and 32 GB single modules, and 32 GB (2x 16 GB) and 64 GB (2x 32 GB) kits. Speeds range between DDR5-6000 to DDR5-8000. These support XMP and EXPO.

The XPower Zenith is a mid-range kit, which comes in the same kind of densities as the XPower Storm RGB, but with speeds of DDR5-5200, DDR5-5600, and DDR5-6000. The XPower Cyclone is the company's enthusiast-segment DDR5 OC memory series. The non-CKD (UDIMM) variant comes in speeds of up to DDR5-8000, with the CKD (CUDIMM) variants pushing further, up to DDR5-9200.

ADATA XPG brought many of its latest memory, storage, and gaming PC hardware to Computex 2025. We begin our tour with the SE940, a delightful compact USB4 portable SSD. The drive features a USB4-native Silicon Motion SM2324 controller that takes advantage of 40 Gbps USB4 interface to offer 4 GB/s maximum sequential reads, and 4 GB/s max sequential writes. The drive supports UASP, and comes in capacities of 1 TB, 2 TB, and 4 TB, along with tested support for Windows, Android, macOS, and PlayStation 5.

Next up, are the company's XPG Mars 980 line of flagship M.2 NVMe SSDs. The drives take advantage of PCIe Gen 5 x4 host interface, and are powered by 6 nm Silicon Motion SM2508 controllers. The 4 TB variant offers up to 14 GB/s maximum sequential reads, with up to 13 GB/s maximum sequential writes, 2 million IOPS 4K random reads, up to 1.65 million IOPS 4K random writes; and endurance of 2,960 TBW. There are three variants of the Mars 980 based on cooling. The Mars 980 Blade is a bare drive, and only has a heat-spreading sticker. The Mars 980 Storm is the top variant, with a self-contained liquid cooling solution. The Mars 980 Pro comes with an air-cooler.

G.Skill Memory at the 2025 Computex introduced its latest, high-performance gaming PC memory. We begin our tour with the new Trident Z5 NeoX RGB memory kit that ticks at a whopping DDR5-10600, with timings of CL58-63-63, and comes in densities of 24 GB per module. As a "Neo" branded kit from G.Skill, it comes with an EXPO profile for this speed, but which engages a UClk:MClk divider. G.Skill showed us the proof of its pudding on a machine powered by a Ryzen 5 8500G "Phoenix 2" processor, with a memory speed of 5300 MHz (DDR5-10600), timings of 62-63-63-126, and memory voltage of 1.4 V, in what is one of the highest memory overclocks for the AMD platform.

Next up, is possibly the world's fastest CAMM2 module, offering speeds of DDR5-10000 and 64 GB of density (2-channels or 4 sub-channels), and timings of CL56-70-70. A CAMM2 module is a dual-channel memory module designed to minimize vertical PCB footprint next to the CPU socket, which should benefit enthusiasts and overclockers. The speed was validated on a machine powered by a Core Ultra 9 285K processor. Winding things up is the white Trident Z5 NeoX RGB which ticks at DDR5-10747, with CL68-128-128, and validated on an Intel 285K platform. The Trident Z5 NeoX RGB comes in three bright colors of white, orange and fluorescent green.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to unveil DDR5 memory with an ultra-high kit capacity of 256 GB (64 GB x4), overclocked to DDR5-6000 CL32. Built with high-performance SK hynix DDR5 ICs, this overclock memory speed and timing pushes the boundaries of memory overclocking by fully loading 4 modules of high-capacity DDR5 64 GB U-DIMM modules on a single system; marking a new milestone for high-performance computing, content creation, AI applications, and advanced workstation workloads.

Overclocked, Ultra-Capacity 256 GB (64 GB x4) at DDR5-6000 CL32 In content creation and recent advancements in AI, the need for higher DRAM capacity is essential. Whether calculating large language models or working with complex or high-resolution video content, high-speed memory of high-density 64 GB modules would help to provide a smoother and more efficient workflow. Loaded with AMD EXPO memory overclock profiles, see the DDR5-6000 CL32 256 GB (64 GB x4) kit being stress-tested in the screenshots below on the ASUS ROG CROSSHAIR X870E HERO motherboard with the AMD Ryzen 7 9800X3D desktop processor, as well as on the MSI MPG X870E CARBON WIFI motherboard with the AMD Ryzen 9 9900X desktop processor.

The long-promised gaming performance uplift for "Arrow Lake" processors is here, but for now, it is only available in China. Called Intel Performance Optimizations (IPO), this feature aims at system integrators rather than end users and offers a balanced approach between stock settings and full manual overclocking, all while preserving warranty coverage. IPO works by applying optimized profiles that adjust a range of CPU and memory parameters. On the CPU side, it fine‑tunes P‑core and E‑core frequencies, ring‑bus speeds, the UPI interconnect, D2D links between tiles, and both PL1 and PL2 power limits. For RAM, IPO raises transfer rates and tightens timings, pushing modules beyond their factory XMP or EXPO profiles. Early results from Chinese OEM Maxsun show that IPO can boost core clocks by about 200 MHz and elevate DDR5‑8000 kits to DDR5‑8400. In gaming tests provided by Maxsun, this translated to roughly a 10 percent uplift in frame rates, an encouraging figure given Arrow Lake's mild launch performance in gaming.

At debut, some Arrow Lake SKUs trailed their "Raptor Lake" predecessors because the chiplet‑based memory controller introduced extra latency and ring‑bus clocks ran slower. Supply‑chain constraints and tariffs have limited IPO's rollout to China so far, where pre‑built systems from vendors like Maxsun are shipping with the feature enabled. Warranty handling stays with the OEM, so users can enjoy the extra headroom without risking hardware support. Behind the scenes, Intel has been issuing firmware and microcode patches since December, most recently microcode 0x114 paired with CSME firmware 19.0.0.1854v2.2, to improve Arrow Lake's efficiency. IPO represents the next step in that effort and could become a model for global "opt‑in" BIOS presets if the pilot proves successful. For now, China is serving as the testing ground for Intel's latest attempt to squeeze more performance out of Arrow Lake. We have to wait and see if Western markets follow soon.

KLEVV, the leading consumer memory and storage brand introduced by Essencore, today announces exciting updates to its DDR5 Gaming/OC memory lineup. The new releases include stylish color options for the FIT V and BOLT V series, enhanced performance with lower latency SKUs, and "Optimized for AMD" variants across its DDR5 OC models. This update boosts overall system efficiency and expands platform compatibility, offering gamers, creators, and professionals even more choices to elevate their systems.

KLEVV introduces two fresh color variations to its FIT V and BOLT V memory series, complementing a broader range of system designs. The FIT V series now features an elegant Jet Black edition, delivering a minimalist and understated aesthetic tailored for creators and professionals. Meanwhile, the BOLT V series now features an all new pure White edition, combining a bold, modern aesthetic alongside high-speed performance tailored for gamers.

G.Skill International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is announcing a new high-capacity, low-latency DDR5 specification of DDR5-6000 CL26 with a total of 96 GB (48 GB x2) kit capacity, intended for the AMD AM5 platform. Designed for PC enthusiasts, gamers, professionals, and AI applications who are looking for high performance, this new memory kit enables low-latency performance at high kit capacities on the latest AMD computing platforms.

High-Capacity & Low-Latency Performance DDR5 Memory for AMD AM5
G.Skill continues to push the limits of DDR5 memory with the new DDR5-6000 CL26 at a high kit capacity of 96 GB (48 GB x2). Featuring a very low latency timing of CL26-36-36-96, this memory kit is engineered to provide efficiency and responsiveness for high-performance computing tasks, such as content creation, 3D modeling, or AI applications, on the latest AMD AM5 platforms. See below for a Memtest validation screenshots on the ASUS ROG CROSSHAIR X870E HERO motherboard with the AMD Ryzen 9 9950X3D desktop processor, as well as on the MSI MPG X870E CARBON WIFI motherboard with the AMD Ryzen 9 9900X desktop processor.

Biwin, a world-renowned innovator in cutting-edge memory and storage solutions, proudly introduces the Biwin Black Opal OC Lab Gold Edition DW100 RGB DDR5 192 GB Memory Kit (48 GB x 4), available in DDR5-6400 CL30-39-39-108 1.4 V and DDR5-6000 CL28-36-36-102 1.4 V specifications. Breaking the capacity limits of traditional consumer memory, this ultra-large 192 GB kit offers the performance boost needed for AI computing, large-scale data processing, and next-gen computing.

Push Memory Performance with Revolutionary 192 GB Memory Kit
Biwin Black Opal DW100, delivering an ultra-high-capacity 192 GB (48 GB x4) configuration, redefines what's possible with desktop memory and exceptional memory bandwidth, stability, and efficiency. This breakthrough enables users to take full advantage of DDR5's enhanced data throughput to power fast, out-of-the-box speeds for AI computing, large language models (LLMs), generative AI, and edge computing, and other data-rich workloads.

Biwin, a leading innovator in storage and memory technology, in cooperation with the OC Lab, launches the new OC Lab Gold Edition DW100 RGB DDR5 at DDR5-8000 CL34 & CL36 32 GB (2×16 GB) along with a second DDR5-6400 CL28 EXPO profile.

Both DDR5-8000 options, with their ultra-high speeds and optimized timings, are tailored for overclocking and extreme performance scenarios that push the system to the limit. These profiles excel in scenarios where every ounce of speed is needed, such as high-end gaming, benchmarking, or other performance-demanding tasks. The DDR5-6400 option strikes a more balanced approach, prioritizing lower latencies while still delivering a strong performance. With its lower latency, the DDR5-6400 provides smooth gaming, faster application load times, and overall system responsiveness.

V-COLOR Technology Inc. proudly introduces the groundbreaking CKD SCC (Speed Booster, Colorful Makeover and Cost effective) O CUDIMM RGB Filler Kit 2+2 (2 DRAM Modules + 2 Filler Modules) additions to its DDR5 memory lineup, redefining high-performance and customization. With the launch of the new SCC O CUDIMM RGB Filler Kit now compatible with Intel Core Ultra CPUs Motherboards 800 series up to 8800 MT/s and not only that, the already existent SCC UDIMM kit just got a massive upgrade now reaching 8000 MT/s with dual profiles for Intel XMP 3.0 and AMD EXPO. This new SCC line will be under the family of the already amazing XFinity series that continues to push the boundaries of memory innovation.

The latest CKD SCC O CUDIMM is optimized for Intel Core Ultra CPUs and Z890 series motherboards, offering unmatched performance and stability. With speeds reaching 8000 MT/s ~ 8200 MT/s for 32 GB (2x 16 GB) configurations and 7000 MT/s ~ 8800 MT/s for 48 GB (2x 24 GB) configurations. The latest lineup of SCC technology doesn't just revolutionize the new O CUDIMM memory modules; it also pushes the boundaries of already existing UDIMMs to unprecedented levels. Speeds now reach an impressive 7200 MT/s up to 8000 MT/s, while the addition of dual profiles ensures seamless compatibility and performance optimization for both AMD EXPO and Intel XMP 3.0 systems. This development bridges accessibility across platforms, offering next-level performance for enthusiasts and professionals alike.

A new case of catastrophic CPU failure has emerged involving AMD's Ryzen 7 9800X3D processor, marking the latest in a series of reported incidents within the last few days involving high-performance GPUs and CPUs. The failure occurred during routine use when a system equipped with the 9800X3D and an ASRock Nova X870E motherboard suddenly shut down, resulting in visible thermal damage to both components. The incident is particularly noteworthy as the system operated under stock settings, with only AMD EXPO memory optimization enabled. The affected user, who has two decades of PC building experience, reported that the system had been operational for approximately 20 days before the failure, with no temperature anomalies recorded through HWMonitor during its operation.

The hardware was running the ASRock BIOS version 3.16. This case differs significantly from the previous AMD Ryzen 7 9800X3D failure, where user error during installation was identified as the primary cause, with the user force-installing the CPU in the socket. The timing of the failure—during a low-intensity workload of streaming video content—further complicates the investigation into root causes. While isolated cases of hardware failure are not uncommon in the PC component market, this case may be the first one caused entirely by the CPU/motherboard combination, not user error. The user also faces uncertainty regarding warranty coverage, as the CPU and motherboard were purchased separately from different retailers. We hope the warranty case goes well, and the user gets a replacement!

While the Ryzen 5 7500F was the least expensive Raphael AM5 Zen 4 CPU that you could find, AMD has now silently launched the Ryzen 5 7400F, a new 6-core/12-thread SKU. Similar to the Ryzen 5 9600 (non-X) that was silently introduced during CES 2025, the Ryzen 5 7400F was not officially announced, but rather just showed up on AMD's product pages. Unlike the Ryzen 5 7500F, which was available only to OEMs and system integrators (SIs), the Ryzen 5 7400F will apparently be available in retail/e-tail as well.

As said, the Ryzen 5 7400F is a Raphael architecture CPU with Zen 4 CPU cores and fits into an AM5 socket. It is a 6-core CPU with support for AMD Simultaneous Multithreading (SMT), so it packs 12-threads and has the same 32 MB of L3 cache. The base clock is set at 3.7 GHz, with a maximum boost clock of 4.7 GHz. The TDP is still at 65 W. As with the rest of the lineup, it is an unlocked CPU, so overclocking is possible, and it supports AMD EXPO Memory Overclocking technology, as well as Precision Boost Overdrive. In the boxed version, it comes with an AMD Wraith Stealth cooler.

You've seen Splave on top of overclocking leaderboards, get ready to see him on PC hardware store shelves. The professional overclocker now has a line of high-end PC memory kits and power supplies in partnership with G.Skill and Enermax. The new Enermax Revolution DFX Pro 1350 W Splave Edition (the show demo was a different model as proof of concept) has a few features custom designed by him. The first one is a button that flushes all capacitors to make sure there's no residual power left in it when the AC input is switched off. Overclockers tend to need this between resets, and even waste a few seconds waiting on their PSUs to drain, or getting their motherboards to do that job (not recommended). The PSU has individually sleeved cables that are designed to not get in the way, and make them easier to manage; and the fan is configured to turn backwards for 20 seconds, blowing air out, each time the PSU is sent an ACPI shutdown command.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, today unveils its groundbreaking B850 and B840 series motherboards, introducing a new era of performance optimization and EZ-friendly design for the latest AMD Ryzen processors with full-line PCIe Gen 5 x16 graphics cards support.⁠

D5 Bionic Corsa: Redefining Memory Overclocking
At the heart of GIGABYTE's new B850/ B840 motherboard series lies the innovative D5 Bionic Corsa technology, a game-changing approach to memory performance. This breakthrough technology has achieved remarkable up to 8600 MT/s DDR5 speeds, setting a new standard for memory overclocking. Through the intelligent AORUS AI SNATCH software, users can now effortlessly enhance their system's performance with unprecedented ease. The AI-powered EXPO AI BOOST feature eliminates the traditional time-consuming trial and error process, delivering optimized memory profiles that balance performance and stability with just a few clicks.

G.SKILL International Enterprise Co., Ltd, the world's leading brand of performance overclock memory and PC components, is thrilled to release new low CAS latency memory kits featuring AMD EXPO overclock profile for the new AMD Ryzen 9000 series processors and performance X870 chipset motherboards. These new specifications include DDR5-6000 CL26 2x16GB/2x32GB kits and 2x 24 GB/2x 48 GB memory kits under the Trident Z5 Royal Neo, Trident Z5 Neo RGB, and Ripjaws M5 RGB Neo series.

Aiming to provide high-performance overclock DDR5 memory for PC enthusiasts, G.SKILL is releasing a new low CAS Latency memory kit at DDR5-6000 CL26-36-36-96 with kit capacity configuration of 32 GB (2x16GB), as well as the world's first 64 GB (2x32GB) kit capacity for this low latency specification. Featuring the AMD EXPO memory overclocking profile, these new specifications are built for selected X870 series motherboards and AMD Ryzen 9000 series processors. The screenshot below demonstrates DDR5-6000 CL26 2x32GB kit's stability under the Memtest memory stress test on the ASUS ROG Crosshair X870E Hero motherboard and AMD Ryzen 9 9900X desktop processor.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, introduces the iGame Shadow Series performance DDR5 memory. The iGame Shadow DDR5 memory features an artistic heatsink design inspired by Chinese ink wash paintings. The memory does come with ARGB lighting that can synchronize with the rest of your build via the iGame Center software.

iGame Shadow DDR5 Series memory is aesthetic and built for performance. The iGame Shadow is available in a wide range of specifications from DDR5-6000 CL28 to extreme-performance DDR5-8400 CL42, designed to meet the performance demands of mainstream and high-end flagship motherboard users. The memory uses high-quality SK Hynix M-die, known for performance ideal for overclocking. The iGame Shadow memory features aluminium alloy heatsink designed to optimize heat dissipation.

MSI has unveiled a new performance-enhancing feature for its AM5 socket motherboards to improve DDR5 memory latency. Some latency issues that emerged following AMD's AGESA 1.2.0.2a microcode update, which added support for AMD's Ryzen 9000X3D processors, are now fixed. MSI has baked in its BIOS tuning to develop a new "Latency Killer" feature, which can be found in the advanced menu section, specifically within the overclocking submenu in BIOS of MSI X870E/X870 gaming motherboards like MEG X870E GODLIKE and MPG X870E CARBON WIFI. Users have three options to choose from: Auto, Enabled, and Disabled. While the default behavior of the Auto setting remains unclear, it is believed to be initially disabled to ensure system stability.

Recent benchmark testing of Uniko's Hardware using AIDA64 has demonstrated promising results, showing an eight nanosecond improvement in memory latency when the new feature is activated. The test was conducted using a Ryzen 7 9800X3D processor paired with an MPG X870E Carbon WiFi motherboard and DDR5-8000 CL38 memory, running in High-Efficiency mode at its maximum preset. Some Reddit users with AMD Ryzen 7 9800X3D on MSI Tomahawk X870 reported seeing 10-12 ns improvement from enabling the "Latency Killer." MSI motherboards complement its Latency Killer feature with additional memory optimization tools in the BIOS, including EXPO / A-XMP profiles, Memory Try It presets, High-Efficiency Mode, and comprehensive manual overclocking options for enthusiasts seeking maximum performance.

Lexar late last week introduced the ARES DDR5-6000 CL26 memory kit. The kit is optimized for AMD Ryzen platforms, such as the recently launched Ryzen 7 9800X3D. It comes with an AMD EXPO profile for DDR5-6000 and tight timings, including a CAS latency of 26, or 55 ns. It also includes an Intel XMP 3.0 profile that enables the same timings. Typical DDR5-6000 kits tend to come with a CL of 30. Under the hood, the kit uses SK Hynix A-die DRAM chips, and a 10-layer PCB. The module features thermal pads for not just the DRAM chips, but also the PMIC. These transfer heat to a 1.8 mm-thick aluminium heatspreader that's crowned by a silicone diffuser for the module's lighting setup that consists of eight ARGB LEDs, with 13 lighting presets. The module comes in two color options—silver and black. The company didn't reveal pricing or availability information.

XPG, the go-to provider for gamers, esports pros, and tech enthusiasts, is pleased to announce the XPG LANCER NEON RGB DDR5 gaming memory module has been awarded Honoree status by the 2025 CES Innovation Awards presented by the Consumer Electronics Show (CES). In line with the annual topics of "Sustainability and Innovation" featured at CES 2025, the LANCER NEON is the world's first eco-friendly RGB DDR5 memory module and boasts exclusive technology to keep things cool while delivering lightning fast performance.

LANCER NEON RGB DDR5 gaming memory utilizes an exclusive heat dissipating PCB coating which provides top-notch heat dissipation stability and heat radiation. LANCER NEON RGB memory with this cooling solution runs at an average 8.5°C lower than standard overclocked memory, improving heat dissipation efficiency by up to 10%. Enjoy extreme overclocking while maintaining high performance and never compromise on speed. In addition, this coating broadens the scope of gaming aesthetics available to gamers and overclockers.

KLEVV, the leading consumer memory and storage brand introduced by Essencore, is excited to announce the launch of its brand-new URBANE V RGB DDR5 Gaming/OC memory. Ideal for advanced content creation and professional gaming. Inspired by the traditional bow and arrow, the URBANE V RGB DDR5 Gaming/OC memory captures the essence of speed, stability, and precision. It effortlessly blends style and functionality, with flowing curves evoking a bow, sleek white aesthetics reminiscent of a quill, and precision of archery portraying its cutting-edge hardware built for accuracy, symbolizing limitless potential—making it a perfect fit for any build.

Crafted from premium components, it features a 2 mm-thick aluminium heat sink with sleek linear grooves, refined curved edges, and a low-profile height of 42.5 mm, ensuring superior cooling efficiency and eye-catching aesthetics. Engineered with precision, it optimizes heat dissipation to regulate temperatures during intense gaming. Fully customizable RGB lighting offers 16 million colors and synchronized effects, seamlessly integrating with major motherboard RGB software for limitless personalization.

Kingston Technology Company, Inc., a world leader in memory products, announced the upcoming release of Kingston FURY Renegade DDR5 CUDIMMs, compatible with Intel's new 800-series chipset (formerly codenamed Arrow Lake). Intel's 800-series chipset is the first platform to utilize Clock Drivers on CUDIMMs (Clocked Unbuffered Dual Inline Memory Modules). At 6400 MT/s DDR5, JEDEC mandates the inclusion of a Client Clock Driver (CKD) on UDIMMs and SODIMMs. This component buffers and redrives the clock signal from the processor, enhancing signal integrity to the module. To distinguish these advanced modules from standard DDR5 UDIMMs and SODIMMs, JEDEC has designated them as CUDIMMs and CSODIMMs, respectively.

Kingston FURY Renegade RGB and non-RGB CUDIMM modules start at an overclocked speed of 8400 MT/s and are available as 24 GB single modules and 48 GB dual channel kits. Since CUDIMMs and UDIMMs share the same 288-pin connector, Kingston FURY UDIMMs with XMP and EXPO profiles are also compatible with Intel 800-series motherboards. However, it's recommended to verify compatibility through the motherboard manufacturer's QVL (Qualified Vendor List) or by checking the Kingston Configurator for supported speeds and capacities.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts and gaming brand of ADATA Technology, the world's leading brand for memory modules and flash memory, has now expanded its product line and officially entered the field of workstations. Today XPG announced the launch of the first AICORE Overclocked DDR5 R-DIMM, with a maximum speed of 8,000 MT/s and a capacity of 32 GB, making challenging large-capacity workstation memory expansions a breeze. AICORE is built for improving overall system performance, process complex data, multi-tasking more quickly, and maximize the efficiency of AI computing.

Born for High-Speed Computing and AI Development
R-DIMM adopts a Register Clock Driver (RCD) and is characterized by high-speed, low-latency, and enhanced operational stability. AICORE Overclocked R-DIMM memory is designed for high speed and stability and is perfect for large-scale data processing, AI generation, 3D rendering and graphics, video post-production editing, and multitasking. AICORE is designed for securities markets that emphasize real-time data analysis and data science professionals or expert image creators to accelerate work efficiency and quickly complete various large-scale projects. AICORE Overclocked DDR5 R-DIMM memory has a maximum speed of 8,000 MT/s which is 1.6 times faster than standard R-DIMM memory, delivering more powerful performance to meet the rigorous speed requirements of high-end systems.

AMD today made four key announcements for its Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture. These mainly aim to improve upon the products as originally launched in August. To begin with, AMD announced a 105 W cTDP (configurable TDP) mode for the Ryzen 7 9700X and Ryzen 7 9600X processors, with full warranty coverage. This setting can be enabled in the UEFI setup program of a motherboard running its latest version of UEFI firmware, which encapsulates the AGESA ComboAM5 PI 1.2.0.2 microcode. The setting raises the PPT (package power tracking) value of the 9700X and 9600X to 140 W, and treats them as if they were 105 W TDP processors. These chips were originally launched by AMD with 65 W (88 W PPT), and as reviewers quickly found out, unlocking power improves performance at stock clock speeds, as it improves boost frequency residence of these chips.

Next up, is the AGESA PI 1.2.0.2 microcode itself, which introduces the 105 W cTDP mode for the 9700X and 9600X along with warranty coverage, which we just talked about; plus works to improve the core-to-core latency on the Ryzen 9 9900X and Ryzen 9 9950X. These are processors with two CPU complex dies (CCDs), each with either 8 or 6 cores enabled. To the software, this is still a single-socket (1P) CPU with 12 or 16 cores. Although some awareness of the dual-CCD architecture is added to the OS scheduler to help it localize certain kinds of workloads (such as games) to a single CCD, reviewers noted that core-to-core latency on the dual-CCD chips was still too high, which should affect performance when a software's threads are migrating between cores, or if a workload is multithreaded, such as media encoding. AMD addressed exactly this with the new AGESA PI 1.2.0.2 update.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to showcase an incredibly high-speed overclock of G.SKILL DDR5 memory at DDR5-9000 CL44-56-56 with 48 GB (24 GB x2) kit capacity, featuring AMD EXPO overclock profile and demonstrating the memory overclock capability of the ASUS ROG CROSSHAIR X870E HERO motherboard and the AMD Ryzen 7 8700G processor.

A New High-Speed Frontier with 24 GB x2 Continuing to explore the overclock limits of DDR5 memory speed in conjunction with the new ASUS NitroPath DRAM technology that provides enhanced DDR5 memory overclock performance, G.SKILL demonstrates an amazing DDR5-9000 CL44-56-56 with two 24 GB capacity modules. Refer to the screenshot below to see this G.SKILL memory kit reaching the astounding overclocked memory speed on the ASUS ROG CROSSHAIR X870E HERO motherboard with an AMD Ryzen 7 8700G processor