Samsung's latest semiconductor manufacturing technology is falling short of expectations, as the company struggles to achieve acceptable production rates for its cutting-edge 3 nm chips. The latest rumors indicate that both versions of Samsung's 3 nm Gate-All-Around (GAA) process produce fewer viable chips than anticipated. The initial targets set by the South Korean tech giant were aimed at a 70% yield rate in volume production. However, the first "SF3E-3GAE" iteration of the technology has only managed to achieve between 50-60% viable yield output. More troubling is the performance of the second-generation process, which is reportedly yielding only 20% of usable chips—a figure that falls dramatically short of production goals. The timing is particularly challenging for Samsung as major clients begin to reevaluate their manufacturing partnerships.

Qualcomm has opted to produce its latest Snapdragon 8 Elite processors exclusively through rival TSMC's 3 nm facilities. Even more telling is the exodus of South Korean companies, traditionally loyal to Samsung, who are now turning to TSMC's more reliable manufacturing processes. While Samsung can claim the achievement of bringing 3 nm GAA technology to market before TSMC's competing N3B process, this technical victory rings hollow without the ability to mass-produce chips efficiently. The gap between Samsung's aspirations and manufacturing reality continues to widen. However, Samsung is shifting its focus toward its next technological milestone. Development efforts are reportedly intensifying around a 2 nm manufacturing process, with plans to debut this technology in a new Exynos processor (codenamed 'Ulysses') for the 2027 Galaxy S27 smartphone series.

Samsung Electronics today reported financial results for the third quarter ended Sept. 30, 2024. The Company posted KRW 79.1 trillion in consolidated revenue, an increase of 7% from the previous quarter, on the back of the launch effects of new smartphone models and increased sales of high-end memory products. Operating profit declined to KRW 9.18 trillion, largely due to one-off costs, including the provision of incentives in the Device Solutions (DS) Division. The strength of the Korean won against the U.S. dollar resulted in a negative impact on company-wide operating profit of about KRW 0.5 trillion compared to the previous quarter.

In the fourth quarter, while memory demand for mobile and PC may encounter softness, growth in AI will keep demand at robust levels. Against this backdrop, the Company will concentrate on driving sales of High Bandwidth Memory (HBM) and high-density products. The Foundry Business aims to increase order volumes by enhancing advanced process technologies. Samsung Display Corporation (SDC) expects the demand of flagship products from major customers to continue, while maintaining a quite conservative outlook on its performance. The Device eXperience (DX) Division will continue to focus on premium products, but sales are expected to decline slightly compared to the previous quarter.

Samsung Electronics is speeding up its work on 2 nm production facilities, industry sources say. The company has started to install advanced equipment at its "S3" foundry line in Hwaseong to set up a 2 nm production line. This line aims to produce 7,000 wafers each month by the first quarter of next year. Also, Samsung plans to create a 1.4 nm production line at its "S5" foundry in Pyeongtaek Plant 2 by the second quarter of next year. This line has a goal to make 2,000 to 3,000 wafers each month. By the end of next year, Samsung will change all the remaining 3 nm production lines at "S3" to 2 nm.

As we reported earlier, Samsung has pushed back the start date for its Tyler, Texas foundry. The plant set to open by late 2024, won't install equipment until after 2026. Also, Samsung has changed its plans for the Pyeongtaek Fab 4 foundry line. Because of lower demand, it will now make DRAM instead, moreover, at Pyeongtaek Fab 3, which has a 4 nm line, Samsung has cut back production. These changes are part of Samsung's plan to make 2 nm chips next year and 1.4 nm chips by 2027. The company wants to catch up with its rival TSMC, right now, Samsung has 11.5% of the global foundry market in Q2, while TSMC leads with 62.3%. An industry expert stressed how crucial this is saying, "With the delay in 3 nm Exynos production and other issues, getting the 2 nm process right could make or break Samsung Foundry". The struggle for Samsung is real, with the company's top management, led by DS Division Vice Chairman Jeon Young-hyun, having recently issued a public apology for the division's underwhelming performance.

Samsung Electronics today reported financial results for the second quarter ended June 30, 2024. The Company posted KRW 74.07 trillion in consolidated revenue and operating profit of KRW 10.44 trillion as favorable memory market conditions drove higher average sales price (ASP), while robust sales of OLED panels also contributed to the results.

Memory Market Continues To Recover; Solid Second Half Outlook Centered on Server Demand
The DS Division posted KRW 28.56 trillion in consolidated revenue and KRW 6.45 trillion in operating profit for the second quarter. Driven by strong demand for HBM as well as conventional DRAM and server SSDs, the memory market as a whole continued its recovery. This increased demand is a result of the continued AI investments by cloud service providers and growing demand for AI from businesses for their on-premise servers.

Smartphone chipset industry watchdogs believe that the Samsung 3 nm GAA process did not meet customer expectations, due to alleged yield issues. TSMC is seemingly victorious in this segment, as reports suggest that a next-generation 3 nm node production goal of "100,000 monthly wafers by the end of 2024" has been set. Three days ago, Samsung Foundry revealed that it is working on a very advanced SF2 GAAFET process—press outlets in South Korea propose that the manufacturing giant is hoping to outmuscle its main rival in a future 2 nm node category. Tuesday's press introduction stated that a development partnership is set: "to deliver optimized next generation ARM Cortex -X CPU developed on Samsung Foundry's latest Gate-All-Around (GAA) process technology."

A Sedaily article posits that the company's cutting-edge manufacturing tech has already attracted interest from notable parties: "Samsung Electronics is taking advantage of these advantages to win orders for the 2 nm project. Samsung Electronics took its first step by winning an order to produce a 2 nm AI accelerator from Preferred Networks (PFN), Japan's largest AI company. Qualcomm, the world's largest system semiconductor design company, has entered into discussions with Samsung Electronics' System LSI Division, which designs high-performance chips, to produce 2 nm prototypes." December 2023 news reports suggested that Samsung leadership was considering a 2 nm wafer price discount—in order to stay competitive with competing foundry services. It is possible that Qualcomm is evaluating the 2 nm SF2 GAAFET process for a distant Snapdragon 8 "Gen 5" chipset, while Samsung LSI could be working on a 2 nm "Exynos 2600" SoC design.

AMD FidelityFX Super Resolution (FSR) is an open-source resolution upscaling technology that takes lower-resolution input and uses super-resolution temporal upscaling technology, frame generation using AMD Fluid Motion Frames (AFMF) technology, and built-in latency reduction technology to provide greater-resolution output images from lower-resolution settings. While the technology is open-source, it battles in market share with NVIDIA and the company's Deep Learning Super Sampling (DLSS). However, in the mobile space, there hasn't been much talk about implementing upscaling technology up until now. According to a popular leaker @Tech_Reve on X/Twitter, we have information that AMD is collaborating with Samsung and Qualcomm to standardize on upscaling technology implementations in mobile SoCs.

Not only does the leak imply that the AMD FSR technology will be used in Samsung's upcoming Exynos SoC, but some AMD ray tracing will be present as well. The leaker has mentioned Qualcomm, which means that future iterations of Snapdragon are up to adopt the FSR algorithmic approach to resolution upscaling. We will see how and when, but with mobile games growing in size and demand, FSR could come in handy to provide mobile gamers with a better experience. Primarily, this targets Android devices, which Qualcomm supplies, where Apple's iPhone recently announced MetalFX Upscaling technology with an A17 Pro chip.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today unveiled its latest innovations in analog and logic semiconductor technologies and outlined its blueprint for upcoming technological advancements at its inaugural Samsung System LSI Tech Day 2023 event. Attended by approximately 300 customers and partners at its Samsung Semiconductor U.S. headquarters, the event featured tech sessions led by Samsung executives, covering a wide range of topics from System LSI humanoids to AI and the company's R&D endeavors in the U.S. 11In the opening keynote, Samsung emphasized the company's vision to lead hyper-intelligent, hyper-connected and hyper-data technologies in the Fourth Industrial Revolution era with its comprehensive logic solutions uniquely tailored for various industries.

"Generative AI has quickly emerged as perhaps the most significant trend of the year, demanding more powerful foundational technologies to process data and bring AI to life," said Yong-In Park, President and Head of System LSI Business at Samsung Electronics. "We are paving the path toward a new era of proactive AI, leveraging our Samsung System LSI Humanoid platform, which seamlessly converges our capabilities across a broad spectrum of logic semiconductors, from powerful computational IPs, connectivity solutions to sensors emulating the main five human senses."

Make health and fitness journeys smoother with the Exynos W930—the wearable processor that keeps smartwatches ahead of the curve, with new leaps in performance and power saving.

Watch it work wonders
Exynos W930 is equipped with the Arm Cortex-A55 dual-core CPU, boosting CPU speed to 1.4 GHz for an 18% jump over our last generation processor. In-package DRAM expands to 2 GB in the Exynos W930, passing the last generation by 33%, so you can switch between apps up to 25% faster and manage your workouts and your work life better with a suite of apps performing at their best.

Samsung's unannounced Exynos 2400 mobile chipset has been linked to the upcoming Galaxy S24 smartphone family, but internet tipsters have speculated that the in-house SoC will be reserved for the baseline model only. The more expensive Plus and Ultra variants could be the main targets for flagship smartphone fetishists - it is possible that Qualcomm's upper echelon Snapdragon 8 Gen 3 chipset is set to feature within these premium devices. Samsung's Exynos processors are not considered to be fan favorites, but industry insiders reckon that the latest performance figures indicate that Samsung's up-and-comer has the potential to turn some heads. Exact specifications for the Exynos 2400 are not public knowledge - one of the tipsters suggests that a 10-core layout has been settled on by Samsung, as well as a recent bump up in GPU core count - from 6 to 12. The company's own 4 nm SF4P process is the apparent choice set for production line.

A leaker has posted benchmark scores generated by an unknown device that was running an Exynos 2400 SoC - the Geekbench 5 results indicate an average single-core score of 1530 with a peak of 1711. The multi-core average score is shown to be 6210, and the highest number achieved is 6967. Therefore the Exynos 2400 is 31% percent faster (in multi-core performance) than the refreshed Snapdragon 8 Gen 2 variant currently found in Galaxy S23 Ultra smartphones, but the divide between the two in terms of single-core performance is not so great. The 2400 manages to outpace (by 30%) Apple's present generation Bionic A16's average multi-core score, although the latter beats the presumed engineering sample's single-core result by 20%. The Exynos 2400 will face a new lineup of rival mobile processors in 2024 - namely Apple's next generation Bionic A17 and Qualcomm's Snapdragon 8 Gen 3, so it is difficult to extrapolate today's leaked figures into a future scenario.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced its first ultra-wideband (UWB) chipset, the Exynos Connect U100. With single-digit centimeter accuracy, the new UWB solution is optimized for use in mobile, automotive and Internet of Things (IoT) devices, offering precise distance and location information. Samsung also unveiled 'Exynos Connect', a new brand that consolidates its short-range wireless communication solutions, such as UWB, Bluetooth and Wi-Fi that are essential in facilitating an increasingly hyper-connected world.

"Our Exynos Connect U100 combines sophisticated ranging and positioning capabilities with strong security to enable hyper-connectivity between people and everyday objects, fueling a range of new applications in positioning and location tracking," said Joonsuk Kim, Executive Vice President of the Connectivity Development Team at Samsung Electronics. "Building on our technology leadership in communications technologies, we are committed to driving innovation in short-range communication solutions to transform the way we connect and relate to the world around us."

Google's internal team Project Zero, dedicated to the discovery and patching of zero-day vulnerabilities in mobile hardware, software, web browsers and open source libraries disclosed a series of vulnerabilities in Samsung's Exynos chipsets featured across a wide range of mobile devices. Four of these critical vulnerabilities allow for internet-to-baseband remote code execution, and testing conducted by Project Zero confirmed that an attacker can compromise a phone at the baseband level with only the victim's phone number. They believe that with sufficient skill an attacker could exploit these vulnerabilities completely silently and remotely. The fourteen other vulnerabilities are related but considered to not be as critical as they require a more extensive setup including a malicious mobile network operator or local access to the targeted device.

Due to the severity of the main four critical vulnerabilities Project Zero has delayed full disclosure on how the exploit works stating:

Due to a very rare combination of level of access these vulnerabilities provide and the speed with which we believe a reliable operational exploit could be crafted, we have decided to make a policy exception to delay disclosure for the four vulnerabilities that allow for Internet-to-baseband remote code execution.

Kernel information for a chipset code-named 'Quadra' has been leaked by Home IT. It appears that this SoC is under development at Samsung Electronics, and could be featured in the company's next generation flagship smartphone range. The recently released Galaxy S23 smartphone series is powered by Qualcomm's cutting-edge Snapdragon 8 Gen 2 processor, which ended up being a fine choice for the end user. This was not an ideal partnership for the semiconductor giant, considering its constant push to promote internally developed hardware.

Industry experts have praised Samsung for not integrating an Exynos processor into this generation of devices, including regional model variations, but that has not stopped the company's persistent development cycle of proprietary mobile CPUs. Rumors point to a collaboration with Google, and the Exynos 2300 SoC looks to form the basis of the latter's next generation Tensor G3 chipset. The leak reveals that the standard 2300 has been designed as a 1+4+4 core configuration, comprised of four performance cores, four efficiency cores, and one super core.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today showcased a series of cutting-edge semiconductor solutions set to drive digital transformation through the decade, at Samsung Tech Day 2022. An annual conference since 2017, the event returned to in-person attendance at the Signia by Hilton San Jose hotel after three years.

This year's event, attended by more than 800 customers and partners, featured presentations from Samsung's Memory and System LSI business leaders—including Jung-bae Lee, President and Head of Memory Business; Yong-In Park, President and Head of System LSI Business; and Jaeheon Jeong, Executive Vice President and Head of Device Solutions (DS) Americas Office—on the company's latest advancements and its vision for the future.

The upcoming Samsung Exynos 2200 mobile processor that is set to feature in the S22 series of phones features an RDNA2 Xclipse 920 GPU designed in collaboration with AMD. This new GPU has surfaced in various Geekbench scores where it handily outperforms the Adreno 730 found in the flagship Qualcomm Snapdragon 8 Gen 1. The Exynos 2200 achieved an OpenCL Geekbench score of 9,143 points which is 50.7% higher than the OnePlus 10 Pro sporting a Snapdragon 8 Gen 1. The processor also performed impressively in the Vulkan benchmarks scoring an average of 8,556 points which places it between 17 - 25% faster. These synthetic benchmarks aren't always entirely reflective of actual performance and we have yet to see power and heat figures so we will need to wait until Samsung officially releases the S22 lineup on February 9th to determine if this will be the new mobile champion.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced its new premium mobile processor, the Exynos 2200. The Exynos 2200 is a freshly designed mobile processor with a powerful AMD RDNA 2 architecture based Samsung Xclipse graphics processing unit (GPU). With the most cutting-edge Arm -based CPU cores available in the market today and an upgraded neural processing unit (NPU), the Exynos 2200 will enable the ultimate mobile phone gaming experience, as well as enhancing the overall experience in social media apps and photography.

"Built on the most advanced 4-nanometer (nm) EUV (extreme ultraviolet lithography) process, and combined with cutting-edge mobile, GPU, and NPU technology, Samsung has crafted the Exynos 2200 to provide the finest experience for smartphone users. With the Xclipse, our new mobile GPU built with RDNA 2 graphics technology from the industry leader AMD, the Exynos 2200 will redefine mobile gaming experience, aided by enhanced graphics and AI performance," said Yongin Park, President of System LSI Business at Samsung Electronics. "As well as bringing the best mobile experience to the users, Samsung will continue its efforts to lead the journey in logic chip innovation."

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduced three of its latest automotive chip solutions: the Exynos Auto T5123 for 5G connectivity, the Exynos Auto V7 for comprehensive in-vehicle infotainment systems, and the ASIL-B certified S2VPS01 power management IC (PMIC) for the Auto V series.

"Smarter and more connected automotive technologies for enriched in-vehicle experiences including entertainment, safety and comfort are becoming critical features on the road," said Jaehong Park, Executive Vice President of System LSI Custom SOC Business at Samsung Electronics. "With an advanced 5G modem, an AI-enhanced multi-core processor, and a market-proven PMIC solution, Samsung is transfusing its expertise in mobile solutions into its automotive lineup and is positioned to expand its presence within the field."

Samsung appears to be in a hurry to beat Apple and Qualcomm at bringing real-time ray tracing to the smartphone space, with its next-generation Exynos 2200 "Pamir" SoC. The chip integrates a graphics processor based on the AMD RDNA2 architecture, codenamed "Voyager." Samsung all but confirmed that the compute units of this will feature Ray Accelerators, the hardware component that performs ray-intersection calculations. The "Voyager" iGPU, as implemented on the Exynos 2200 SoC, physically features six RDNA2 compute units (384 stream processors), and hence six Ray Accelerators.

Built on the 4 nm EUV silicon fabrication process, Exynos 2200 will feature not two, but three kinds of CPU cores—four lightweight efficiency cores, three mid-tier cores, and one ultra high-performance core. Each of these three operate in unique performance/Watt bands, giving software finer-grained control over the kinds of hardware resources they want. Samsung is expected to debut the Exynos 2200 with its next-generation Galaxy S and Galaxy Note devices.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that four of its System LSI products received product carbon footprint label certification from the Carbon Trust, the first of Samsung's logic chips to do so. Having received the semiconductor industry's first carbon footprint accreditation for memory chips from the Carbon Trust in 2019, Samsung has now broadened its ESG (Environmental, Social, and Governance) spectrum with this global recognition of 'eco-friendly' logic chips. Samsung also grabbed the industry's first triple Carbon Trust Standard for Carbon, Water and Waste in June 2021.

The Carbon Trust is an independent and expert partner of organizations around the world that advises businesses on their opportunities in a sustainable, low carbon world. The Carbon Trust also measures and certifies the environmental footprint of organizations, supply chains and products. Of the various certification categories of the Carbon Trust, Samsung's System LSI products received the CO2 Measured product carbon footprint label. The label certifies the chip's carbon footprint, which informs consumers of the impact that the product and its manufacturing process have on the environment. Receiving the CO₂ Measured label is a critical first step for carbon reduction, since it verifies the current carbon emissions of the product with globally recognized specifications (PAS 2050), which Samsung can use as a benchmark to measure future carbon reductions.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced its new wearable processor, the Exynos W920. The new processor integrates an LTE modem and is the first in the industry to be built with an advanced 5-nanometer (nm) extreme ultra-violet (EUV) process node, offering powerful yet efficient performance demanded by next-generation wearable devices.

"Wearables like smartwatches are no longer just a cool gadget to have. They're now a growing part of our lifestyles to keep you fit, safe and alert," said Harry Cho, vice president of System LSI marketing at Samsung Electronics. "With the Exynos W920, future wearables will be able to run applications with visually appealing user interfaces and more responsive user experiences while keeping you connected on the go with fast LTE."

Samsung intends to take its partnership with AMD for graphics further, by designing its next-generation Exynos 2200 "Pamir" SoC with a faster GPU based on the AMD RDNA2 graphics architecture. Bound for the second half of 2021, Exynos 2200 will be built on Samsung's swanky new 4 nanometer 4LPP (4 nm Low Power Plus) silicon fabrication node, and integrate an RDNA2-based GPU codenamed "Voyager." Samsung hopes to compete with Qualcomm's Snapdragon 895 SoC and its Adreno 730 GPU. Interestingly, the new Snapdragon is also expected to be built on the same Samsung 4 nm node. It will be interesting to see what device the Exynos 2200 debuts with, given that both the Galaxy S22 and Galaxy Note 21 won't arrive before 2022.

We recently reported that Samsung would be announcing their next-generation flagship Exynos processor with AMD RDNA2 graphics next month. We heard that the RDNA2 GPU was expected to be ~30% faster than the Mali-G78 GPU present in Galaxy S21 Ultra however according to a new 3DMark Wild Life benchmark it would appear the new processor scores 56% higher. This result would give the upcoming Exynos processor the fastest graphics available in any Android phone even matching/beating out the Apple A14 Bionic found in the iPhone 12. This early performance benchmark paints a very positive picture for the upcoming processor however we still don't know how the score will be affected under sustained load or if this will performance will even be replicated in the final product.

NVIDIA's $40 billion takeover of Arm Holdings plc from SoftBank, got a shot in the arm, as three major licensees of the IP came out in support of the bid. These include Broadcom, MediaTek, and Marvell Technology Group. This development is key for NVIDIA to fight the perception built up by a rival faction, that the democratized nature of the Arm IP would get lost if a chipmaker like NVIDIA owns it. This rival faction is primarily led by Qualcomm.

It's interesting to note the individual backers of the NVIDIA takeover. There is nothing but love between Broadcom and Qualcomm, especially after the former's failed bid to acquire the latter. MediaTek is a major smartphone and IoT SoC maker, dominating the low-cost and mainstream smartphone segments. Marvell is big in datacenter and storage IP. Each of the three are results of huge IP consolidation over the past decade.

AMD at its Computex event shed some light on its IP partnership with Samsung. We already knew this was going to be a closer collaboration than most IP licensing deals, as AMD themselves announced this would be a semi-custom solution designed between both companies. AMD CEO Lisa Su described the technology to be embedded in the upcoming Samsung Exynos SoC as being based on RDNA2 - but this likely is just a marketing and clarity perspective on AMD's technology being implemented, since between the design of RDNA2 and the announcement of the Samsung partnership a lot of water has necessarily run under AMD's graphics IP bridge.

Lisa Su did however confirm that two key RDNA2 technologies will find their way into Samsung's Exynos: Variable Rate Shading (VRS) and Raytracing. This isn't he first time VRS has made an appearance on a mobile SoC - it's already been implemented by Qualcomm in the Adreno 660 GPU (part of the Snapdragon 888 SoC design). However, Raytracing does seem to be a first for the SoC market, and Samsung might just edge out competition in its time to market with this technology. more details will certainly be shared as we get closer to the fabled AMD-partnered Exynos release.

Samsung is readying a powerful Arm-based SoC rivaling Apple's groundbreaking M1 silicon, under its Exynos brand. This chip is being designed for thin-and-light notebooks, as well as premium tablets, essentially letting Samsung target Apple's MacBook (M1) and iPad Pro form-factors. Unlike Apple, Samsung won't be burdened with having to rally its ISV partners to develop specifically for its hardware; the company is preparing to launch notebooks in the second half of 2021 that are powered by a Windows 10 on Arm derivative. This would give the notebook access to all of the applications already developed for the OS, including Office and certain Adobe Creativity Suite apps. The M1-rivaling Exynos chip will pack the latest-generation 64-bit Arm CPU cores, as well as an integrated GPU designed by AMD.

In 2019, AMD and Samsung have announced that they will be joining forces to develop a new class of mobile SoCs, carrying the Exynos name and having a Radeon GPU inside. These Exynos SoCs could be used for almost everything that needs a low-power processor. While the original plan was to have these processors run inside Samsung's mobile phone offerings, it seems like there is another application for them. If the rumors coming from ZDNet Korea are correct, we are in for a surprise. According to the source, Samsung is preparing to use the Exynos SoC with Radeon graphics in the company's next-generation laptops lineup.

While there is little to no information regarding the specifications of the said system, we can expect it to be a fully Samsung-made laptop. That means that Samsung will provide display, RAM, storage, battery, and other components manufactured by the company or its divisions. This laptop is expected to replace Samsung's Galaxy Book S, which currently uses Qualcomm Snapdragon 8cx SoC. The new PC is going to be Windows 10 based system. For more details, we have to wait for the announcement.