Monday, November 11th 2024
Samsung's Second-Gen 3 nm GAA Process Shows 20% Yields, Missing Production Goals
Samsung's latest semiconductor manufacturing technology is falling short of expectations, as the company struggles to achieve acceptable production rates for its cutting-edge 3 nm chips. The latest rumors indicate that both versions of Samsung's 3 nm Gate-All-Around (GAA) process produce fewer viable chips than anticipated. The initial targets set by the South Korean tech giant were aimed at a 70% yield rate in volume production. However, the first "SF3E-3GAE" iteration of the technology has only managed to achieve between 50-60% viable yield output. More troubling is the performance of the second-generation process, which is reportedly yielding only 20% of usable chips—a figure that falls dramatically short of production goals. The timing is particularly challenging for Samsung as major clients begin to reevaluate their manufacturing partnerships.
Qualcomm has opted to produce its latest Snapdragon 8 Elite processors exclusively through rival TSMC's 3 nm facilities. Even more telling is the exodus of South Korean companies, traditionally loyal to Samsung, who are now turning to TSMC's more reliable manufacturing processes. While Samsung can claim the achievement of bringing 3 nm GAA technology to market before TSMC's competing N3B process, this technical victory rings hollow without the ability to mass-produce chips efficiently. The gap between Samsung's aspirations and manufacturing reality continues to widen. However, Samsung is shifting its focus toward its next technological milestone. Development efforts are reportedly intensifying around a 2 nm manufacturing process, with plans to debut this technology in a new Exynos processor (codenamed 'Ulysses') for the 2027 Galaxy S27 smartphone series.
Sources:
yeux1122 (Blog), via Wccftech
Qualcomm has opted to produce its latest Snapdragon 8 Elite processors exclusively through rival TSMC's 3 nm facilities. Even more telling is the exodus of South Korean companies, traditionally loyal to Samsung, who are now turning to TSMC's more reliable manufacturing processes. While Samsung can claim the achievement of bringing 3 nm GAA technology to market before TSMC's competing N3B process, this technical victory rings hollow without the ability to mass-produce chips efficiently. The gap between Samsung's aspirations and manufacturing reality continues to widen. However, Samsung is shifting its focus toward its next technological milestone. Development efforts are reportedly intensifying around a 2 nm manufacturing process, with plans to debut this technology in a new Exynos processor (codenamed 'Ulysses') for the 2027 Galaxy S27 smartphone series.
26 Comments on Samsung's Second-Gen 3 nm GAA Process Shows 20% Yields, Missing Production Goals
If we can't make this process work, let's just jump to the next one, even harder to make? What could possibly go wrong?
I think TSMC will soon find they can charge much more for their products, since there will be no competition at the top...
Up to 50% is risk production. Up to 75% is ramp-up and over 85% are mature yields.
TSMC has historically had 70%+ even in the risk-production phase. Their initial 3nm was the exception with 55% but N3E has improved this to over 70%.
Samsung's 20% for risk-production or 60% for ramp-up are pretty abysmal in comparison.
Im guessing Intel 20A was equally as bad which is why it was canned.
"Hey Uncle Sam, how about giving us a few billions of dat fat CHIPS money, so we can fix this" ?
AMD could probably make this work with their chiplets, even Intel for their consumer lineup if it's performant.
Those chiplets would cost an arm and a leg with 60% yield.
Apple a18 is 90mm2 and the Pro model is 105mm2.
Zen 5 Chiplet is 70mm2.
I would also think the chiplets could absorb a higher defect rate, with the ability to disable up to 2 cores.
3.14*150²= ~70650mm²