Demonstrating continued innovation, Kioxia Corporation and Western Digital Corp. today announced details of their newest 3D flash memory technology. Applying advanced scaling and wafer bonding technologies, the 3D flash memory delivers exceptional capacity, performance and reliability at a compelling cost, which makes it ideal for meeting the needs of exponential data growth across a broad range of market segments.

"The new 3D flash memory demonstrates the benefits of our strong partnership with Kioxia and our combined innovation leadership," said Alper Ilkbahar, Senior Vice President of Technology & Strategy at Western Digital. "By working with one common R&D roadmap and continued investment in R&D, we have been able to productize this fundamental technology ahead of schedule and deliver high-performance, capital-efficient solutions."

YMTC today at the Flash Memory Summit (FMS) 2022 unveiled its X3-9070 TLC 3D NAND flash powered by Xtacking 3.0 architecture. Since its debut show at FMS 2018, YMTC's Xtacking technology has become a hallmark of the company's vision for innovation, and the approach to hybrid bonding has been widely recognized as one of the key enablers of the industry's future growth. Built out to be a common growth platform that drives value and innovation in the semiconductor ecosystem, YMTC's Xtacking 3.0 architecture opens up a world of opportunities for diversified applications in 5G, AloT, and beyond.

From 1.0 to 3.0, YMTC's Xtacking technology, a heterogeneous 3D integration architecture, has established a proven track record of success, as evidenced by a diverse portfolio of Xtacking NAND-based system solutions, including SATA III, PCIe Gen3 & Gen4 SSDs, as well as eMMC & UFS for mobile and embedded applications, garnering recognition from leading OEMs.

Phison Electronics Corp., a global leader in NAND flash controller and storage solutions, today announced significant milestones in 2022 that were highlighted by key partnerships, product innovations and advancements, and overall technology leadership.

"Despite market challenges, Phison is proud to have successfully navigated 2022 with strong innovation and technology leadership, two hallmarks of our company," said K.S. Pua, Phison CEO. "As a forward-thinking company, we cannot wait to bring more SSD customizations, innovations, and solutions to our partners, and customers next year."

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, as promised at Flash Memory Summit 2022 and Samsung Memory Tech Day 2022, announced today that it has begun mass producing a 1-terabit (Tb) triple-level cell (TLC) eighth-generation Vertical NAND (V-NAND) with the industry's highest bit density. At 1 Tb, the new V-NAND also features the highest storage capacity to date, enabling larger storage space in next-generation enterprise server systems worldwide.

"As market demand for denser, greater-capacity storage pushes for higher V-NAND layer counts, Samsung has adopted its advanced 3D scaling technology to reduce surface area and height, while avoiding the cell-to-cell interference that normally occurs with scaling down," said SungHoi Hur, Executive Vice President of Flash Product & Technology at Samsung Electronics. "Our eighth-generation V-NAND will help meet rapidly growing market demand and better position us to deliver more differentiated products and solutions, which will be at the very foundation of future storage innovations."

KIOXIA America, Inc. is at Intel Innovation this week to demonstrate its CM7 Series NVMe SSDs that deliver next-generation levels of performance to enterprise and data center workloads. The KIOXIA CM7 family is designed with PCIe 5.0 technology in Enterprise and Datacenter Standard Form Factor (EDSFF) E3.S and 2.51-inch form factors. These drives double performance from the prior generation and offer an expanded set of form factor options, larger capacities, and advanced features.

Intel Innovation is a technology showcase event that spotlights the tools, training and community created to empower developers to create what's next. CM7 demos will be conducted in the KIOXIA kiosk located in Intel Innovation's PCIe 5.0 and CXL Ecosystems Zone on the show floor of San Jose's McEnery Convention Center. KIOXIA will present a video showing its PCIe 5.0 drives demonstrating high performance, low latency and high bandwidth, in a 12th Gen Intel Core processor-based workstation. CM7 performance of up to 14 gigabytes per second sequential read throughput, utilizing the full bandwidth of PCIe 5.0 x4 speed, will be shown.

KIOXIA America, Inc. has introduced new Industrial Grade flash memory devices. This new lineup utilizes the latest generation KIOXIA BiCS FLASH 3D flash memory with 3-bit-per-cell (triple-level cell, TLC) technology, and is available in a 132-BGA package. Densities range from 512 gigabits (64 gigabytes) to 4 terabits (512 gigabytes) to support the unique requirements of industrial applications - including telecommunication, networking, embedded computing and much more.

The storage requirements for many industrial applications stand in stark contrast to those of SSDs designed to be housed in climate-controlled data centers - including the need for extended temperature ranges and the ability to maintain high reliability and performance in rugged operating conditions. Designed with these needs in mind, the new KIOXIA devices support a wide temperature range (-40°C to +85°C) and offer suitable products for the industrial market.

KIOXIA America, Inc. today announced that it has begun sampling the latest generation of its JEDEC e-MMC Ver. 5.1-compliant embedded flash memory products for consumer applications. The new products are available in capacities of 64 and 128 gigabytes (GB) and integrate the company's BiCS FLASH 3D flash memory and a controller in a single package.

Demand for mid-range capacities in consumer products such as tablets and IoT devices continues to grow, and though the market continues to shift to UFS, there are cases where e-MMC may still be used. The new KIOXIA e-MMC devices expand the available options. A leading provider of flash memory and storage for consumer applications and mobile devices, KIOXIA has been supporting e-MMC since 2007 and was the first supplier to introduce the higher performance follow-on solution to e-MMC, UFS, in early 2013. Today, the broad KIOXIA lineup of e-MMC and UFS solutions provides support across a wide range of densities (4 GB-1 TB).

During this year's Flash Memory Summit, Phison, a company known for SSD controllers and now flash drives, demonstrated a system running AMD Ryzen 7000 series processors based on Zen 4 architecture. What is interesting about the shown specification is that the system was running an engineering sample of an upcoming Zen 4-based CPU with the latest storage technologies at impressive speeds. Using a Phison PS5026-E26 SSD controller, also called E26, the PCIe 5.0 SSD is powered by Micron's latest 232-layer TLC NAND flash. This new NAND technology will also bring greater densities to the market by promising higher endurance, higher read/write speeds, and better efficiency.

With AMD's upcoming AM5 platform, support for PCIe 5.0 SSDs is a welcome addition. And we today have some preliminary tests that show just how fast these SSDs can run. In CrystalDiskMark 8.0.4, it achieved over 10 GB/s in both read and write. We know that the E26 controller is capable of 12 GB/s speeds, so more fine-tuning is needed. Being an early sample, we expect final specifications to be better. The system is powered by an engineering sample of a six-core, twelve-threaded Zen 4 CPU running at unknown clocks, codenamed 100-000000593-20_Y. We can expect to see more of this technology once AMD's AM5 platform lands and Phison-powered SSDs hit the shelves in September.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in NAND Flash controllers and solid-state storage devices, today announces it will be showcasing its unique suite of SSD controller solutions for Datacenter, Notebook PCs and Automotive / Industrial SSDs during the Flash Memory Summit from August 2-4 at the Santa Clara Convention Center, booth #311.

YMTC today at the Flash Memory Summit (FMS) 2022 unveiled its X3-9070 TLC 3D NAND flash powered by Xtacking 3.0 architecture. Since its debut show at FMS 2018, YMTC's Xtacking technology has become a hallmark of the company's vision for innovation, and the approach to hybrid bonding has been widely recognized as one of the key enablers of the industry's future growth. Built out to be a common growth platform that drives value and innovation in the semiconductor ecosystem, YMTC's Xtacking 3.0 architecture opens up a world of opportunities for diversified applications in 5G, AloT, and beyond.

From 1.0 to 3.0, YMTC's Xtacking technology, a heterogeneous 3D integration architecture, has established a proven track record of success, as evidenced by a diverse portfolio of Xtacking NAND-based system solutions, including SATA III, PCIe Gen3 & Gen4 SSDs, as well as eMMC & UFS for mobile and embedded applications, garnering recognition from leading OEMs.

Samsung Electronics, the world leader in advanced memory technology, today unveiled an array of next-generation memory and storage technologies during Flash Memory Summit 2022, held at the Santa Clara (California) Convention Center, Aug. 2-4. In a keynote titled "Memory Innovations Navigating the Big Data Era," Samsung spotlighted four areas of technological advancement driving the big data market—data movement, data storage, data processing and data management—and revealed its leading-edge memory solutions addressing each field.

To maximize data center efficiency in an increasingly data-driven world, Samsung introduced a next-generation storage technology, "Petabyte Storage." The new solution will allow a single server unit to pack more than one petabyte of storage, enabling server manufacturers to sharply increase their storage capacity within the same floor space with a minimal number of servers. High server utilization will also help to lower power consumption.

SK hynix Inc. announced today that it has developed the industry's highest 238-layer NAND Flash product. The company has recently shipped samples of the 238-layer 512Gb triple level cell (TLC) 4D NAND product to customers with a plan to start mass production in the first half of 2023. "The latest achievement follows development of the 176-layer NAND product in December 2020," the company stated. "It is notable that the latest 238-layer product is most layered and smallest in area at the same time."

The company unveiled development of the latest product at the Flash Memory Summit 2022 in Santa Clara. "SK hynix secured global top-tier competitiveness in perspective of cost, performance and quality by introducing the 238-layer product based on its 4D NAND technologies," said Jungdal Choi, Head of NAND Development at SK hynix in his keynote speech during the event. "We will continue innovations to find breakthroughs in technological challenges."

Kioxia Corporation, the world leader in memory solutions, today announced the launch of the second generation of XL-FLASH, a Storage Class Memory (SCM) solution based on its BiCS FLASH 3D flash memory technology, which significantly reduces bit cost while providing high performance and low latency. Product sample shipments are scheduled to start in November this year, with volume production expected to begin in 2023.

The second generation XL-FLASH achieves significant reduction in bit cost as a result of the addition of new multi-level cell (MLC) functionality with 2-bit per cell, in addition to the single-level cell (SLC) of the existing model. The maximum number of planes that can operate simultaneously has also increased from the current model, which will allow for improved throughput. The new XL-FLASH will have a memory capacity of 256 gigabits.

This week at the Flash Memory Summit Conference & Expo, KIOXIA America, Inc.—along with the entire industry - will celebrate an important milestone: the 35th anniversary of its invention of NAND flash memory. While looking back at the transformative technology it invented back in 1987, KIOXIA also has its eyes on the future, defining what's next for flash by introducing innovative new products, form factors, and solutions. At FMS, the company will highlight how it is using flash memory to drive advancements and improvements in a wide variety of applications, including mobile computing, the edge, the cloud, data centers and automotive.

KIOXIA's Scott Nelson, executive vice president and chief marketing officer and Shigeo (Jeff) Ohshima, technology executive, SSD Application Engineering will jointly present a keynote session titled: "KIOXIA: 35 Years of Flash & Beyond." The session will highlight the 35th Anniversary of the invention of flash memory and will look forward to how KIOXIA is driving the future of this game-changing technology.

MaxLinear Inc. today announced the availability of Panther III, the latest in the company's Panther series of storage accelerators. The company is showcasing this product at the Flash Memory Summit in Santa Clara, CA, August 2 - 4. Booth 111. Businesses need immediate access to larger and larger amounts of data and, at the same time, are faced with security and CAPEX costs challenges. With its 16 nanometer (nm) DPU architecture, Panther III provides breakthrough data reduction, encryption, deduplication, and data protection and sets a new standard in storage acceleration with a high throughput of 200 Gbps and ultra-low single-pass transformation latency.

Panther III opens new opportunities within the storage market, including all-flash-array and non-volatile memory express (NVMe) systems. As with previous generations of Panther products, Panther III offers powerful data reduction technology that intelligently offloads the CPU to open all tiers of storage to their full bandwidth potential with no CPU or software limitations. These capabilities enable intelligent and faster dataset delivery, high-performance analytics, and improved workload accuracy in fast-growing Edge to disaggregated computing of the public cloud.

Kioxia Corporation today announced that it has collaborated with Aerospike to enhance Aerospike Server Community Edition database - resulting in a 36 % increase in application performance compared with the original software without the enhancement by Kioxia. Testing was performed with KIOXIA FL6 Series enterprise NVMe Storage Class Memory (SCM) SSDs with a software enhancement developed by Kioxia.

The Aerospike database is optimized to run on flash memory and SSD devices and is capable of providing high throughput and low latency on flash memory. Featuring Kioxia's SCM solution, XL-FLASH, the PCIe 4.0 and NVMe 1.4 -compliant KIOXIA FL6 Series SSDs bridge the gap between DRAM and TLC-based drives, making them well-suited to latency-sensitive use cases such as caching layer, tiering and write logging. Currently, in mass production, dual-port KIOXIA FL6 Series drives deliver high endurance (60 DWPD) and are available in capacities up to 3,200 GB.

KIOXIA America, Inc. today announced sampling of the industry's first XFM DEVICE Ver. 1.0-compliant removable PCIe standard attached, NVMe storage device: the XFMEXPRESS XT2. With a new form factor and connector, the XFM DEVICE Ver. 1.0 standard delivers an unparalleled combination of features designed to revolutionize ultra-mobile PCs, IoT devices and a variety of embedded applications.

First introduced in August of 2019, and then presented as a proposal to the JEDEC Subcommittee for Electrical Specifications and Command Protocols, KIOXIA XFMEXPRESS XT2 is a new form factor for PCIe/NVMe specification devices. Featuring a powerful combination of small size, speed and serviceability, XFMEXPRESS technology was developed to enhance next-generation mobile and embedded applications. The XFMEXPRESS XT2 from KIOXIA is the first product to meet the specification of the new JEDEC standard.

Kioxia Corporation, the world leader in memory solutions, today announced it will begin construction of a state-of-the-art new fabrication facility (Fab2) at its Kitakami Plant in Iwate Prefecture, Japan for the possible expansion of production of its proprietary 3D Flash memory BiCS FLASH. Construction of the facility is scheduled to commence in April 2022 and is expected to be completed in 2023.

The new Fab2 facility will utilize AI-based cutting-edge manufacturing to increase production capacity of the entire Kitakami Plant and further enhance product quality, allowing Kioxia to expand its business organically and take advantage of the medium to long term growth of the flash memory market driven by the accelerating adoption of cloud services, 5G, IoT, AI, automated driving and the metaverse.

Kioxia Corporation, a world leader in memory solutions, today announced the launch of Universal Flash Storage (UFS) Ver. 3.1 [1] embedded flash memory devices utilizing the company's innovative 4-bit per cell quad-level-cell (QLC) technology. For applications needing high density, such as cutting-edge smartphones, Kioxia's QLC technology enables the capability to achieve the highest densities available in a single package.

Kioxia's UFS proof of concept (PoC) device is a 512 gigabyte prototype that utilizes the company's 1 terabit (128 gigabyte) BiCS FLASH 3D flash memory with QLC technology, and is now sampling to OEM customers. The PoC device is designed to meet the increasing performance and density requirements of mobile applications driven by higher resolution images, 5G networks, 4K plus video and the like.

Floadia Corporation, headquartered in Kodaira-shi, Tokyo, has developed a prototype 7-bit-per-cell flash memory chip that can retain analog data for 10 years at 150 degrees Celsius by devising a memory cell structure and control method. With the existing memory cell structure, the problem of characteristic change and variation due to charge leakage was significant, and the data retention was only about 100 seconds.

Floadia will apply the memory technology to a chip that realizes AI (artificial intelligence) inference operations with overwhelmingly low power consumption. This chip is based on an architecture called Computing in Memory (CiM), which stores neural network weights in non-volatile memory and executes a large number of multiply-accumulate calculations in parallel by passing current through the memory array. CiM is attracting worldwide attention as an AI accelerator for edge computing environments because it can read a large amount of data from memory and consumes much less power than conventional AI accelerators that perform multiply-accumulate calculations on CPUs and GPUs.

A new era for flash used in servers and storage is here, and it's being introduced by KIOXIA America, Inc. Today, the company announced the industry's first lineup of Enterprise and Datacenter Standard Form Factor (EDSFF) E3.S SSDs designed with PCIe 5.0 technology - the CD7 Series. Building on the KIOXIA E3.S full-function development vehicle that received a 'Best in Show' award at last year's Flash Memory Summit, the CD7 Series E3.S increases flash storage density per drive for optimized power efficiency and rack consolidation.

Breaking free from the design limitations of the 2.5-inch form factor, the EDSFF E3 family is optimized for the needs of high-performance, highly efficient servers and storage. EDSFF enables the next generation of SSDs to address future data center architectures, while supporting a variety of new devices and applications. It provides improved airflow and thermals, signal integrity benefits, and options for larger SSD capacity points. EDSFF standardizes status LEDs on the drive, which eliminates the need for LEDs on the drive carriers. Support for higher E3.S power budgets than 2.5-inch form factor SSDs and better signal integrity allows EDSFF to deliver the performance promised by PCIe 5.0 technology and beyond.

SkyHigh Memory Limited., a global leader in embedded storage solutions, is introducing 3.0 V 1 Gb - 4 Gb densities 4 KB page and 2 KB page ML-3 products to its family of NAND Flash memories. The new 1 Gb - 4 Gb ML-3 SLC NAND Flash product family devices are designed on 1xnm, the industry's most advanced technology node for SLC NAND products. Available with different interfaces, SkyHigh Memory first-generation Serial (SPI) SLC NAND and third-generation Parallel SLC NAND complete the third generation ML-3 4 Gb - 16 Gb parallel SLC NAND product family already in production.

The new 1 Gb - 4 Gb devices will be offered to support high-reliability systems that store critical data and operate at extended temperatures, up to +105°C. Thanks to its internal ECC engine, the ML-3 product family can support chipsets with as low as a 1-bit ECC engine to accommodate legacy chipsets and modern chipsets with higher ECC engines.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD233: XFM Embedded and Removable Memory Device (XFMD) standard. XFMD (XFM stands for Crossover Flash Memory) is a new universal data storage media providing an NVMe over PCI Express interface in a small, thin form factor. The device is designed to bring replaceable storage to devices typically soldered down in IoT devices and embedded applications. Developed by JEDEC's JC-64.1 Subcommittee for Electrical Specifications and Command Protocols, JESD233 is available for download from the JEDEC website.

JESD233 XFMD is a removable, versatile memory solution intended for use in a wide range of applications that require an easy device exchange. Examples include IoT devices, automotive applications, notebook PCs, gaming consoles, video recording devices (drones, surveillance systems, etc.), Extended Reality (AR, VR, MR), and more.

To maximize connectivity between the host and the device, JESD233 XFMD leverages industry-leading standards from PCI-SIG and NVM Express, Inc. The PCI Express interface provides fundamental bus connectivity and NVM Express serves as the higher level protocol for accessing the non-volatile media as a low-latency logical storage device.

KIOXIA America, Inc. today announced sampling of its newest generation of 256 and 512 gigabyte (GB) Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices. Housed in 0.8 and 1.0 mm-high packages, the new products improve performance by 30% for random read and 40% for random write - making them thinner and faster than their predecessors. The new KIOXIA UFS devices utilize the company's most current, high-performance BiCS FLASH 3D flash memory and are targeted to a variety of mobile applications.

The broad set of power and space conscious applications that utilize embedded flash memory continue to need higher performance and density, and UFS has increasingly been the solution of choice. From a total GB perspective, UFS now accounts for the majority of the demand relative to e-MMC. According to Forward Insights, when combining overall UFS and e-MMC GB demand worldwide, almost 70% of the demand this year is for UFS, and this will continue to grow.

KIOXIA America, Inc. today announced sampling of its 1 terabyte (TB) Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices. Housed in a 1.1 mm-high package - making it the thinnest 1 TB UFS offering available - the new product utilizes KIOXIA's BiCS FLASH 3D flash memory and achieves sequential read speed of up to 2,050 MB/sec and sequential write speed of up to 1,200 MB/sec.

Mobile devices are constantly evolving, and 5G networks are poised to deliver levels of speed, scale and complexities the likes of which have never been seen before. Reaping the connectivity benefits of 5G - namely, faster downloads and reduced lag time - requires high performance and low power consumption. Additionally, with 5G making it easier and faster for users to store even more on their mobile devices, the storage requirements for smartphones and other applications are increasing at a rapid pace. KIOXIA's 1 TB UFS brings the ultra-high speed read/write performance, low power consumption, shortened application launch times and storage capacity demanded by 5G and other digital consumer products.