AMD (NYSE:AMD) today announced revenue for the fourth quarter of 2011 of $1.69 billion, net loss of $177 million, or $0.24 per share, and operating income of $71 million. The company reported non-GAAP net income of $138 million, or $0.19 per share, and non-GAAP operating income of $172 million. Fourth quarter non-GAAP net income excludes an impairment of AMD's investment in GLOBALFOUNDRIES of $209 million, restructuring charges of $98 million, the loss from discontinued operations of $4 million, the amortization of acquired intangible assets of $3 million and a loss on debt repurchase of $1 million.

For the year ended December 31, 2011, AMD reported revenue of $6.57 billion, net income of $491 million, or $0.66 per share, and operating income of $368 million. Full year non-GAAP net income was $374 million, or $0.50 per share, and non-GAAP operating income was $524 million.

GLOBALFOUNDRIES and ARM today revealed the latest advances in their longstanding collaboration to deliver optimized system-on-chip (SoC) solutions for ARM Cortex-A series processor designs using ARM Artisan advanced physical IP and GLOBALFOUNDRIES' leading-edge process technologies. The companies announced the industry's first test chip based on a dual-core Cortex-A9 processor operating at frequencies of more than 2.5GHz. In addition, a 20nm tape out using GLOBALFOUNDRIES' Technology Qualification Vehicle (TQV) was also announced for SoCs based on Cortex-A9 processors.

The two companies worked closely together to develop a TQV strategy that allows GLOBALFOUNDRIES to optimize its advanced process technology for customer designs based on Cortex-A series processors. The solution is more than a standard test chip. Each TQV is designed to emulate a full specification SoC and aims to improve performance, lower power consumption and facilitate a faster path to market for foundry customers.

AMD (NYSE: AMD) today announced that revenue for the third quarter ending Oct. 1, 2011 is expected to increase four to six percent as compared to the second quarter of 2011. The company previously forecasted third quarter 2011 revenue to increase 10 percent, plus or minus two percent, from the second quarter of 2011.

In addition, AMD expects third quarter gross margin to be approximately 44 to 45 percent. The company previously forecasted third quarter 2011 gross margin to be approximately 47 percent.

Just over one year after revealing plans for a major global capacity expansion, GLOBALFOUNDRIES today announced its newly constructed cleanrooms in New York and Dresden are ready for the installation of 300mm semiconductor wafer fabrication equipment. Achieving "Ready for Equipment" (RFE) status marks the transition from the construction phase to the operations phase-a significant milestone on the path to volume manufacturing in these new facilities.

"At GLOBALFOUNDRIES, we continue to invest aggressively in driving sustained growth on advanced technologies," said GLOBALFOUNDRIES CEO Ajit Manocha. "The build-out of our 300mm manufacturing campuses in New York and Dresden is supporting growing customer demand for advanced technologies, while creating hundreds of jobs and providing a significant boost to the economies in the surrounding regions. By completing these massive construction projects on schedule and on budget, we are continuing to deliver on our commitment to being the only truly global foundry."

AMD (NYSE: AMD) announced that it amended its Wafer Supply Agreement (WSA) with GLOBALFOUNDRIES Inc. The primary purpose of the amendment was to revise the pricing methodology applicable to wafers delivered in 2011 for AMD's microprocessor and accelerated processing unit (APU) products. The amendment also modified AMD's existing commitments regarding future increases in production of certain graphics processing unit (GPU) and chipset products at GLOBALFOUNDRIES.

Under the amended agreement, GLOBALFOUNDRIES has committed to provide AMD with, and AMD has committed to purchase, a fixed number of 45nm and 32nm wafers per quarter in 2011. AMD will pay GLOBALFOUNDRIES fixed prices for 45nm wafers delivered in 2011. AMD's price for 32nm products will be based on good die.

AMD today announced that its Board of Directors has appointed Senior Vice President and CFO Thomas Seifert, 47, as interim CEO following the resignation of Dirk Meyer, 49, as president, CEO and a director of the company effective immediately.

A CEO Search Committee has been formed to begin the search for a new CEO. The Committee is led by Bruce Claflin, Chairman of AMD's Board of Directors, who has been named Executive Chairman of the Board as he assumes additional oversight responsibilities during the transition period. Seifert will maintain his current responsibilities as CFO and has asked not to be considered for the permanent CEO position.

In a keynote address today at SEMICON West, Gregg Bartlett, senior vice president of technology and R&D at GLOBALFOUNDRIES, revealed details of the company's plans to drive Extreme Ultraviolet (EUV) lithography to high-volume production. "Our strategy is to move past the pre-production tool step and straight to purchasing a production-level tool for installation in Fab 8-our new leading-edge fab currently under construction in upstate New York," Bartlett said. "We are planning to install this tool in the second half of 2012 so we can immediately begin the development work to enable volume production by the 2014/2015 timeframe. It is our collaborative approach to R&D that has put us in a position to make such a move-a move that will accelerate the charge to volume production for the entire industry."

As an industry leader in bringing immersion lithography to high-volume production, GLOBALFOUNDRIES is well positioned to lead this effort. "We can take what we learned with immersion and apply it to ramping EUV to high volume," Bartlett said. "From our perspective, we see immersion lithography getting us through the 22/20nm node, but not without some serious cost challenges and added complexity. We need another solution, and in our view EUV is the most promising candidate."

At next week's Design Automation Conference (DAC), GLOBALFOUNDRIES will unveil a new platform to spur innovation in semiconductor manufacturing and help deliver unparalleled service to chip designers. Called GLOBALSOLUTIONS, the new ecosystem combines the company's internal resources with a broad spectrum of partners to efficiently enable the fastest time-to-volume for foundry customers.

"As chip design grows in complexity and manufacturing partnerships become increasingly critical, foundry customer enablement needs to extend beyond process design kits and reference flows to include the full spectrum of the semiconductor value chain," said Jim Kupec, senior vice president of worldwide sales and marketing at GLOBALFOUNDRIES. "To this end, GLOBALSOLUTIONS includes ecosystem partners in all aspects of design enablement, turnkey services, design for manufacturability, optical proximity correction and mask operations, and will further expand our capabilities in advanced assembly solutions. This will allow our customers to unlock their innovation potential and differentiate at all levels of the design process, from the silicon and SoC level all the way up to the full system."

With AMD's next generation of graphics processors, the company plans to, at one point, switch its GPU manufacturing from its present Taiwan-based foundry partners such as TSMC and UMC, to GlobalFoundaries, its erstwhile own manufacturing division. From 40 nm, graphics processors are expected to jump to 28 nm as the next manufacturing process standard. GlobalFoundries will be ready with a 28 nm High-K metal gate (HKMG) node for making AMD products which are now bulk-manufactured in Taiwan.

During a quarterly conference call with financial analysts, chief executive officer of AMD, Dirk Meyer said "The first intersection of our AMD GPUs and GlobalFoundries are on the 28nm. We haven't been public with respect to any timing there." GlobalFoundries is said to have two principal kinds of 28 nm nodes, the 28nm-HP (High Performance) node makes complex chips such as GPUs, game console chips, storage controllers, networking and media encoding, while the 28nm-SLP (Super Low Power) is used for less complex devices, particularly intended to be low-power, for portable devices, such as baseband, application processors, and other handheld functions. In 2011, AMD is expected to release its next-generation of GPUs in a series codenamed "Northern Islands".

AMD (NYSE:AMD) announced revenue for the first quarter of 2010 of $1.57 billion, net income of $257 million, or $0.35 per share, and operating income of $182 million. The company reported non-GAAP net income of $63 million, or $0.09 per share, and non-GAAP operating income of $130 million.

"Strong product offerings and solid operating performance resulted in record first quarter revenue," said Dirk Meyer, AMD President and CEO. "We continue to strengthen our product offerings. We launched our latest generation of server platforms, expanded our family of DirectX 11-compatible graphics offerings, and commenced shipments of our next-generation notebook platforms to customers."

At the 2010 Mobile World Congress, GLOBALFOUNDRIES and ARM today unveiled new details on their leading-edge System-on-Chip (SoC) platform technology for powering the next generation of wireless products and applications. The new chip manufacturing platform is projected to enable a 40 percent increase in computing performance, a 30 percent decrease in power consumption, and a 100 percent increase in standby battery life. The new platform includes collaboration on two GLOBALFOUNDRIES process variants: 28nm super low power (SLP) for mobile and consumer applications and 28nm high performance (HP) for applications requiring maximum performance.

"The success of the next generation of mobile products will be increasingly dependent on their ability to deliver PC-class performance, a highly integrated rich media experience and longer battery life," said GLOBALFOUNDRIES chief operating officer Chia Song Hwee. "These demands are going to require a strong technology foundation and close collaboration between industry leaders to enable an increasing number of design companies to unlock this innovation. We are working closely with ARM to optimize the physical IP and implementation of the Cortex-A9 processor with our proven manufacturing experience in high-volume, advanced technology products, to deliver a fully integrated platform for leading-edge wireless products and applications."

Toppan Photomasks, Inc. (TPI) and GLOBALFOUNDRIES today announced that they have formed a joint venture for operation of the Advanced Mask Technology Center (AMTC) in Dresden, Germany. The joint venture will provide leading-edge photomasks to GLOBALFOUNDRIES and to TPI's European and global networks of customers.

Under terms of the venture, TPI's Dresden manufacturing facility and the AMTC will be combined into a single manufacturing facility. TPI will retain its Dresden sales, customer service and mask front-end functions. The new integrated organization builds on the AMTC's history of providing advanced masks, TPI's and GLOBALFOUNDRIES' manufacturing excellence in Dresden, Toppan's world-class mask technology development, and the extensive collaborative relationships that GLOBALFOUNDRIES and Toppan have established in the industry.

ARM and GLOBALFOUNDRIES today announces a long-term strategic relationship to provide their mutual customers with an innovative SoC enablement program. To support the long-term relationship, GLOBALFOUNDRIES and ARM have signed a broad agreement on processor implementation and circuit optimization to provide mutual customers with a robust enablement program geared towards next-generation applications.

The SoC enablement program, built around a full suite of ARM Physical IP, Fabric IP and Processor IP, will deliver customers unparalleled design flexibility on GLOBALFOUNDRIES' most advanced HKMG semiconductor manufacturing capabilities. The collaborative efforts of the partnership will initially focus on enabling SoC products which use the low power and high performance ARM Cortex -A9 processor on GLOBALFOUNDRIES 28nm HKMG process. The characteristics of GLOBALFOUNDRIES 28nm "Gate First" HKMG technology is optimized for high performance processing with minimal leakage making it an ideal choice for advanced mobile solutions.

As the semiconductor industry begins its transition to the next technology node, GLOBALFOUNDRIES is on track to take its position as the foundry technology leader. On October 1 at the Global Semiconductor Alliance Emerging Opportunities Expo & Conference in Santa Clara, Calif., GLOBALFOUNDRIES (Booth 321) will provide the latest details on its technology roadmap for the 32nm/28nm generations and its innovative "Gate First" approach to building transistors based on High-K Metal Gate (HKMG) technology.

"With each new technology generation, semiconductor foundries are increasingly challenged with the economics to sustain R&D and the know-how to bring these technologies to market in high-volume," said Len Jelinek, director and chief analyst, iSuppli. "With a heritage of rapidly ramping leading-edge technologies to high volumes at mature yields, combined with aggressive investments in capacity and technology, GLOBALFOUNDRIES is uniquely-positioned to challenge for next-generation foundry leadership."

GLOBALFOUNDRIES today announced the appointment of Jim Ballingall as vice president of marketing. In this role, Ballingall will be responsible for developing and implementing marketing solutions and strategies to support the growth of GLOBALFOUNDRIES as it aims to reshape the landscape of the foundry industry.

"The core of the GLOBALFOUNDRIES brand comprises the sum of the unique value propositions that we create, promise, and deliver to our customers," said Jim Kupec, senior vice president of sales and marketing at GLOBALFOUNDRIES. "As we strive to deliver on our vision and become the world's first truly global foundry, Jim's proven foundry industry leadership and experience will help us develop and convey our unique value propositions to customers and stakeholders and position the company for optimal success, as we unlock our customers' potential to innovate and win."

Advanced Technology Investment Company LLC (ATIC) of Abu Dhabi and Chartered Semiconductor Manufacturing (Chartered) of Singapore today announced a definitive agreement whereby ATIC would acquire Chartered, one of the world's top dedicated semiconductor foundries.

The proposed acquisition will be effected by way of a scheme of arrangement under section 210 of the Companies Act of Singapore, subject to the approval of Chartered shareholders and the sanction of the High Court of Singapore. The transaction is expected to close during the fourth quarter of 2009. Completion of the transaction will be subject to customary conditions, such as regulatory and shareholder approvals. Details can be found in the joint scheme announcement that has been filed with the Singapore Exchange Securities Trading Limited (SGX), as well as in the scheme document to be sent to Chartered shareholders.

GLOBALFOUNDRIES today announced a strategic customer relationship with STMicroelectronics. One of the world's leading suppliers of semiconductor solutions, ST will partner with GLOBALFOUNDRIES to produce products based on 40nm Low Power (LP) bulk silicon technology. The 40nm LP process is ideal for the next generation of wireless applications, handheld devices, and consumer electronics, which require excellent performance and long battery life. First tape out and production of ST products by GLOBALFOUNDRIES is planned to start in 2010.

"When we launched GLOBALFOUNDRIES, our long-term vision was to bring a new business model to the foundry market and to become the partner of choice for the largest and most innovative semiconductor design and manufacturing companies," said Doug Grose, Chief Executive Officer, GLOBALFOUNDRIES. "With the addition of an industry-leader in low-power technology like STMicroelectronics we now begin to deliver on this vision. We look forward to harnessing our full capabilities for ST to provide best-in-class service in bringing their 40nm design innovation to life in high volumes and at mature yields."

GLOBALFOUNDRIES today announced it officially broke ground on the construction of Fab 2, a new semiconductor manufacturing facility located at the Luther Forest Technology Campus in Saratoga County, New York. Once completed, Fab 2 will stand as the most technologically advanced semiconductor manufacturing facility, or fab, in the world and the largest leading-edge semiconductor foundry in the United States. The construction and ramp-up phases for the new $4.2 billion facility are expected to take approximately three years to complete, with volume production expected in 2012.

"Semiconductors are the building blocks of technology innovation and are present in everything from mobile phones to kitchen appliances and solar panels," said Hector Ruiz, chairman of GLOBALFOUNDRIES. "As today's chip designers push the boundaries on the next generation of products, there is a growing need for a new approach to design and manufacturing rooted in collaboration and innovation. With Fab 2, GLOBALFOUNDRIES moves the semiconductor industry away from the traditional model of isolated regional development and into an era of global hubs of manufacturing and technology expertise."

In its effort to meet the ever-increasing demands of consumer technology, the semiconductor industry has long been preoccupied with smaller transistors and larger silicon wafers. While these are important tactics, opportunities for increasing efficiency, becoming more agile, and minimizing waste are often overlooked in manufacturing processes, according to Thomas Sonderman, vice president of manufacturing systems and technology at GLOBALFOUNDRIES.

At SEMICON West 2009, Sonderman is calling for a renewed focus on operational agility in the semiconductor manufacturing industry, particularly in light of increased pressure to move to processes based on 450 millimeter (mm) wafers.

GLOBALFOUNDRIES today announced the appointment of Ron Dickinson as vice president of enterprise quality. The appointment marks the completion of the senior management team, cementing a strong leadership base to support the long-term growth and success of GLOBALFOUNDRIES as it aims to reshape the foundry landscape. In his role, Dickinson will enhance the customer experience by driving maximum levels of quality assurance and reliability for internal and external areas across the business.

"To become the industry's premier global foundry company, we need to execute on an uncompromised standard of excellence when it comes to quality management," said GLOBALFOUNDRIES CEO Doug Grose. "Ron brings nearly three decades of world-class experience to help us achieve this goal by implementing a program that consistently meets and exceeds industry-leading benchmarks in efficiency, yields, quality, and cost."

GLOBALFOUNDRIES today announced the appointment of Norm Armour as vice president and general manager and Eric Choh as vice president of operations to lead an expanding team dedicated to developing Fab 2, the company's next semiconductor fabrication facility, or "fab," at the Luther Forest Technology Campus in Saratoga County, New York. Once constructed, Fab 2 is expected to be the world's most advanced semiconductor foundry, creating more than 1,200 new direct jobs plus an additional 5,000 spin-off jobs in the region.

"Norm and Eric bring a wealth of semiconductor manufacturing experience to GLOBALFOUNDRIES and will play critical leadership roles as we build and operate the most sophisticated semiconductor manufacturing facility in the world," said Douglas Grose, chief executive officer, GLOBALFOUNDRIES. "With a wealth of industry expertise in fab build-out and global operations, we now have the leadership team in place to create a cluster of semiconductor manufacturing and technology innovation in upstate New York that will bring the next wave of chip innovation to the marketplace."

GLOBALFOUNDRIES today described an innovative technology that could overcome one of the key hurdles to advancing high-k metal gate (HKMG) transistors, bringing the industry one step closer to the next generation of mobile devices with more computing power and vastly improved battery life.

The semiconductor industry is celebrated for overcoming seemingly insurmountable odds to continue the trend toward smaller, faster, and more energy-efficient products. Performed in partnership with IBM through GLOBALFOUNDRIES' participation in the IBM Technology Alliance, the new research is designed to enable the continued scaling of semiconductor components to the 22 nanometer node and beyond.

GLOBALFOUNDRIES today announced it has issued the formal commitment letter to the State of New York for the construction of the Fab 2 project at the Luther Forest Technology Campus (LFTC). The letter officially initiates the construction phase of the Fab 2 project and triggers the State of New York to begin the process of issuing bonds for the payment of reimbursements and incentives to the company for the development of the estimated $4.2 billion semiconductor wafer fabrication facility, or "fab."

GLOBALFOUNDRIES, the new leading-edge semiconductor foundry company formed by a joint venture between AMD and Advanced Technology Investment Company (ATIC), today announced the appointment of Curtis "Mojy" Chian as senior vice president of design enablement.

Chian brings more than two decades of leadership experience in silicon process technologies, most recently at Altera Corporation, where he served as vice president of technology development. At GLOBALFOUNDRIES, he will be responsible for global design enablement and will be the primary technical customer interface-working closely with customers to efficiently bring the world's most sophisticated chip designs to market.

AMD today reported first quarter 2009 results.
For financial reporting purposes, AMD consolidates the operating results of GLOBALFOUNDRIES in its results as of March 2, 2009 and has created the Foundry segment as of the start of the fiscal year. References to "AMD" in this announcement include these consolidated operating results which are reported for GAAP purposes. "AMD Product Company" refers to AMD, excluding the operating results of the Foundry segment and intersegment eliminations.
AMD reported revenue for first quarter of 2009 of $1.177 billion. First quarter 2009 revenue was flat compared to the fourth quarter of 2008 and decreased 21 percent compared to the first quarter of 2008.