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AMD Showcases Several Premium X570 Motherboards for Ryzen 3000 Zen2
AMD at its 2019 Computex private showcase for the media following its CEO's keynote address, unveiled several premium motherboards based on the new AMD X570 chipset. The X570 is an in-house design effort by AMD, and unlike the X470, isn't sourced from ASMedia. The chipset supports PCI-Express gen 4.0 end-to-end, which means not only is the chipset-bus gen 4.0, but also the downstream PCIe lanes it puts out. The chipset connects to the AM4 socket over a PCI-Express 4.0 x4 link (64 Gbps).
It has a downstream PCIe lane budget of 16 lanes, which the motherboard designers can spread out as up up to two M.2 NVMe slots, an x4 (physical x16) slot, a bunch of x1 slots, and newer generation connectivity such as 802.11ax WLAN, 2.5/5.0/10 GbE wired networking, and a larger number of USB 3.2 ports, including newer 20 Gbps portsn over external controllers. This chipset runs hotter than the X470, with a TDP rumored to be around 15W, probably because of the PCIe gen 4.0 implementation. Many of the motherboards we spotted had active fan-heatsinks over the chipset.
It has a downstream PCIe lane budget of 16 lanes, which the motherboard designers can spread out as up up to two M.2 NVMe slots, an x4 (physical x16) slot, a bunch of x1 slots, and newer generation connectivity such as 802.11ax WLAN, 2.5/5.0/10 GbE wired networking, and a larger number of USB 3.2 ports, including newer 20 Gbps portsn over external controllers. This chipset runs hotter than the X470, with a TDP rumored to be around 15W, probably because of the PCIe gen 4.0 implementation. Many of the motherboards we spotted had active fan-heatsinks over the chipset.