Shuttle Computer Group, Inc., one of the world's leading designers of small form computers, announces a new and powerful cube-sized computer, its SZ270R9, designed for advanced home and portable gaming, along with virtual reality applications. Unlike other PCs, once set, users can overclock with the Turbo button for the quickest, most realistic action. In spite of its small size, it has an impressive expansion capability and storage capacity. With lots of interior space, the SZ270R9 supports large-format dual-slot graphics cards; users can install up to four 2.5" or 3.5" hard drives and two m.2 bays. It also supports Intel's new Optane Memory to improve data processing and system speed.

"This is the ultimate gaming PC, power packed with an external design that looks like you're ready for battle," said Robert Garcia, channel manager, Shuttle Computer Group. "And when you press the overclock button, watch out! You'll be the winner for sure."

The latest version of Intel's desktop client-platform roadmap has been leaked to the web, which reveals timelines and names of the company's upcoming product lines. To begin with, it states that Intel will upgrade its Core X high-end desktop (HEDT) product line only in Q4-2018. The new Core X HEDT processors will be based on the "Cascade Lake-X" silicon. This is the first appearance of the "Cascade Lake" micro-architecture. Intel is probably looking to differentiate its Ringbus-based multi-core processors (eg: "Coffee Lake," "Kaby Lake") from ones that use Mesh Interconnect (eg: "Skylake-X"), so people don't compare the single-threaded / less-parallized application performance between the two blindly.

Next up, Intel is poised to launch its second wave of 6-core, 4-core, and 2-core "Coffee Lake" processors in Q1-2018, with no mentions of an 8-core mainstream-desktop processor joining the lineup any time in 2018. These processors will be accompanied by more 300-series chipsets, namely the H370 Express, B360 Express, and H310 Express. Q1-2018 also sees Intel update its low-power processor lineup, with the introduction of the new "Gemini Lake" silicon, with 4-core and 2-core SoCs under the Pentium Silver and Celeron brands.

Intel 9th generation Core processors could hit the shelves some time in 2018, after Intel has ironed out supply issues of its current 8th generation Core "Coffee Lake" lineup, and figured out what to do with the unsold 7th generation Core "Kaby Lake" inventory. It has been rumored that the company could increase core-counts across the board again, with the introduction of an eight-core part in the mainstream-desktop lineup, probably to better segment the Core i7 series from the Core i5 series. It's not implausible to expect the next-generation Core i7 MSDT parts to be 8-core/16-thread, and Core i5 MSDT 6-core/12-thread, with 4-core/4-thread or 8-thread Core i3 parts making up the entry-level, which would bring Intel's MSDT lineup on core/thread-count parity with AMD.

The change-log of the latest FinalWire AIDA64 version spells out several 9th generation Core processor model numbers, at least the Core i5 and Core i3 SKUs. The Core i5 lineup includes the i5-9600K, followed by the i5-9600, i5-9500, i5-9400, i5-9400T, i3-9300, i3-9300T, i3-9100, i3-9100T, i3-9000, and i3-9000T, with the "T" extension denoting lower TDP, probably at 35W, while the rest of the lineup has its TDP rated at 65W. The change-log also speaks about Intel's second-wave of Core "Coffee Lake" parts, which launch early-2018, alongside its other 300-series chipset for the platform, such as the H370, B360, and H310.

Security researchers have found glaring security flaws with Intel Management Engine, the on-chip micro SoC that, besides governing the functionality of the processor, provides on-chip management and security features. These security flaws render "potentially millions" of PCs and notebooks, based on Intel processors, according to the researchers. Intel on Monday released a Detection Tool application that lets you identify vulnerabilities in the Management Engine of your Intel processor-powered PC, and suggests updates to Intel Management Engine drivers, or points to BIOS updates from your PC manufacturer.

Updates to Intel ME are specific to TXE 3.0 (trusted execution engine version 3.0), which is featured on processors based on "Skylake," "Kaby Lake," and "Coffee Lake" micro-architectures, across client- and enterprise market segments, and Atom processors released in the past three years. Intel chronicled this security flaw further under Security Advisory 86, and released the SA-00086 Detection Tool.

ECS today rolled out the LIVA Z Plus ZE mini-PC featuring legacy connectivity, combined with otherwise modern hardware, which puts its applications halfway between retail/POS (point of sale) and educational/robotics. The mini-PC features four RS232 serial COM ports, so you can directly plug in POS peripherals such as barcode/RFID scanners, receipt printers, credit card POS machines, electronic weighing scales, etc. It comes with rather powerful 7th generation "Kaby Lake" SoC options, including Celeron 3965U, Core i3-7100U, Core i5-7200U, and i5-7500U, bolstered by Intel vPro.

Besides factory-fitted SoCs, the LIVA Z Plus ZE comes with two DDR4 SO-DIMM slots, supporting up to 32 GB of dual-channel memory, and one M.2-2242 slot with both PCI-Express 3.0 x4 and SATA 6 Gbps wiring. Besides the four RS232 ports, it features four USB 3.0 ports (three type-A, one type-C), two 1 GbE wired network interfaces, 802.11ac + Bluetooth 4.0 WLAN, stereo HD audio, and display outputs that include one each of HDMI 1.4 and miniDisplayPort. Measuring 117 mm x 128 mm x 51 mm (WxDxH), it supports VESA mounting, which lets you tuck it away behind your monitor. It draws power from an external 65W power brick.

The first product based on Intel's ambitious "Kaby Lake-G" multi-chip module, which combines a quad-core "Kaby Lake-H" die with a graphics die based on AMD "Vega" architecture, will be a NUC (next unit of computing), and likely the spiritual successor to Intel's "Skull Canyon" NUC. The first picture of the motherboard of this NUC was leaked to the web, revealing a board that's only slightly smaller than the mini-ITX form-factor.

The board draws power from an external power brick, and appears to feature two distinct VRM areas for the CPU and GPU components of the "Kaby Lake-G" MCM SoC. The board feature two DDR4 SO-DIMM slots which are populated with dual-channel memory, and an M.2 NVMe slot, holding an SSD. There are two additional SATA 6 Gb/s ports, besides a plethora of other connectivity options.

Intel hired Raja Koduri, who resigned as head of AMD's Radeon Technologies Group (RTG), earlier this week. Koduri has been made Senior Vice President and Chief Architect of Intel's future discrete GPUs. That's right, Intel has renewed its dreams to power high-end graphics cards that compete with AMD and NVIDIA. Intel's last attempt at a discrete GPU was "Larrabee," which evolved into a super-scalar multi-core processor for HPC applications under the Xeon Phi line.

This development heralds two major theories. One, that Intel's collaboration with AMD RTG on graphics IP could only go further from here, and what is a multi-chip module of Intel and AMD IP now, could in the future become a true heterogeneous die of Intel's and AMD's IP. Two, that the consolidation of AMD's graphics assets and IP into a monolithic entity as RTG, could make it easier to sell it lock, stock, and barrel, possibly to Intel.

Intel this Tuesday, issued a curious-looking product-change notification (PCN) directed at retail-channel distributors, which points to the re-branding of 7th generation Pentium "Kaby Lake" desktop processors under the new Pentium Gold brand (PCN #115827-00). The re-brand affects retail SKUs of the Pentium G4560, G4620, and G4600. Intel is borrowing the precious-metal nomenclature from its Xeon product-line over to the Pentium brand, which will help consumers tell the MSDT (mainstream-desktop) Pentium processors from the ULP (ultra low-power) chips branded Pentium.

When this product-change comes into effect from the 2nd of November, 2017, MSDT Pentium dual-core chips will be branded Pentium Gold, while low-power "Gemini Lake" SoCs will bear the Pentium Silver brand, besides Celeron. Re-branded names apart, the Pentium Gold SKUs will be identical to the parts they are replacing. The Pentium G4560, for example, will be re-branded Pentium Gold G4560 (or simply "4560") and will carry an identical feature-set. You probably won't even need to update your motherboard BIOS (of your 100-series and 200-series chipset motherboards) to use these chips. It's not likely that these chips will work on 300-series chipset motherboards since they feature a different pin-map, and the retail box design will reflect that with clear markings. The name change also comes with a refreshed case-badge and a slightly modified box design.

A member of the HKEPC tech community, with access to an upcoming Core i7-8700K six-core mainstream-desktop processor, wasted no time in de-lidding it (removing its integrated heatspreader or IHS). It was revealed that Intel is still using thermal-paste between the IHS and the CPU die. The "Coffee Lake" die itself is as wide as the "Kaby Lake," but is visibly longer. It has a die area of approximately 151 mm², compared to the 126 mm² of "Kaby Lake." This is due to its increased CPU core count to 6, and a proportionate increase in last-level cache (L3 cache) to 12 MB. The die is marginally northwest of center, so you can get away placing your TIM blob dead-center of the IHS.

Intel is set to release its newest generation of processors, known as code name Coffee Lake in just a few days. Recent controversy has focused around the inability of newer processors to be used with motherboards supporting the previous generation CPUs. Intel has released data sheets for Coffee Lake CPUs, and images of the socket's layout support Intel's statement that Coffee Lake will indeed need a new socket design. Specifically, there are more pins responsible for delivering the main power for the CPU cores, known as VCC pins, with Coffee Lake motherboards sporting 146 VCC pins illustrated in the first image below, compared to Kaby Lake and Skylake's 128 illustrated in the second image.

With these pins responsible for delivering power to the CPU cores, this may suggest that previous generation motherboards allowed for lower power operation than is possible with the higher core count of Coffee Lake processors. Whatever the reason, it definitely confirms that Coffee Lake CPUs are hardware-incompatible with previous generation motherboards, and not simply a software or BIOS-level lock.

The upcoming Intel 300-series chipset, and LGA1151 socket continues to be a source of chaos for PC builders. While the 100-series and 200-series chipset based motherboards support both 6th generation Core "Skylake," and 7th generation Core "Kaby Lake" processors, they will not support the upcoming 8th generation Core "Coffee Lake" chips. What's more, the upcoming 300-series chipset motherboards, which were earlier believed to feature backwards-compatibility for "Skylake" and "Kaby Lake" chips, will not support them, according to a Hardware.info report.

The LGA1151 socket between the two platforms remains unchanged, down to the package notches, which are designed to prevent you from installing a processor on an incompatible motherboard (eg: LGA1150 processors on LGA1151 motherboards). This isn't even a case like the incompatibility between LGA2011 and LGA2011v3, where the latter features DDR4 memory I/O, compared to the former's DDR3. Platform segmentation, and synthetically keeping up with a product development cycle, by forcing people to upgrade motherboards every two generations, appears to be Intel's primary motivation. The Hardware.info report, however, doesn't rule out the possibility of 300-series chipset motherboards getting support for older LGA1151 processors in the future, through BIOS updates.

ZOTAC International, a Hong Kong based and a global manufacturer of innovation which created the first-ever Mini Gaming PC, continues to push the MAGNUS Series to a previously impossible level. With the all-new MAGNUS EK and ER Series powered by high-performance Intel or AMD Ryzen processors with a ZOTAC GeForce GTX 1070/1060 Series graphics card, ZOTAC is showcasing the first Mini PC series ever built with desktop sized graphics cards. Packing the punch that rivals full-size desktop rigs twice their weight, they are solid choices even for demanding pro gamers.

ZOTAC takes the unprecedented step of packing the best-performing desktop graphics card into the small footprint of the Gaming Mini PC paired with a next-generation processor. MAGNUS EK Series features a 7th Gen Intel Core quad-core processor based on the Kaby Lake architecture to deliver higher frequencies in speeds for a powerful gaming experience. Plus it adds the revolutionary new Intel Optane Memory that enables quick access times while allowing for larger storage capacities.

Intel's upcoming Core i7-8700K six-core mainstream desktop processor was put through Cinebench R15, where it was seen trading blows with much higher high-end desktop (HEDT) processors, thanks to its core-count and relatively high clock speeds. Unlike HEDT processors, the i7-8700K doesn't carry a bulky uncore, keeping its TDP low at 95W, enabling high clock speeds. This reflects in its single-threaded performance, where it was significantly faster than older chips, some of which are even HEDT, but since the "Coffee Lake" architecture is essentially a refresh of the "Kaby Lake" architecture, the chip could lose out on single-threaded performance to the Core i7-7700K on account of slightly lower clock speeds.

The multi-threaded test is where the action is. Bolstered by two more cores, four more threads, and 4 MB more L3 cache, the i7-8700K is proportionately faster than the quad-core chips it succeeds, and is even faster than older 6-core HEDT chips thanks to higher clock speeds, and a newer micro-architecture. The i7-8700K features 6 cores, 12 threads enabled by HyperThreading, Intel's newest Turbo Boost Max 3.0 technology introduced with its Core X family, and 12 MB of L3 cache. It launches on the 5th of October, at an expected price of around USD $380, if not more.A video presentation by YouTuber Karl - MrTechQc, who tested the chip, follows

ZOTAC International, a Hong Kong based and a global manufacturer of innovation, today announced two groundbreaking releases from the acclaimed ZBOX M series and P series Mini PCs. More customized to contemporary users' needs, yet equipped with future fast technologies. The ZBOX MI553 has a refreshing all-new minimal and elegant design with future fast technologies permeating all of the Mini PC, while the ZBOX PI225 tops world rankings in being the smallest and thinnest Mini PC ever.

"Both ZBOX MI553 and PI225 inherit the defining features of their predecessors, and perhaps employ the most ambitious designs and features yet in a Mini PC. We want to make sure users can enjoy a simple and fast computing experience," said Chinny Chuang, ZOTAC Global Director of Marketing. Future Fast - The all-new ZBOX MI553 introduces the largest surface-area of ventilation ever that with future fast technologies that brings speeding performance to the forefront. It features a 7th Gen Intel Core processor based on the Kaby Lake architecture, a revolutionary Optane Memory technology, Thunderbolt 3, USB 3.1 Gen2, and the fast lanes to support a NVMe M.2 SSD. Professionally dressed for the office and casually comfortable for the home, the all new ZBOX MI553 is the multi-functional do it all Mini PC.

Intel is rushing in its 8th generation Core mainstream-desktop (MSDT) processor lineup, codenamed "Coffee Lake," later within Q3-2017. The first four of these will be six-core SKUs, which while built in the "LGA1151" package, the same ones as the 7th generation "Kaby Lake" and 6th generation "Skylake," will not be compatible with motherboards based on the older 100-series and 200-series chipsets, for reasons unknown. Upcoming motherboards based on the 300-series chipset, could support not just 8th generation "Coffee Lake" processors, but also older LGA1151 processors. The chipset lineup consists of the Z370 Express, which features support for CPU overclocking and 2-way multi-GPU; and the mid-range B360 Express chipset, which could launch either in late-2017 or early-2018, alongside the first Core i3 "Coffee Lake" chips. The first wave of motherboards to go with "Coffee Lake" processors will hence be Z370-based. VideoCardz compiled a partial, but growing list of motherboards which could make up the first wave.

Intel recently concluded an event intended for local distributors in China, a key presentation slide of which was snapped and posted online. The slide confirms the company's product-stack for the mainstream desktop platform, and its augmentation with the first wave of 8th generation Core "Coffee Lake" SKUs. The slide also confirms that Intel will be replacing current Core i7 4-core/8-thread SKUs with Core i7 6-core/12-thread ones; Core i5 4-core/4-thread SKUs with 6-core/6-thread ones, and Core i3 2-core/4-thread SKUs with 4-core/4-thread ones, marking the biggest fundamental update to the product stack since the Core MSDT family started out a decade ago, with the Core "Lynnfield" and "Clarkdale" processors.

The slide further describes per-core performance increases ranging between 11-29 percent owing to higher clock-speeds and a slightly newer micro-architecture, and 51-65 percent increases in multi-threaded performance owing to the increasing core-counts across the board. While these SKUs are expected to logically replace the various Core "Kaby Lake" SKUs from their current price-points, there could be a tiny price increase, across the board, which Intel could justify using the higher core-counts.

Intel 8th generation Core "Coffee Lake" mainstream desktop processors could work on older socket LGA1151 motherboards based on Intel 200-series chipset, after all. A recent motherboard BIOS update by ASUS alters the name-string of a system device to read "Intel Kaby Lake/Coffee Lake-S Host Bridge/DRAM Controller," reinforcing the theory that Coffee Lake and its companion 300-series chipset make up the Kaby Lake "Refresh" platform.

Responding to a customer question, motherboard maker ASRock had recently commented that "Coffee Lake" processors won't be supported by current motherboards based on the 200-series chipset, dashing hopes of current platform users to upgrade to newer 6-core processors without having to unnecessarily buy a new motherboard and reinstall software. This development shouldn't necessarily raise hopes. Although Kaby Lake and Coffee Lake have a lot of architectural similarities, particularly with their uncore components, revised electrical requirements of the new chips could be behind the lack of backwards platform-compatibility. It remains to be seen if you can use your current "Skylake" and "Kaby Lake" processors on upcoming 300-series chipset motherboards.

Intel has recently updated documentation on their available list of processors based on the 7th generation of the Core Family. These new Kaby Lake-based CPUs will further flesh-out Intel's offerings in both the desktop, laptop, and professional segments with new entries in the Core i3, Kaby Lake-U, and Xeon E3 lines of processors.

The new Core i3 processors make use of the S-0 stepping, instead of the B-0 stepping of previously-released processors. The additions are comprised of the i3-7340 (4.2 GHz, 4 MB cache, 51 W TDP); i3-7320T (3.6 GHz, 4MB cache, 35 W TDP); i3-7120 (4 GHz, 3 MB cache, 51 W TDP); and the i3-7120T (3.5 GHz, 3 MB cache, 35 W TDP.) On the laptop side of the equation, Intel is introducing four new processors: the Core i3-7007U (2 cores, 4 threads, 2.1 GHz, 3 MB cache); the Core i3-7110U (2 cores, 4 threads, 2.6 GHz, 3 MB cache); the Core i5-7210U (2 cores, 4 threads, 2.5 GHz base, 3.3 GHz Turbo, 3 MB cache); and the Core i7-7510U (2 cores, 4 threads, 2.7 GHz base, 3.7 GHz Turbo, 4 MB cache.) Lastly, Intel is adding the new E3-1285 v6 Xeon to its lineup. This one brings increased clock speeds (4.1 GHz base, 4.5 GHz Turbo) with Intel's HD P630 integrated graphics, increasing the TDP by 19 W ( to 91 W) compared to the already existing Xeon E3-1275 v6 - for a 300 MHz clock speed increase. This Xeon should be the new highest-end processor for the iMac, which should place its pricing above the $612 mark previously held by the Xeon E3-1280 v6.

So, yes, Intel, I think the AMD engineers who have developed the Zen architecture from the ground-up would take issue with that. Especially when AMD's "Glued-together" dies actually wipe the proverbial floor with the blue company's chips in power-performance ratios, and deliver much better multi-threaded performance than Intel's offerings. Not bad for a "Glued-together" solution, I'd say.

Our resident W1zzard had this to say regarding AMD's latest CPUs: "The SenseMi power-management system seems to be working well in idle, with the 8-core machine drawing the same amount of power as Intel's quad-core "Kaby Lake" machine." And "At stock speeds, the energy-efficiency of Ryzen is truly phenomenal. Prime95 loads all cores and threads on the chip, and the Ryzen ends up with as much power draw as the quad-core Intel i7-7700K. The high power draw result of the overclocked chip is due to the increased voltage needed to achieve stable operation." And let's not forget this: This is epic. We're assuming you've sifted through our game-test results before seeing this page, and so you'll find that the gaming power draw of the 8-core Ryzen makes Intel's quad-core i7-7700K look bad. Power draw is as much as 30W lesser! Ryzen is hands down the most energy-efficient performance CPU AMD ever made, and easily outclasses Intel's 14 nm "leadership." Good show."

Intel Pentium G4560 dual-core socket LGA1151 processor is too good for Intel's comfort. For the past two generations, Intel has enabled HyperThreading on Pentium dual-core chips, and expanded L3 cache amount from 2 MB to 3 MB; which had been the two key differentiators for the company's Core i3 desktop lineup from Pentium. HyperThreading was warranted by an increasing number of games and applications which wouldn't work without at least 4 logical CPUs. The G4560 is a formidable part at its USD $64 price - 2 cores, 4 threads, the latest "Kaby Lake" micro-architecture, 3 MB L3 cache, and 3.50 GHz clock speeds. On the flip side, it makes buying Core i3 dual-core parts close to double its price a dumb option. Intel's solution? Effectively kill it.

According to a DigiWorthy report, Intel has decided to scale down production of the Pentium G4560 in a bid to cripple its availability, and force consumers to opt for pricier 7th generation Core i3 parts. The cheapest part, the Core i3-7100, is priced almost double that of the G4560, at $117. You get the same two "Kaby Lake" cores, 4 threads enabled by HyperThreading, the same 3 MB L3 cache, but slightly higher clock speeds of 3.90 GHz, and a faster integrated graphics core, if you use one. Does the extra 400 MHz warrant double the price? Not even in the case of Intel's priciest Core i7 SKUs. All prices are Intel's "recommended customer price" for 1000-unit tray quantities.

As the third generation of the "XPC nano" series, which was originally introduced in 2015, four new models are now being added to the product range. The seventh generation of Intel Core processors (Kaby Lake) boosts the level of performance while simultaneously reducing the energy consumption once again. The core components supplied with the NC03 barebone models are the chassis, mainboard, cooling system and the power supply unit. Choosing a model will also determine the particular processor, which is already soldered on the mainboard - either a Celeron, Core i3, Core i5 or Core i7. The base model NC03U features an Intel Celeron 3865U dual-core processor clocked at 2x 1.8 GHz. The tried-and-tested 14 nm architecture and power consumption of just 5 Watt in idle mode represent a particularly high level of energy efficiency.

Like the previous range of NC02 models, the chassis dimensions here are 141 x 141 x 42 mm and can accommodate one 2.5-inch drive with a maximum height of 15 mm. When undoing the two screws of the covers of the black chassis, space for the above mentioned 2.5-inch drive in the form of a high-capacity hard disk or SSD comes to light. Two SO-DIMM sockets can be fitted with up to 32 GB of DDR4 memory in total. In addition, one free M.2 expansion slot is available and, thanks to it being PCIe, it supports fast NVMe cards with a length of 80 mm. A second M.2 slot is already equipped with a WLAN module.

NVIDIA's GeForce 384 series drivers seem to have quite a few secrets, beginning with DirectX 12 API support on 5-plus year old GeForce "Fermi" GPUs, and now 4K Ultra HD support for Netflix UWP app without the need of new-generation CPUs (namely Intel "Kaby Lake," AMD "Summit Ridge," and AMD "Bristol Ridge."). The new-generation CPUs feature a host of hardware-level DRM features which the Netflix app needs to playback 4K Ultra HD content. The new GeForce 384 series drivers let you circumvent that requirement.

Reddit user aethervisor discovered that the Windows Store (UWP platform) app of Netflix could play back content at full 4K Ultra HD resolution on their machine with an older CPU and GeForce GTX 1080 graphics. New-generation CPUs had become a requirement for this to happen, besides the latest Windows 10 version, an HDCP 2.2-compliant 4K display (and no active secondary displays that don't satisfy HDCP 2.2), a powerful enough GPU, and either the UWP app or the Netflix website on Microsoft's Edge web-browser. NVIDIA struck down a big requirement that opens up Netflix 4K to a much wider user-base.

A critical flaw was discovered in the way Intel implemented its simultaneous multi-threading technology, HyperThreading, on "Skylake" and "Kaby Lake" processors. Being a micro-architecture specific flaw, this could affect all implementations, from low-power mobile chips, to mainstream desktop, high-end desktop, and perhaps even enterprise-segment Xeon processors. At this time, there are no security implications of this flaw.

Intel chronicled this flaw in its micro-architecture errata "SKZ7/SKW144/SKL150/SKX150/SKZ7/KBL095/KBW095," and described it as follows: "Under complex micro-architectural conditions, short loops of less than 64 instructions that use AH, BH, CH or DH registers as well as their corresponding wider register (e.g. RAX, EAX or AX for AH) may cause unpredictable system behavior. This can only happen when both logical processors on the same physical processor are active." As an implication, Intel goes on to note that Due to this erratum, the system may experience unpredictable system behavior."

Gaming PC builder Falcon Northwest teased a picture of its upcoming Tiki compact high-performance desktop built on the AMD Radeon theme. The silver-bodied beast shows off a Radeon Pro Vega Frontier Edition graphics card through an acrylic cutout on its side, and will be one of the first pre-built desktops you can buy with the $1,000-ish air-cooled Radeon Pro Vega Frontier Edition. Not much else is known about this variant of the Tiki. Looking at its prominent AMD branding, it's entirely possible that the side-panel hides a mini-ITX socket AM4 motherboard with a Ryzen 7 series chip; or maybe not, and it sticks with a Core i7 "Kaby Lake" with a 200-series chipset mini-ITX motherboard.

After the absence of some further details on Intel's upcoming Coffee Lake mainstream CPU architecture (which is understandable, really, considering how the X299 platform and accompanying processors are all the rage these days), some new details have emerged. Intel's Coffee Lake architecture will still be manufactured on the company's 14 nm process, but is supposedly the last redoubt of the process, with Intel advancing to a 10 nm design with subsequent Cannon Lake.

The part in question is a six-core processor, which appears identified as a Genuine Intel CPU 0000 (so, an engineering sample.) SiSoft Sandra identifies the processor as a Kaby Lake-S part, which is probably because Coffee Lake processors aren't yet supported. The details show us a 3.1 GHz base, and a 4.2 GHz boost clock, with a 256 Kb L2 cache per core and a total of 12 MB L3 (so, 2 MB per core, which is in-line with current Kaby Lake offerings.) The 6-core "Coffee Lake" silicon will be built on a highly-refined 14 nm node by Intel, with a die-size of 149 mm². Quad-core parts won't be carved out of this silicon by disabling two cores, but rather be built on a smaller 126 mm² die.