The fiftieth TOP500 list of the fastest supercomputers in the world has China overtaking the US in the total number of ranked systems by a margin of 202 to 143. It is the largest number of supercomputers China has ever claimed on the TOP500 ranking, with the US presence shrinking to its lowest level since the list's inception 25 years ago.

Just six months ago, the US led with 169 systems, with China coming in at 160. Despite the reversal of fortunes, the 143 systems claimed by the US gives them a solid second place finish, with Japan in third place with 35, followed by Germany with 20, France with 18, and the UK with 15.

NVIDIA accused Intel of cheating in its ISC 2016 presentation, particularly in a performance-related slide, in which it claimed that its "Knights Landing" Xeon Phi HPC processor provides faster training of neural nets than NVIDIA "Maxwell" GPUs. In a slide, Intel claimed that a Xeon Phi HPC processor card is 2.3 times faster at training deep-learning neural nets, and 38 percent better scaling across nodes, than NVIDIA "Maxwell" GPUs, which triggered a swift response from the GPU maker, which made significant investments in deep-learning technologies over the past three years.

NVIDIA argued that Intel is using the classic technique of running outdated benchmarks to test its neural net training speeds. The company says that if Intel used the latest version of the same benchmark (Caffe AlexNet), the "Maxwell" GPU will be found to be 30 percent faster than the Xeon Phi at training neural nets. NVIDIA also notes that "Maxwell" is only its previous-generation part, and a "Pascal" based HPC processor would easily be 90 percent faster than the Xeon Phi. More importantly, NVIDIA notes that Intel compared 32 of its new Xeon Phi servers against four-year-old Nvidia Kepler K20 servers being used in ORNL's Titan supercomputer. The latest "Pascal" GPUs leverate NVLink to scale up to 128 GPUs, providing the fastest deep-learning solutions money can buy.

Noctua unveiled a prototype fin-stack heatsink for very large CPU socket types, such as Intel Socket P (LGA3647) and AMD SP3, powering chips such as Intel Xeon Phi "Knights Landing," and upcoming AMD Opteron SP3 32-core SoCs. There will be 3U and 4U versions of this heatsink, supporting NF-A9 (92 mm) and NF-F12 (120 mm) fans. The heatsink is just a very large aluminium fin-stack, to which heat drawn from the base is fed by seven 8 mm thick nickel-plated copper heat pipes.

Intel Corporation todayannounced several new and enhanced technologies bolstering its leadership in high-performance computing (HPC). These include disclosure of the future generation Intel Xeon Phi processor, code-named Knights Hill, and new architectural and performance details for Intel Omni-Path Architecture, a new high-speed interconnect technology optimized for HPC deployments.

Intel also announced new software releases and collaborative efforts designed to make it easier for the HPC community to extract the full performance potential from current and future Intel industry-standard hardware. Together, these new HPC building blocks and industry collaborations will help to address the dual challenges of extreme scalability and mainstream use of HPC while providing the foundation for a cost-effective path to exascale computing.

Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, today announced an ongoing collaboration with Intel to deliver an on-package memory solution for Intel's next-generation Xeon Phi processor, codenamed Knights Landing. The memory solution is the result of a long-term effort between the two companies to break down the memory wall, leveraging the fundamental DRAM and stacking technologies also found in Micron's Hybrid Memory Cube products.

"The ecosystem is changing and the importance of scalable on-package memory and memory bandwidth is now coming to light," said Chirag Dekate, Research Manager at IDC. "Memory is at the heart of the solution space which will benefit both big compute and big data. This announcement is a clear validation of how Micron is advancing the role and impact of memory on systems and the value that 3D memory can deliver."