Adlink's Next-Gen IPC Strives to Revolutionize Industry Use Cases at the Edge
ADLINK Technology Inc., a global leader in edge computing, and a Titanium member of the Intel Partner Alliance, is proud to announce the launch of its latest MVP Series fanless modular computers—the MVP-5200 Compact Modular Industrial Computers and MVP-6200 Expandable Modular Industrial Computers—powered by 12/13th Gen Intel Core i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65 W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
The MVP-5200/MVP-6200 series though expandable remains compact with support for up to 4 PCI/PCIe slots that allow for performance acceleration through GPUs, accelerators, and other expansion cards. Comprehensive modularized options and the ease of configuration can effectively reduce lead times for customers' diverse requirements. In addition, ADLINK also offers a broad range of pre-validated expansion cards, such as GPU, motion, vision, and I/O embedded cards, all can be easily deployed for your industrial applications.
The MVP-5200/MVP-6200 series though expandable remains compact with support for up to 4 PCI/PCIe slots that allow for performance acceleration through GPUs, accelerators, and other expansion cards. Comprehensive modularized options and the ease of configuration can effectively reduce lead times for customers' diverse requirements. In addition, ADLINK also offers a broad range of pre-validated expansion cards, such as GPU, motion, vision, and I/O embedded cards, all can be easily deployed for your industrial applications.