GIGABYTE introduced the X299-WU8, a high-end desktop motherboard being sold as a quasi-workstation-class board, in the CEB form-factor (305 mm x 267 mm). Based on Intel X299 Express chipset, it features out-of-the-box support for Intel's socket LGA2066 Core X 9000-series processors, in addition to existing Core X 7000-series. A design focus with this board is on PCIe connectivity. The board employs two PLX PEX8747 PCIx gen 3.0 x48 bridge chips, which convert two gen 3.0 x16 links from the processor to four downstream x16 links, which can further be switched to x8. All seven expansion slots are PCI-Express 3.0 x16 physically, which are electrically "x16/NC/x16/NC/x16/NC/x16" or "x16/x8/x8/x8/x8/x8/x8." The topmost slot stays x16, while the other six share three x16 links depending on how you populate them. The board has certifications for 4-way SLI and CrossFireX.

The GIGABYTE X299-WU8 draws power from a combination of 24-pin ATX and two 8-pin EPS connectors, conditioning it for the CPU with an 8+1 phase VRM. An additional 6-pin PCIe power input, which is optional, stabilizes slot power delivery to the graphics cards. The CPU socket is flanked by eight DDR4 DIMM slots, supporting up to 128 GB of quad-channel DDR4 memory. Storage connectivity is surprisingly sparse, with just one M.2-2280 slot that has PCIe 3.0 x4 wiring, and eight SATA 6 Gbps ports. USB connectivity includes USB 3.1 gen 2 (including a type-C port), a number of USB 3.1 gen 1 ports, both on the rear panel and via headers; high-end onboard audio including an ALC1220 CODEC and headphones amp; and two 1 GbE networking interfaces. Expect this board to be priced around $600, given that the PEX8747 isn't cheap these days, and this board has two of it.

MSI drew more than a few eyeballs at Computex 2018 when it showcased the X399 MEG Creation motherboard for AMD Ryzen Threadripper processors. With the advent of "new" Skylake-X Refresh processors by Intel, the company has a new high-end motherboard with the X299 MEG Creation. MSI appears to have toned down on the design from its X399-based product, although you still see the metal waveform design along the chipset heatsink that's contiguous with M.2 SSD heatsinks, the VRM heatsink, and the rear I/O shroud. The board draws power from a combination of 24-pin ATX, and two 8-pin EPS power connectors, conditioning it for the LGA2066 processor with a 14-phase VRM.

Expansion slots on the MSI X299 MEG Creation include four PCI-Express 3.0 x16, from which three are wired to the CPU, and the fourth one to the PCH. Between them are three M.2-2280 slots with PCI-Express 3.0 x4 wiring, each. You can add up to four more M.2-2280 SSDs with the included M.2-Xpander Aero accessory, which is a 4-slot M.2 riser with air-cooling, which made its debut with the X399 MEG Creation. Another star attraction with this board is Realtek 2.5 Gbps Ethernet, alongside an Intel i219-V powered 1 GbE interface, and an 802.11 ac + BT 5.0 WLAN. Another interesting accessory is the ThunderboltM3, a Thunderbolt 3.0 card with two type-C ports, and two DisplayPort connectors, for daisy chaining your displays. Storage connectivity, besides the seven M.2 slots, includes eight SATA 6 Gbps ports, and a U.2 port. This board could be priced around the $500-mark.

Intel could very soon fork its high-end desktop platform into two, with the introduction of the new Z399 socket LGA2066 chipset later this quarter; and the fabled X599 chipset powering LGA3647 processors. The move is probably triggered by AMD's introduction of new 24-core and 32-core Ryzen Threadripper processors that wipe out competitiveness of its existing "Basin Falls" X299 platform. The X599 could essentially be a C629 with the addition of some client-segment features (and the subtraction of some enterprise-segment ones), whereas the Z399 is a whole different beast.

With the introduction X599 and LGA3647, Intel could restore competitiveness at the >$1,500 market segment with new 24-core, 26-core, and 28-core "Skylake-X" XCC (extended/extreme core count) processors; whereas the introduction of Z399 could be necessitated with a that of a new 22-core chip for the LGA2066 socket, from which Intel can carve out new 20-core and 22-core SKUs. Existing Skylake-X LCC and HCC chips could be forwards-compatible with Z399, and X299 motherboards could still be eligible for supporting new 20-core and 22-core processors via BIOS updates. The Z399 could introduce a handful of new client-segment features Intel is introducing with the Z390.

32-gigabyte DDR4 UDIMMs are a reality. Samsung recently announced the development of a 32 GB DDR4 dual-rank UDIMM, using higher density DRAM chips. Those chips, however, are unlikely to be available anytime soon, compounded by Samsung's reported scumbaggery in the making. In the midst of all this, motherboard major ASUS designed its own non-JEDEC UDIMM standard, called "Double Capacity DIMM" or DC DIMM, with the likes of G.Skill and Zadak designing the first models. The utility of these modules is to max out the CPU memory controller's limit despite having fewer memory slots on the motherboard. Possible use-cases include LGA1151 mini-ITX motherboards with just one slot per memory channel (2 slots in all), or certain LGA2066 boards with just four slots (one slot per channel).

There is no word on the memory chip configuration modules, but it's highly likely they are dual-rank. The first DDR4 DC modules could be 32 GB, letting you max out the memory controller limit of 8th gen and 9th gen Core processors with just two modules. ASUS is heavily marketing this standard with its upcoming motherboards based on Intel's Z390 Express chipset, so it remains to be seen if other ASUS motherboards (or other motherboards in general) support the standard. Ironically, the Zadak-made module shown in ASUS marketing materials use DRAM chips made by Samsung.

Wrap your head around this: at some point in 2019, AMD will be selling 7 nm processors while Intel sells 14 nm processors. That how grim Intel's 10 nanometer silicon fabrication process development is looking. In the Q&A session of its Q2-2018 Earnings Call, Intel stated that the first products based on its 10 nm process will arrive only by Holiday 2019, making 14 nm micro-architectures hold the fort for not just the rest of 2018, but also most of 2019. In the client-segment, Intel is on the verge of launching its 9th generation Core "Whiskey Lake" processor family, its 5th micro-architecture on the 14 nm node after "Broadwell," "Skylake," "Kaby Lake," and "Coffee Lake."

It's likely that "Whiskey Lake" will take Intel into 2019 after the company establishes performance leadership over 12 nm AMD "Pinnacle Ridge" with a new round of core-count increases. Intel is also squeezing out competitiveness in its HEDT segment by launching new 20-core and 22-core LGA2066 processors; and a new platform with up to 28 cores and broader memory interface. AMD, meanwhile, hopes to have the first 7 nm EPYC processors out by late-2018. Client-segment products based on its architecture, however, will follow the roll-out of these enterprise parts. We could see a point in 2019 when AMD launches its 7 nm 3rd generation Ryzen processors in the absence of competing 10 nm Core processors from Intel. Posted below is an Intel slide from 2013, when the company was expecting 10 nm rollout by 2015. That's how much its plans have derailed.

Corsair today rolled out the second generation Hydro H75 all-in-one liquid CPU cooler (model: CW-9060035-WW). A successor to the original H75 from 2013, the new 2018 Hydro H75 has four major design changes. First, you get the modern octagonal pump-block with ceramic bearings, higher coolant pressure, and white LED illumination. Second, you get more durable tubing with braided fiber outer layer. Third, you get the slightly thicker (27 mm) 120 mm aluminium radiator. You get not one, but two SP120 PWM fans that spin up to 1,900 RPM, pushing up to 64 CFM of air, at up to 31 dBA noise output, each. You install these fans in a push-pull configuration. Lastly, there's support for some of the newer CPU sockets, such as AM4 and LGA2066. Available now, the new Corsair Hydro H75 is priced at USD $89.99.

Intel is allegedly killing off the "Extreme Edition" brand extension it has been using to denote its flagship client-segment products, such as processors and NUCs. This, according to industry observer François Piednoël. This could also mean the retirement of related elements such as the iconic Intel Skull, and the black and silver packaging. What Intel is replacing this moniker with, remains a mystery.

Intel currently assigns the "Extreme" extension to only one client-segment product, the Core i9-7980XE. With the advent of the 28-core client-segment processor on a new motherboard platform, Intel could find itself tough to justify the extension on the "Basin Falls" (LGA2066) platform. The company is planning to launch new 20-core and 22-core LGA2066 processors, besides its 28-core processor on the new platform. The Extreme extension is also used on the company's "Skull Canyon" NUC.

ID-COOLING a cooling solution provider focusing on thermal dissipation and fan technology research and production for over 10 years, announced DASHFLOW 360 AIO water cooler, featuring an ever enhanced pump and RGB lighting on both the pump and fans at the same time synchronizing with motherboard RGB control. The newly developed pump is designed to provide extreme cooling performance with 450L/H water flow and 3m flow lift. Metallic pump cover with the linear cuttings allows amazing RGB lighting through. A big copper base contacts CPU to help the heat transfer. Micro fin submerged design increases the heat dissipation surface.

Premium coated G1/4 fittings are equipped on both ends of the premium sleeved tubing, more reliable & performance efficient. Inside the tubing is self-contained highly efficient and eco-friendly liquid coolant. Users are not suggested to twist the fittings unless you know how to work with customized water cooling kits. A newly developed square radiator has bigger heat dissipation area to support the superb cooling of DASHFLOW 360. Equipped with a set of RGB DF-12025-RGB-TRIO high airflow fans, DASHFLOW 360 is able to cool down 400W TDP processors. Fan speed is PWM controlled from 900 to 2000RPM, pushing max. airflow of 56.5CFM each. On four corners are mounted with rubber dampeners to absorb operating vibration. Each fan has 9 LEDs around the motor center. Fan blades and frame are made of lighting emitting materials to help an evenly spread RGB lighting.

Intel is readying a refresh to its "Basin Falls" HEDT platform (LGA2066 client high-end desktop), with a new 22-core silicon. This part is neither Skylake HCC (20 tiles, up to 18 cores) nor Skylake XCC (30 tiles, up to 28 cores), but a new die with four more tiles than the Skylake HCC silicon, all of which are cores. The new silicon could let Intel design 20-core and 22-core SKUs for the X299 Express chipset, and is seen as a direct response to AMD's 24-core Ryzen Threadripper II processor, which was recently shown beating the 18-core i9-7980X in tech demos. The 32-core Threadripper II could face competition from the 28-core HEDT processor Intel is readying for Q4-2018, but that processor won't be compatible with LGA2066.

In related news, the company is giving finishing touches to a new 8-core "Coffee Lake" die for the mainstream-desktop platform (LGA1151 socket, 300-series chipset). This die features 8 cores, and likely 16 MB of shared L3 cache, while retaining the iGPU and uncore components from the existing Coffee Lake-S die. The chip could retain the classic "Ring Bus" design. The new 8-core mainstream-desktop SKUs, and at least two new high-end desktop SKUs (20-core and 22-core), could be launched in September 2018. The "Basin Falls" refresh, coupled with the new LGA3647 "Purley" derivative for the 28-core monstrosity, will be all Intel has to face AMD this year, with the company's next HEDT silicon, "Cascade Lake-X" being reportedly delayed to the second half of 2019, probably due to foundry problems.

At Computex 2018, we witnessed two major HEDT (high-end desktop) processor announcements. Intel unveiled a client-segment implementation of its "Skylake XCC" (extreme core count) silicon, which requires a new motherboard, while AMD announced a doubling in core-counts of its Ryzen Threadripper family, with the introduction of new 24-core and 32-core models, which are multi-chip modules of its new 12 nm "Zen+" die, and compatible with existing X399 chipset motherboards. With frantic increases in core counts, the practicality of these chips to even the most hardcore enthusiast or productivity professional diminishes. The Computex 2018 demos reek of a pissing-contest between the x86 processor giants, with AMD having an upper hand.

The HEDT segment is intended to occupy the space between client desktops and serious scalar workstations. Intel is frantically putting together a new HEDT platform positioned above its current LGA2066 (X299) platform, built around its Purley enterprise platform, and a variant of the LGA3647 socket (this chip + your X299 motherboard is no bueno). This socket is needed to wire out the 28-core Skylake XCC (extreme core count) silicon, which has a six-channel DDR4 memory interface. The company put up a live demo at the teaser of this unnamed processor, where it was running at 5.00 GHz, which led many to believe that the processor runs at that speed out of the box, at least at its maximum Turbo Boost state, if not nominal clock. Intel admitted to "Tom's Hardware," that it "forgot" to mention to the crowds that the chip was overclocked.

The CNPS (computer noise prevention system) line of CPU coolers from Zalman have decades of reputation, but the company hasn't launched much under this banner, in recent times. The company finally got around to new products, all of which are tower-type heatsinks. Leading the pack is the CNPS10X Optima II. This cooler is a successor of the original CNPS10X Optima from way back in 2011. The heatsink design is unchanged from the original - a conventional tower-type fin-stack with four 8 mm-thick copper heat pipes making direct contact with the CPU at the base. What's changed is an improved fan and support for newer CPU sockets such as AM4 and LGA2066.

The included 120 mm fan of the CNPS10X Optima II comes with a new split-blade impeller (or dual-blade as Zalman likes to call it), which improves air-flow, that is then traded for lower RPMs, and noise. The impeller is translucent, and illuminated by white LEDs. It also has a The cooler is rated for thermal loads of up to 200W TDP. Next up, is the CNPS9X Optima. This cooler features a narrower aluminium fin-stack than the CNPS10X Optima II, but a similar direct-touch base, and four copper heat pipes branching out through various points of the fin-stack. It has the 120 mm "Shank Fin" fan that debuted with the original CNPS10X. This cooler can handle thermal loads of up to 180W, and like the Optima II, it supports newer sockets such as AM4 and LGA2066.

It was only a matter of time before Intel maxed out the "Skylake-X" silicon on the client segment, by bringing its "Skylake XCC" (extreme core count) 700 mm² die on a client-segment package, and here we are. Without taking model names, Intel made it clear that it's launching a new client-segment 28-core/56-thread processor. The company didn't specify the processor's package, and we're doubtful if it's LGA2066 for the simple reason that the Skylake XCC die has 6-channel memory interface. Nevertheless, this processor is clocked at 2.70 GHz (nominal), and without revealing Turbo speeds, Intel managed to overclock it bench-stable to 5.00 GHz, at which it scored 7,334 nT Cinebench points. This product will launch in Q4-2018.

ENERMAX, a leading designer and manufacturer of high-performance PC hardware products, announces the launch of a new all-in-one liquid cooler series, LIQFUSION. At CES 2018, ENERMAX debuted the prototype of LIQFUSION; this closed-loop water cooler quickly gained media and visitors' attention to its beautiful and brilliant lighting effects. The durable ceramic pump, eye-catching ENERMAX RGB fans and waterblock with the unique flow indicator design make LIQFUSION as a one-of-a-kind cooler that has both performance and aesthetics.

LIQFUSION is equipped with an exclusive RGB-sync waterblock with patented flow indicator, which enables the user to easily monitor the status of coolant flow. Together with visually appealing ENERMAX addressable RGB fans, LIQFUSION can create unique, vivid RGB lighting effects.

Koolance rolled out the CPU-400 series CPU water blocks. The blocks are available in two main variants - the CPU-400I for Intel sockets LGA2066, LGA2011(v3), and LGA115x; and the CPU-400A for AMD sockets AM4, AM3(+), and FM2(+). The primary material is nickel-plated copper, with a mirror finish at the base. The top is made of POM acetal. According to its maker, the block's "standard G 1/4 BSPP threading will accept any Koolance fitting diameter up to 19 mm (3/4 in) OD compression style." The block weighs about 230 g. Available now, both the CPU-400I and the CPU-400A are priced at USD $89.99.

Xigmatek today introduced the Prodigy ST1266 low-profile CPU cooler. With an overall height (including fan) of 67 mm, the cooler is capable of handling thermal loads of up to 150W, making it fit for some of the higher-end mainstream desktop CPUs, such as the Core i7-8700K and the Ryzen 7 1800X. It supports sockets LGA2066, LGA2011(v3), LGA115x, AM4, AM3(+), and FM2(+). Its design involves a conventional C-type, top-flow layout. The cooler measures126 mm x 120 mm x 67 mm.

Six 6 mm-thick copper heat pipes make direct contact with the CPU at the base, which doubles up as a small aluminium mono-block heatsink. The heat-pipes convey heat to a thin aluminium fin-stack that propagates along the plane of the motherboard, which is ventilated by a 15 mm-thick 120 mm fan, which takes in 4-pin PWM input, spins between 800 to 1,500 RPM, pushing up to 56.9 CFM of air, with a maximum noise-level of 22.4 dBA. The company didn't reveal pricing.

Phanteks showed off premium versions of its latest Glacier C300-series CPU water blocks, with the Glacier C350iP and the Glacier C350AP. The two are nearly identical to each other, but differ with their CPU socket support, with the former supporting Intel LGA115x and LGA2011(v3)/LGA2066; and the latter supporting just AM4. These blocks themselves are identical to the Glacier C350-series, but come with acetal tops. The gunmetal-gray top replaces the clear-acrylic ones on the standard C350-series blocks, such as the C350a and C350i. The cold plate material is still nickel-plated copper, with mirror finish at the base. Both blocks are priced at USD $69.99, which is surprisingly $10 cheaper than their acrylic twins.

Jonsbo today introduced the Angel Eye TW2 series all-in-one liquid CPU coolers. Available in two variants based on radiator size - the TW2-120 with a 120 mm x 120 mm radiator, and the TW2-240 with the 240 mm x 120 mm radiator; the series includes sub-variants based on the type of RGB LED lighting. The "standard edition" variants have RGB LED lighting limited to the pump-block, with non-illuminated radiator fans; "Version 501" variants have RGB LED lighting on the pump-block as well as the fan impeller; while the range-topping "Version 601" variants have RGB LED lighting on the circular fan-frames instead of the impeller.

The pump-block is cylindrical, with a prominent circular RGB LED diffuser framing it from the top. The copper block features a 0.15 mm micro-fin lattice. The radiator is made of aluminium. All sub-variants of the TW2-120 and TW2-240 have the same cooling performance, as their fans otherwise have identical specs - PWM power input, 800 to 1,500 RPM speed, 21.6 to 50.4 CFM air-flow, and up to 25 dBA noise output, each. The coolers support AMD sockets AM4, AM3(+), FM2(+); and Intel sockets LGA2066, LGA2011(v3), LGA1366, LGA115x, and LGA775. The company didn't reveal pricing.

X2 introduced the Eclipse Advanced 992, a tower-type CPU cooler its makers believe has enough metal to cool HEDT processors, including AMD Ryzen Threadripper series, and Intel Core X. It supports AMD sockets TR4 (SP3r2), AM4, AM3(+), FM2(+), and Intel sockets LGA2066, LGA2011(v3), LGA1366, LGA115x, and LGA775. Its design involves an aluminium fin-stack which is narrowed towards the base for better VRM heatsink clearance; through which six 6 mm-thick copper heat-pipes pass, which draw heat making direct contact with the CPU at the base. The aluminium fin-stack is ventilated by a 120 mm RGB LED-illuminated fan, which spins between 400 to 1,500 RPM, pushing up to 45.26 CFM of air, with a noise output ranging between 10 to 22 dBA. The cooler can handle thermal loads of up to 200W. Measuring 127.5 mm x 53 mm x 155.9 mm (WxDxH), it weighs about 740 g.

Raijintek today introduced the Leto Pro RGB CPU cooler. An upscale variant of the Raijintek Leto launched earlier this year, the Leto Pro RGB retains the essential tower-type heatsink design of the original Leto, but comes with two 120 mm RGB LED-illuminated fans in push-pull configuration. Each of the two included Raijintek Macula 12 RGB fans spins between 800 to 1,800 RPM, pushing up to 56 CFM of air, with a noise output of 25 dBA. Raijintek has also launched the Leto RGB, which is the original Leto with a single Macula 12 RGB fan. With both its fans installed, the Leto Pro RGB measures 127 mm x 101 mm 155 mm (WxDxH), weighing 925 g. It supports nearly all modern CPU socket types, including AM4, AM3(+), FM2(+), LGA2066, LGA2011(v3), and LGA115x.

GIGABYTE finally gave its socket LGA2066 motherboard series the silvery Designare treatment, with the new X299 Designare EX motherboard. The board features the same silver+blue styling the company implemented on its X399 Designare EX, but unlike its Z270X Designare, the silver theme doesn't continue onto the PCB. This is probably also because the X299 Designare EX is based on the same exact PCB as the Aorus X299 Gaming 7.

All that's changed between the X299 Designare EX and the Aorus X299 Gaming 7, is an included Thunderbolt 3 add-on card, the silver colored VRM, chipset, and M.2 SSD heatsinks, the silver-colored rear I/O shroud, and GIGABYTE Designare branding replacing the Aorus branding, wherever applicable. The LED inserts are still RGB multi-color, although out of the box, they're configured to be soft-blue. You can configure them with the GIGBAYTE RGB Fusion software. Unlike the Aorus X299 Gaming 7, this board features a silver back-plate that covers most of the board's reverse side, and an integrated rear I/O shield. The rest of its feature set is identical to that of the Aorus X299 Gaming 7. One can expect the GIGABYTE X299 Designare EX to be the company's most expensive socket LGA2066 motherboard, above even the Aorus X299 Gaming 9, on account of its included Thunderbolt 3 add-on card, and Designare-specific features.

Cooler Master, a leader in PC components and peripherals, introduces RGB enabled all-in-one liquid cooling: MasterLiquid ML240L RGB and MasterLiquid ML120L RGB. Both models have full RGB effects on both the fan and pump, which comes with a controller and RGB splitter cable for quick setup or alternatively sync seamlessly with ASUS, MSI, Gigabyte and ASRock motherboards.

The ML240L RGB and ML120L RGB comes with the dual chamber RGB pump for increased reliability and provide a perfect balance of low noise levels at optimal performance. The aesthetic design of the low resistance radiator shows premium build and attached is the MasterFan MF120R RGB (2 included for the M240L RGB). The double layer tubing with sleeved on the outside and FEP on the inside for robust usage.

ASUS expanded its socket LGA2066 workstation-class motherboard lineup with the WS C422 Pro SE. The board is physically identical to the WS X299 Pro SE, but is based on the Intel C422 chipset. Designed for single-socket Intel Xeon W ("Skylake-W") processors, this board is targeted at workstation builders who require ECC memory support.

"Skylake-W" is an enterprise variant of the "Skylake-X" silicon, with support for up to 512 GB of ECC quad-channel DDR4 memory. It features up to 18 CPU cores, and is different from the Xeon Scalable "Skylake-SP" silicon. The board supports up to 512 GB of quad-channel DDR4 memory with support for ECC, over its eight memory slots. The rest of its feature-set is identical to that of the WS X299 Pro SE.

SilentiumPC today introduced the Navis Pro series all-in-one, closed-loop liquid CPU coolers. These coolers are available in two models based on radiator size, the Navis Pro 120 (120 mm x 120 mm radiator), and the Navis Pro 240 (240 mm x 120 mm radiator). What sets this cooler apart is a unique 9-pole pump motor that keeps the noise output of the pump-block under 15 dBA at all times.

The included Sigma HPE fans come with fluid-dynamic bearings for high endurance, and spin between 800 to 2,300 RPM, pushing up to 74 CFM of air, with a noise output as low as 22 dBA, each. The pump-block has a rated MTBF of 80,000 hours. Most common CPU socket types are supported, including AM4, AM3(+), FM2(+), LGA2066, LGA2011(v3), and LGA115x. Backed by 5-year warranties, the Navis Pro 120 is priced at 55€, and the Navis Pro 240 at 75€.

ASUS today introduced the WS X299 SAGE motherboard, a socket LGA2066 motherboard designed for Intel Core X "Skylake-X" processors, in the SSI-CEB form-factor. This board is targeted at the same quasi-workstation crowd that the company's WS X299 Pro and WS X299 Pro SE are designed for, but unlike the latter, it lacks an iKVM remote-management chip. Those looking for more serious workstation builds involving something from Intel's Xeon stable or even 2P setups, should consider the larger WS C621E SAGE. The WS X299 SAGE is targeted at those who need the massive PCIe loadout of the C621E SAGE, but can make do with 1P Core X processors.

The ASUS WS X299 SAGE draws power from a combination of 24-pin ATX, two 8-pin EPS, and a 6-pin PCIe power. An 8-phase VRM powers the CPU, and is rated to power 16-core and 18-core CPU models. The CPU socket is wired to eight DDR4 DIMM slots supporting up to 128 GB of quad-channel DDR4 memory; and seven PCI-Express 3.0 x16 slots. Storage connectivity includes eight SATA 6 Gb/s ports, and two each of 32 Gb/s M.2 slots and 32 Gb/s U.2 ports. Four USB 3.1 gen 2 ports, two 1 GbE interfaces, and a dozen USB 3.0 ports make for the rest of it. The company didn't reveal pricing.

Akasa today rolled out additions to its coveted Venom line of premium CPU coolers, with the new Venom R10 and Venom R20 all-in-one (AIO) closed-loop liquid CPU coolers. The two are differentiated with radiator sizes, with the R10 featuring a 120 mm x 120 mm radiator, and the R20 a 240 mm x 120 mm. The two are characterized by a pump-block with a groovy RGB multi-color LED studded ornament, which takes input from a standard 4-pin RGB header, and can be controlled with ASUS Aura Sync, GIGABYTE RGB Fusion, and MSI Mystic Light RGB software.

The ornament features multiple diodes that put light out through a diffuser, and the Akasa Venom logo. The coolers don't include 120 mm fans, you add your own. The pump-block puts out up to two 4-pin PWM fan inputs. The coolers support most common CPU socket types, including AM4, AM3(+), FM2(+), LGA2066, LGA2011(v3), and LGA115x. The company didn't reveal pricing.