Intel has significantly changed its latest 0x112 microcode update, removing users' ability to bypass the Digital Linear Voltage Regulator (DLVR) through standard BIOS settings on "Arrow Lake" processors. DLVR, a technology designed to provide precise voltage control for individual performance cores and efficiency core clusters, offers great benefits during gaming sessions and light workloads. According to overclocker der8auer's analysis, DLVR can effectively manage power consumption during gaming, with power losses of around 20 W at typical gaming loads. However, these losses can shoot up to approximately 88 W under full CPU utilization. Previously, users could disable DLVR through a BIOS setting called "Power Gate" mode, which is particularly useful for intensive workloads where power losses might impact performance. With the new microcode update, this option has been removed from standard BIOS settings. It is also worth pointing out that DLVR is in its second iteration inside Arrow Lake CPUs, after the initial debut in "Raptor Lake," which had DLVR fused off.

Intel explained to Hardwareluxx that this change was implemented to "prevent accidental misuse of DLVR bypass," restricting its use to extreme overclocking scenarios involving sub-ambient cooling methods like liquid nitrogen. The update has already been rolled out through BIOS updates on some Z890 chipset motherboards, with ASRock and MSI being among the first manufacturers to implement the new microcode. While DLVR bypass may still be accessible through specialized LN2 profiles on high-end motherboards, the average enthusiast user loses direct control over this feature. This development mainly affects early Arrow Lake adopters, as not all motherboards include extreme overclocking profiles. While Intel's move appears to prevent potential issues, we must remember that power settings are something that users should only change with plenty of consideration. Removing this power gate mod is Intel prevention for Raptor Lake-like situations where these chips had an issue with Vmin shift.

ASUS Republic of Gamers (ROG) today announced that new ROG Maximus Z890 Apex motherboards have been used to achieve 5 world records, 19 global first-place records and 31 first-place records. In the hands of some of the world's premier professional overclockers, the Maximus Z890 Apex has coaxed dazzling performance out of the latest Intel Core Ultra processor (Series 2) lineup and the latest high-performance memory kits.

Veterans of the overclocking scene will not be surprised to learn that these records were achieved with an Apex motherboard on the bench. This series has an undeniable pedigree. Since the very first model, ASUS has designed Apex motherboards for the singular purpose of helping the world's most talented overclockers shatter barriers on their way to new records.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to showcase multiple new products at Computex 2024, including new DDR5 memory, peripherals, and PC cases for PC enthusiasts. G.SKILL will also host two major annual extreme overclocking events at the G.SKILL Computex booth - the 10th Annual OC World Record Stage 2024 and the 8th Annual OC World Cup 2024 - as well as the 4th Annual G.SKILL Extreme Mod Stage 2024 to showcase creative system mods. G.SKILL sincerely invites you to come visit our booth at Nangang Exhibition Center, Hall 1 (TaiNEX 1), 1F, Booth J0601a during Computex from June 4 to June 7, 2024.

G.SKILL OC World Record Stage has been a highly anticipated overclocking event in the extreme overclocking community. It's a great venue where the world's top professional overclockers gather at the G.SKILL Computex booth and try to achieve as many overclocking records as possible using liquid nitrogen (LN2) for extreme cooling. This year, this extreme overclocking event features high-end performance motherboards from ASRock, ASUS, GIGABYTE, and MSI, the latest Intel platform, and G.SKILL DDR5 memory.

According to Geekerwan, Apple's latest M4 silicon has achieved a remarkable milestone by using liquid nitrogen to chill Apple's M4 iPad Pro. This unconventional approach unlocked great single-core performance, surpassing even the M3 Max and M2 Ultra processors in Geekbench v6 benchmark tests. The setup involved cooling the M4 iPad Pro, equipped with a 3+6 core configuration, using a Kingpin Cooling T-Rex Rev 4 CPU LN2 pot filled with liquid nitrogen. This extreme cooling allowed the M4 processor to operate at an astonishing 4.41 GHz during the benchmark run, resulting in a staggering single-core score of 4,001 points. This score represents a 28% increase over the M3 Max found in the 16-inch MacBook Pro and an impressive 44% improvement over the M2 Ultra powering the Mac Studio.

Notably, the M4's single-core performance is capable of reaching scores in the 3,000s. With liquid nitrogen cooling, it suprases the 4,000-point mark, making this achievement all the more remarkable. While the M4's multi-core performance did not match the lofty expectations set by its single-core power, it still managed to achieve a score of 13,595 points, outperforming both the M3 Max and M2 Ultra, which scored 20,957 and 21,330 points, respectively. This was done on the 3+6 core configuration with three P-cores and six E-cores, which is not the top-end M4 configuration. This shows that with adequate cooling, like MacBooks, the upcoming M4 Pro and M4 Max chips could achieve much higher performance than their predecessors.

IBM, at the 2023 IEEE International Electron Device Meeting (IEDM), demonstrated a concept nanosheet transistor that posts a near 100% performance improvement at the boiling point of nitrogen, of 77 Kelvin (-196 °C). Given how relatively industrialized and scaled out the manufacture, safe transport, storage, and use of liquid nitrogen is, this development potentially unlocks a new class of chips that attain top performance under liquid nitrogen cooling. Think a new generation of AI HPC accelerators that can instantly double their performance under LN2, provided a new kind of cooling solution is developed for data-centers.

Nanosheet transistors are the evolutionary next step to FinFETs, which have been driving semiconductor foundries since 16 nm, which could see their technical limits met at 3 nm. Nanosheets are expected to make their debut with 2 nm-class nodes such as the TSMC N2 and Intel 20A. At an operating temperature of 77 K, IBM's nanosheet device is claimed to offer a near doubling in performance, due to less charge carrier scattering, which results in lower power. Reducing scattering reduces resistance in the wires, letting electrons move through the device more quickly. Combined with lower power, devices can drive a higher current at a given voltage. Cooling also results in greater sensitivity between the device's on and off positions, so it takes lesser power to switch between the two states, resulting in lower power. This lower power means that transistor widths can be lowered, resulting in higher transistor densities, or smaller chips. As of now IBM is wrestling with a technical challenge concerning the transistor's threshold voltage, a voltage which is needed to create a conducting channel between the source and the drain.

ASUS today announced that an international group of elite overclockers has set nine world records and achieved sixteen first-place finishes in a variety of performance benchmarks with ASUS Pro WS WRX90E-SAGE SE and ASUS Pro WS TRX50-SAGE WIFI workstation motherboards. The motherboards leveraged AMD Ryzen Threadripper PRO 7000 WX-Series and AMD Ryzen Threadripper 7000 series processors which featured up to 96 cores and 192 threads. The group of overclockers included Der8auer, Elmor, Massman, OGS, Safedisk, Seby and Shamino.

Ready for CPU and memory overclocking
For AMD Threadripper 7000 series workstations and high-end desktop (HEDT) models, AMD offers CPU and DRAM overclocking options. To fully leverage the performance of the AMD processors, ASUS has incorporated an innovative dual power supply design on Pro WS WRX90E-SAGE SE and Pro WS TRX50-SAGE WIFI motherboards. Along with robust power delivery and advanced cooling modules, these boards exhibit rock-solid stability during overclocking.

When Intel announced the appearance of the 4th generation Xeon-W processors, the company announced that the clock multiplier was left unlocked, available for overclockers to try and push these chips even harder. However, it was only a matter of time before we saw the top-end Xeon-W SKU take a chance at beating the world record in Cinebench R23. The Intel Xeon W9-3495X SKU is officially the world record score holder with 132,484 points in Cinebench R23. The overclocker OGS from Greece managed to push all 56 cores and 112 threads of the CPU to 5.4 GHz clock frequency using liquid nitrogen (LN2) cooling setup. Using ASUS Pro WS W790E-SAGE SE motherboard and G-SKILL Zeta R5 RAM kit, the OC record was set on March 8th.

The previous record holder of this position was AMD with its Threadripper Pro 5995WX with 64 cores and 128 threads clocked at 5.4 GHz. Not only did Xeon W9-3495X set the Cinebench R23 record, but the SKU also placed the newest record for Cinebench R20, Y-Cruncher, 3DMark CPU test, and Geekbench 3 as well.

Intel Core i9-13900K processor has just been launched, and overclockers worldwide got their hand on a few samples to make history. According to the HWBot submission, a Swedish overclocker named "elmor" has pushed Intel's top-end consumer SKU to a fantastic 8.812 GHz. For more than eight years, the record for the single-highest overclocking speed was held by AMD FX-8370, from the now-bygone era of AMD Black Edition processors. The overclocking attempt was performed using liquid nitrogen (LN2) that cools the chip using its −195.8 °C temperature. Pushing core voltage to 1.850 Volts and VCCIN to 2 Volts, multiplier set to x88, and a bus speed of 100.15 MHz. In addition to the Core i9-13900K CPU, elmor used ASUS ROG Maximus Z790 APEX motherboard and 32 GB DDR5 GSKILL memory running at 4808 MT/s.

As a reminder, the FX-8370 CPU was holding the number one sport for eight years with a speed of 8.722 GHz. Beating the FX-8370 by just 90 MHz, it will be interesting to see if any of the upcoming CPU SKUs can match this overclocking record, and we are curious if any contender will come to beat elmor's current record.

Extreme overclocking is an enthusiast discipline where overclockers try to push their hardware to extreme limits. Combining powerful cooling solutions like liquid nitrogen (LN2), which reaches sub-zero temperatures alongside modified hardware, the silicon can output tremendous power. Today, we are witnessing a custom XOC (eXtreme OverClocking) BIOS for the NVIDIA GeForce RTX 3090 Ti graphics card that can push the GA102 SKU to impressive 890 Watts of power, representing almost a two-fold increase to the stock TDP. Enthusiasts pursuing large frequencies with their RTX 3090 Ti are likely users of this XOC BIOS. However, most likely, we will see GALAX HOF or EVGA KINGPIN cards with dual 16-pin power connectors utilize this.

As shown below, MEGAsizeGPU, the creator of this BIOS, managed to push his ASUS GeForce RTX 3090 Ti TUF with XOC BIOS to 615 Watts, so KINGPIN and HOF designs will have to be used to draw all the possible heat. The XOC BIOS was uploaded to our VGA BIOS database, however, caution is advised as this can break your graphics card.

We recently reported on the DDR5-8888 CL88 Overclocking world record set by G.Skill, ASUS, and overclocker "lupin_no_musume" using G.Skill Trident Z5 DDR5 memory on an ASUS ROG Maximus Z690 APEX motherboard. This same overclocker has now set a new record using the same memory and motherboard combination achieving a speed of 4779.7 MHz (9560 MT/s) at 120-120-120-120-127-2 timings using liquid nitrogen cooling. The record was set with a single 16 GB Trident Z5 DDR5 memory module paired with an Intel Core i9-12900K processor.

3DMark Fire Strike Hall of Fame is where overclockers submit their best hardware benchmark trials and try to beat the very best. For years, one record managed to hold, and today it just got defeated. According to an extreme overclocker called "biso biso" from South Korea and a part of the EVGA OC team, the top spot now belongs to the AMD Radeon RX 6900 XT graphics card. The previous 3DMark Fire Strike world record was set on April 22nd in 2020, when Vince Lucido, also known as K|NGP|N, set a record with four-way SLI of NVIDIA GeForce GTX 1080 Ti GPUs. However, that record is old news since January 27th, when biso biso set the history with AMD Radeon RX 6900 XT GPU.

The overclocker scored 62389 points, just 1,183 more from the previous record. He pushed the Navi 21 XTX silicon that powers the Radeon RX 6900 XT card to an impressive 3,147 MHz. Paired with a GPU memory clock of 2370 MHz, the GPU was probably LN2 cooled to achieve these results. The overclocker used EVGA's Z690 DARK KINGPIN motherboard with Intel Core i9-12900K processor as a platform of choice to achieve this record. You can check it out on the 3DMark Fire Strike Hall of Fame website to see yourself.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today Z690 AORUS TACHYON motherboard with the latest 12th generation Intel Core i9 12900K processor and LN2 liquid nitrogen heat dissipation set the world-leading overclocking records of dual 8 GHz, which is 8000 MHz on i9-12900K CPU and 8300 MHz on DDR5 memories. GIGABYTE Z690 AORUS TACHYON motherboard designed by world-famous overclocker equips with plenty functions exclusively for extreme overclockers, which promise overclockers higher scores with easier operation, establishing GIGABYTE's leading role in overclocking on the Z690 motherboards.

"GIGABYTE demonstrate its determination of returning to the overclocking glory with the launch of the Z590 AORUS TACHYON motherboard, and the release of the Z690 AORUS TACHYON further verified the continuation of GIGABYTE's overclocking pedigree on motherboards." said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division. "Z690 AORUS TACHYON proves GIGABYTE's strong R&D strength on LN2 overclocking by the world records it created. We will definitely use Z690 AORUS TACHYON to create better overclocking performance, and can't wait to see that overclockers around the world use this motherboard to break more world records.

Intel Core i9-11900K processor, the flagship model from the 11th generation "Rocket Lake" CPU lineup, has been overclocked to more than 7 GHz by the "Rog-Fisher". Thanks to the report coming from VideoCardz, we have information that the top-end Rocket Lake processor is possibly a very good overclocker. Running at 7048 MHz, the CPU managed to achieve that frequency using "only" 1.873 V. There is no doubt that the system was being cooled by LN2, as such overclocks need it to remain stable, however, we don't have any data on that. The CPU was paired with the ASUS ROG Maximus XIII Apex motherboard, designed for extreme overclocking purposes.

It is important to note that the CPU didn't run any benchmarks, as it was just validated at that frequency by Valid x86. The sample was likely supplied by Intel, so it could be a cherry-picked model. For the official benchmark results of Rocket Lake processors, we have to wait until tomorrow (March 30th), when NDA lifts.

GIGABYTE announced the Z590 AORUS Tachyon, a high-end motherboard targeted at enthusiasts seeking out extreme CPU and memory overclocking feats. The board is designed with an optimized layout for open-air test benches. It features a powerful CPU VRM solution that draws power from two 8-pin EPS connectors, and 12 direct VRM phases, each with 100 A DrMOS and full Tantalum capacitor layout. The board features a 1-DIMM-per-channel (1DPC) memory, over just two DDR4 DIMM slots, a memory topology that enables the highest frequencies. The board also comes with physical controls for a number of overclocker-friendly features, such as BIOS profile selection, cold-restart, manual BIOS ROM selection, LN2 optimization, etc.

Expansion slots on the GIGABYTE Z590 AORUS Tachyon include four PCI-Express x16, from which two are Gen 4 (when paired with 11th Gen "Rocket Lake"), and run at either x16/NC or x8/x8; and the other two are Gen 3 x4/x1, wired to the Z590 PCH. Storage connectivity includes three M.2 NVMe slots, from which one is wired to the CPU and is Gen 4 x4 when used with "Rocket Lake," and the others Gen 3 x4. Other connectivity includes a premium onboard audio solution powered by a Realtek ALC1220-VB CODEC, a 2.5 GbE wired network interface powered by an Intel i225-V controller, and an 802.11 ax (Wi-Fi 6E), powered by an Intel AX210 controller. The company didn't reveal pricing.

GALAX, the maker of the popular premium Hall Of Fame (HOF) edition of graphics cards, has recently announced its GeForce RTX 3090 HOF Edition GPU. Designed for extreme overclocking purposes, the card is made with a 12 layer PCB, 26 phase VRM power delivery configuration, and three 8-pin power connectors. Today, we have managed to get the first comprehensive review of the card by a Chinese YouTube channel 二斤自制. However, this wasn't just regular testing being conducted on a card with factory settings. The channel has applied 1000 Watt vBIOS to the GPU and ran it all on the air cooler the GPU comes with.

In the default 420 Watt setting, the card has been running with a GPU clock of 1845 MHz and a temperature of 69 degrees Celsius. However, when the 1000 Watt vBIOS was applied to the card, the GPU core has managed to ramp to 2000 MHz and consume as much as 630 W of power. If you were wondering if the stock cooler was able to handle it all, the answer is yes. The card has reached a toasty 96 C temperature. While GALAX doesn't offer BIOS like this, the ID of the BIOS corresponds to that of a custom XOC 1000 W BIOS for EVGA Kingpin GeForce RTX 3090 GPU, which you can find in our database. When it comes to performance, the gains were very minimal at only 2-3%. That must have been due to the insufficient cooling, and the card could have done much better on water or LN2. The Firestrike Ultra and Firestrike Extreme results are displayed below.

GALAX is preparing to launch its flagship graphics card based on NVIDIA's Ampere lineup of GPU, specifically the GeForce RTX 3090 variant. The company is currently developing the GeForce RTX 3090 Hall Of Fame (HOF) edition GPU that is supposed to have a regular HOF treatment. That means a white aesthetics (white PCB plus white cooling solution), a massive three fan air-cooler, and of course, a PCB that is designed for extreme overclocking. Today, thanks to the sources over at VideoCardz, we have the first look at the PCB of GALAX's upcoming GeForce RTX 3090 HOF edition graphics card.

Featuring a massive VRM configuration consisting out of 26 phases, the GPU is swimming in VRM phases and it is the highest number of VRM phases we have seen on any GeForce RTX 3090 GPU. It is not exactly clear from the pictures how much of the total 26 VRMs is going to Vcore (GPU), and how much to Vmem (memory). To power the card, there are three 8-pin power connectors. It is important to note that these specifications are not finalized, as this is only a prototype. Nonetheless, the card is made with LN2 extreme overclocking in mind and is going to probably be more expensive. There are event probes for voltage measuring directly from the card, to avoid having to do it in software. NVLINK fingers are present as well, meaning that dual-card setups are still an option with this GPU. The real product is expected to arrive sometime in February according to the source, however, we don't know the exact date or pricing.

An Intel Rocket Lake-S CPU with 8 cores and 16 threads has recently surfaced in an overclocking video, being pushed to 6.923 GHz operating frequency, as showcased via a CPU-Z screen-grabbed from the video. Neither author of the video or the overclocker that pulled this feat are currently known. However, it can be seen from the CPU-Z that the overclocked CPU at 6.9 GHz supports instruction sets not available to Intel's current lineup of desktop CPUs, but that will be supported by Rocket Lake-S: namely, SHA and AVX512F. Likewise, the cache sizes correspond to the expected changes for Intel's Rocket Lake-S.

The overclocked CPU was paired with overclocked DDR4 memory as well, which was brought up to 6,666 MHz, buoyed by a crispy 1.830 V. Motherboard information is scarce, but it's speculated that it's a Gigabyte-branded Z590 motherboard. Perhaps this video is part of an Intel-pushed marketing attempt to increase desirability of its Rocket Lake-S CPUs to overclockers and enthusiasts. Expect the official Rocket Lake-S unveiling to occur during CES, with market availability around March.

Overclocking is always fun and almost everyone can do it, however, when it comes to extreme overclocking, there are only a handful of persons doing it. Today, a Chinese extreme overclocker "baby-j" has managed to establish a new world record frequency with his Crucial Ballistix Max DDR4-4000 (BLM16G40C18U4B.M8FB1) memory kit. Using liquid nitrogen (LN2) cooling for the DIMMs, the overclocker managed to push the memory kit to an amazing 7004.2 MHz, making it the world's highest frequency hit on DDR4 memory. What is more amazing is the fact that the platform used for the new record-setting overclock, is based on AMD's B550 motherboards running with AMD Ryzen 5 PRO 4650G processor, which seems to have a very good memory controller. The timings were a bit relaxed with them running at 22-26-26-46-127-1 (tCAS-tRC-tRP-tRAS-tCS-tCR) settings.

AMD's Radeon RX 6800 XT graphics card debuted yesterday and in the overall test results, we saw that it runs just a few percent behind NVIDIA's direct competitor - GeForce RTX 3080. However, when it comes to overclocking and world records, the card has just set one. Popular extreme overclocker Alva Jonathan aka "LUCKY_NOOB", has managed to overclock the Radeon RX 6800 XT GPU and set a new world record with the card. Paired with LN2 cooled Ryzen 9 5950X clocked at 5.4 GHz, the graphics card was cooled by... air cooler? Indeed it was. Lucky has managed to clock the RX 6800 XT at 2650 MHz using the reference air cooler. With that system, he managed to score 47932 points in 3DMark FireStrike.

The overclocker has modified 3DMark's tessellation to presumably give the Radeon card more performance, so the score isn't valid on the official 3DMark charts. What gives the overclocker an idea of a world record is the fact that HWBOT actually accepts those numbers, which ranks it higher than the NVIDIA GeForce RTX 3090 graphics card that scored 47725 points. Despite the modifications, it is impressive to see AMD's card rank that high, and as more overclockers are getting their hands on these cards, it is a question if we are going to see the 3 GHz barrier broken by a Radeon card.

When id Tech's lead developer announced that id Tech 7 the game engine responsible for Doom Eternal could run at 1000 FPS many assumed current hardware wouldn't be able to hit the mark. Polish hardware retailer X-kom in collaboration with Bethesda has achieved this feat with only consumer hardware and some serious liquid nitrogen overclocking. The challenge was part of the QuakeCon at Home event and saw X-kom push the Intel Core i7 9700K to 6.6 GHz paired with an ASUS RTX 2080Ti Strix overclocked to 2.4 GHz. The motherboard used was the ASUS Maximus XI APEX which was powered by a 1200 W Be Quiet Straight Power supply.

The Ryzen 3 3100 is turning out to be a fun little toy for enthusiasts. PC enthusiast TSAIK succeeded in overclocking it to 5923 MHz under extreme cooling. The chip was fed 1.45 Volts, and put under liquid nitrogen cooling, to achieve the feat. An MSI MAG X570 Tomahawk motherboard and a single stick of 8 GB memory underclocked to DDR4-1600 made the rest of the critical hardware. The feat is the second highest OC record for a "Zen 2" powered processor, next only to TSAIK's own speed record with the flagship Ryzen 9 3950X, which was pushed to 6041 MHz. Find the HWBot submission for the Ryzen 3 3100 speed record here.

Visiting Bitspower at CES or Computex is a real adventure of sorts in terms of not knowing what to expect. Last year, for example, we were greeted to LN2 pots of all things, in addition to new blocks and fans that made their way to the retail market over the subsequent months. It was also interesting to take a look back at the concept of the Premium Summit M CPU block from last year, knowing what it turned out now. This year, the company hosted us again at CES and had a large hotel suite full of products- refreshes, and new alike. We take a look at their offerings here, and be sure to read past the break for more.

The very first thing we saw was a distribution plate/case hybrid, which Bitspower wants to bring out as a test bench case later this year. There have been other such executions come out recently, including some at CES from other companies, and this is a natural extension of the distro plate development that has caught the mind of several custom watercooling companies for one reason or another. This particular version uses two Xylem DDC pumps with Bitspower heatsinks, and has four large feet to prop up the finished build horizontally for testing/display. Bitspower expects to introduce the finalized version at Computex later this year, and are seeking feedback from our readers on what features they would like to see here.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces that the XPG Overclocking Lab (XOCL) has overclocked the SPECTRIX D60G RGB DDR4 memory module to a frequency of 5634 MT/s, a new record. The previous record was 5608 MT/s. The milestone was achieved with an Intel Core i9 chipset and MSI MPG Z390I GAMING EDGE AC motherboard in an LN2-cooled configuration. The results have been certified and published on HWBOT.

The D60G is built with high-quality chips and a metal heat sink for excellent signal integrity, reliability, and stability, which effectively extends the lifespan of the memory module. What's more, Intel Extreme Memory (XMP) 2.0 profiles make overclocking a snap and enhance system stability. Instead of adjusting individual parameters in BIOS, users can do it right through their PC's operating system.

EVGA today released its flagship graphics card, the GeForce RTX 2080 Ti KINGPIN, designed by the legendary Vince "KINGPIN" Lucido himself. Unlike past generations of KINGPIN-branded flagships by EVGA, this card features an all-in-one closed-loop liquid cooling solution that's factory-fitted. The cold-plate of this CLC cools the GPU and memory, while a dedicated copper heatsink pulls heat from the VRM, and is ventilated by a 100 mm fan. Dissipating heat is a 240 mm x 120 mm radiator with two included high air-flow fans. For DIY liquid-cooling enthusiasts, EVGA is separately selling the Hydro Copper full-coverage water-block for this card. KINGPIN Cooling may offer LN2 evaporators for this card.

The PCB of this card has been designed by legendary volt-modder Illya "TiN" Tsemenko, and is an outstanding 12-layer thick, with high dispersion of electrical and signal traces to minimize interference. A 16+3 phase VRM powers the beast, made up of the most expensive components the industry has to offer. The VRM pulls power from three 8-pin PCIe power connectors.

CES may have officially ended but our coverage from the trade show continues. Bitspower had invited TechPowerUp to come visit their suite, mentioning there would be something new and unexpected, and that indeed was the case. Our tour began with the customary showcase of the new GPU water blocks compatible with reference, and board partner designs, for the new NVIDIA GeForce RTX 2060 and relatively new AIC RTX 2070/80(Ti) cards as well. These feature integrated RGB lighting compatible with all major motherboard lighting solutions for control, and adopt the split central-inlet flow design as well.