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Intel Reveals Big Plans for Panther Lake & Arrow Lake-H-powered Handheld Gaming PCs

In an exclusive report, Laptop Mag has extracted intriguing disclosures from Intel's Robert Hallock. The company's VP and General Manager of Client AI and Technical Marketing was happy to announce that new-generation processors are lined up for inclusion within next waves of handheld gaming PCs. Industry rumors posited that things would end with Team Blue's Core Ultra "Lunar Lake" generation of APUs; as featured on the recently deployed MSI Claw 8 AI+ and Claw 7 AI+ models. First-generation devices with "Meteor Lake" chips did not disrupt the market, and struggled to keep up with AMD Ryzen Z1 chipset-based rivals. Despite negative conjecture suggesting a withdrawal, Hallock revealed that a certain department is growing in size: "Intel is beefing up its staff to support gaming ISVs who want to do handhelds."

Team Blue's fortified support network is touted to expand the market reach of portable gaming PCs; the Intel executive elaborated on this topic: "we're starting a number of internal programs to give them more assistance in targeting this performance profile because—relative to what they're accustomed to—(handhelds) are still relatively rare in terms of availability." Hallock and colleagues are diving in with a new strategy; game development studios are on the receiving end of pre-release hardware: "a lot of game devs tend to just target what they have on their desks or in their QA labs...so (we're) arming them with more handhelds as prototype devices. Getting them dev kits leading into Panther Lake."

Recent Leak Reveals Upcoming Lenovo ThinkPad, ThinkBook, and Yoga Laptops

A recent leak from the reliable analyst Evan Blass has revealed a bunch of new ThinkPad, ThinkBook, and Yoga devices set to see the light of day at MWC 2025. Although the tweet has been deleted by Evan, Notebookcheck was able to summarize the information provided in the nick of time. First up, we have the refreshed ThinkPads, including the T14, T14s, T16, and X13. All the devices are equipped with the beloved TrackPoint, unlike the recently launched ThinkPad X9 Aura. The T14 G6 and T16 G4 are expected to be marketed as a CoPilot+ PC, indicating Lunar Lake prowess. However, the processor powering the X13 is not known at this point.

The Lenovo Yoga Pro 9i Aura will also reportedly see the light of day at MWC 2025, packing a 16-inch display with an unconfirmed Intel processor. As for the ThinkBooks, the lineup will likely welcome two new entrants, including the ThinkBook 14 2-in-1 -- a 14-inch convertible with a touchscreen and stylus support -- and the ThinkBook 16P G6 - a 16-inch device that is rumored to boast a dedicated GPU, a numeric keypad, and a spacious trackpad. Finally, we have the IdeaPad Slim 3x, which will boast the entry-level Snapdragon X processor and position itself as a budget device with a 16-inch display, fingerprint scanner, SD card reader, USB-A and USB-C ports, as well as a privacy cover for the webcam. The image order has been detailed below.

Apple's Upcoming M5 SoC Enters Mass Production

Apple's M4 SoC was released to overwhelmingly positive reviews, particularly regarding the commendable performance and efficiency benefits it brought to the table. The chip first appeared in the OLED iPad Pro lineup last May, arriving in the company's MacBook Pro lineup only much later, giving Intel's Lunar Lake and AMD's Strix Point a run for their money. Now, it appears that the company is cognizant of the heat brought by AMD's Strix Halo, and has already commenced mass production for the first SoC in the M5 family - the vanilla M5, according to Korean news outlet ET News.

Just like last time, the M5 SoC has been repeatedly rumored to first arrive in the next-generation iPad Pro, scheduled to enter production sometime in the second half of this year. The MacBook Pro will likely be next-in-line for the M5 treatment, followed the rest of the lineup as per tradition. Interestingly, although Apple decided against using TSMC's 2 nm process for this year's chips, the higher-tier variants, including the M5 Pro and M5 Max are expected to utilize TSMC's SoIC-mH technology, allowing for vertical stacking of chips that should ideally benefit thermals, and possibly even allow for better and larger GPUs thanks to the separation of the CPU and GPU portions. Consequently, yields will also improve, which will allow Apple to bring costs down.

Intel Core Ultra 255H "Arrow Lake-H" Delivers 32% Single-Core Performance Improvement Over "Meteor Lake" Predecessor

Intel's Core Ultra 7 255H "Arrow Lake" processor has demonstrated impressive performance improvements in recent PassMark benchmarks, achieving a 32% higher single-core score compared to its "Meteor Lake" predecessor. The Arrow Lake-H chip recorded 4,631 points in single-threaded tests, significantly outpacing the Core Ultra 7 155H's 3,500 points while delivering a 15% overall improvement in CPU Mark ratings. The performance leap comes from Intel's architectural overhaul, implementing "Lion Cove" performance cores alongside "Skymont" efficiency cores on TSMC's N3B process node. This combination enables the 255H to achieve higher boost frequencies while maintaining the same core configuration as its predecessor—six P-cores, eight E-cores, and two Low Power Efficiency (LPE) cores.

Notable in this iteration is the absence of Hyper-Threading, resulting in 16 threads compared to the 155H's 22 threads. Arrow Lake-H maintains Intel's heterogeneous structure, incorporating up to eight Xe-LPG+ graphics cores derived from the Alchemist architecture. The neural processing unit (NPU) capabilities remain consistent with Meteor Lake, delivering 13 TOPS of INT8 performance. This positions the chip below Lunar Lake's 45 TOPS. Despite performance improvements, market success will largely depend on system integrators' ability to deliver compelling devices at competitive price points, particularly as AMD's Strix Point platforms maintain strong positioning in the $1,000 range. The battle of laptop chip supremacy is poised to be a good one in the coming quarters, especially as more Arm-based entries will force both Intel and AMD to compete harder.

Fujitsu FMV Note U: World's Lightest CoPilot+ PC Introduced

Fujitsu is a name that we hear less often nowadays, at least in the consumer technology sector. However, the prominent Japanese brand is by no means dormant, and has now unveiled a brand-new laptop that is shockingly light - in fact, it is the lightest laptop available on the market right now that features CoPilot+ functionality. Dubbed the FMV Note U, the ultra-light laptop tips the scales at just around 848 grams, which roughly equates to around 1.87 lbs.

The laptop is powered by the Intel Core Ultra 7 256V or 258V "Lunar Lake" processors, paired with 16 or 32 GB of LPDDR5X-8533 memory. The chip is plenty fast, and will easily suffice for almost any moderately intensive workload thrown its way. There is, unsurprisingly, no room for discrete graphics, which means the admirably performant Arc 140V iGPU has to bear all the weight for GPU tasks. A 64 Wh battery is also present, which, paired with Lunar Lake's commendable efficiency, should allow for decently long runtimes away from the wall.

MSI Claw 8 AI+ Launch Delayed in USA

MSI's Claw 8 AI+ and Claw 7 AI+ handheld gaming PCs were unveiled late last year—these new models have been rolled out quite quickly; launching within a year of first-generation Claws. The successors feature many improvements—across hardware (Intel Lunar Lake), software and physical properties—when compared to the Meteor Lake-powered originals. MSI appeared ready to not repeat past mistakes—the Claw 8 AI+ and Claw 7 AI+ were showcased at CES 2025 earlier this month, with press material pointing to a North American market launch on January 15. VideoCardz was in the process of preparing a special launch article for the 8-inch model, but many customers have reportedly not received their orders.

Hands-on impressions started to appear on the internet earlier this year, possibly only emerging via Chinese press outlets—today's article claims that international publications have not yet received review samples. According to VideoCardz, MSI had lined up the Claw 8 AI+ and Claw 7 AI+ for an Asian market launch on December 26. Several retailers in the USA have revised shipping dates for the Claw 8 AI+—the likes of Amazon, Newegg and B&H are expecting first shipments next month, somewhere around the 4th to the 12th. MSI's official online store has removed release date information from product pages, and Best Buy has followed suit. Activity on the MSI Claw subreddit provides evidence of lucky customers getting their mitts on first wave units—early impressions (post-unboxing) are promising, but one customer was left puzzled by the absence of extra items. Many handheld enthusiasts have expressed anger about finding it difficult to obtain the basic hardware, but BigShotBosh took issue with MSI's aftermarket extras: "...looks like the travel case, screen protector and dock for the Claw 8 won't be available until March of this year. Talk about a botched rollout."

Ventiva Showcases Fan-less Cooling Solution in Intel-powered PC Concept

Ventiva, the leader in thermal solutions, today announced that its Ventiva ICE9 thermal management suite is being featured in a fan-less proof-of-concept laptop design, powered by Intel Lunar Lake processors at CES. By collaborating with Dell Technologies and Intel on the PC design, this concept introduces a new level of silent productivity for sub-12 mm laptops.

"Ventiva ICE technology offers a revolutionary approach to help achieve thin, light, and silent laptop designs that offer great performance," said Josh Newman, Vice President, Client Computing Group, and General Manager, Product Marketing & Management, Intel. "Intel is excited about the result of the close co-engineering collaboration with Ventiva and Dell Technologies to help ready their technology for future Intel Core Ultra devices."

ASUS Shows Off Copilot+ Ready NUCs Powered by Lunar Lake and Strix Point, and NUC Pro+

ASUS at the 2025 International CES showed off some of the first NUC desktops that meet Microsoft Copilot+ AI PC logo requirements. The new ASUS NUC 14 Pro AI measures 130 mm x 130 mm x 34 mm. It runs an Intel Core Ultra 200V series "Lunar Lake" processor. Depending on the processor model, you get 16 GB or 32 GB of hardwired LPDDR5X memory. You also get the processor's Xe2 "Battlemage" iGPU. Its NPU provides up to 45 AI TOPS of performance, meeting Copilot+ requirements. Storage is care of an M.2-2280 slot with NVMe Gen 4 x4 wiring. I/O options include two 40 Gbps Thunderbolt 4 ports including DisplayPort passthrough, and networking that includes Bluetooth 5.4 and Wi-Fi 7.

ASUS won't (or probably can't use the "NUC" moniker with AMD processors), and so there's the ExpertCenter PN54 for those who want essentially the same device, but with an AMD Ryzen AI 300 series processor. This mini PC has the same exact dimensions as the NUC 14 Pro AI, and is powered by a Ryzen AI 300 "Strix Point" processor, with options going all the way up to the Ryzen AI 9 HX 370. This chip includes the XDNA 2 NPU with 50 AI TOPS on tap, which means it meets Microsoft Copilot+ AI PC logo requirements. It also features the Radeon 870M RDNA 3.5 graphics with 16 CU. The chip uses standard dual-channel DDR5-5600 using SODIMMs. Storage includes an M.2-2280 slot with Gen 4 x4 wiring. In place of Thunderbolt 4, you get a couple of USB4 ports with 40 Gbps bandwidth and DP passthrough. Comms include Bluetooth 5.4 and Wi-Fi 7, just like on its Intel-powered sibling.

AMD Debuts Ryzen AI Max Series "Strix Halo" SoC: up to 16 "Zen 5" cores, Massive iGPU

AMD at the 2025 International CES debuted the Ryzen AI Max 300 series of mobile processors. These chips are designed to go up against the Apple M4 Pro, or the chip that powers the Apple MacBook Pro. The idea behind it is to provide leadership CPU and graphics performance from a single package, minimizing the PCB footprint from having a discrete GPU. In stark contrast, the Intel Core Ultra 200V "Lunar Lake," is designed more to go against the Apple M4, or the chips that power the latest MacBook Air but not quite the MacBook Pro. What sets "Strix Halo" functionally apart from "Lunar Lake" or even the M4 Pro, is that the AMD chip doesn't have memory-on-package (MoP), it relies on discrete LPDDR5X memory chips.

The "Strix Halo" processor is "Fire Range" on steroids. There are one or two "Zen 5" CCDs, for up to a 16-core/32-thread core configuration. Each of these "Zen 5" cores are unlike the ones on "Strix Point," in that they feature a fully unlocked AVX512 hardware pipeline (512-bit FP). The CCD shares a lavish 32 MB of L3 cache among 8 "Zen 5" cores. This is hardly the star attraction. Unlike "Fire Range," which features the small 6 nm client I/O die from "Granite Ridge," The new "Strix Halo" features a massive SoC die built on the 5 nm EUV foundry node. This packs the star attraction of the processor, it's oversized iGPU that has a massive 40 compute units (2,560 stream processors).

MSI Cubi NUC AI Series Unveiled at CES 2025: Mini Powerhouses with AI Integration

MSI, a global leader in computing solutions, is excited to announce the launch of its latest innovation in mini PCs: the Cubi NUC AI Series. This new lineup features the Cubi NUC AI+ 2M and the Cubi NUC AI 1UM, both carefully designed to deliver exceptional performance in impressively compact formats.

Cubi NUC AI+ 2M: The Ultimate Copilot+ PC
Measuring just 0.826 liters, the Cubi NUC AI+ 2M sets a new standard for mini PCs. Despite its compact size, it is powered by an Intel Core Ultra Processor from the Lunar Lake platform and comes with AI tools designed to enhance productivity and improve the user experience. Equipped with a dedicated AI Boost NPU, it functions as a Copilot+ PC, seamlessly integrating with AI-driven applications like CoCreator, Windows Studio Effects, Live Captions, and Live Translation—making it ideal for both professional and personal use. One of its standout features is the one-touch fingerprint power button, which provides both security and convenience. Additionally, a dedicated Copilot button offers instant access to AI assistance, streamlining workflows and daily tasks. The built-in microphone and speaker further enrich the user experience, enabling smooth communication and voice-activated commands. Connectivity is another strong point, with two Thunderbolt 4 ports, one of which supports up to 100 W Power Delivery input. This means the Cubi NUC AI+ 2M can be powered directly through a monitor using a Type-C connection, minimizing cable clutter and simplifying your setup.

Intel at CES 2025 Liveblog: Announcements Galore for Client, Commercial, and Edge

Intel today hosts the 2025 International CES Keynote address with a slew of announcements from across its consumer and commercial processor product lines. The company is expected to expand its "Arrow Lake" and "Lunar Lake" processor lines that it debuted in 2024, across many new product segments. In particular, "Arrow Lake" is expected to hit critical mass in the mobile and commercial PC spaces. "Lunar Lake" will see many more processor models, letting it power the year's most popular Copilot+ AI PCs. The desktop Core Ultra "Arrow Lake-S" will enter mainstream segments alongside mid-range motherboard chipsets. Join us, as we blog the very latest from Intel's CES keynote.

Update 16:32 UTC: The show is underway.

Update 16:37 UTC: Michelle Johnston Holthaus, Interim co-CEO, is expected to take centerstage.

LG's "Hybrid AI" gram Laptops Offer the Best Of Both Worlds With On-Device and Cloud AI Services

LG Electronics (LG) is set to unveil its 2025 LG gram lineup, the company's first on-device AI-powered laptops, at CES 2025 in January. The new lineup includes innovative models such as the gram Pro, gram Pro 2-in-1, gram and gram Book. Leveraging LG's gram AI technology, the latest grams deliver state-of-the-art capabilities and stellar performance, harnessing large language models and personalized AI features to elevate the user experience - all while preserving the series' iconic slim and lightweight design.

Enhancing Productivity and Personalization with LG gram AI
The 2025 gram laptops present a smarter, more secure and highly-personalized user experience through LG's innovative gram AI. With gram chat On-Device, these laptops utilize AI algorithms to process and analyze data locally without requiring a network connection. At the same time, they provide convenient access to cloud-based AI services via gram chat Cloud, powered by GPT-4o. This subscription-based service, which uses GPT-4o, is offered free of charge for the first year. The integration of on-device and cloud-based AI creates a hybrid AI solution that enhances productivity by delivering personalized insights, a comprehensive knowledge base and an intuitive, ever-evolving experience that adapts to users' needs.

Intel Nx50 Series "Twin Lake" Pure E-core Processor Line Powered by "Skymont" Surfaces

"Twin Lake" is codename for a line of low-power x86-64 processors by Intel, which succeed the Core i3 N-series and N200 series "Alder Lake-N" processors. These non-socketed (BGA) chips power a wide range of devices from entry level notebooks and mini PCs to consumer NAS servers, and other embedded applications. The chips feature only E-cores. While "Alder Lake-N" used "Gracemont" cores, "Twin Lake" uses the swanky new "Skymont" cores, which serve as E-cores in "Lunar Lake" and "Arrow Lake" hybrid processors. "Skymont" cores feature massive IPC and clock-speed gains over "Gracemont," of nearly 50%, which pulls up their performance levels to match the "Golden Cove" and "Raptor Cove" P-cores of "Alder Lake" and "Raptor Lake," although these cores can't boost up to 5.00 GHz. We got the first name-drop of "Twin Lake" way back in May 2024. Jaykihn leaked what the processor lineup could look like.

The "Twin Lake" silicon features two "Skymont" E-core clusters sharing an L3 cache. At this point, the sizes of the shared L2 caches of the E-core clusters, and the size of the shared L3 cache are not known. On "Alder Lake-N," each "Gracemont" cluster features 2 MB of L2 cache, and the two clusters share a 6 MB L3 cache. The silicon also features an iGPU based on what is very likely the Xe-LPG graphics architecture, with four Xe cores worth 32 execution units (EU). The series is led by the Intel N355. This chip maxes out the "Twin Lake" silicon, enabling both "Skymont" clusters, for an 8-core/8-thread CPU configuration. The CPU comes with a base frequency of 3.00 GHz, and boosts up to 3.90 GHz. The chip comes with a configurable TDP of 9 W and 15 W. It comes with a maxed out iGPU, with all 32 EU being enabled, and a graphics frequency of 1.35 GHz.

Minisforum V3 SE 3-in-1 Tablet Goes on Sale with Ryzen 7 APU

Minisforum is a consumer hardware brand that is well known for its impressive lineup of SFF/Mini PCs. However, what might not be as well-known, might be the fact that the brand also makes a plethora of other computing hardware and accessories. The company had recently announced the V3 and the more affordable V3 SE 3-in-1 tablet PCs with a design that is reminiscent of the Microsoft Surface. The V3 SE is now available to purchase, starting at $799.

At its heart, the Minisforum V3 SE is powered by the 28 W Ryzen 7735U "Rembrandt R" APU based on the Zen 3+ microarchitecture paired with 16 GB of LPDDR5-6400 memory. The APU is a decently powerful one, with multicore performance that is roughly in the same league as the Core Ultra 7 258V "Lunar Lake" processor. Unsurprisingly, any kind of discrete graphics is absent from the PC tablet, thereby making it rely solely on the 12-CU Radeon 680M iGPU for graphically demanding tasks. Storage is taken care of by its 1 TB M.2 SSD, which is housed in a 2280 slot.

Intel's "Wildcat Lake" Emerges as New Entry-Level Processor Series

According to recently discovered shipping manifests, Intel is developing a new processor series codenamed "Wildcat Lake," potentially succeeding their entry-level "Intel Processor" lineup based on Alder Lake-N. The documents, revealed by x86deadandback, suggest a 2025 launch timeline for these chips targeting lightweight laptops and mini-PCs. The shipping records from October 30 mention CPU reball equipment compatible with BGA 1516 sockets, measuring 35 x 25 mm, indicating early validation testing is underway. These processors are expected to be manufactured using Intel's advanced 18A process technology, sharing the same manufacturing node as the upcoming Panther Lake series. Early technical specifications of Wildcat Lake point to a hybrid architecture combining next-generation "Cougar Cove" performance cores with "Darkmont" low-power efficiency (LPE) cores in a 2P+4LPE configuration.

This design appears to separate the core clusters, departing from traditional shared ring bus arrangements, similar to the approach taken in Intel's Lunar Lake and Arrow Lake processors. While Wildcat Lake's exact position in Intel's product stack remains unclear, it could serve as a modernized replacement for the what were Pentium and Celeron processor families. These chips traditionally power devices like Chromebooks, embedded systems, and home servers, with the new series potentially offering significant performance improvements for these market segments. The processor is expected to operate in the sub-double-digit TDP power envelope, positioning it below the more powerful Lunar Lake series. Graphics capabilities will likely be more modest than Lunar Lake's Xe2 architecture, aligning with its entry-level market positioning.

Intel to Launch 22 Mobile Processor Models at CES 2025, not all are Arrow Lake

Intel is significantly expanding its desktop Core Ultra 200 "Arrow Lake-S" lineup with new 65 W models along the sidelines of the 2025 International CES, but more importantly, it is bringing the "Arrow Lake" microarchitecture to the mobile space. The company is planning to launch at least 22 processor models this January, but not all of them are based on "Arrow Lake." Tom's Hardware reports that the lineup broadly revolves around the "Core 2-series" processor model numbering.

The Core Ultra 200H series consists of H-segment (conventional thickness notebook) processors in the 28 W to 45 W class, and are based on the "Arrow Lake-H" silicon. The Core Ultra 200HX series targets premium gaming notebooks and portable workstations, and consists of 55 W to 65 W class processors, including CPU overclocking capabilities on certain models. Things get interesting with the Core Ultra 200U series. These chips are based on the "Meteor Lake Refresh" silicon—an older microarchitecture—targeting the 7 W to 28 W segments for ultraportables. Lastly, there's the Core H 200 and Core U 200 series (no "Ultra" in the branding), which are based on the older "Raptor Lake" monolithic silicon, targeting mainstream notebooks.

Samsung Introduces Lunar Lake-powered Galaxy Book 5 Pro with 25 Hour Battery Life

Laptops powered by Intel's Lunar Lake family of processors have been seeping out slowly but steadily into the market. Samsung has no intention of sitting idle either, and has lifted the curtains on its Galaxy Book 5 Pro with an impressive AMOLED display and a battery life claim of a stupendous 25 hours. The laptop will be launched in South Korea on January 2, and a global rollout should follow thereafter.

Basically, the Book 5 Pro is the more affordable sibling of the Book 5 Pro 360. As the sharp-eyed amongst you may have already guessed, the Book 5 Pro does not feature the 360° hinge, which allowed the Book 5 Pro 360 to function as a convertible. Now, of course, a lot of people simply do not care about having convertible functionality, and the newly announced notebook is likely targeted at them.

HWiNFO v8.16 Adds Support for Next-Gen AMD CPUs/APUs and Intel GPUs

HWiNFO has been updated to version v8.16, which brings several new improvements and fixes, as well as adds enhanced support for next-generation AMD CPUs and APUs, as well as next-generation Intel GPUs. While it does not specify any models, it is clear that it gets support for AMD's upcoming Kraken Point and Strix Halo APUs, as well as Intel's upcoming Battlemage GPUs.

In addition, the new HWiNFO v8.16 also improves support for Intel Lunar Lake, adds reporting of number of NPU tiles, adds support for Cybenetics Powenetics PMD (Power Measurements Device), enhances sensor monitoring on MSI's Z890, B860, and H810 series motherboards, enhances reporting of CUDIMM CKD parameters, NGU clock, and drive letter, and improves reporting of V/F curve settings, among other things. You can check out the full release notes below.

MSI Claw 8 AI+ To Get Massive Battery and Lunar Lake CPU With Full Unveiling at CES 2025

MSI previously gave us a teaser of what to expect from its upcoming Claw 8 AI+ gaming handheld with Intel's Lunar Lake Core Ultra CPUs, calling it "the most advanced 8-inch gaming handheld in the market," but a recent CES listing has divulged more details about the upcoming challenger to the likes of the Lenovo Legion Go. For starters, the upgraded battery capacity has been revealed, along with an estimated battery life and performance figures. Supposedly, more information will be revealed about the Claw 8 AI+ at CES 2025, which starts on January 7, 2025.

According to the CES page, the new MSI Claw 8 AI+ will have an 8-inch display and an 82 WHr battery, which will supposedly be able to deliver "4+ hours of gameplay for AAA titles." However, these manufacturer claims are generally to be taken with healthy helpings of salt, especially in when it comes to claims as nebulous as "AAA titles" without any proposed quality settings, specific games, or frame rates. Regarding the display, it wouldn't be surprising to see MSI use the same display as the one found in the Lenovo Legion Go, since there is a somewhat limited selection of 8-inch displays for handheld gaming devices. The MSI Claw 8 AI+ will also use Intel's 2nd-generation ARC iGPUs in conjunction with AI-enhanced graphics, which should provide a healthy uptick in both performance and efficiency, with the CES listing touting 48 TOPS of compute power.

AMD Claims Ryzen AI 9 HX 370 Outperforms Intel Core Ultra 7 258V by 75% in Gaming

AMD has published a blog post about its latest AMD Ryzen AI 300 series processors, claiming they are changing the game for portable devices. To back these claims, Team Red has compared its Ryzen AI 9 HX 370 processor to Intel's latest Core Ultra 7 258V, using the following games: Assassin's Creed Mirage, Baldur's Gate 3, Borderlands 3, Call of Duty: Black Ops 6, Cyberpunk 2077, Doom Eternal, Dying Light 2 Stay Human, F1 24, Far Cry 6, Forza Horizon 5, Ghost of Tsushima, Hitman 3, Hogwarts Legacy, Shadow of the Tomb Raider, Spider-Man Remastered, and Tiny Tina's Wonderlands. The conclusion was that AMD's Ryzen AI 9 HX 370, with its integrated Radeon 890M graphics powerhouse, outperformed the Intel "Lunar Lake" Core Ultra 7 258V with Intel Arc Graphics 140V by 75% on average.

To support this performance leap, AMD also relies on software technologies, including FidelityFX Super Resolution 3 (FSR 3) and HYPR-RX, to unlock additional power and gaming efficiency. FSR 3 alone enhances visuals in over 95 games, while HYPR-RX, with features like AMD Fluid Motion Frames 2 (AFMF 2) and Radeon Anti-Lag, provides substantial performance boosts across thousands of games. The company has also compared its FSR/HYPR-RS combination with Intel's XeSS, which is available in around 130 games. AMD claims its broader suite supports 415+ games and is optimized for smoother gameplay. The AFMF 2 claims support with thousands of titles, while Intel's GPU software stack lacks a comparison point. Of course, these marketing claims are to be taken with a grain of salt, so independent testing is always the best to compare the two.

Intel Reportedly Ramps "Arrow Lake" Orders at TSMC Amid Internal Foundry Struggles

According to Taiwanese media Commercial Times, Intel is significantly increasing its outsourcing of "Arrow Lake" CPU production to TSMC, a strategic move as it grapples with persistent issues in its own foundry division. This decision to outsource a substantial portion of Arrow Lake's production is a significant shift in Intel's strategy, showing the company's rising reliance on external partners to meet quality and performance demands. The Arrow Lake Core Ultra 200 series is Intel's first major outsourcing initiative, in which Intel gave its core IP to third-party foundries, more specifically for a 3 nm node at TSMC. However, it clearly indicates the performance gaps in Intel's own Intel Foundry and the high demand expectations for the new CPUs. Originally intended to use Intel 20A node, Intel shifted focus of 18A node for its products and upcoming foundry customers.

Intel's recent orders with TSMC extend to its upcoming Lunar Lake chips and next-generation Falcon Shores AI GPUs, both of which will use TSMC's 3 nm process. Although Intel's 18A node remains promising, the company relies on current products to sustain its revenue streams, making TSMC's support crucial in ensuring timely shipments. This increased outsourcing reflects Intel's need to maintain competitive performance in the short term. Once its Foundry division meets performance and capacity targets, Intel aims to bring more CPU manufacturing back in-house. However, if anything goes wrong, Intel could face challenges securing sufficient volume from TSMC, as the foundry has longstanding commitments with major clients like Apple, NVIDIA, Qualcomm, and AMD.

Apple Mac Studio with M4 Ultra SoC Reportedly Delayed, MacBook Air Remains on Schedule

Apple's M4-equipped MacBook Pro, Mac mini, and 24" iMac lineups are set to debut next week. The M4 family of desktop-class SoCs, which will soon be joined by the M4 Pro and M4 Max, is likely to bring substantial performance improvements to the aforementioned Mac models. If the recently leaked benchmarks are anything to go by, the M4-powered lineup appears poised to outperform Intel's "Lunar Lake" rather comfortably, while bringing the heat to AMD's "Strix Halo" as well as Intel's upcoming "Arrow Lake-H"-powered notebooks.

For those interested in the thin-and-light segment, the MacBook Air has always presented itself as a very decent option. According to recent reports by Mark Gurman, the M4-equipped MacBook Air is scheduled for launch sometime during January to March of 2025, with mass production set to start soon. The Mac Studio, which was supposedly slated to launch alongside the MacBook Air, is now delayed by a few months and will possibly see the light of day during the second quarter of 2025.

Intel "Lunar Lake" Compute Tile Annotated and PCH Tile Pictured

Some of the first die-shots and annotations of the Intel Core Ultra 200V "Lunar Lake" processor surfaced on the web, thanks to die-shots by GeenWens and Kurnalsalts on Twitter. Be sure to check out our Lunar Lake Technical Deep-dive article to learn the basics of how Lunar Lake is different from "Meteor Lake." Both are disaggregated chiplet-based processors, but Lunar Lake remodels things a bit. All the logic engines of the processor—the CPU, the iGPU, and the NPU, are located in a centralized Compute tile that's built on the TSMC 3 nm process, while all the I/O controllers are spun out to the Platform Controller tile built on TSMC 6 nm, which sit on a Foveros base tile that acts as an interposer, facilitating high-density microscopic connections between the two tiles. The base tile sits on the fiberglass substrate, which also has stacked LPDDR5X memory for either 16 GB or 32 GB of on-package system memory.

The Kurnalsalts annotation provides a good lay of the land for the Compute tile. The most striking aspect of it is the CPU. "Lunar Lake" comes with a 4P+4E core hybrid CPU, but the two kinds of cores do not share a last-level cache or sit in a ringbus, unlike in case of the Compute tile of "Meteor Lake." The four "Lion Cove" P-cores each come with 2.5 MB of dedicated L2 caches, and share a 12 MB L3 cache. The four "Skymont" E-cores are not part of the ringbus connecting the four P-cores, rather they are physically separated, much like the low-power island E-cores on "Meteor Lake." The E-core cluster shares a 4 MB L2 cache among the four E-cores. This E-core cluster is directly connected to the switching fabric of the Compute tile.

Intel Royal Core Successor Rumored to be Codenamed Cobra Core

Intel's future processor microarchitectures and their constituent CPU cores have hit the rumor-mill. The "Lion Cove" P-core is now current-gen, as products based on the Core Ultra 200V "Lunar Lake" processor, which implements it, have been announced. "Lion Cove" will also be the main workhorse of "Arrow Lake," and Intel's Xeon 7 P-core server processors. The core ditches Hyper-Threading, but introduces a double-digit percent IPC gain over "Raptor Cove." The thunder of "Lion Cove" was stolen by the new "Skymont" E-core during the "Lunar Lake" technical presentations, as it offers nearly the same IPC as "Raptor Cove," at much lower power, and is held back by a lack of HTT and its inability to operate at high clock speeds that "Raptor Cove" can. We predict "Skymont" is shaking things up at Intel, and will have an impact on the way the company's future CPU cores are designed—to place greater emphasis on power and die-area to achieve IPC growth targets with each generation.

The successor to "Lion Cove" is codenamed "Royal Core." This would be the first time in over five years (since "Sunny Cove") that Intel's P-core codename doesn't use "Cove," signaling a departure from that naming scheme. The first iteration of "Royal Core" will power Intel's "Nova Lake" microarchitecture that succeeds "Lunar Lake." A slightly updated version of this core, codenamed "Royal Core 1.1," will power the "Beast Lake" microarchitecture, which likely falls in the lineage of "Arrow Lake," if not being a direct successor to it. An alleged Intel employee's work project description revealed "Cobra Core," a CPU core that succeeds "Royal Core," although the codename of its parent microarchitecture hasn't been revealed. Microarchitectures such as "Beast Lake," and its successor implementing "Cobra Core" are slated for much later into the decade, and we don't expect them to see the light of the day till at least 2026-27, if not later.

Intel Core Ultra 300 Series "Panther Lake-H" Leaks: 18 CPU Cores, 12 Xe3 GPU Cores, and up to 45 Watt TDP

Details have emerged about Intel's upcoming "Panther Lake" processors, set to be the third generation of Core Ultra mobile chips. Called the Core Ultra 300 series, these CPUs are expected to succeed "Lunar Lake". According to recent leaks, Panther Lake-H will be manufactured using Intel's cutting-edge 18A process node. The chips are said to feature a combination of Cougar Cove P-Cores, Skymont E-Cores, and Xe3 (Celestial) integrated graphics. This architecture builds upon Intel's hybrid core design, refining it for even better performance on mobile devices. The leaked information suggests a range of configurations for Panther Lake-H, the high-perfomance variant of the lineup. These include models with varying core counts and power envelopes, from efficient 25 W parts to more interesting 45 W options. Notably, some SKUs reportedly feature up to 18 cores in total, combining P-cores, E-cores, and LP E-cores in a five-tile package. This is an increase from previously believed 16 cores.
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