G.Skill International Enterprise launches 2 sets high capacity memory modules in DDR2-800 CL6 and DDR2-667 CL5.

After waiting for 5 years, Microsoft starts to ship the new generation O.S. - VISTA. The global computer users are looking for high capacity memory modules to be capable of running it. G.Skill International Enterprise provides two different speed 2GB capacity module for mainstream. All users can catch the latest O.S. trend in saving price.

Corsair today expanded its Fully Buffered DIMM (FB-DIMM) DDR2-667MHz family of products to support the latest dual-core Intel Xeon based platforms. Corsair high density high-speed FB-DIMMs offer enhanced memory throughput allowing for superior application responsiveness. Based on the JEDEC standards, the new DDR2-667Mhz FB-DIMMs are designed to provide ultimate flexibility and expandability to balance capabilities of Intel dual core processors. Corsair FB-DIMMs and servers modules come with a lifetime warranty and dedicated technical supports. For more information on the new 2GB DDR2-667MHz FB-DIMM memory modules, go here.

Hynix today announced it has developed the world's fastest and smallest 512Megabit mobile DRAM. This product meets JEDEC standards and operates at 200MHz - the fastest in the industry. By using 32-bit wide I/Os, Hynix's 512Mb mobile DDR SDRAM processes 1.6Gbytes (400 bps x32) of data per second, which is approximately 1.5 times faster than speed of the company's existing mobile DRAM products. The new product is expected to enhance the company's competitiveness in mobile applications, which is driving the trend towards miniaturization(8mm x 10mm). Moreover, Hynix is expected to combine 512Mb mobile DRAM and NAND Flash in a multi-chip package (MCP), which will enable the design of slimmer mobile phones.