Patriot Memory today starts offering high-performance unbuffered DDR3 DIMMs with ECC for servers. Designed to compliment the triple channel technology of Intel's Core i7 platform, Patriot's new products offer both single channel and triple-channel kits that range from 2 GB on a single module and exceed 12 GB on three 4 GB modules. All modules are also covered by a lifetime warranty and free technical support.

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today expanded their lineup of DDR2 to include new high-speed 4 GB kits qualified to operate and excel at a low voltages. These new OCZ solutions are designed to be the ultimate upgrade for users who not only want to reap the benefits of performance memory, but want a future-proof choice for their system.
"Though enthusiasts are known for applying increased voltage to modules in order to obtain higher performance, our newest modules offer exceptional speeds at lower voltages improving overall performance and stability," commented Eugene Chang, Vice President of Product Management at the OCZ Technology Group. "By engineering modules with both high speed and reduced voltage requirements we are able to offer enthusiasts and gamers memory with increased headroom and overall better stability and performance over the long term."

Corsair, the worldwide leader in high performance computer and flash memory products, today announced the new Corsair Cooling range of advanced cooling solutions for Dominator and Dominator GT modules, including the world's first sub-ambient cooler for PC memory.

The new cooling solutions include the Corsair Cooling Hydro Series H30 water-block and Ice Series T30 thermo-electric cooler, which is capable of cooling memory to below room temperature for enhanced overclocking performance and reliability.

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, announced shipment of its 32-Gigabyte (GB) moviNAND, the highest density embedded memory card utilizing advanced 30-nanometer (nm) class process technology. Use of high-density embedded memory improves the performance of high-end phones and other mobile consumer electronics when processing and storing large amounts of multimedia content such as videos, video games and TV broadcasts.

The 32 GB moviNAND is the first embedded memory card to use 32 Gigabit (Gb) NAND devices produced with 30nm-class process technology. The new Samsung card doubles the density of the previous generation of moviNAND that is now being produced with 16 Gb 40nm-class NAND chips.

Patriot Memory, a global pioneer in high performance memory, NAND flash and computer technology, today announced their DDR2 4GB and 8GB SODIMM mobile solutions to answer the need of extreme mobile computing.

"The performance gap between mobile and desktop computing has reduced significantly over the recent introduction of more powerful mobile platforms," commented Les Henry, Director of Engineering at Patriot, "By adding Patriot's DDR2 4GB module or 8GB in dual channel mode, mobile systems can eliminate that gap and perform like a true desktop replacement."

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today expanded their memory lineup for AMD enthusiasts and power users with new DDR3 kits qualified and optimized specifically for the AM3 platform. The new low-voltage kits were designed exclusively for AMD's transition to DDR3 and are tailored to make full use of the latest computing environments as well as establish a future-proof system with restricted voltage requirements.

"AMD's new AM3 architecture is designed specifically for the gaming community, with emphasis on high data transfer rates between the system memory and the graphics subsystem," commented Dr. Michael Schuette, VP of Technology Development at OCZ. "The key improvement over the AM2 platform is the embracing of DDR3 technology where OCZ has a track record of being a market leader. These new AMD kits further establish our leading role in this category and show our commitment to both industry partners and the gaming community by complementing AMD's gaming platform with future-oriented, low voltage memory technology."

A-DATA Technology Co., Ltd., a worldwide leader in high performance memory products, today introduced its newly speed of XPG Gaming Series DRAM module in DDR2-1066, as dual channel 2GBx2/1GBx2 and single channel kits up to 2GB. Designed for consumers who want to enhance their gaming ability, the XPG Gaming Series DDR2-1066G DRAM module provide CL6-6-6-18 timing at 2.0V±0.1V to delivering outstanding performance, speed, and gamer experience.

Optimized for the latest gaming platform, the XPG Gaming Series DDR2-1066G DRAM module delivers the perfect blend of performance, durability, and stability with low power consumption. It is an affordable midrange offering for gamer of all levels and the professionals demanding the latest DDR2 technology.

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, is pleased to be one of the first to offer Intel Extreme SODIMM modules to the enthusiast market. These memory solutions implement a high-performance specification optimized and predefined for platforms utilizing Intel Core 2 Extreme mobile processors. Extending beyond a traditional capacity upgrade for high-end gaming and professional laptops, OCZ's XMP SODIMMs offer superior performance qualified by Intel for ultimate compatibility and stability.

Patriot Memory, a global provider of premium quality memory modules and flash memory solutions, today announced their DDR3 12 GB Tri-Channel Viper kit.

Designed specifically for the Intel Core i7 processor/Intel X58 Express Chipset, the Patriot Viper 12 GB kit has been built to excel for the Core i7 triple channel tehcnology. The Patriot Viper 12 GB are hand tested extensively on X58 motherboards to ensure maximum compatibility and supreme quality. The kits will be offered in 1333 MHz and come in both CL7 and CL9. "With all memory slots utilized in all three channels, the Core i7 brings the effectiveness of a server to mainstream desktops, and for a fraction of the price, says Benny Chea, Patriot Memory's Applications Engineer. Mr. Chea went on to say, "Multi-applications users will appreciate the increased bandwidth."

Micron Technology, today announced that its suite of DDR3 server memory modules are validated with Intel's next-generation Intel Xeon processor chips. Micron's validated 1, 2, 4 and 8-gigabyte (GB) DDR3 modules are performance-driven, delivering speeds of 1066 megabits per second (Mb/s) and 1333 Mb/s, greatly increasing server throughput. Additionally, Lexar Media, a wholly-owned subsidiary of Micron, has validated its corresponding Crucial-branded modules, leveraging Micron's award-winning DDR3 memory.

Rambus Inc., one of the world's premier technology licensing companies specializing in high-speed memory architectures, today announced it has acquired a number of patents from Inapac Technology, Inc. to broaden its offerings for the mobile memory market. These patented innovations complement the high-bandwidth, low-power memory technologies developed by Rambus as part of its Mobile Memory Initiative, announced earlier this year. Specific terms of the deal are not disclosed.
These newly acquired patented innovations are key enablers for achieving high manufacturing yields in System-in-Package (SiP) implementations. SiP consists of a number of stacked integrated circuits (IC) - such as a media processor, DRAM, and Flash memory device - enclosed in a single package or module. This technology allows designers to achieve high functionality in a very compact space, ideal for mobile products such as mobile phones and mobile gaming devices. Given its performance characteristics, SiP has applicability in computing and consumer electronics products as well.

Geil has announced the launch of its EVO ONE DDR3 gaming memory series. Both dual and triple channel memory kits will be available, ranging from 2 GB (2x 1GB sticks) in dual channel to 6 GB (3x 2GB sticks) in triple channel.

All memory kits feature Geil's EVO One Heatspreader with MTCD technology.

Elpida Memory (Elpida), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it has begun mass production of the industry's highest density 2-gigabit Mobile RAM using 50 nm process technology at its Hiroshima fab.
Mobile RAM is an ultra low-power memory that is ideal for use in mobile phones and other portable devices and requires extremely advanced technology for development and production. As a leading supplier of mobile DRAM, Elpida has managed to quickly establish a full-scale 50 nm Mobile RAM production system using ArF immersion lithography and copper interconnect technology.

ATI Radeon specialist Sapphire is preparing a new SKU based on its recently unveiled cooler design based on its Vapor-Chamber technology. In an attempt to step up performance and spicing up specifications sheets, the company plans to load 2 GB of GDDR5 memory on an HD 4870 accelerator. To hold that much memory, GDDR5 chips are populated on both sides of the PCB. The chips on the back of the card are cooled by a heatsink, while the ones in the front are subjected to the fan's air-flow. The card uses reference AMD clock speeds of 750/900 MHz (core/memory). DVI, D-Sub and DisplayPort make for the card's connectivity. It is expected to be priced at 258 EUR.

Swayed by all the recently released "Green" products, GeIL today launched a series of green DDR2 memory modules rated to work at 1.6V, lower than the standard 1.8V. Also, the packaging of the Green Series is said to be made of recycled paper pulp. All modules are enhanced with a lifetime warranty as well.

Patriot Memory, a global provider of premium memory module and flash memory solutions, announced today the release of their DDR2 Quad Channel 8GB Kits.

In today's complex, multi-task world, it is becoming increasingly important to be able to switch between scenerios, and still maintain enough memory to run multiple applications," says Saeed Arash Far, Patriot Memory's Technical Marketing Engineering Manager.

Known by computer enthusiasts to be the company with some top quality PC coolers, Xigmatek, has a new product up its sleeve: the Dragoon N422 memory module heatsink cooler. The cooler serves as a replacement for the heatspreaders or stock-heatsinks memory modules come with. It can latch onto most standard-sized 240-pin DDR2 and DDR3 modules.

The cooler consists of two units that dissipate heat from either sides of the module. Each unit consists of a metal plate that makes contact with the module. The plate itself propagates into an arrangement of aluminum fins, but the interesting component is the copper heatpipe that runs through the length of the plate. The heatpipe makes direct contact the memory chips, and conveys heat to a small yet dense aluminum fin array. Two such plates are latched onto a module using screws. The total weight of the cooler per module (two plates) is 105g. It measures 131.1 (L) x 76.5 (W) x 9.6 (H) mm. Due to its design, the cooler can be used only on double-sided modules (modules with DRAM chips on both sides). The Dragoon N422 is yet to reach retail channels so we could tell its price.

Patriot Memory, a global provider of premium memory module and flash memory solutions, announced today the release of their DDR3 Tri Channel Signature Kits.

"With today's economy, 'value' has become even a greater concern for the consumer. Patriot Memory plans on making sure we provide solutions that provide value and the high quality that has made Patriot Memory a leader in the memory industry," says JR Wakabayashi, Marketing Manager for Patriot Memory.

Coming in kits of 3GB (3 x 1GB) and 6GB (3 x 2GB), Patriot's Signature Tri Channel is being offered at 1066MHZ, Cas Latency 7. The Patriot Tri Channel is compatible with all current X58 DDR3 motherboards.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology and the leading producer of high-end graphics memory, announced today that it has begun mass producing GDDR5 graphics memory using 50-nanometer class process technology.

"Our early 2009 introduction of GDDR5 chips will help us to meet the growing demand for higher performance graphics memory in PCs, graphic cards and game consoles," said Mueez Deen, director, mobile and graphics memory, Samsung Semiconductor, Inc. "Because GDDR5 is the fastest and highest performing memory in the world, we're able to improve the gaming experience with it across all platforms," he added.

Toshiba Corporation today announced the prototype of a new FeRAM -Ferroelectric Random Access Memory-that redefines industry benchmarks for density and operating speed. The new chip realizes storage of 128-megabits and read and write speeds of 1.6-gigabytes a second, the most advanced combination of performance and density yet achieved. Full details of the new FeRAM will be presented this week at the International Solid-State Circuits Conference 2009 (ISSCC2009) in San Francisco, USA.

Mushkin, one of the leading manufacturers of high performance computer components, announces the availability of a new DDR3 Triple-Channel-Kit. It's called: "998679r" and is equipped with 6GB and a high frequency of 1600 MHz. The memory will be delivered in a noble aluminium case assembled with unqiue "radioactive" heatspreaders.
"This kit is the ultimate combination of newest technology and fancy design." Proclaims Steffen Eisenstein, CEO of Mushkin Logistic GmbH very proudly, and continues: "The response for the "radioactive" heatspreader was huge, now we will have a hell of a party on DDR3!"

Transcend Information Inc., a global leader in the manufacture of high performance memory modules, is proud to unveil 4GB aXeRam DDR3-1800 memory upgrade kits. Designed specifically for hard-core gamers using only top-binned, premium quality DRAM chips and custom high-purity aluminum heat sinks with cooling fins, aXeRam DDR3-1800 dual-channel kits deliver amazing high-speed overclocking performance while maintaining cool temperatures and rock-solid system stability.

Transcend's 4GB aXeRam DDR3-1800 kit's two identically-matched 240-pin unbuffered 2GB DDR3 1800MHz DIMMs are carefully paired for use in dual-channel configuration, which together provide memory bandwidth of up to 28.8GB/s. To ensure extra-stability and signal integrity at high clock speeds, all aXeRam modules use robust eight-layer PCBs that fully comply with JEDEC standards. The aXeRam 128Mx8 DDR3 DRAM chips are selected with the strictest quality and performance standards and are manufactured using small Fine-Pitch Ball Grid Array (FBGA) packages to assure better thermal dissipation, electrical efficiency and improved overclocking performance. Transcend's aXeRam DDR3-1800 modules also support new Intel Extreme Memory Profile (XMP) technology, which allows users with high-performance motherboards to easily overclock their memory with aXerRam's built-in aggressive speed-maximized profiles, or manually input their own memory timing parameters to take their system to the next level.

A-DATA Technology Co. Ltd., a worldwide leading manufacturer in high performance memory products, announced today that its XPG DDR3 memory modules have broken a new world record on SuperPi 32m. The record was set by utilizing the DFI Lanparty UT X58 motherboard and XPG X Series v2.0 memory, the DDR3-2133X v2.0 2GBx3 triple-channel kit.
The SuperPi 32m record of 6min 40sec 360ms was achieved at a speed of 2237 MHz and latency settings of 8-7-7-21 using DDR3-2133X v2.0 2GBx3 triple-channel kit.

SanDisk Corporation and Sony Corporation today announced the joint development of two expanded formats that will shape the flash memory landscape for years to come. "Memory Stick format for Extended High Capacity (Tentative name)" expands the "Memory Stick PRO" format series to achieve a maximum storage capacity of 2-terabytes (TB), while the "Memory Stick HG Micro" format enables a maximum data-transfer speed of 60 megabytes per second (MB/s), making it one of the fastest-smallest memory card formats to date. Format licensing corresponding to the "Memory Stick format for Extended High Capacity" and the "Memory Stick HG Micro" is scheduled to start in 2009.

Lexar Media, a leading global provider of memory products for digital media, today announced the immediate availability of Crucial Ballistix Tracer DDR3-1333 (PC3-10600) memory modules in three vibrant new colors - green, blue and red. Performance memory enthusiasts and system modders can choose from a variety of Crucial Ballistix Tracer module colors to match their case color scheme or to suit their individual style. The new color modules are available in 3GB and 6GB kits through select resellers worldwide and directly from Crucial's website here.