Kingston Technology Company, Inc., the independent world leader in memory products, today announced the new HyperX Plug and Play (PnP) series of high-performance enthusiast memory. HyperX PnP are the first modules to scale the higher memory heights that are a part of the second generation Intel Core i5 and i7 CPUs. The memory is programmed with faster frequencies and when 'plugged' into a system using the Sandy Bridge chipset, will automatically 'play' at either 1600MHz or 1866MHz in both desktop and notebook PCs.

The modules are programmed using JEDEC-compliant settings, allowing 1600MHz and 1866MHz frequency support. It is as simple as plugging in the memory and turning on the machine, as the system automatically recognizes faster memory speed with no further BIOS settings required. Users will notice performance gains as overclocking is automatic with the HyperX Plug and Play modules. In addition, the modules are backwards compatible with previously released DDR3 systems on the market.

Toshiba Corporation, reinforcing its leadership in the development and fabrication of cutting-edge, high density NAND flash memories, today announced that it has fabricated NAND flash memories with 19 nm process technology, the finest level yet achieved. This latest technology advance has already been applied to 2-bit-per-cell 64-gigabit (Gb) chips that are the world's smallest and offer the highest density on a single chip (8 gigabytes (GB)). Toshiba will also add 3-bit-per-cell products fabricated with the 19nm process technology to its product line-up.

Samples of 2-bit-per-cell 64-gigabit will be available from the end of this month with mass production scheduled for the third quarter of the year (July to September 2011). Toshiba leads the industry in fabricating high density, small die size NAND flash memory chips. Application of the 19nm generation process technology will further shrink chip size, allowing Toshiba to assemble sixteen 64Gbit NAND flash memory chips in one package and to deliver 128GB devices for application in smartphones and tablet PCs. The 19nm process products are also equipped with Toggle DDR2.0, which enhances data transfer speed.

G.Skill International Co. Ltd., manufacturer of extreme performance memory and solid-state storage with solid quality, today announces the world's fastest 8GB (4GBx2) DDR3 memory, rated at 2300MHz CL9 with only 1.65V voltage. This ultimate memory kit will join G.Skill award winning Ripjaws-X family and will be available soon via G.Skill global authorized distribution partners.

Since the demand of big capacity memory has grown dramatically, G.Skill R&D team has been dedicated to develop the fastest and best performing products based on 4GB memory sticks continuously. Following the marvelous achievement of DDR3 1900MHz 48GB and DDR3 2200MHz 16GB kits, G.Skill once again pushed the memory speed further and developed the industry leading memory kit. The DDR3 2300MHz CL9 kit has passed a series of rigorous tests and guarantees the best stability and performance.

PNY Technologies, Inc. ("PNY") today announced the NVIDIA Verto GeForce GT 520 1024MB graphics card. The new PNY GT 520 graphics card is the perfect mainstream upgrade to bring the latest technology to computers at a reasonable cost. Whether you're watching or editing HD video, enhancing photos, or gaming with support for DirectX 11, this latest PNY graphics card provides a solution for every graphics need. The on-board HDMI port allows for easy connectivity to any HDMI enabled computer monitor or television.

"This mainstream graphics card caters to a wide variety of consumers looking to upgrade their PCs to handle the now everyday tasks of living in a digital world," said Nicholas Mauro, senior marketing manager, PC components for PNY. "It's an ideal solution to enhance your overall computer visualization experience at an affordable cost."

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it has developed a 4-gigabit DDR2 Mobile RAMTM that employs state-of-the-art 30nm process. This new Mobile RAM features a low operating voltage of 1.2V, achieves a 1066Mbps high-speed data transfer rate, and uses roughly 30% less operating current compared with stacking two of Elpida's 40nm 2-gigabit products. Through sophisticated circuit design and advanced process technology, this product achieves the world's smallest class in chip size for a 4-gigabit LPDDR2. In addition, it is an eco-friendly DRAM equipped with a low power feature that targets mobile devices such as smart phones and tablet PCs by contributing to extended operating times of battery-powered devices.

Currently, the rapidly expanding market for smart phones and tablet PCs is striving to expand the features of its operating systems. As a result, the ideal density of DRAMs is also rapidly on the rise, and there is an increasing need for high density DRAMs - 8-gigabit for high-end smart phones and 16-gigabit for high-end tablet PCs. At the same time, there is a strong demand for smaller, thinner, and lighter DRAM packages, and attention is being focused on advanced package technologies such as Package on Package (PoP) and Multi Chip Package (MCP).

Toshiba America Electronic Components, Inc. (TAEC) today announced that it has enhanced its NAND flash portfolio with the introduction of SmartNAND, its next-generation 24-nanometer (nm) NAND flash product family. The SmartNAND series integrates leading-edge 24nm process NAND flash technology with a control chip that supports error correction code (ECC) and is available in densities ranging from 4 to 64 gigabyte (GB).

The new series is expressly designed to remove the burden of ECC from the host processor, while minimizing protocol changes. SmartNAND simplifies the host-side design and application of advanced NAND technology in a range of applications including portable media players, tablet PCs, digital TVs, set-top-boxes, and other devices that require high-density, non-volatile memory.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the availability of 2000MHz versions of the award-winning Vengeance family of DDR3 memory.

The new 2000MHz kits are equipped with aluminum heat spreaders anodized in Jet Black. They join the 1600MHz Vengeance DDR3 memory kits, which are available in either Jet Black or Cerulean Blue, and the 1866MHz Vengeance DDR3 kit, available in Jet Black.

Exceleram, the Highend Memory maker based in Landau / Germany announces the availability of the new Blue Rippler Kits. The new Blue Rippler series starts with 8 different memory kits. They will be available in capacities from 8GB to 24GB - the focus is here for all memory demanding applications.

"Something special for the new Blue Rippler series is the high compatibility, you can use them for LGA1155, LGA1156, LGA 1366 and AM3. Thus the endcustomer don't need much time to find the right memory for his system." said Martim Reis Silva, Salesdirector Exceleram.

Samsung Electronics America Inc., a subsidiary of Samsung Electronics Corporation, today announced three new mobile PC lines for the workplace. The Series 2, Series 4 and Series 6 laptops combine first-rate reliability and enhanced security with features like anti-shock hard drives and pressure-resistant casings to meet the needs of a fast-paced enterprise or educational environment.

"Samsung's new mobile PCs deliver an unrivaled experience for the workplace, with features specifically designed to meet the needs of IT managers and end users," said Scott Ledterman, director of mobile PC marketing at Samsung Enterprise Business Division. "The new Series 2, 4 and 6 laptops present a unique opportunity for Samsung to specifically focus on the enterprise and educational channels and underscores Samsung as a global leader in the enterprise PC market."

G.Skill, the worldwide leading memory designer and manufacturer, has announced the newest concept and development of new Sniper series designed specifically for PC gamers and modding enthusiasts. Extensive compatibility tests are conducted on a wide range of Intel and AMD platforms, which guarantee the best performance, quality and reliability for user's gaming needs.

The New Sniper series is designed in ultra low voltage, especially 1.25V. This kit can save up to 10% electric power which will simultaneously allow gamers to enjoy smooth gaming without any overheat problems and meet energy efficiency requirements.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the availability of a new blue version of their award-winning Vengeance family of DDR3 memory modules. Vengeance DDR3 memory is optimized for overclocking and compatibility, at an attractive price point. The original Vengeance modules, released to critical acclaim in November 2010, are equipped with aluminum heat spreaders anodized in Jet Black.

The new modules offer performance identical to the original, with Cerulean Blue anodized heat spreaders that provide a great match with the latest 2nd generation Intel Core processor family motherboards from ASUS, MSI, and Gigabyte. The striking blue color is shared with Corsair Gaming Series power supplies, allowing users to maintain a consistent color scheme throughout their system. Style-conscious system builders can also mix original Jet Black and new Cerulean Blue Vengeance modules for an even more dramatic look that matches their motherboard.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of its next-generation storage system standard, Universal Flash Storage (UFS). UFS is designed to be the most advanced specification for both embedded and removable flash memory-based storage in mobile devices such as smart phones and tablet computers.

The UFS standard represents an evolutionary progression of JEDEC standards in this field, and has been specifically tailored for mobile applications and computing systems requiring high performance and low power consumption. The initial data throughput for UFS will be 300 megabytes per second (MB/s), and the standard also supports command queuing features to raise random read/write speeds. JESD220 Universal Flash Storage may be downloaded free of charge from the JEDEC website here.

Microsoft today released Service Pack 1 for Windows 7 and Windows 2008 R2, to all users. A Service Pack is a periodical cumulative of updates released between a period of time, that also introduces new features to the OS. For both operating systems based on the Windows 6.1 kernel, Service Pack 1 will provide all product and security updates released to date. A couple of new features that will benefit Windows 2008 R2 are also bundled. These include Dynamic Memory and RemoteFX.

Dynamic Memory lets Hyper-V administrators pool available memory on a physical host and dynamically distribute it to any virtual machine(s) running on that host, while RemoteFX lets Windows Server 2008 R2 administrators provide a rich end user desktop virtualization experience by delivering vivid content, independent of any graphics stack, to server-hosted virtual and session-based desktops. We put Windows 7 Service Pack 1 to test, to see how the updated OS benefits gamers, or if it does in the first place. Our performance analysis can be read here. A list of notable changes with SP1 can be read here.

Exceleram - the Highend MemoryBlacksmith in Landau / Germany announces the availability of 3 new parts of the EP-Series, and expanded its product range. "The EP series includes memory(kits) based on timing latencies of (currently) 1333mhz, but with "air" up to the top, so that overclockers have their fun." says Steffen Eisenstein, Product Manager at Exceleram.

We start with 3 models: the EP3001A, a 2GB 1333MHz CL9 single module. Followed by a 4GB (2x 2GB) 1333MHz CL9 Memorykit and a 6GB (3x 2GB) 1333MHz CL9 kit, both with the known "Rippler" heatsink. The voltage is 1.5 volts and all are exclusively equipped with the famous Power Chip Rev. D 128 x 8 chips.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced that its JC-45 Committee for DRAM Modules intends to form a new Subcommittee focused on the standardisation of hybrid memory modules. To be chaired by PNY Technologies, Inc. and Cypress Semiconductor, the JC-45.6 Hybrid Modules Subcommittee will hold its first meeting in Munich, Germany on February 28, 2011.

Hybrid memory modules are comprised of different types of memory technologies and leverage some of the beneficial characteristics of each, operating as a system instead of as individual components. "I am optimistic about the potential benefits of hybrid modules," said Chris Socci, Chairman of the new JC-45.6 Subcommittee. "For example, modules with a DRAM interface that also incorporate the non-volatile characteristics of NAND flash could provide new options for data security in a variety of storage and backup systems in the event of power loss. This new family of modules has the potential to help entire segments of the market 'go green' by reducing the need for batteries, and may one day extend to all applications that demand memory."

Eurocom announces an addition to its already extensive line of fully configurable, performance based Mobile Notebooks with the EUROCOM Racer. This new model will feature next generation technology from ATI, Intel and NVIDIA and will support Intel's new seventh generation chipset platform, the Huron River HM 65. The EUROCOM Racer is expected to ship February 1, 2011.

The EUROCOM Racer will support up to a 100W GPU which will allow it to run up to an NVIDIA Geforce GTX 485M, AMD Radeon Mobility HD6970M or NVIDIA Quadro FX 3800M graphics solution. A major innovation in the EUROCOM Racer model is support for four memory modules which can be configured with up to 32GB of RAM. The EUROCOM Racer supports both DDR3-1333 and DDR3-1600 memory.

Lexar Media, a leading global provider of memory products for digital media, today announced new Lexar Professional Secure Digital Extended Capacity (SDXC) memory cards. The new high-capacity Lexar Professional 133x SDXC cards enable the capture, storage, and transfer of extended lengths of 1080p high-definition (HD) video and continuous, rapid-fire image capture in a single, high-performance solution. The Lexar Professional 133x SDXC card is the first available in a 128GB capacity, and is also offered in a 64GB capacity. Both cards are speed rated at 133x, providing a minimum guaranteed transfer speed of 20MB per second, and feature a Class 10 speed designation. For additional information about Lexar Professional SDXC cards, visit www.lexar.com.

"The professional photography industry is at a point where digital photo- and video-capture methods are converging, meaning that professional shooters need a memory solution with the versatility and reliability to safely store both photos and videos," said Pachi Chen-Wong, senior product marketing manager, Lexar Media. "The 64GB and 128GB Lexar Professional 133x SDXC cards combine high-speed performance with large capacities to offer solutions for professionals who shoot large volumes of high-resolution images and HD video."

Memory major Kingston Technology is ready to greet Intel's 2011 Core processor family with a new line of DDR3 memory kits tailored for it. The HyperX Genesis, as it's called, combines faster, lower-latency, and lower-voltage DDR3 memory with a new sporty-looking heatsink design that keeps the modules cool while maintaining standard module height. The heatsink is basically two sheets of metal interlocked at the top, with rows of holes to draw in convectional air currents, to cool the heatsink. Kingston's new HyperX Genesis series is expected to be out in early January, 2011.A video presentation showing the modules from almost all angles follows.

Mushkin Enhanced (Mushkin) released two new DDR3-1600 MHz (PC3-12800) memory kits bearing the company's Radioactive-themed FrostByte heatspreaders. The release includes a 4 GB (2x 2 GB) dual-channel kit best suited for socket LGA1156 systems, and a 6 GB (3x 2 GB) triple-channel kit, best suited for LGA1366 systems. The modules operate at 1600 MHz with timings of 7-9-7-24, with module voltage of 1.65V. Backed by a lifetime warranty, the 4 GB kit is priced at US $67.49, and the 6 GB one at $101.49.

The world-famous DRAM module manufacturer KINGMAX presented overclocking DDR3 2400MHz Nano Gaming RAM. It is the unique and the only one DRAM module can be operated at 2400MHz without conventional heat sink. Instead of adding conventional heat sink, Nano Gaming RAM adopts the nano thermal dissipation technology（NTD Tech）to improve thermal performance by 10%. Its bandwidth can reach up to 19.2GB/sec under low voltage which means the performance will be more conspicuously improved in 3D shooting games that involve more rigorous requirements for speed.

Heat dissipation is always the key issue for the stability of system operation. Particularly in overclocking or 3D games, high temperature may easily cause the instability of operation. Targeting the overclocking and game market, KINGMAX DDR3 Nano Gaming Ram adopting NTD Tech increases the effect of heat radiation, it not only keeps the working temperature far lower than conventional heat sinks, but improves thermal dissipation performance by 10%, thereby effectively maintaining low temperature and high stability. In other words, only NTD Tech can replace conventional heat sinks and only Nano Gaming Ram can allow overclocking enthusiasts and gamers to feel free to challenge the overclocking limit.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced it has begun sample shipments of its newly developed 30nm process 4-gigabyte DDR3 SO-DIMM. The new memory module was built using currently available advanced 30nm process DRAM manufacturing technology and is composed of sixteen 2-gigabit DDR3 SDRAMs. It achieves a high density of 4 gigabytes.

Compared with Elpida's 40nm DRAM module, the new product uses 20% less operating current and 30% less standby current consumed by PC systems, and as a DRAM module it achieves one of the lowest levels of current consumption in the industry. The new eco-friendly DRAM product provide an effective power-saving response to today's need for a longer battery life for notebook PCs, netbooks, tablet PCs and other handheld electronic devices.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the launch of a new, highly overclocked, low voltage memory kit. This 4GB Dominator GT memory kit, implemented using a matched pair of 2 GB DIMMs, is guaranteed to operate at 2133MHz, with latency settings of 9-11-9-27, and at a memory voltage of only 1.5V.

"We have seen an increasing number of requests from overclockers for memory that can achieve high clock speeds at lower voltages," stated Thi La, Vice President of Memory Products at Corsair. "At 2133MHz, this 4GB memory is the world's fastest commercially available memory at 1.5 volts."

Patriot Memory, a global pioneer in high-performance memory, NAND flash and computer peripheral solutions today announced the addition of 16GB and 32GB LX Series microSD High Capacity (SDHC) cards. These large capacity cards meet SD Associations Class 10 specifications enabling them to deliver high performance to today's smartphones and other digital devices.

"Today's mobile devices have evolved from simplistic phones to multi-functional tools capable of handling email, music, photos and more," says Meng Jay Choo, Patriot's Flash Product Manager. "Smartphones have become a part of our everyday lives letting us connect with each other. Adding 16GB and 32GB storage solutions let consumers expand the capabilities of these devices."

Micron Technology, Inc. today introduced a portfolio of high-capacity flash memory products that will lengthen the life of NAND for years to come. By integrating the error management techniques in the same NAND package, the new Micron ClearNAND devices alleviate the challenges traditionally found in NAND process shrinks. Micron's ClearNAND portfolio extends the opportunities for more advanced NAND process generations to be used in enterprise servers, tablet PCs, portable media players, and dozens of other consumer applications.

"The pace of NAND scaling is largely responsible for the incredible growth and success the industry has seen to date, and for helping to create new flash-based storage solutions," said Glen Hawk, vice president of Micron's NAND Solutions Group. "While the advantages in NAND scaling are evident, so are the challenges with the technology becoming increasingly more difficult to manage. Micron's ClearNAND products remove this management burden for our customers and extend the life of this all-important technology."

Transcend Information Inc., a worldwide leader in memory and storage products, today launched an 8GB aXeRam DDR3-2000 memory kit that contains two identically matched 4GB memory modules. With a combination of high capacity, high clock speed and exceptionally low voltage of just 1.6V, the new modules are ideal for hardcore gamers, overclockers and professional users reap the benefits of a 64-bit operating system.

64-bit processors have become mainstream in mid-range and high-end systems due to their ability to support memory capacities larger than 4GB, which is essential for memory-hungry applications such as HD video editing, large databases, virtual server farms, etc. With 8GB of total capacity, a clock frequency of 2000MHz and timings of 9-11-9-24, Transcend's newly released dual-channel kit is a comprehensive memory upgrade solution-especially for systems with modern processors running more advanced operating systems.