Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the Vengeance series of high performance DDR3 memory modules for enthusiasts and system builders.

Vengeance memory modules use carefully selected RAMs to enable excellent overclocking results on current and future generation Intel and AMD platforms. All initial Vengeance memory modules have a low 1.5V supply voltage for maximum compatibility and for energy-efficient operation. Vengeance DDR3 memory kits are available in single, dual, or triple module kits, with sizes ranging from 4GB all the way up to 16GB. All Vengeance modules are equipped with aluminum heat spreaders for thermal performance as well as aggressive appearance.

Apacer, one of the world's leading brands of memory modules, announced today its ARES DDR3 Overclocking Memory Module. The newly-unveiled memory module is named after the god of war "ARES." Features include advanced memory chips, zero noise heat pipe cooling system with a large red aluminum heat dissipation fin. It is able to operate at a blazing-fast clock rate of 2400MHz, allowing not only overclockers to create overclocking miracles but hardcore gamers to achieve their optimum performance during the games.

ARES, the god of war, clad in armor dashing in the ferocious battlefield, is thought to have been invincible in Greek mythology. After the previous launch of second-to-none Aeolus equivalent, Apacer again named its DDR3 memory module from the mythology. Just as its name suggested, ARES DDR3 Overclocking Memory Module promises to deliver amazing and stable overclocking performances that feed the needs of the overclocking experts.

Exceleram - the Highend Memory based in Landau, Germany, announces the availability of the first four Rippler Memory Kits. The name Rippler stands for a new Heatsink designed especially for the overclocking community. The German Exceleram Team completed the development and the Rippler Series is ready to ship now. First shipments are leaving the German warehouse this week. The Rippler Series will be expanded during the next weeks.

"We already have customer requests for other Rippler Kits and we will consider them of course." said Martim Reis Silva - Sales Director Exceleram. As a goody, there are also 2 highend kits with black 8layer PCB available. In the beginning the memory will be delivered in a noble aluminiumbox instead of plastic blister.

Mushkin, a global leader in high-performance computer products, announced today the release of 'Redline Ridgeback', a new variation on a heatsink that has become a staple in the high-performance and overclocking communities. Because of its aggressive yet sleek design and incredible heat dissipation qualities, enthusiasts the world over have demanded the Ridgeback heatsink for their memory cooling needs. Now, this exciting piece of technology has been prepared for Mushkin's world-renowned Redline Series with an engaging and strong blood-red appearance.

"The Ridgeback Project has been an exciting project for both myself and our marketing department. Because of Ridgeback's success, we wanted to offer the cooling technology with a sharp new look, and to give customers new aesthetic options. Case modders and system builders now have a striking new look available to them when using Ridgeback. Redline has always been Mushkin's premier memory line, and we're happy to add Ridgeback to its mix. Our new blood-red Ridgeback heatsinks scream 'performance' and offer it in every respect." - Brian Flood, director of product development.

OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) and memory modules for computing devices and systems, unveils new Xtreme Thermal Exchange (XTE) and Blade 2 high-speed desktop memory, providing the optimal balance of blazing DDR3 performance and cooling efficiency in one solution. Committed to staying ahead of the curve in the high performance segment of the memory market, OCZ is offering high-end memory that keeps pace with intensive overclocking, gaming, and other high-productivity computing environments.

"Building on our previous lines of enthusiast overclocking memory, the new XTE and Blade 2 DDR3 memory series are designed to set the benchmark once again and deliver the ultimate in performance and stability," said Alex Mei, CMO of OCZ Technology Group. "Featuring new compact, yet highly efficient heatspreader designs, these hand-tested kits are the ideal solution for overclockers gaming and productivity applications, and are optimized for the latest generation of platforms from Intel and AMD."

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced that it was once again selected as 2010's Best PSU and Best Memory Manufacturer by the readers of Custom PC magazine and bit-tech.net, two of the most respected technology publications in the United Kingdom.

The awards were voted for by Custom PC and bit-tech's audience of performance PC enthusiasts, overclockers and gamers. Choosing the companies they judged to have excelled in 2010, Corsair emerged as the clear victor in both the power supply and memory categories.

Power Quotient International (PQI) has released a series of DDR3 server memory modules in response to the advent of cloud computing. DDR3 Registered/ECC server memory modules are powerful additions to PQI's Power Memory product range and symbolize the technical strength and product integrity of PQI memory modules for enterprise applications. DDR3 Registered/ECC server memory modules continuously undergo complete, complex, and rigorous integrity tests to provide both stable and compatible memory solutions that increase performance and ensure the stability of servers and workstations under year-round, high-speed data processing conditions.

DDR3 Registered/ECC server memory modules consist of carefully selected, originally manufactured DRAM IC's paired with PLL (Phase-Lock Loop) chips made by a well-known manufacturer, as well as high specification PCB's, in order to achieve PQI's main objective: high quality. In particular, the DDR3 1333's 32GB/s (tri-channel mode) transmission bandwidth server memory module is capable of meeting the most demanding server environments and enhancing the overall performance of high-end computing systems.

ASUS has announced the latest addition to its Fermi series of DirectX 11 graphics cards with ENGT430/DI/1GD3 (LP). Powered by the NVIDIA GeForce GT430 graphics processor, the ASUS-designed PCI-Express 2.0 ENGT430/DI/1GD3 (LP) card is ideal for home theatre enthusiasts and casual gamers. Built using a specially designed low profile PCB (printed circuit board), the ASUS ENGT430 includes NVIDIA PureVideo engine that accelerates even Blu-ray 3D media. Its use of the highest quality components, including ASUS Dust-Proof fan, GPU Guard, and Fuse Protection ensures that the ASUS ENGT430 remains stable and reliable for long-term use.

Barely a week after pictures of AMD's "Barts" prototype surfaced, it wasn't long before a specifications sheet followed. The all-important slide from AMD's presentation to its add-in board partners made it to sections of the Chinese media. "Barts" is a successor to "Juniper", on which are based the Radeon HD 5750 and HD 5770. The specs sheet reveals that while indeed the GPU looks to be larger physically, there are other factors that make it big:

Memory Controller
Barts has a 256-bit wide memory interface, which significantly increases its pin-count, and package-size. The "Pro" and "XT" variants (which will go on to be HD 6x50 and HD 6x70, respectively), have memory clocked at 1000 MHz and 1200 MHz, respectively, so that's nearly 100% increase in memory bandwidth .

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has expanded its 'Green Memory' initiative going beyond DRAM and solid state drives (SSDs) to include several memory products for PC and mobile application areas. At the seventh annual Samsung Mobile Solutions Forum being held here today, Samsung announced that its 'Green Memory' initiative will now include Samsung LPDDR2 and GDDR5 green memory as well as its GreenDDR3 and Green SSDs.

Stepping up its efforts to increase worldwide interest in Green IT products and eco-friendly solutions, a new website has been launched to promote the expanded initiative to OEM customers and consumers. It provides detailed information on Samsung's green product strategies and green-focused partners, for all three market areas, as well as industry-wide green IT trends.

Toshiba America Electronic Components, Inc. and its parent company Toshiba Corporation, a leading innovator in NAND flash memory technologies and solutions, today announced the launch of 8GB (gigabyte) 16GB and 32GB SDHC UHS-I cards compliant with the SD Memory Card Standard Ver. 3.0 (SD 3.0), UHS104. These new SD cards offer the world's fastest SDHC data read and write speeds.

Toshiba also extended its industry leadership in memory card solutions by unveiling the world's first 4GB, 8GB and 16GB microSDHC UHS-I cards compliant with (SD 3.0), UHS50. Mass production of the new SDHC UHS-I cards and sample shipments of the new microSDHC UHS-I cards will start this November.

Toshiba Corporation, reinforcing its leadership in the development and fabrication of cutting-edge, high density NAND flash memories, has announced that it today started mass production of NAND flash memories fabricated with 24nm*1 process technology. This latest technology advance has already been applied to 2bit-per-cell 64-gigabit (Gb) chips that are the world's smallest and offer the highest density on a single chip (8 gigabytes (GB))*2, and which are available from today. Toshiba will also add 32Gb and 3bit per cell products fabricated with the 24nm process technology to its product line-up.

Toshiba leads the industry in fabricating high density, small die size NAND flash memory chips. Application of the 24nm generation process technology will further shrink chip size, allowing Toshiba to boost productivity and bring further enhancements to high density, small sized products. The 24nm process products are also equipped with Toggle DDR, which enhances data transfer speed.

Lexar Media, a leading global provider of memory products for digital media, today announced Crucial Ballistix high-performance memory modules with thermal sensor and temperature-monitoring utility, encased in a radically redesigned and more effective heat spreader. The thermal sensor and monitoring utility allow PC enthusiasts to view memory module temperature in real time, a major benefit for overclockers and enthusiast users constantly battling against excessive system heat. Additionally, the new Crucial Ballistix modules feature a redesigned "finned" heat spreader design that reduces memory module temperature by up to 30% more than the current Crucial Ballistix design. The new Crucial Ballistix modules are initially available exclusively at popular online retailer Newegg.com.

"Ask any PC enthusiast and they'll tell you that system heat is a constant concern," said Crucial Ballistix senior product manager, Jeremy Mortenson. "Our new Crucial Ballistix memory modules offer two incredibly effective tools in memory cooling: thermal sensors for temperature monitoring, and an improved heat spreader design."

Lexar Media, a leading global provider of memory products for digital media, today introduced 8GB Crucial DDR3-1066 (PC3-8500) CL9 very low-profile (VLP), ECC registered dual in-line memory modules (RDIMMs), enabling blade and low-profile server users to populate their systems with up to 144GB of memory, depending upon motherboard and processor configuration. Additionally, these new high-density, low-profile modules are guaranteed compatible with Intel Xeon processors based on the Nehalem architecture. The 8GB Crucial VLP RDIMM modules are available through select resellers worldwide and online.

VLP memory modules enable powerful and compact computing power within server systems, because they are designed to stand vertically in order to accommodate additional memory modules and enable improved system airflow. Blade servers, as well as servers utilized for virtualization, will benefit from these new high-density Crucial VLP modules.

Patriot Memory, a global pioneer in high-performance memory, NAND flash, storage and enthusiast computer products, today expanded their lineup of DDR3 memory solutions with the launch of its new ultra-high performance Viper II Series Sector 5 Edition Extreme Performance DDR3 memory for Intel P55 platforms.

Patriot Viper II Series Sector 5 Edition modules pass a thorough qualification and screening process on multiple high-performance motherboards using the Intel P55 chipset platforms and Intel Core i7 CPUs to ensure performance at 2500MHz with latency timings of 9-11-9-27. These modules are targeted and designed specifically for performance enthusiasts and overclockers looking to set new benchmark records and push the boundaries of computing performance.

Intel Corporation today culminated the transition to the company's award-winning "Nehalem" chip design with the launch of the Intel Xeon 7500 processor series. In less than 90 days, Intel has introduced all-new 2010 PC, laptop and server processors that increase energy efficiency and computing speed and include a multitude of new features that make computers more intelligent, flexible and reliable.

Expandable to include from two to 256 chips per server, the new Intel Xeon processors have an average performance three times that of Intel's existing Xeon 7400 series on common, leading enterprise benchmarks, and come equipped with more than 20 new reliability features.

Walton Chaintech, one of the world's most well-known memory and storage device manufacturers, announces the availability of its latest memory clock that can reach a memory speed of 2400MHz. To address consumers' diversifying high-speed computing platform needs, this new clock is the industry's fastest computing clock with a transmission bandwidth of 19,200MB/sec per transmission. No more will users be restricted by memory bandwidth when faced with system overclocking, they will be able to maximize their computing systems' performance and potential.

The all-new APOGEE GT DDR3-2400 memory utilizes a 1.6V voltage and 9-11-10-27 timing operation process. Not only is this more powerful than many products currently in the market, different users' requests can be met as Walton Chaintech provides two-in-one KIT packs that are compatible with the widely-used dual-channel motherboards. Users do not have to worry about modular selection; system compatibility is enhanced because the KIT provides two types of capacities, 1GB x2 and 2GB x2, giving users more flexibility.

Mushkin Enhanced, a global leader in high-performance computer products, announced today the release of 'Ridgeback', a new heatsink designed for the gaming and enthusiast communities. The initial series of Ridgeback kits will offer DDR3-1600 performance for Intel's LGA1366 and LGA1156 platforms at two different latency levels, as well as a DDR2-1066 solution. In the near future, kits for AMD's AM3+ and other platforms will be available.

"The Ridgeback Project has been an exciting project for both myself and our marketing department. We've worked hard to develop this world-class memory cooling solution. Ridgeback will help ensure that modules work well in intense, high-labor scenarios and will also look elegant in many types of installations," said Brian Flood, director of product development.

Patriot today announced the launch of its new Sector 5 Series Extreme Performance DDR3 memory. Designed specifically for overclockers and enthusiasts using Intel based platforms, the Sector 5 boasts an amazing 2250MHz with timings of 9-9-9-27. Individually hand tested on the Intel P55 chipset platform; the Sector 5 modules offer incredible performance for users looking to reach new heights in overclocking and benchmarking. Engineered for the gaming enthusiast and intense overclocker, the Sector 5 is one of the fastest modules on the market and will be offered as a 4GB kit (2 x 2GB modules) under the part number PVV34G2250LLK.

"Our goal is to provide the hardcore enthusiast with a performance module that is actually going to perform at the specified timing with stability", says Les Henry, Patriot's VP of Engineering. "Consumers can feel confident that what we advertise for our speeds and timing is true to the specifications. Additionally, users can expect headroom to reach faster speeds. We have been able to hit speeds over 2400MHz with these modules in our lab."

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of a family of compatible device specifications for Serial Presence Detect (SPD) EEPROMs, Thermal Sensors (TS), and combination devices with both SPD and TS in a single package. The specifications offer advanced power management features for a wide array of applications, and may be downloaded free of charge at JEDEC.org.

"These chips are being applied in a wide range of applications from handheld devices to telecommunications equipment and data servers," said Desi Rhoden, Chairman of JEDEC's JC-42 Committee for Random Access Memory (RAM). He added, "The demand for green technologies has the industry looking for new ways to measure and conserve power. This family of devices gives a way to accurately measure temperatures to less than half a degree so that systems can automatically adjust their energy usage in response to customer's needs."

KINGMAX, leading manufacturer of DRAM Module and Flash Products, announces the high density solution for DDR3 memory for Intel Core i5 and i7, provide the most stable compatibility for desktop and laptop platforms. These DIMMs are available in single, dual and triple channel configurations and are specifically tuned for Intel CPUs; unleash the best performance for gaming operation.

KINGMAX high density solution DRAM Module improves the performance of 64 bit OS efficiently. The efficiency would be upturned after adopting KINGMAX high density DRAM Module, while operating video decoding, large image file handling and modifying and performance demanding games.

G.Skill International Co. Ltd., manufacturer of extreme performance memory and high performance solid-state storage, has today released its ultimate DDR3 memory kit. At 2400 MHz CL9 and 2000 MHz CL6, these ultra high frequency memory modules are available in standard 4GB (2GBx2) memory kits and are specifically tailored for Intel's P55 chipset and LGA-1156 CPUs.

The 2,400MHz CL9 memory modules are the fastest commercially available memory product in the world, allowing overclocking enthusiasts to reach unprecedented levels of performance to achieve the ultimate PC. In addition, G.Skill has also announced a series of ultra low latency DDR3 2,000MHz memory kits, including an extreme CL6, followed by CL7, CL8 and CL9, which perfectly match current Intel Core i5 750 and Core i7 860, 870 CPUs.

World class flash memory module manufacturer, Silicon Power announces today the new Xpower DDR3 overclocking series memory module. Complete with dual (2GBx2) and tri-channel (2GBx3) packs, it is available in DDR3-1600, 1800, 2000, 2133 MHz variants. Completely compatible with Intel quad-core Core i5 and Core i7 platforms, Xpower DDR3 modules use "oblique groove manufacturing process" and pure aluminum heat sink to resolve heat dissipation issues. In addition, Xpower DDR3 applies 1.65V to maintain high speed and stability to meet the needs of enthusiasts and gamers.

The oblique groove heat sink design of Silicon Power's Xpower DDR3 overclocking series increases the heat dissipation area of the heat sink and can provide up to twice the heat dissipation ability over standard heat sinks. In addition, the Xpower DDR3 series use 8-layered PCBs and new fly-by topology design for more efficient commands, addresses, control signals, and clocks signals. It also supports On-DIE Termination (ODT) to dramatically reduce unwanted reflection signals and maximize speed. Silicon Power insists on using original memory modules and FBGA packaging for better heat dissipation and accurate data transfer.

GeIL announces the launch of the all new DDR3 Gaming Series Black Dragon Triple Channel Kit to be added to the performance DDR3 memory module lineup. The Gaming Series DDR3 Black Dragon Triple Channel Kits will be available for the full range of speed with enhanced performance and stability by GeILs' DBT - Die-hard Burn-in Technology.

Available Speeds:

• 1066 MHz CL7&8, 1333 MHz CL6, 7&9, 1600 MHz CL7,8&9,
• 1800 MHz CL7, 8&9, 2000 MHz CL8&9, 2133 MHz CL9

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had completed development of a 65nm XS extra-shrink version 1-Gigabit DDR3 SDRAM that is as cost-competitive as 50nm process memory devices.

In response to the slump in the DRAM market that has lasted since 2008, Elpida is taking a two-track R&D approach that focuses on conventional process migration and on layout innovations that reduce the cost of capital investment. Along with migrating to advanced processes such as 50nm and 40nm the company is developing shrunken chip versions through extensive use of existing ArF dry scanner equipment. As a result, a 65nm S shrink version was developed in 2008 and now a 65nm XS extra-shrink version has been completed.

The 65nm XS is a smaller version of the already shrunken 65nm S and delivers 25% more chips per 300mm wafer compared with its predecessor. In addition to its extremely small chip size the XS shortens the manufacturing process and helps to greatly reduce equipment costs through the use of ArF dry scanner equipment. Chips costs are comparable to 50nm process products.