Lexar Media, a leading global provider of memory products for digital media, today announced the immediate availability of Ballistix DDR3-1333 (PC3-10600) and DDR3-1600 (PC3-12800) three channel DDR3 memory kits. These new kits support the latest Intel chipset technology, based on the Core i7 processors. Ballistix three channel DDR3 memory kits are available in 3GB and 6GB kits through select resellers and directly from Crucial's website.

G.Skill International Co. Ltd., a world leader in extreme performance memory with solid quality, today announces Triple Channel DDR3 2000HMz performance memory at enhanced CL 7-8-7 timings and is designed for the latest Intel Core i7 processors / Intel X58 Express Chipset. This combination affords unparalleled performance margins allowing for the very best Overclocking and memory bandwidth.

A team at Rice University has determined that a strip of graphite only 10 atoms thick can serve as the basic element in a new type of memory, making massive amounts of storage available for computers, handheld media players, cell phones and cameras. In new research available online in Nature Materials, Rice professor James Tour and postdoctoral researchers Yubao Li and Alexander Sinitskii describe a solid-state device that takes advantage of the conducting properties of graphene. Tour said such a device would have many advantages over today's state-of-the-art flash memory and other new technologies. Graphene memory would increase the amount of storage in a two-dimensional array by a factor of five, he said, as individual bits could be made smaller than 10 nanometers, compared to the 45-nanometer circuitry in today's flash memory chips. The new switches can be controlled by two terminals instead of three, as in current chips.

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today introduced the Blade Series Triple Channel Memory kit, the latest maximum-performance RAM designed specifically for the Intel Core i7 processor / Intel X58 Express Chipset. At DDR3-2000 CL 7-8-7, the Blade Series harnesses industry-leading speeds at the low voltage required to safely run Core i7's triple channel mode. With the ideal combination of all the factors that formulate the ultimate memory solution- density, speed, latency, and an effective new cooling design-the Blade 2000 kit is guaranteed to please enthusiasts looking to take the hottest Intel platform to new heights.

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today unveiled the Flex EX memory series, featuring breakneck speeds demanded by enthusiasts in an updated compact form factor to maximize memory configurations on your motherboard. These premium high-density modules operate at incredibly fast DDR2 and DDR3 speeds to run the latest memory-intensive games and applications, and offer enthusiasts the thermal management necessary for the stability and performance on high-end gaming and overclocking systems.

Unveiled minutes ago, Corsair is now preparing a brand new series of blazing-fast tri-channel DDR3 DOMINATOR GT modules. Just like a modern fast car, these modules have their own distinctive marks - black and red heatspreaders and special red labels. Initially, Corsair is going to launch a kit that consists of three 2GB modules operating at 2,000MHz at just 1.65V with low latencies of CL7-8-7-20. The new modules are set to become available in "very near future".

Elpida Memory today announced that it had completed development of a 50nm process 2-gigabit Mobile RAM product using 50nm process technology with 193nm (ArF) immersion lithography and copper interconnect. The ultra low-power features of Mobile RAM are ideal for use in mobile phones, portable multimedia devices, portable internet-related devices and other handheld device applications. In its development of Mobile RAM Elpida has focused on conserving electric current. Compared with 70nm products the new 50nm product uses less than half the data retention current and half the operating current. These enhanced features enable double the memory capacity without an increase in system power consumption.

Memory maker A-DATA Technology announced today its latest A-DATA XPG DDR3-1800+ memory kits. Part of the Plus series, these kits are available now in both 2x1GB and 2x2GB dual channel kits, and in triple channel retail packages of 3x1GB and 3x2GB. The kits are JEDEC programmed to operate using CL9-9-9-24 timings, but despite that A-DATA claims flawless operation using CL8-8-8-24 at 1.65V-1.85V. In addition A-DATA ships these kits with limited lifetime warranty and shiny red heatspreaders. For more information, please read the full press release here.

Elpida Memory, Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that its Board of Directors has decided to acquire a portion of the shares its strategic partner Powerchip Semiconductor Corporation (PSC) owns in Rexchip Electronics Corporation (Rexchip), a Taiwan-based manufacturing joint venture created by PSC and Elpida. Details of the share acquisition appear below.

GeIL Memory USA debuts today no less than 22 new triple-channel DDR3 kits, yes twenty two indeed. These kits are part of the company's Value and Utra series. All kits come with lifetime warranty and aluminum heatspreaders. The full list of all memory kits follows below.

Elpida Memory, Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it has completed development of a 50nm process DDR3 SDRAM. The new DRAM product features the lowest power consumption in the industry, 2.5Gbps ultra high speed and a 1.2V low voltage operation based on the industry's smallest chip size. The new 50nm process DDR3 SDRAM was developed using the industry's most advanced 193nm (ArF) immersion lithography technology and copper interconnect technology and has a chip size of less than 40mm2. Also, the new SDRAM is an eco-friendly DRAM. It operates on not only DDR3 standard 1.5V supply voltage but even lower voltages of 1.35V and 1.2V and contributes to the low-power operations of high-density memory systems such as servers and data centers.

Lexar Media, a leading global provider of memory products for digital media, today announced the immediate availability of Crucial DDR3-1066 (PC3-8500) and DDR3-1333 (PC3-10600) three channel memory kits in support of Intel's next generation Core i7 processors. Users ready to harness the power of three channel memory can find guaranteed-compatible Crucial DDR3 modules in 3GB, 6GB and 12GB kits at Crucial.

Intel Corporation and Micron Technology Inc. today announced mass production of their jointly developed 34nm, 32 gigabit multi-level cell (MLC) NAND flash memory device. Developed and manufactured by the companies' NAND flash joint venture, IM Flash Technologies (IMFT), the process technology is the most advanced process available on the market and enables the industry's only monolithic 32 Gb NAND chip that fits into a standard 48-lead thin small-outline package (TSOP). The companies are ahead of schedule with 34nm NAND production, expecting their Lehi facility to have transitioned more than 50 percent of its capacity to 34nm by year's end.

GeIL Memory has just released the new EVO Cyclone memory cooler. At first sight this cooler is like most other similar solutions on the market, but it has one unique feature. The single fan that cools the memory has a LED display and embedded thermal sensor, that displays the surrounding temperature and real-time fan speed. Apart from this, the 50mm cooler spins at 3400rpm and produces only 21dBa noise. The EVO Cyclone also comes with a height-adjustable clip designed that fits even memory modules with large heatsinks. GeIL is expected to ship the EVO Cyclone in the weeks to come. To learn more about the product, please go to this page.

Nanya Technology Corporation, one of the worldwide leading DRAM manufacturers, today announced it is shipping 800MHz DDR2 registered dual in-line memory module (RDIMM) designed specifically for the new Quad-Core AMD Opteron processor, to help optimize performance of high-end server systems and workstation applications.
"Nanya worked closely with AMD on the launch of the Quad-Core AMD Opteron processor (codenamed "Shanghai") to ensure that Nanya DDR2 800 RDIMM would take advantage of the dramatic enhancements in energy efficiency and performance enabled by the new Quad-Core AMD Opteron processors," said Dr. Pei Lin Pai, Vice President of Global Sales & Marketing and Spokesman of Nanya Technology Corporation.

Mushkin, Inc., a global leader in high-performance memory products, today announced the release of its triple-channel memory kits designed specifically for the new Intel Core i7 platform. The flagship offering of the new memory kits is the XP3-12800 7-8-7, allowing end users to extract higher performance at 1600MT/s than competitors' products while staying within safe operating voltages. Additionally, early adopters of the new platform will find Mushkin's triple-channel products stable and reliable, ensuring a trouble-free migration.

"We've worked diligently to create parts for the Core i7 platform that push specifications to unprecedented levels while maintaining the high quality and reliability standards of our existing products," said Brian Flood, director of product development for Mushkin. "Our triple-pack customers will be rewarded with the utmost reliability from our standard rated products, and greatly increased performance from our high performance line."

Kingston Technology Company announced today that it is starting to ship select DDR2 and DDR3 HyperX memory modules with its new T1 heatspreaders. The taller heatspreaders utilize HyperX Thermal Xchange (HTX) technology to further diffuse heat buildup when overclocking. HTX technology is the latest innovation from Kingston's engineers. It includes bigger heatspreaders made of heavy-duty extruded aluminum and extended fins for maximum thermal conductivity. The new series includes both dual and triple channel kits. All Kingston HyperX products are backed by a lifetime warranty and free 24/7 technical support, the HyperX T1 series makes no exception.

• KHX16000D3T1K3/3GX - 3GB 2000MHz (CL9-9-9-27 @ 1.65v) DDR3 kit of 3 optimized for XMP - $ 435.00
• KHX14900D3T1K3/3GX - 3GB 1866MHz (CL9-9-9-27 @ 1.65v) DDR3 kit of 3 optimized for XMP - $ 403.00
• KHX14400D3T1K3/3GX - 3GB 1800MHz (CL9-9-9-27 @ 1.65v) DDR3 kit of 3 optimized for XMP - $ 397.00
• KHX16000D3T1K2/2GN - 2GB 2000MHz (CL9-9-9-27 @ 2.0v) DDR3 kit of 2 NVIDIA SLI-ready - $ 295.00
• KHX14400D3T1K2/2G - 2GB 1800MHz (CL8-8-8-24 @ 1.9v) DDR3 kit of 2 - $ 279.00
• KHX8500D2T1K2/4G - 4GB 1066MHz (CL5-5-5-15 @ 2.2-2.3v) DDR2 kit of 2 - $ 177.00
• KHX6400D2T1K2/2G - 2GB 800MHz (CL5-5-5-15 @ 2.0v) DDR2 kit of 2 - $ 55.00

After Corsair dropped off some of its latest Dominator 2 DDR3 memory kits for testing with the new Nehalem platform, various sites immediatelly acknowledged that there're some changes in the DHX coolers that cool the new memories. The new approach will be called DHX+ and it consists of a modified thick-sink design where an additional fins are bolted on the top of the cooler. Now HEXUS.net has unveiled that the DHX+ technology will also offer enthusiasts to futher cool the memory by attaching a water cooled TEC block on top. The block appears to be still in development, so we'll have to wait a little bit more until more information is available. The Pelt/waterblock combination should allow extra voltage to be pushed through appropriately selected RAM modules without killing them, potentially yielding higher clock rates and lower latencies.

After OCZ, Corsair and G.Skill, Kingston is now launching new HyperX DDR3 triple-channel kits designed specifically for the new Intel-based X58 motherboards.
"Kingston is excited to bring the fastest DDR3 triple channel memory products to market as we are the first to deliver 2000MHz gaming kits of three with Intel's reduced voltage," said Mark Tekunoff, senior technology manager, Kingston. "All of our triple-channel kits can be overclocked manually or by using XMP-ready profiles. The 2GHz modules have been tested to support up to that speed on ASUS P6T Deluxe motherboards while the Intel DX58SO motherboards have been tested up to 1600MHz."
In addition to the top-of-the-line 2000MHz modules, Kingston's family of triple-channel kits include 1866MHz, 1800MHz, and low-latency 1600MHz and 1375MHz speeds. Kingston ValueRAM kits of three are also available in 1333MHz and 1066MHz speeds:

• KHX16000D3K3/3GX - 3GB (3x1GB) 2000MHz CL9-9-9-27 @ 1.65V, optimized for XMP $334.00
• KHX14900D3K3/3GX - 3GB (3x1GB) 1866MHz CL9-9-9-27 @ 1.65V, optimized for XMP $317.00
• KHX14400D3K3/3GX - 3GB (3x1GB) 1800MHz CL9-9-9-27 @ 1.65V, optimized for XMP $312.00
• KHX12800D3LLK3/3GX - 3GB (3x1GB) 1600MHz CL8-8-8-24 @ 1.65V, optimized for XMP $285.00
• KHX11000D3LLK3/3GX - 3GB (3x1GB) 1375MHz CL7-7-7-20 @ 1.65V, optimized for XMP $192.00
• KVR1333D3N9K3/6G - 6GB (3x2GB) 1333MHz CL9-9-9 @ 1.5V, ValueRAM kit $240.00
• KVR1333D3N9K3/3G - 3GB (3x1GB) 1333MHz CL9-9-9 @ 1.5V, ValueRAM kit $132.00
• KVR1066D3N7K3/6G - 6GB (3x2GB) 1066MHz CL7-7-7 @ 1.5V, ValueRAM kit $240.00
• KVR1066D3N7K3/3G - 3GB (3x2GB) 1066MHz CL7-7-7 @ 1.5V, ValueRAM kit $132.00

Keeping up with the competition, G.Skill Memory is also making debut with a full line of DDR3 performance memory products designed for the Intel Core i7 processors and the Intel X58 Express chipset. Included are a total of four G.SKILL 3GB and 6GB triple memory kits with DDR3 1333MHz and 1600MHz frequencies for enthusiasts, overclockers, and early-adopters:

• F3-10666CL9T-3GBNQ: 3GB (1GB x 3) DDR3-1333 (PC3 10666), CL9-9-9-24 @ 1.5-1.6V
• F3-10666CL9T-6GBNQ: 6GB (2GB x 3) DDR3-1333 (PC3 10666), CL9-9-9-24 @ 1.5-1.6V
• F3-12800CL9T-3GBNQ: 3GB (1GB x 3) DDR3-1600 (PC3 12800), CL9-9-9-24 @ 1.5-1.6V
• F3-12800CL9T-6GBNQ: 6GB (2GB x 3) DDR3-1600 (PC3 12800), CL9-9-9-24 @ 1.5-1.6V

All kits are backed by G.Skill's lifetime warranty.

Patriot Memory, a global provider of premium quality memory modules and flash memory solutions, has decided to add some color to its Viper memory kits by bundling them with Futuremark's 3DMark Vantage benchmarking software. The bundle offers selected Patriot high-performance DDR2 and DDR3 Viper series gaming memory kits with the Advanced Edition of Vantage and even better, the software comes preloaded on a Patriot 2GB Xporter Razzo USB flash which is also included in the bundle. The product bundles are listed below:

• PVS32G2000LLKNB - DDR3 2GB 2000MHz Low Latency (9-9-9-24) with NVIDIA EPP 2.0 support
• PVS32G1800LLKNB - DDR3 2GB 1800MHz Low Latency (8-8-8-20) with NVIDIA EPP 2.0 support
• PVS34G1333LLKB - DDR3 4GB 1333MHz Low Latency (7-7-7-20)
• PVS24G8500ELKNB - DDR2 4GB 1066MHz Enhanced Latency (5-5-5-15) with NVIDIA EPP support
• PVS24G6400LLKNB - DDR2 4GB 800MHz Low Latency (4-4-4-12) with NVIDIA EPP support

Patriot Memory, a global provider of premium quality memory module and flash memory solutions, today announced the release of their Viper series Tri-Channel memory kits designed for the forthcoming Intel Core i7/Intel X58 Express Chipset. Available in both 3GB and 6GB kits, these newly engineered memory kits come with the award winning Viper series heat shields and are the perfect balance of speed and latency while achieving lower voltage requirements.

"Intel's Nehalem architecture shows significant improvements over previous platforms," says Les Henry, Technical Director for Patriot Memory.

"High performance DDR3 DIMMs from Patriot Memory, combined with the phenomenal memory bandwidth & processing capability of Intel's upcoming Core i7 microprocessors, will deliver exciting levels of performance to PC enthusiasts worldwide," said, Steve R. Peterson, Intel's Director of Chipset & Graphics Marketing.

Corsair has announced the availability of two tri-channel DDR3 memory kits for the upcoming Core i7-supportive X58 platform. Corsair claims to have extensively tested these kits for stable operation on various X58 chipset-based motherboards. The kits are value-oriented, and come under the XMS3 series.

There's a 3GB (3x 1GB, model: TR3X3G1333C9) kit, and a 6 GB (3x 2GB, model: TR3X6G1333C9) kit. Both kits operate at 1333 MHz, with timings of 9-9-9-24. The modules use simplistic aluminum heatspreaders, with no fancy DHX cooling mechanisms. This could be attributed to the fact that they are value oriented, and that they could be operating at low voltages of 1.60V, and therefore, small thermal footprint. The 3 GB kit is priced at US $ 167, while the 6 GB kit is priced at $ 316.

Toshiba Corporation today announced that Toshiba and SanDisk have signed a non-binding memorandum of understanding on the reallocation of wafer output and equipment ownership and funding at their two joint ventures producing NAND flash memory on 300 millimeter (mm) wafers at Toshiba's Yokkaichi Operations in Japan, in response to a proposal from SanDisk. The move is designed to enhance the production flexibility of NAND flash memory in line with the rapidly changing marketplace and to optimize each company's business strategies. The details will be set forth in definitive agreements.

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today unveiled the industry's first triple channel memory kit designed specifically for the impending Intel Core i7 processor / Intel X58 Express Chipset. Optimized for the Core i7's triple channel mode, these new 3GB and 6GB kits ensure optimal performance via an ideal combination of low voltage requirements, speed, and latency.