Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, today announced that it has developed a prototype fusion memory chip that can significantly increase the data processing speed between processors in mobile applications. Samsung's new fusion solution OneDRAM is expected to be specified in the design of handsets, game consoles and in other digital applications, especially those that use 3-dimensional graphics.

TwinMOS recently introduced the brand new TwiSTER DDR2-850 DRAM modules situated between the TwiSTER DDR2-800 and TwiSTER DDR2-1066 flagmans. The TwiSTER DDR2-850 modules will be available in 512MB and 1024MB densities. Both modules work at CL5 with nominal frequency of 850MHz(DDR). New-generation, high-performance 0.09μm original dies in a 64Mx8 configuration are used, along with the latest FBGA (Fine-Pitch Ball Grid Array) packaging technology, for both the 512MB and 1GB models. As a world-leading DRAM manufacturer, all TwinMOS products are RoHS compliant.

Kingmax released yesterday the latest version of its SuperRAM DDR400. Kingmax's SuperRAM series adheres to standards by using TSOP packaging technology and high-quality IC chips to achieve the high-quality performance required of Kingmax products. The new SuperRAM DDR400 uses deep blue PCB instead of the previous red. In addition, Kingmax has built in into the front side of the SuperRAM DDR400 PCB decoder ASIC IC chip, which uses Kingmax's proprietary TinyBGA packaging technology.

SanDisk and Sony today announced the development of a new Memory Stick PRO-HG format, compatible with the existing Memory Stick PRO format. The Memory Stick Duo sized card extends the maximum storage capacity by up to 32GB, and boost performance by increasing the internal core clock from 40MHz to 60MHz. As a result, the maximum data rate has jumped to 60MB/sec - three times that of the Memory Stick PRO format. Minimum write speed for Memory Stick PRO-HG media is listed at 15MB/sec. The first Memory Stick PRO-HG media will be available in January 2007, but there is no information when the format's maximum 32GB storage capacity will be reached.

Elpida Memory, Inc. and Powerchip Semiconductor Corp.(PSC) jointly announce that both parties will establish a new joint venture company to operate DRAM fabrication facilities in Central Taiwan Science Park with a total planned capacity of 240,000 12" wafers per month, making this site the largest concentration of 12" DRAM fabrication facilities in the world. At the same time, both parties have also agreed to jointly develop a part of next generation process technology. Through manufacturing and development collaborations, the alliance between Elpida and PSC will help combine the strengths of the Japanese and Taiwanese DRAM industries, where both parties will be in an excellent position to collectively strive for the number one position in the DRAM industry.

Super Talent technology today announced its 2GB DDR2-667 ECC Registered and 2GB DDR2-667 FB-DIMMs. The new 2GB DDR2-667 ECC Registered DIMMs have been certified by Supermicro for use in eight-way server motherboards featuring AMD's Opteron dual-core processors. These modules have also earned CMTL certification as well. You also recieve Lifetime warranty. Super Talent 2GB DDR2-667 ECC Registered and DDR2-667 FB-DIMMs are available immediately with OEM pricing starting at $350.

Kingston announced today the HyperX PC9200(1150MHz) and PC9600(1200MHz) high performance memory. Both HyperX memory modules are rated at CL5-5-5-15 timings with 2.3-2.35V operational voltage. For optimal performance, Kingston recommends motherboards designed by ASUS based on the latest NVIDIA nForce 600 series and Intel i965 chipsets. Kingston's HyperX PC9200 and PC9600 memory modules are currently available in 512MB and 1GB single channel, as well as 1GB and 2GB dual channel kits. Each module endures 24 hours of burn-in reliability testing, extensive dynamic testing and visual inspection. Kingston's memory comes with a lifetime warranty and 24/7 technical support.

G.Skill International Enterprise launches 2 sets high capacity memory modules in DDR2-800 CL6 and DDR2-667 CL5.

After waiting for 5 years, Microsoft starts to ship the new generation O.S. - VISTA. The global computer users are looking for high capacity memory modules to be capable of running it. G.Skill International Enterprise provides two different speed 2GB capacity module for mainstream. All users can catch the latest O.S. trend in saving price.

Corsair today expanded its Fully Buffered DIMM (FB-DIMM) DDR2-667MHz family of products to support the latest dual-core Intel Xeon based platforms. Corsair high density high-speed FB-DIMMs offer enhanced memory throughput allowing for superior application responsiveness. Based on the JEDEC standards, the new DDR2-667Mhz FB-DIMMs are designed to provide ultimate flexibility and expandability to balance capabilities of Intel dual core processors. Corsair FB-DIMMs and servers modules come with a lifetime warranty and dedicated technical supports. For more information on the new 2GB DDR2-667MHz FB-DIMM memory modules, go here.

Hynix today announced it has developed the world's fastest and smallest 512Megabit mobile DRAM. This product meets JEDEC standards and operates at 200MHz - the fastest in the industry. By using 32-bit wide I/Os, Hynix's 512Mb mobile DDR SDRAM processes 1.6Gbytes (400 bps x32) of data per second, which is approximately 1.5 times faster than speed of the company's existing mobile DRAM products. The new product is expected to enhance the company's competitiveness in mobile applications, which is driving the trend towards miniaturization(8mm x 10mm). Moreover, Hynix is expected to combine 512Mb mobile DRAM and NAND Flash in a multi-chip package (MCP), which will enable the design of slimmer mobile phones.