Kingston Technology Company, Inc., the independent world leader in memory products, today announced the launch of the new Kingston HyperX Predator. The new high-performance DRAM module complements the HyperX product range with the fastest speeds, lowest latencies and highest capacities. HyperX Predator is aimed at extreme enthusiasts and overclockers looking to push their systems to the maximum with the fastest speeds and highest performance hardware.

With its new heatspreader, HyperX Predator offers a more aggressive design, which accompanies the look and design of the latest PC hardware, and provides great heat dissipation to optimize memory reliability. The memory is Intel XMP certified and has been fully tested and validated on a top range of motherboards currently available on the market. End users can easily overclock their systems by simply selecting a profile in BIOS with no need for manual adjustments.

Integrated Device Technology, Inc. (IDT), the Analog and Digital Company delivering essential mixed-signal semiconductor solutions, today announced that it will be presenting on the NVM Express (NVMe) specification as well as exhibiting its latest enterprise flash controller products in booth #707 at the Flash Memory Summit, held in Santa Clara, CA on August 21-23.

Peter Onufryk, director of engineering in the Enterprise Computing Division at IDT, will present "How the Streamlined Architecture of NVM Express Enables High Performance PCIe SSDs." The presentation will provide an overview of NVM Express along with a detailed outline of the specification's performance features.

PNY Technologies, world renowned manufacturing giant, for USB and Memory products have released the sleek and sophisticated model HP v275w USB flash pendrive. Incorporating style, durability with functionality, the HP v275w is the ideal choice for storing and transfer of documents and files anywhere with flair and ease.

Decorated with premium scratch proof metallic casing and unique mirror reflective design, it lends a sharp and professional appeal to the drive, perfect for your business work or presentations. The waterproof, dustproof and shockproof features enable protection of precious data and uninterrupted sharing in the long run. Eliminating the use of caps, the HP v275w uses slide in and out feature for quick and effortless plug and use operation without the hassles of fretting over a misplaced cap. The drive also has a lanyard loop that can be attached to your wallet or any other accessory.

Toshiba Corporation (TOKYO:6502) today announced an adjustment to production of NAND flash memory at its Yokkaichi Operation plant in Mie Prefecture, Japan, that will cut Toshiba's production by approximately 30%, effective from today.

Oversupply of NAND flash memory in the retail market, for application in USB memories and memory cards, has resulted in continual price declines since the beginning of this year. Toshiba has responded by adjusting shipments to the retail market since June and from today will reduce the operating rate at the plant in order to adjust output. This move will help to reduce inventory in the market and improve the overall balance between supply and demand.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today began shipping their new line of Mac compatible DDR3 memory modules. Upon completion of our testing conducted at Apple's Compatibility Lab headquarters (Cupertino, CA)-STT engineers unveiled their new line of Apple approved DDR3 memory modules.

SuperTalent now features eco-friendly modules that reduce the voltage requirements a full 10% from the traditional 1.5-volt to the new 1.35-volt standard. SuperTalent offers a wide variety of green DDR3 modules to meet the needs of new and existing server designs. Now is the perfect time to implement this cost cutting module by adding it to, or replacing your current DRAM memory.

Elitegroup Computer Systems (ECS) today announces that it is the first hardware manufacturer to support the latest AMD Memory Profile (AMP) on its innovative platform: A85F2-A Deluxe motherboard. It has been ready to take full advantage of the performance, high end gaming, multi-tasking and energy efficiency with the most anticipating technology "AMP", allowing users to fully satisfy their growing demand with its unique operating designed.

With striving on Research and Development and also closely cooperation with AMD, ECS is honored to become the first AMD Memory Profile (AMP) certified motherboard vendor in the world. The upcoming AMD Memory Profile (AMP) not only breaks through the traditional design, it also enables the performance tuning of DDR3 memory modules beyond standard JEDEC (Joint Electron Devices Engineering Council) specification.

Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, today announced an industry first with high-volume availability of its 45-nanometer (nm) Phase Change Memory (PCM) for mobile devices, featuring 1-gigabit (Gb) PCM plus 512-megabit (Mb) LPDDR2 in a multichip package. As the first company in the world currently offering PCM solutions in volume production, Micron is providing chipset vendors, enablers, and handset manufacturers with a proven product that meets the expanding needs of today's wireless market and paves the way for enhanced features and capabilities.

PCM provides enhanced boot time, simplifies software development and boosts performance with overwrite capability. It also provides very low power consumption and extremely high reliability. In addition, the design-optimizing shared interface between LPDDR2 and PCM is fully compliant with JEDEC industry standards.

ADATA Technology Co., Ltd. today announced the start of shipments of the XPG Gaming v2.0 Series DDR3 2400G DRAM modules. These dual channel kits are designed and engineered to bring optimum performance to third generation Intel Core processors and the Z77 platform.

XPG DRAM modules signify Xtreme Performance Gear, providing the extreme speed and performance required by advanced users. The XPG Gaming series v2.0 is targeted specifically at the distinct performance and cooling needs of the worldwide gaming community. These latest DDR3 2400G modules offer new levels of data transfer speed, along with the many features that are hallmarks of the XPG series.

Patriot Memory, a global pioneer in high-performance memory, NAND flash, storage and enthusiast computer products today announces the launch of the new Intel Extreme Masters Limited Edition DDR3 Memory. Built exclusively for gamers, the Intel Extreme Masters Limited Edition will provide the rock solid performance and stability needed for today's most extreme gaming systems.

Designed specifically to take full advantage of the performance capabilities of the newest 2nd and 3rd generation Intel Core processor family, the Intel Extreme Masters Limited Edition is fully certified for Intel XMP 1.3 delivering frequencies of 1600MHz, 1866MHz, and 2133MHz*. Featuring the same great custom high performance heat shield as the Viper III, the Intel Extreme Masters Limited Edition will provide superior thermal protection when used during long and demanding gaming sessions. The new Intel Extreme Masters Limited Edition modules will be available in dual and quad-channel kits and offered in 8GB, 16GB, and 32GB capacities.

AVADirect, a leading provider of custom computer systems, offers the first personal supercomputer workstation with Dual 8-Core Xeon CPUs, 192GB Memory and Four Graphics Cards. Because of the close partnership with EVGA, AVADirect now offers ground breaking capabilities based on new EVGA SR-X motherboard with wide variety of component combinations to meet the needs of the most demanding professionals or enthusiasts.

Within the past month, manufacturers began to release new motherboards based on the E5 2600 XEON processors. End-users have seen them offered in rackmount and tower configurations from Supermicro, Asus, and Intel. Now, AVADirect is proud to announce that EVGA has released an enthusiast series motherboard that AVADirect offers in a custom configuration. Supported by the EVGA Classified SR-X dual-socket 2011 motherboard, the configuration boasts a whole new level of performance and expandability, including 7x PCI e expansion slots (with PCI-E 16x 3.0 support), 6x USB 3.0 ports, and 8x internal SATA ports; 4 being SATA III 6Gb/s. More importantly, the system will support up to 192GB of certified, Quad-Channel ECC RAM.

Themis Computer today announced the NanoPAK Small Form Factor Computer with AMD Fusion processors. Designed with a new generation of high performance, low-power processors to survive in demanding environments, the NanoPAK is a compact, mobile standalone rugged computer targeted for a myriad of extreme commercial and military applications that include stand alone and embedded computers, real time control, man wearable systems, smart displays, mobile computing, and robotics.

The NanoPAK system is now available with either the AMD Fusion processor or the Intel Atom processor and FLASH storage in a small, light footprint that optimizes size, weight, and power. Leveraging Themis thermal and kinetic management expertise, the hardened aluminum NanoPAK enclosure withstands the toughest environmental conditions.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun sampling the industry's first 16-gigabyte (GB) double data rate-4 (DDR4), registered dual inline memory modules (RDIMMs), designed for use in enterprise server systems.

"By launching these new high-density DDR4 modules, Samsung is embracing closer technical cooperation with key CPU and server companies for development of next-generation green IT systems," said Wanhoon Hong, executive vice president, memory sales & marketing, Samsung Electronics. "Samsung will also aggressively move to establish the premium memory market for advanced applications including enterprise server systems and maintain the competitive edge for Samsung Green Memory products, while working on providing 20 nanometer (nm) class based DDR4 DRAM in the future."

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of key updates to its Universal Flash Storage (UFS) standard. Specifically tailored for mobile applications and computing systems requiring high performance and low power consumption, the new UFS v1.1 standard is an update to the v1.0 standard published in 2011, incorporating feedback from industry UFS technology implementers. JESD220A Universal Flash Storage v1.1 contains important amendments and references to the latest related MIPI Alliance specifications, and may be downloaded free of charge from the JEDEC website here.

JEDEC has also published a complementary standard, JESD223A UFS Host Controller Interface (HCI) v1.1. JESD223A defines a standard host controller interface on which system designers can create a common host controller software driver layer to work with UFS host controller hardware from different manufacturers. The HCI functionality also enables higher performance and power efficiency by minimizing the involvement of the host processor in the operation of the Flash storage subsystem. JESD223A Universal Flash Storage Host Controller Interface v1.1 may also be downloaded free of charge here.

Leading mainboard and graphics card maker MSI has just announced the release of the N680GTX Lightning, the new king of the graphics card world equipped with the NVIDIA GeForce GTX 680 GPU. The N680GTX Lightning utilizes proprietary Unlocked Digital Power architecture to unleash the full performance of the graphics card without any extra modifications. The innovative patented GPU Reactor power supply back plate also reduces power supply noise and improves overclocking stability. the N680GTX Lightning is kept cool by the Twin Frozr IV cooling solution with Dust Removal technology, dual temperature-controlled fan setup and SuperPipe.

Corsair launched a new affordable high-density DDR3-1600 MHz dual-channel memory kit, model: CMZ16GX3M2A1600C9. The kit consists of two 8 GB modules, which operate at 1600 MHz (PC3-12800), with timings of 9-9-9-24, and DRAM voltage of 1.5V. The modules pack an Intel XMP v1.3 profile that enables the advertised speeds. Apart from these, the kit is built in the conventional Corsair Vengeance module design. It is expected to be priced at US $135.

Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, today introduced a new class of 1 GHz, 2-gigabit (Gb) and 4 Gb, 30-nanometer (nm) DDR3 devices, strengthening the company's comprehensive DDR3 portfolio. Designed for the high- performance networking and discrete graphics markets, the new devices feature industry-leading low power use while delivering speeds up to 2133 megatransfers per second (MT/s).

Micron supports its customers in highly competitive market segments with a broad portfolio of DRAM and nonvolatile memory devices that meet the demand for high-performance, cost-efficient memory solutions. "Micron has been successful in creating a complete DRAM portfolio, and this product offering rounds out the broadest DRAM offering in the industry," said Mike Howard, senior principal analyst, DRAM and Memory at iSuppli.

Apacer is presenting their entire product line of state-of-the-art storage solutions for consumer and industrial usages at Computex Taipei 2012, June 5 to 9, at booth T202A on the 2nd floor of Taipei International Convention Center. Apart from their very comprehensive USB 3.0 line-up including SuperSpeed flash drives, external hard drives as well as card readers, this year Apacer will also be showing their leading overclocking memory modules in live demonstrations.

G.SKILL - manufacturer of world leading high performance memory and SSD, debuts the largest memory computer system that runs a total of 96GB (8GBx 12) RipjawsZ DDR3 1600MHz kit on the latest EVGA SR-X motherboard at Computex 2012.

G.SKILL also displays the fastest memory of G.SKILL's TridentX which achieved the amazing speed over DDR3 3000MHz CL11 16GB (4GBx4) on both ASUS Z77 MAXIMUS V FORMULA and GIGABYTE Z77A-UD5 motherboards.

Silicon Power showed off its newest line of DDR3 modules for overclocking, named XPower. The modules will ship with high clock-speed XMP profiles (≥1866 MHz). The one pictured below does DDR3-2400 MHz. Available in module densities of 4 GB and 8 GB, the XPower modules with make up single-module, dual-channel, triple-channel, and quad-channel kits. Seeing as how these modules are also available in triple-channel kits, it's likely that some, if not all, support older versions of Intel XMP, for compatibility with older platforms (eg: triple-channel Nehalem and Westmere supporting XMP 1.2). Key selling features here are thoroughly tested modules, and chunky aluminum heatsinks.

Corsair is finally giving its high-end DRAM family some love, with the new Dominator Platinum family of high-speed DDR3 memory modules. With it, the company also came up with its newest DRAM module heatsink design. The new DHX heatsink uses a revamped design that extracts heat from the DRAM chips more efficiently. At its top portion, the module features a user-swappable "light bar", which is purely an aesthetic touch. Further, the modules support Corsair Link, which lets the user monitor temperatures and voltages of each module via software, in real-time. Pictured below is a DDR3-3000 MHz variant of the Dominator Platinum. The module packs an XMP 1.4 profile for 3000 MHz (1500 MHz actual), with CAS latency of 12T.

Patriot Memory, a global pioneer in high-performance memory, NAND flash, storage and enthusiast computer products today introduces their new Viper 3 memory series.

Specifically engineered for rock solid performance in the most demanding computer environments, Patriot Memory's Viper 3 Series is designed with true power users in mind. Available in a customized four color line up with specific performance variants, the Viper 3 Series will offer a wide range of performance solutions. Leading the pack, the Black Mamba will feature speeds from 1600 MHz up to 2133 MHz at 1.5 volts for increased stability and endurance. Providing speeds of 1600 MHz up to 2133 MHz, the Venom Red and Sapphire Blue modules will offer true killer high performance for enthusiast gaming and the most demanding applications. With full Intel XMP certification, the Sapphire Blue will be the ultimate gaming solution for use with Intel platforms and overclocking profiles. Offering an eco-friendly solution, the Jungle Green modules will feature a power draw of only 1.35 volts.

PNY Technologies, Inc. ("PNY") today announced the release of the Verto GeForce GT 640 1024MB DDR3 graphics card. This new entry-level NVIDIA 28nm Kepler card features dedicated graphics performance from this powerful next-generation GeForce architecture.

The GT 640 delivers premium multimedia performance and reliable entry-level gaming, for a faster, more immersive experience. Harnessing PhysX technology, bring your HD videos, photos, web, and games to life; edit your photos and videos; or play the latest DirectX 11 games with GPU-accelerated tessellation. Accelerate your desktop's performance with cutting-edge features, such as CUDA technology to handle the most demanding system tasks -- such as photo editing -- and delivering incredible performance improvements over traditional CPUs. Adding to the incredible performance and power efficiency of the GT 640 is the new -- built from the ground up -- SMX unit, available only on Kepler. The revolutionary Kepler GPU has taken graphics to the next level and allows the GT 640 to simultaneously run up to three monitors with NVIDIA Surround technology -- expanding your viewing perspective and increasing productivity.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced it is shipping HyperX dual-channel kits engineered especially for the new Intel third-generation Core i7 and i5 processors (Ivy Bridge). Kingston HyperX memory is available in 16GB and 8GB kits of two at 1600MHz, 2133MHz, 2400MHz and soon to be speedy 2666 MHz frequencies.

"The new 22nm architecture of this processor allows significant performance gains for benchmarkers, enthusiasts and overclockers," said Mark Tekunoff, senior technology manager, Kingston. "Enthusiasts who want to push the performance boundaries of the new processors will want to pair it with Kingston HyperX memory. Our 2666 MHz kit combined with the top CPU in the Ivy Bridge family will allow unparalleled performance."

Samsung Electronics Co., Ltd., a global leader in advanced semiconductor technology solutions, announced today that it has begun producing the industry's first four gigabit (Gb), low power double-data-rate 2 (LPDDR2) memory using 20 nanometer (nm) class* technology. The mobile DRAM (dynamic random access memory) chip, which went into mass production last month, will help the market to deliver advanced devices that are faster, lighter and provide longer battery life than today's mobile devices.

"Samsung began expanding the market for 4Gb DRAM last year with the first mass-produced 30nm-class DRAM, and now we are working on capturing most of the advanced memory market with our new 20nm-class 4Gb DRAM," said Wanhoon Hong, executive vice president, memory sales & marketing, Samsung Electronics. "In the second half of this year, we expect to strongly increase the portion of 20nm-class DRAM within our overall DRAM output to make the 4Gb DRAM line-up the mainstream product in DRAM production, and therefore keeping the leadership position in the premium market and strengthening our competitive edge."

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD209-3 LPDDR3 Low Power Memory Device Standard, designed to satisfy the performance and memory density demands of the latest generation of mobile devices such as smartphones, tablets, ultra-thin notebooks and similar connected devices on the newest, high-speed 4G networks.

LPDDR3 offers a higher data rate, improved bandwidth and power efficiency, and higher memory densities over its groundbreaking predecessor, LPDDR2. Developed by JEDEC's JC-42.6 Subcommittee for Low Power Memories, the LPDDR3 Low Power Memory Device Standard is available for free download from the JEDEC website: www.jedec.org/sites/default/files/docs/JESD209-3.pdf.