Kingston Technology Company, Inc., the independent world leader in memory products, announces that tomorrow marks 25 years in the business as the largest third-party manufacturer of computer and device memory. Kingston was founded on October 17, 1987 by CEO and co-founder John Tu, and COO and co-founder David Sun.

The entrepreneurial spirit of both owners and the success of the company have been recognized globally through the years. Kingston's core tenets of respect, loyalty, flexibility and integrity have created an exemplary corporate culture; one that guides its relationships with customers, partners and vendors, and to which Kingston owes its success.

Exceleram announced some new memory modules and 8 GB dual channel kits with Hynix CFR chips. "Our new "X Series" is now ready," said Mr. Kent Lee, Marketing Director, Exceleram. Following is the Overview of the X Series with the Hynix CFR Chips:

• E30106X 2GB (1x2GB) 1333MHz, CL9, 1.5V, w/o Heatsink
• E30112X 4GB (1x4GB) 1333MHz, CL9, 1.5V, w/o Heatsink
• E30149X 4GB (1x4GB) 1600MHz, CL11, 1.5V, w/o Heatsink
• E30146X 4GB (1x4GB) 1600MHz, CL9, 1.5V, w/o Heatsink
• E30150X 4GB (1x4GB) 1866MHz, CL9, 1.65V, w/o Heatsink
• E30138X 8GB (2x4GB) 1866MHz, CL9. 1.65V, Black Sark Heatsink

Intellectual Ventures (IV) announced today that it has reached settlement agreements with SK hynix Inc. and Elpida Memory, Inc. and resolved all pending patent infringement litigation with both companies.

"Intellectual Ventures has reached amicable settlements with both SK hynix and Elpida in the three patent infringement actions we filed against the companies over the past two years," said Melissa Finocchio, vice president and chief litigation counsel for Intellectual Ventures. "IV has built a world-class portfolio of semiconductor patents, and our preference is to sign license agreements and form productive, long-standing relationships with innovative companies rather than to litigate."

Congratulations to the Russian legendary overclockers, Slamms and Smoke, from team "OCLAB.RU" on breaking the new SuperPI 32M world record. With incredible memory speed of DDR3 2,640MHz CL8, team OCLab.ru has achieved the fastest SuperPI 32M score of 4m 44.609s. This incredible record has been validated by the world's most well-known overclocking community website,hwbot.org, and can be found here.

Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, today announced high-volume availability of 30-nanometer (nm) reduced-power DDR3L-RS SDRAM for ultrathin computing devices and tablets. The 2-gigabit (Gb) and 4 Gb solutions reduce power consumption in standby to provide longer battery life, while maintaining the high performance and cost effectiveness of PC DRAM.

"Micron has been one of the leaders in the development and commercialization of DDR3L-RS and the introduction of its 30 nm product is confirmation of this," said Mike Howard, senior principal analyst, DRAM and Memory at IHS iSuppli. "DDR3L-RS is an excellent option for customers who have tight power budgets and need high performance at a competitive price. We expect many of the next-generation ultrathin platforms to take advantage of DDR3L-RS."

Lexar, a leading global brand of flash memory products, today introduced the Lexar High-Performance microSDHC UHS-I and microSDXC UHS-I memory cards for smartphones, tablets, and sports camcorders. The UHS-I cards carry a Class 10 speed classification, and deliver read transfer speeds up to 300x (45MB per second), allowing users to quickly capture, store, play back, and transfer their favorite media files, including 1080p full-HD and 3D video.

Designed for adventure seekers and adrenaline junkies, these cards enable outdoor enthusiasts to capture up to eight hours of their greatest moments in HD and share it with friends faster. Users can also store up to 24,800 photos or 14,200 songs, and when paired with the included USB 3.0 reader, get fast transfer rates from their memory card to their PC or Mac computer.

SK Hynix announced that it has introduced DDR3L-RS (Reduced Standby) DRAM for mobile solutions using its 20nm class technology. This product significantly reduces the standby power consumption.

By using cutting-edge 20nm class technology and efficiently managing standby current, this DDR3L-RS product reduces 70% of standby power compared to existing DDR3L DRAM while it maintains DDR3L performance. DDR3L DRAM which has recently gone mainstream works at 1.35V, while DDR3 DRAM does at 1.5V.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced HyperX red memory as a permanent addition to the entry-level, high performance HyperX blu product line. The vibrant red colored heatspreaders allow greater heat dissipation to help maintain optimal system performance. HyperX red is for entry-level gamers, system builders, PC modders and mainstream consumers looking for stylish, high-performance memory upgrades at reasonable prices.

HyperX red is Intel XMP ready and is available in 8 GB kits and 4 GB single modules at 1600 MHz and 1333 MHz, in both 1.65v and 1.5v. With the ease of installation and HyperX reliability, these new modules meet the needs of consumers and gamers alike who seek higher performance via faster speeds and larger capacities.

AMD today launched the AMD FirePro S9000 and S7000, the industry's most powerful dual- and single-slot server graphics cards for compute, virtual desktop infrastructure (VDI) and workstation graphics deployments in data centers. Equipped with next-generation Graphics Core Next architecture and intelligent AMD PowerTune and ZeroCore Power technologies, the AMD FirePro S9000 and S7000 reduce power consumption by up to 95% at idle, meaning greater savings and reduced operating costs in the data center.

By using the AMD FirePro S9000 and S7000 server graphics, information technology (IT) managers can now effectively address a number of daily data center challenges, while empowering IT professionals to manage intense workloads securely from virtually anywhere in the world at virtually any time. By having the flexibility to set up multiple virtual desktops, scientists, engineers and graphics professionals can have access to accelerated productivity suites including computer aided design (CAD), and media and entertainment (M&E) applications, offering them workstation-class performance in a scalable network environment.

SanDisk Corporation, a global leader in flash memory storage solutions, today marked the 25-year anniversary of flash memory, the transformational technology used by billions of consumers and countless businesses in smartphones, tablets, ultra-thin laptops, data centers and other electronic devices.

Companies such as SanDisk have increased the capacity of flash memory by 30,000 times while decreasing its cost by 50,000 times over the past two decades. SanDisk's first product, a 20 megabyte solid state drive (SSD), sold for $1,000 in 1991 but would cost only two cents today. This efficiency has driven the wide adoption of flash memory and enabled the smart digital lifestyle of anywhere, anytime access to digital content. Flash memory fuels the three forces behind this trend - mobile computing, pervasive connectivity and the proliferation of digital content.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced the launch of the new Kingston HyperX Predator. The new high-performance DRAM module complements the HyperX product range with the fastest speeds, lowest latencies and highest capacities. HyperX Predator is aimed at extreme enthusiasts and overclockers looking to push their systems to the maximum with the fastest speeds and highest performance hardware.

With its new heatspreader, HyperX Predator offers a more aggressive design, which accompanies the look and design of the latest PC hardware, and provides great heat dissipation to optimize memory reliability. The memory is Intel XMP certified and has been fully tested and validated on a top range of motherboards currently available on the market. End users can easily overclock their systems by simply selecting a profile in BIOS with no need for manual adjustments.

Integrated Device Technology, Inc. (IDT), the Analog and Digital Company delivering essential mixed-signal semiconductor solutions, today announced that it will be presenting on the NVM Express (NVMe) specification as well as exhibiting its latest enterprise flash controller products in booth #707 at the Flash Memory Summit, held in Santa Clara, CA on August 21-23.

Peter Onufryk, director of engineering in the Enterprise Computing Division at IDT, will present "How the Streamlined Architecture of NVM Express Enables High Performance PCIe SSDs." The presentation will provide an overview of NVM Express along with a detailed outline of the specification's performance features.

PNY Technologies, world renowned manufacturing giant, for USB and Memory products have released the sleek and sophisticated model HP v275w USB flash pendrive. Incorporating style, durability with functionality, the HP v275w is the ideal choice for storing and transfer of documents and files anywhere with flair and ease.

Decorated with premium scratch proof metallic casing and unique mirror reflective design, it lends a sharp and professional appeal to the drive, perfect for your business work or presentations. The waterproof, dustproof and shockproof features enable protection of precious data and uninterrupted sharing in the long run. Eliminating the use of caps, the HP v275w uses slide in and out feature for quick and effortless plug and use operation without the hassles of fretting over a misplaced cap. The drive also has a lanyard loop that can be attached to your wallet or any other accessory.

Toshiba Corporation (TOKYO:6502) today announced an adjustment to production of NAND flash memory at its Yokkaichi Operation plant in Mie Prefecture, Japan, that will cut Toshiba's production by approximately 30%, effective from today.

Oversupply of NAND flash memory in the retail market, for application in USB memories and memory cards, has resulted in continual price declines since the beginning of this year. Toshiba has responded by adjusting shipments to the retail market since June and from today will reduce the operating rate at the plant in order to adjust output. This move will help to reduce inventory in the market and improve the overall balance between supply and demand.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today began shipping their new line of Mac compatible DDR3 memory modules. Upon completion of our testing conducted at Apple's Compatibility Lab headquarters (Cupertino, CA)-STT engineers unveiled their new line of Apple approved DDR3 memory modules.

SuperTalent now features eco-friendly modules that reduce the voltage requirements a full 10% from the traditional 1.5-volt to the new 1.35-volt standard. SuperTalent offers a wide variety of green DDR3 modules to meet the needs of new and existing server designs. Now is the perfect time to implement this cost cutting module by adding it to, or replacing your current DRAM memory.

Elitegroup Computer Systems (ECS) today announces that it is the first hardware manufacturer to support the latest AMD Memory Profile (AMP) on its innovative platform: A85F2-A Deluxe motherboard. It has been ready to take full advantage of the performance, high end gaming, multi-tasking and energy efficiency with the most anticipating technology "AMP", allowing users to fully satisfy their growing demand with its unique operating designed.

With striving on Research and Development and also closely cooperation with AMD, ECS is honored to become the first AMD Memory Profile (AMP) certified motherboard vendor in the world. The upcoming AMD Memory Profile (AMP) not only breaks through the traditional design, it also enables the performance tuning of DDR3 memory modules beyond standard JEDEC (Joint Electron Devices Engineering Council) specification.

Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, today announced an industry first with high-volume availability of its 45-nanometer (nm) Phase Change Memory (PCM) for mobile devices, featuring 1-gigabit (Gb) PCM plus 512-megabit (Mb) LPDDR2 in a multichip package. As the first company in the world currently offering PCM solutions in volume production, Micron is providing chipset vendors, enablers, and handset manufacturers with a proven product that meets the expanding needs of today's wireless market and paves the way for enhanced features and capabilities.

PCM provides enhanced boot time, simplifies software development and boosts performance with overwrite capability. It also provides very low power consumption and extremely high reliability. In addition, the design-optimizing shared interface between LPDDR2 and PCM is fully compliant with JEDEC industry standards.

ADATA Technology Co., Ltd. today announced the start of shipments of the XPG Gaming v2.0 Series DDR3 2400G DRAM modules. These dual channel kits are designed and engineered to bring optimum performance to third generation Intel Core processors and the Z77 platform.

XPG DRAM modules signify Xtreme Performance Gear, providing the extreme speed and performance required by advanced users. The XPG Gaming series v2.0 is targeted specifically at the distinct performance and cooling needs of the worldwide gaming community. These latest DDR3 2400G modules offer new levels of data transfer speed, along with the many features that are hallmarks of the XPG series.

Patriot Memory, a global pioneer in high-performance memory, NAND flash, storage and enthusiast computer products today announces the launch of the new Intel Extreme Masters Limited Edition DDR3 Memory. Built exclusively for gamers, the Intel Extreme Masters Limited Edition will provide the rock solid performance and stability needed for today's most extreme gaming systems.

Designed specifically to take full advantage of the performance capabilities of the newest 2nd and 3rd generation Intel Core processor family, the Intel Extreme Masters Limited Edition is fully certified for Intel XMP 1.3 delivering frequencies of 1600MHz, 1866MHz, and 2133MHz*. Featuring the same great custom high performance heat shield as the Viper III, the Intel Extreme Masters Limited Edition will provide superior thermal protection when used during long and demanding gaming sessions. The new Intel Extreme Masters Limited Edition modules will be available in dual and quad-channel kits and offered in 8GB, 16GB, and 32GB capacities.

AVADirect, a leading provider of custom computer systems, offers the first personal supercomputer workstation with Dual 8-Core Xeon CPUs, 192GB Memory and Four Graphics Cards. Because of the close partnership with EVGA, AVADirect now offers ground breaking capabilities based on new EVGA SR-X motherboard with wide variety of component combinations to meet the needs of the most demanding professionals or enthusiasts.

Within the past month, manufacturers began to release new motherboards based on the E5 2600 XEON processors. End-users have seen them offered in rackmount and tower configurations from Supermicro, Asus, and Intel. Now, AVADirect is proud to announce that EVGA has released an enthusiast series motherboard that AVADirect offers in a custom configuration. Supported by the EVGA Classified SR-X dual-socket 2011 motherboard, the configuration boasts a whole new level of performance and expandability, including 7x PCI e expansion slots (with PCI-E 16x 3.0 support), 6x USB 3.0 ports, and 8x internal SATA ports; 4 being SATA III 6Gb/s. More importantly, the system will support up to 192GB of certified, Quad-Channel ECC RAM.

Themis Computer today announced the NanoPAK Small Form Factor Computer with AMD Fusion processors. Designed with a new generation of high performance, low-power processors to survive in demanding environments, the NanoPAK is a compact, mobile standalone rugged computer targeted for a myriad of extreme commercial and military applications that include stand alone and embedded computers, real time control, man wearable systems, smart displays, mobile computing, and robotics.

The NanoPAK system is now available with either the AMD Fusion processor or the Intel Atom processor and FLASH storage in a small, light footprint that optimizes size, weight, and power. Leveraging Themis thermal and kinetic management expertise, the hardened aluminum NanoPAK enclosure withstands the toughest environmental conditions.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun sampling the industry's first 16-gigabyte (GB) double data rate-4 (DDR4), registered dual inline memory modules (RDIMMs), designed for use in enterprise server systems.

"By launching these new high-density DDR4 modules, Samsung is embracing closer technical cooperation with key CPU and server companies for development of next-generation green IT systems," said Wanhoon Hong, executive vice president, memory sales & marketing, Samsung Electronics. "Samsung will also aggressively move to establish the premium memory market for advanced applications including enterprise server systems and maintain the competitive edge for Samsung Green Memory products, while working on providing 20 nanometer (nm) class based DDR4 DRAM in the future."

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of key updates to its Universal Flash Storage (UFS) standard. Specifically tailored for mobile applications and computing systems requiring high performance and low power consumption, the new UFS v1.1 standard is an update to the v1.0 standard published in 2011, incorporating feedback from industry UFS technology implementers. JESD220A Universal Flash Storage v1.1 contains important amendments and references to the latest related MIPI Alliance specifications, and may be downloaded free of charge from the JEDEC website here.

JEDEC has also published a complementary standard, JESD223A UFS Host Controller Interface (HCI) v1.1. JESD223A defines a standard host controller interface on which system designers can create a common host controller software driver layer to work with UFS host controller hardware from different manufacturers. The HCI functionality also enables higher performance and power efficiency by minimizing the involvement of the host processor in the operation of the Flash storage subsystem. JESD223A Universal Flash Storage Host Controller Interface v1.1 may also be downloaded free of charge here.

Leading mainboard and graphics card maker MSI has just announced the release of the N680GTX Lightning, the new king of the graphics card world equipped with the NVIDIA GeForce GTX 680 GPU. The N680GTX Lightning utilizes proprietary Unlocked Digital Power architecture to unleash the full performance of the graphics card without any extra modifications. The innovative patented GPU Reactor power supply back plate also reduces power supply noise and improves overclocking stability. the N680GTX Lightning is kept cool by the Twin Frozr IV cooling solution with Dust Removal technology, dual temperature-controlled fan setup and SuperPipe.

Corsair launched a new affordable high-density DDR3-1600 MHz dual-channel memory kit, model: CMZ16GX3M2A1600C9. The kit consists of two 8 GB modules, which operate at 1600 MHz (PC3-12800), with timings of 9-9-9-24, and DRAM voltage of 1.5V. The modules pack an Intel XMP v1.3 profile that enables the advertised speeds. Apart from these, the kit is built in the conventional Corsair Vengeance module design. It is expected to be priced at US $135.