Samsung Electronics Co., Ltd., the world leader in advanced memory technology, said today that it is accelerating its production ramp up of DDR4 memory modules to accommodate an anticipated strong market demand along with the approaching introduction of the new Intel Xeon processor E5-2600 v3 product family. DDR4 is the most advanced memory for server and high-performance computing applications.

"At Samsung, we are taking the lead in readying the DDR4 market to coincide with the introduction of the next-generation Intel Xeon processor E5-2600 v3 product family, and plan to contribute to creating a bigger market for DRAM in the second half of 2014," said Jim Elliott, corporate vice president, Memory Marketing, Samsung Semiconductor, Inc. "We will continue to introduce high-density DDR4 modules for global OEMs that will facilitate the launch of next-generation enterprise servers and will maximize IT investment efficiency."

Micron Technology, Inc., a leading provider of advanced memory and storage solutions for enterprise data centers and high-performance computing applications, today announced it is ramping production of DDR4 memory to support upcoming Intel CPU launches. The improved power and performance of DDR4 technology is a critical requirement for the growing enterprise computing market, delivering a power improvement of up to 35% compared to standard DDR3.

Micron is ramping its 4 Gb-based DDR4 module production at 2133 megatransfers per second (MT/s) in support of Intel's Xeon processor E5-2600 v3 product family-based systems. Micron is also sampling a 2400 MT/s device in anticipation of follow-on products targeted for 2015.

With capacities of up to 4 Gigabit per chip, I'M Intelligent Memory, a Hong Kong based fabless DRAM manufacturer, enters the market for industrial DDR2 memory components with their mission statement "Beyond Limits".

DDR2 SDRAM technology is the memory standard that most industrial applications have been designed around for years. I'M pushes this technology even further by offering higher capacities and wider temperature ranges than other manufacturers. The most common densities of DDR2 continue to be 512 Mb and 1 Gb. The larger capacities, such as 2 Gb and 4 Gb, are defined by JEDEC, but their availability from other manufacturers continues to be very limited. I'M Intelligent Memory focuses on the high end of DDR2 capacities with their 2 Gbit monolithic, 2 Gbit Dual-Die (DDP) and 4 Gbit DDP components in standard or industrial temperature ranges. For automotive customers, AEC-Q100 versions are also available.

TeamGroup announced the new world record of Super Pi 32M (Air Cooling) on Jan. 22, 2014. Working together with HKEPC OC Lab in Hong Kong, TeamGroup overclocking memory module has achieved new record" 4min 38sec 329ms ", not only placed among the Top 5 world record of Super Pi 32M, but also the only non-extreme cooling record in Top 10 Global Ranking.

Super Pi 32M is the most popular test program for pro overclockers to compare the performance and stability of their computers. It's also one of the main items in HWBOT Global Ranking. By using Gauss-Legendre algorithm, it can accurately calculate π to 232 square roots--the 32M digits after decimal point and need extremely high stability of system memory. Beside the performance of processor, memory module clock and low latency timing are also the keys of computing speed. Shorten the computing time is the target for overclockers around the world to compete.

Taiwanese company ADATA Technology is gearing up for the arrival of DDR4 and at CES it showcased a couple of memory modules based on the standard. ADATA's DDR4 sticks have 8 GB and 16 GB capacities and run at 2133 MHz with CL15 latencies while powered at 1.2V.

The modules on display are 'suitable for servers' (they are R-DIMMs) but the company will surely have some consumer-oriented offerings for later this year when Intel launches the DDR4-supporting Haswell-E processors.

Mushkin Enhanced Mfg., an industry-leading designer and manufacturer of high-performance and mission-critical computer products, has unveiled the new refreshed FrostByte heatsink for Blackline and Redline memory modules.

Cut from aircraft-grade aluminum, the FrostByte is the newest model of durability and functionality. The new FrostByte heatsink utilizes our new vortex thermal design to dissipate and control accumulated heat while maximizing PC performance.

SK Hynix Inc. announced that it has developed the world's first 8 Gb (Gigabit) LPDDR4 (Low Power DDR4) using its advanced 20 nm class technology. LPDDR4 is the next generation mobile DRAM interface on the process of standardization which features ultrahigh speed and low power consumption.

This new product works at 3200 Mbps and ultra low-voltage of 1.1V which runs two times faster than 1600 Mbps and does at lower voltage than 1.2V of existing LPDDR3. The Company has been strengthening its cooperation with the customers for the standardization of this new mobile DRAM by providing the samples of LPDDR4 to major customers and SoC(System on Chip) companies.

Crucial, a leading global brand of memory and storage upgrades, today released a new lineup of high-performance memory solutions specifically designed for the new Mac Pro systems. This new memory is engineered to meet the component densities, speeds, and Serial Presence Detect (SPD) programming specifications of the new Mac Pro workstations, and is now available in densities up to 16 GB through select global channel partners and at www.crucial.com.

The new modules designed for Mac Pro workstations operate at 1866 MHz, which is the fastest mainstream DDR3 ECC UDIMM and RDIMM speed currently available, allowing users to leverage all the capabilities of the new Mac Pro systems. For further performance gains, modules are available in densities up to 16 GB. These high-speed, high-density memory modules provide users with increased system responsiveness, faster application load times, and an increased ability to multitask with ease when using data-intensive programs such as Apple FinalCut Pro or Adobe Photoshop software.

The Avexir brand is an established manufacturer associated with producing top quality, high-end RAM memory. Avexir is one of the only manufactures in which the factories hand check each module when it comes to overclocking and working in dual and quad channel modes. The modules are packed into elegant boxes only when they pass thorough quality control tests on different systems including AMD and Intel processors. Other manufacturers unfortunately don't do such controlled hand quality checks, which means users are more likely to encounter a faulty DDR module, which can cause incompatibilities and headache for the user.

Avexir presents today on European market five new series of quality checked memories:

• Avexir BLITZ 1.1 Original White LED
• Avexir BLITZ 1.1 OCF Yellow LED
• Avexir BLITZ 1.1 ELG Yellow LED
• Avexir BLITZ 1.1 ELR Red LED
• Avexir BLITZ 1.1 GBOC Orange LED

SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, today announced MIP, the industry's first module-in-a-package memory form factor. SMART's innovative tiny form factor design is targeted for broadcast video, mobile router, high-end video/graphics cards and embedded computing applications where power consumption, performance and space limitations are of principle concern.

While SMART's MIP occupies just one-fifth the area of an SO-DIMM, it offers higher performance and consumes less power. Key improvements with MIP include 42% power savings, 42% jitter reduction, and 39% PK/PK savings. Being a "soldered down" module, unlike an SO-DIMM, the need for a mating connector is eliminated with MIP. SMART's MIP supports both, applications requiring ECC and the ones that do not. These are key benefits for applications where memory capacity in a small space is critical. And unlike other DRAM down-board usage scenarios, the MIP contains on-package address and CNTRL termination.

Taiwan-based Team Group Inc. has this week announced the Xtreem White line of high-end DDR3 memory. This new speedy RAM comes in 8 GB and 16 GB flavors (dual channel only), makes use of tall aluminum heatspreaders, features Intel XMP 1.3 support, and is backed by a lifetime warranty.

The Xtreem Series White offering includes DDR3-2133 CL11, DDR3-2400 CL10, DDR3-2666 CL11 and DDR3-2800 CL12 kits that go from 69.90 Euro all the way up to 449.90 Euro. All are set to ship this month and can be found at Caseking.de.

Corsair rolled out the Vengeance Airflow line of memory coolers that are designed to complement the recently announced Vengeance Pro memory series. It keeps up with the design of Vengeance Pro modules, and comes in three color options - red, blue, and gray. Unlike similar coolers launched by the company in the past, and designed for the more premium Dominator series, Vengeance Airflow uses a single fan design, with a single 60 mm PWM-controlled fan, which can spin at speeds of up to 3,500 RPM, pushing up to 14.5 CFM of air. There's no mention of Corsair Link support. Measuring 145 mm x 67 mm x 27 mm (WxDxH), the cooler weighs about 115 g. Pricing and availability information is not at hand.

HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced the addition of 2800 MHz memory kits to the HyperX Predator product line. The new 2800 MHz memory kits exhibit top-of-the-market speed and are specifically designed for high-end overclockers, extreme system builders and performance enthusiasts.

HyperX Predator represents the fastest Kingston memory available on the market. In addition to top speeds, HyperX Predator features an aggressive design to enhance the look and performance of the latest PC hardware while providing greater heat dissipation to optimize memory reliability. The memory is Intel XMP ready and has been fully tested and validated on a wide range of motherboards currently available on the market. End users can easily overclock their systems by simply selecting a profile in BIOS with no need for manual adjustments.

Silicon Power, the world's leading provider of memory storage solutions, today unveils the latest memory module solution, DDR3L-1333 and DDR3L-1600 Low-Voltage Series. Running at 1.35 volts at 1333 MHz and 1600 MHz, the Low-Voltage series is able to decrease hardware power consumption effectively without compromising the benefit of the performance. Apart from saving power from long-term operations, it also reduces the unnecessary heat waste, allowing advanced gamers, video and photo professionals and DIY enthusiasts to create an eco-friendly working stations.

Silicon Power Low-Voltage DDR3L series comes in selections from UDIMM to SO-DIMM at 1333 MHz and 1600 MHz, providing desktop and notebook users to save energy up to 20% from the benefits of low energy consumption. Moreover, this series is compatible with the latest Intel Haswell platform, ideal for those who are looking for a greener and power-saving alternative while enjoying the ultimate system performance.

SK Hynix Inc. announced that it has developed 6 Gb (Gigabit) LPDDR3 (Low Power DDR3) using its 20 nm class process technology. This product is a high-performance mobile memory solution that features low power consumption and high-density, which is ideal for next generation premium mobile devices.

Four 6 Gb LPDDR3 products can be stacked up and realize a high density of maximum 3 GB (Gigabytes, 24 Gb) solution in a single package. In consequence, this package reduces the operating power as well as the standby current by 30% and the height of the package becomes thin compared to the Company's 4 Gb-based one. In addition, it works at ultra low-voltage of 1.2V thus it satisfies low power consumption which mobile applications demand.

HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced a HyperX memory and solid-state drive bundle with exclusive collector's edition Battlefield 4 gaming mouse pads. HyperX is working with QPAD, an award-winning designer of headsets, keyboards, mice and mouse pads for gamers. The limited-edition HyperX memory and mouse pad product bundle creates more value for gaming fans and will be available in the United States at Newegg.com, Amazon.com and TigerDirect.com shortly after the highly anticipated Battlefield 4 game launch.

The bundle provides value for Battlefield 4 enthusiasts by giving them an opportunity to own an exclusive collector's edition soft mouse pad along with the best gaming memory on the market. QPAD, based in Sweden, have been big supporters of eSports since 1997 and most gamers are familiar with their high-quality mouse pads as well as award-winning gaming mice, headsets and keyboards. Battlefield 4 is the first-person shooter that follows the immensely popular Battlefield 3 released in 2011, from Electronic Arts Inc.

Patriot Memory has now announced its latest memory offering targeting gamers and overclockers, the Viper 3 Low Profile kits. Coming in 8 GB, 16 GB and 32 GB capacities, Patriot's new memory is just 1.25" tall so as to allow more clearance for large CPU coolers.

The low-profile Vipers have black, red or blu-colored heatsinks, are XMP 1.3 certified, they're available in 1600 MHz, 1866 MHz and 2133 MHz flavors, and are backed by a lifetime warranty.

Transcend Information, Inc. (Transcend), a worldwide leader in storage and multimedia products, today announced the arrival of its 8 GB DDR3L-1600 Low Voltage 1.35V RDIMM memory module. Aimed at improving high performance data mining and big data analytics, the DDR3 Low Voltage RDIMM allows enterprises to address the challenges of server memory density, performance, and power consumption.

Strong demand for data center services continues to grow as more organizations are taking advantage of the huge and highly available computing and storage resources of cloud and virtualization systems. However, the success of implementing these technologies rests on the ability to quickly load applications and easily process information.

Thunderbird is the ruler of sky in American Indian legends that the spreading of his wings summoning hurricane and thunder, changing the color of the sky! The heroic posture of thunderbird inspired Apacer Technology to the design of memory modules, developing the spectacular overclocking artifact in such a mythological creature class - Thunderbird overclocking memory module!

With a clock rate up to DDR3-2933, 8-layer PCB in supreme quality, special aluminum thunderbird wing-shaped heat spreading module, and the blue/ orange/red/ black color to go with other colors of the overclocking motherboard of major brand on the market, the Thunderbird overclocking memory will definitely build a dazzling personal overclocking platform.

Crucial, a leading global brand of memory and server memory, today announced the 64 GB Crucial DDR3L Load-Reduced DIMMs (LRDIMMs) for servers, which enable more DIMMs per channel for up to twice the installed memory capacity per server. Additionally, these modules offer up to a 35 percent increase in memory bandwidth per server compared to standard DIMMs, and eliminate the channel ranking limitation of standard DDR3 registered DIMMs. The Crucial DDR3L LRDIMMs is designed for IT professionals that manage high-end server environments with demanding workloads.

The 64 GB Crucial DDR3L LRDIMMs operates using 1.35V, unlike the 1.5V common in DDR3 RDIMMs, making the new module more energy-efficient and cost-effective, especially in large deployments. Since Crucial LRDIMMs transmit power in a more efficient manner to the CPU (via the data path buffer), they use less voltage, which allows for additional power savings. These new memory modules are also compatible with OEM servers and warranties, allowing users to upgrade their existing server infrastructures without having to purchase an entirely new system. Crucial LRDIMMs fully support the latest Intel Xeon processor E5 family.

OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, will showcase the company's latest enterprise storage and acceleration solutions at the 2013 High Performance Computing (HPC) for Wall Street Show in booth 201 at the Roosevelt Hotel in New York City on September 9. One of the largest shows catering to the HPC market, it is an ideal venue for OCZ to showcase solid state storage products designed for addressing big data performance and low latency for financial applications.

OCZ will unveil the upcoming Aeon Series 3.5" SSD, a Non-Volatile Memory (NVM) SAS drive specifically targeted to meet the stringent requirements of latency sensitive applications currently being mired by legacy hard-disk drive (HDD) infrastructures. Designed for demanding transactional environments such as high-frequency trading (HFT), Aeon delivers the speed and ultra low latency read and writes of DRAM with the persistence and scalability of storage. Aeon reduces file system overhead in enterprise appliances while accelerating applications and improving overall I/O efficiency, along with providing unlimited endurance supporting an infinite number of drive writes per day without wearing out or slowing down.

PNY Technologies Inc, announces the introduction of StorEDGE: a revolutionary new Flash Memory Expansion Module designed exclusively for use in MacBook computers to quickly and easily increase available storage capacity while keeping you mobile. Engineered as a semi-permanent storage solution, StorEdge simply plugs directly into your MacBook to radically upgrade your flash memory without compromising your notebook's sleek design. StorEdge hosts a small form factor and unobtrusive patent pending design, allowing it to sit nearly flush to your MacBook. Available in 64GB and 128GB capacities, StorEdge allows users to store even more images, videos, music, and files - without compromising system speed or performance.

Micron Technology, Inc. (Nasdaq:MU) ("Micron") and Elpida Memory, Inc. ("Elpida") trustees announced today the closing of Micron's acquisition of 100 percent of Elpida's equity, pursuant to a Sponsor Agreement entered into on July 2, 2012 in connection with Elpida's corporate reorganization proceedings conducted under the jurisdiction of the Tokyo District Court. In a related transaction, Micron also announced today the completion of its acquisition of a 24 percent share of Rexchip Electronics Corporation from Powerchip Technology Corporation and certain of its affiliates. The transactions will be recorded for accounting purposes as being effective at 11:59 p.m., Tokyo time, on July 31, 2013.

Elpida's assets include a 300 millimeter (mm) DRAM fabrication facility located in Hiroshima, Japan; an approximate 65 percent ownership interest in Rexchip, whose assets include a 300mm DRAM fabrication facility located in Taiwan; and a 100 percent ownership interest in Akita Elpida Memory, Inc., whose assets include an assembly and test facility located in Akita, Japan. Together with the Rexchip shares acquired from Powerchip, Micron will control approximately 89 percent of Rexchip's outstanding shares and 100 percent of Rexchip product supply. The manufacturing assets of Elpida and Rexchip together can produce more than 185,000 300mm wafers per month, which represents an approximate 45 percent increase in Micron's current manufacturing capacity.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, announced today the launch of the latest XPG V2 series overclocking memory, running at a stellar 3100 megahertz. This new product's dual channel is designed to bring ultimate performance to gamers using Intel Core fourth-generation processors and the latest Z87 platform.

The XPG 3100 V2 is the result of special cooperation with Asrock, and suitable for all motherboards that employ the enthusiast oriented Z87 chipset. Due to strict compatibility testing and QVL (Qualified Vendor List) certification, the modules can be directly overclocked using XMP (EXtreme Memory Profile) to the highest frequency of 3100Mhz. This unprecedented speed will gratify those who always seek an edge in boosting system performance.

Apacer the global leading memory manufacturer- will once again bring overclocking techniques to a new level! Apacer introduces the industry-leading ARES DDR3-3000 series with record-breaking clock rate reaching DDR3 3226 MHz at 2013 Computex Taipei. This series also offer 2800 MHz, 2933 MHz, and other specifications with strictly tested high-end guaranteed memory chips. Two packages (8 GB Kit [4 GBx2] and 16 GB Kit [8 GBx2]) are available to bring extreme lightning speed experience to overclocking players.

Apacer's ARES series overclocking memory has always been the prime choice, or "precious weapon" for overclocking players, and also offers excellent computing efficiency to audio/video workers. This upgrade of clock rate for ARES series will support latest 4th Gen Intel Core Processors and Z87 chipset, and launch the industry-leading DDR3-3000 high-end clock rate! At 2013 Computex Taipei, a new record for air-cooling overclocking of DDR3-3226 MHz 16 GB Kit (4 GBx4) was created successfully by Apacer's overclocking team via ARES DDR3 3000 MHz memory!