SanDisk Corporation, a global leader in flash storage solutions, today introduced the iNAND 7232 storage solution, a new, advanced embedded flash drive (EFD) optimized to deliver best-in-class imaging performance and superior storage capacity in flagship mobile devices. Available in capacities up to 128 GB, the iNAND 7232 storage solution enables original equipment manufacturers (OEMs) to introduce smartphones, tablets and other connected devices that feature ample storage to meet the needs of increasing consumer content while providing data-rich application experiences and next-generation digital photography capabilities.

"From North America to China, consumers are demanding higher and higher capacity storage," said Christopher Bergey, SanDisk's vice president and general manager of Mobile and Tablet Solutions. "Our iNAND 7232 storage solution not only enables mobile OEMs to cost-effectively deliver the robust storage mobile users want, it is also our most advanced embedded storage solution to date. It leverages new, innovative application-level storage architecture and SanDisk's latest 15 nanometer flash storage technology to enable outstanding application experiences, terrific 4K Ultra HD video capture and digital photography experiences never before possible in flagship smartphones."

Mushkin introduced the ECO2, a DDR3L-1600 MHz (PC3L-12800) memory module. Available in 4 GB and 8 GB densities, and coming in single-module, dual-channel, and quad-channel kits, the module ticks at 800 MHz (1600 MHz DDR3-effective), with timings of 9-9-9-24 CR1, and module voltage of 1.35V. DDR3L could play an important role in the transition of mainstream memory standard from DDR3 to DDR4, with the upcoming Intel Core "Skylake" processors, which feature integrated memory controllers that natively support DDR3L-1600 and DDR4-2400 (or DDR4-2666 as some reports suggest). Expect mainstream pricing for these modules.

Essencore Limited, a noteworthy newcomer in DRAM modules and NAND Flash application products including Gaming Memory Modules, Solid State Drives, USB Flash Drives and MicroSD cards, is pleased to announce the sales kick-off in European countries with its brand "KLEVV". In attempt to expand its global presence and to accelerate growth, Essencore hopes that this KLEVV product launch will help to efficiently deliver its premium products to its European customer.

As a young company founded in 2014 by CEO IU Kim, Essencore strives to become world's leading vendor of both DRAM modules and NAND Flash application products. To achieve this goal, Essencore has introduced its house brand "KLEVV" with the industry's first-rate quality and best performing products. In a conscious move to strengthen brand awareness and products at this early stage, KLEVV will focus on the three key consumer markets of U.S., Europe and China. Of all regions, Europe is deemed to have the highest potential, with its huge population of tech enthusiasts. Starting in Germany, UK, and Poland in summer 2015, KLEVV products will soon be available in all corners of Europe.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and solid state storage, showcases the brand new Trident Z series of DDR4 memory designed for PC enthusiasts.

With numerous overclocking records under its belt, G.SKILL TridentX series is known as the most powerful overclocking memory series in the PC enthusiast community. The new Trident Z series comes with high quality aluminum heatspreaders and a customized bar in various colors, providing PC builders the options to match their own system's color scheme, while maintaining efficient heat dissipation.

Team Group showed off three new premium DDR4 memory lines at Computex. It begins with the iconic Team Xtreem brand. The company launched the Xtreem LE (18th Anniversary Limited Edition), a double-height module made with binned DRAM chips, and rigorous QA, that results in DDR4-3400 at 16-16-16-36, with 1.35V DRAM voltage. The module PCB is green, but is topped off with a thick black aluminium heatsink, with a soft-gold beam running along its top.

Next up, is the most imaginatively named of the lot, the Team Gaming OC. These blood-red modules feature a 2-layer aluminium heatsink cooling the DRAM chips. Though the heatsink isn't as tall as the one on the Team Xtreem LE, it is decked with red or green LEDs. These modules offer DDR4-3000 with 16-16-16-36, at 1.35V. Last of the three, is the new Team Dark 128 GB memory kit, made up of eight 16 GB modules. These modules do DDR4-2666 at 15-17-17-35, with 1.2V DRAM voltage.

Crucial, a leading global brand of memory and storage upgrades, today announced Crucial Ballistix DDR4 16GB performance memory. Ideal for gamers and enthusiasts who deal with content creation, virtual machines, RAM drives, and memory-intensive applications, the new Ballistix modules leverage Micron's new 8Gb DDR4 component technology to offer up the highest density DDR4 memory to date.

Until now, only expensive server systems have been able to reach these memory densities, but with Ballistix DDR4 16GB modules, users can achieve greater densities on high-end desktop systems like the latest Intel X99 platforms. Available across Sport LT, Tactical, and Elite product lines, each module includes Intel XMP 2.0 profiles for easy setup and support.

Crucial, a leading global brand of memory and storage upgrades, is now sampling Crucial DDR4 2400MT/s 8Gb-based RDIMM, LRDIMM, and ECC UDIMM server modules through its Technology Enablement Program. Engineered to enable higher density modules, 8Gb-based DDR4 memory allows for increased performance, bandwidth, and energy efficiency.

Higher density modules, when combined with the next DDR4 speed increase of 2400MT/s, create greater channel bandwidth and channel density, as well as increased energy efficiency. Ultimately, these benefits provide more value per gigabit than current 4Gb-based offerings. Taken together, the increase in density, bandwidth, and value deliver a lower total cost of ownership for users.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, is honored to announce that its XPG Z2 DDR4 3400 computer memory is able to clock up to 4034MHz when used with an air-cooled msi X99A XPOWER AC motherboard. This creates a new overclocking world record for production line DDR4 computer memory.

In cooperation with motherboard manufacturers, ADATA strives to achieve the best performance in DDR4 memory compliant with the Intel X99 architecture. The XPG Z2 DDR4 3400 breaks the record with extremely high clock frequency of 4034MHz, impressing both gamers and standard CPU clock users alike with outstanding sustained performance, cooling and stability.

Toshiba's Digital Products Division (DPD), a division of Toshiba America Information Systems, Inc., today introduced the Toshiba EXCERIA Pro SD Memory Card and Toshiba EXCERIA microSD Memory Card, two flash storage options equipped to unleash a device's full shooting potential to capture stunning images and immersive footage. Ideal for professional DSLR photographers and high action sports enthusiasts respectively, the EXCERIA Pro SD and EXCERIA microSD provide unparalleled performance with excellent read/write rates and ample storage to capture fast-action photos and 4K videos without delay.

"Recording the most important life moments shouldn't be limited by speed or space," said Maciek Brzeski, Vice President of Branded Storage Products, Toshiba Digital Product Division. "With the EXCERIA Pro and EXCERIA microSD, Toshiba delivers a memory card that specifically complements consumers' professional and mobile lifestyles." The EXCERIA Pro SD Memory Card allows professional photographers and videographers to maximize the potential of their UHS-II-enabled high performance cameras. With read speeds of up to 260MB/s and write speeds up to 240MB/s, the EXCERIA Pro SD card can transfer photos in less time than non-UHS II cards.

G.SKILL International Enterprises Co., Ltd., the world's leading manufacturer of extreme performance memory, proudly announces yet another extreme speed DDR4 memory kit to the market at a blistering 3666 MHz with only 1.35V. This first-of-its-kind top speed memory kit features a 16GB (4GBx4) capacity and premium class Samsung 4Gb IC chips.

Validated on the Gigabyte X99 SOC Champion motherboard, the Ripjaws 4 series DDR4-3666 MHz memory kit takes the high end desktop X99 chipset platform to new heights in the exciting preparation for the upcoming DDR4 platform.

HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced that it has created the world's fastest DDR4 128GB memory kit running at an astounding 3000MHz. The kit consists of eight 16GB HyperX Predator modules (16GB x 8) motherboard in an eight module, quad-channel configuration along with an MSI X99 MPOWER motherboard in an eight module, quad-channel configuration along with an Intel Core i7 5820K processor.

During Computex en Taipei,HyperX will unleash a high-performance system featuring the upcoming 16GB modules powered by the recently released HyperX Predator M.2 PCIe SSD. The live demo will take place during the HyperX Roadshow Experience from June 4-7, 2015, at the ATT 4 FUN center, in Taipei. More details will be forthcoming about availability and pricing for HyperX Predator 16GB DDR4 modules and kits.

G.SKILL International Enterprises Co., Ltd., the world's leading manufacturer of extreme performance memory and solid state storage, is thrilled to announce the world's first DDR4 128GB(16GBx8) 2800MHz CL16-16-16 -36 1.35V memory kit based on the newest 16GB capacity DDR4 consumer-class memory modules. These high capacity memory modules are manufactured with new 8Gb ICs produced on the latest 20nm fabrication process, which takes performance to a whole new level, by Samsung Electronics.

While 16GB capacity have been available for server memory in the past, support and design for such large capacity memory modules are now paving its way to consumer memory modules, suitable for workstation level workloads where high capacity memory is vital. These new G.SKILL Ripjaws 4 series high capacity memory kits are capable of running in quad-channel at a grand total of 128GB, and have already been validated on the latest ASUS X99 Rampage V Extreme motherboard with Intel Haswell-E processors. A stress-testing screenshot of the newly released memory kit with 16GB DDR4 modules can be found below.

PNY Technologies, world renowned manufacturing giant for USB and Memory products, has officially announced the release of their latest OTG flash drive, the DUO-LINK OU4 OTG USB 3.0 drive. It provides an alternate external storage solution for adding digital content and transferring it from a computer to your smartphone, tablets, iPads and more. The drive offers fast transfers of photos, videos, and music to any computer with a USB 3.0 port, making it easy to free up space on your Android device.

The OU4 comes manufactured in durable metal casing and features a swivel design cap that can be rotated to the side to reveal the microUSB 2.0 placed underneath it. The swivel plastic cap is cleverly attached to the drive, which makes it convenient to slide it back when not in use and protect the port from dust and scratches. For added mobility, it features an integrated strip hole located at the cap, so it can be securely attached to your mobile straps, keychain, wallets or it can be looped around a lanyard and adorned as an accessory.

Micron Technology, Inc., and Intel Corporation today revealed the availability of their 3D NAND technology, the world's highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device.

This new 3D NAND technology, which was jointly developed by Intel and Micron, stacks layers of data storage cells vertically with extraordinary precision to create storage devices with three times higher capacity than competing NAND technologies. This enables more storage in a smaller space, bringing significant cost savings, low power usage and high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today introduced a high-performance mobile memory storage based on Embedded MultiMediaCard (eMMC) 5.0 technology. The new 128-gigabyte (GB), 3-bit NAND-based eMMC 5.0 storage is targeted at the smartphone and tablet mass markets.

"With the introduction of our value-focused, 3-bit NAND-based eMMC 5.0 line-up, we expect to take the lead in the expansion of high-density mobile storage," said Dr. Jung-Bae Lee, Senior Vice President of Memory Product Planning and Application Engineering Team, Samsung Electronics. "We are continuing to enhance our next-generation embedded mobile memory offerings with improved performance and higher densities to meet increasing customer demand across the mobile industry."

Micron Technology, Inc., today announced the availability of ultra reliable, ultra high-speed and ultra high-temperature parallel NOR Flash and low-power DDR4 (LPDDR4) DRAM to meet the increasing memory requirements for the automotive market segment. Micron's G18 NOR family offers the industry's highest-performance parallel NOR, while Micron's automotive-grade LPDDR4 solutions are an industry-first.

These new products meet the needs of automotive applications that require ultra high speed. The G18 family's high performance (266 MB/s)enables faster boot and code execution for higher-density applications, while LPDDR4 enables 33 percent higher peak bandwidth than DDR4. Additionally, Micron's new solutions deliver long-lasting reliability and meet ISO/TS certification requirements-with the G18 family enabling three times faster throughput over quad SPI NOR, and the LPDDR4 products undergoing additional package-level burn-in testing. Furthermore, Micron's G18 NOR products have options that meet the industrial temperature (IT) range of -40 to 85°C and the automotive-grade automotive temperature (AAT) range of -40 to 105°C. The LPDDR4 products have options that meet the automotive-grade industrial temperature (AIT) range of -40 to 95°C, as well as some future options that will meet the automotive-grade ultra temperature (AUT) range of -40C to 125°C, which is the highest operating temperature range in the industry, expected to be available in 2016.

Inno3D iChill GeForce GTX 980 and GTX 970 Black Series Accelero Hybrid S is an integrated air and liquid solution in the after-market. It offers an all-in-one solution with 200% cooling performance and 9 times quieter than the stock cooler. It is also the first LCS to have an integrated active fan specifically designed to cool RAM and VR. Furthermore, it is simple to use, maintenance-free and excellent value for money.

Traditionally GPU liquid cooling is expensive and complicated and adopted by only the most technical audience, the GPU however is now one of the most power hungry and hottest components you'll find in a high-end PC and will benefit from the iChill liquid cooling system even more than CPUs.

Boutique memory modules designer Avexir unveiled its flagship DDR3 memory module, the RAIDEN. This double-height module features a plasma tube on its top, which lights up with a blue lightning-effect, which could look awesome in cyberpunk case-mods. The module could pair particularly well with ASUS Z97 Sabertooth Mark S, ASUS X99 series, and MSI Krait series motherboards.

Form aside, the module has some pretty formidable specs - an 8-layer main PCB, XMP profiles of up to DDR3-2400 MHz, a machined aluminium heatsink drawing heat away from the DRAM chips, and hand-binned DRAM chips for the best overclocked performance. The RAIDEN comes in speeds of DDR3-1866 and DDR3-2400, densities of 4 GB and 8 GB, and in dual- and quad-channel kits that are combinations of the two top-level specs. Avexir didn't reveal pricing or availability.

HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced HyperX FURY DDR4 memory. HyperX FURY DDR4 is the first product line to offer automatic overclocking via plug-and-play functionality for the next generation of high-end desktops featuring the Intel X99 chipset and Haswell-E processors. HyperX FURY DDR4 is available in 2133MHz, 2400MHz and 2666MHz frequencies, and in various kits configurations from 8GB to 64GB.

HyperX FURY DDR4 memory is a cost-efficient high-performance upgrade for Intel 6- and 8-core processors and helps to provide faster video editing, 3D rendering, gaming and AI processing. It takes full advantage of the power efficiency of DDR4 with low 1.2V settings. HyperX FURY DDR4 features a low profile heat spreader in the signature FURY asymmetrical design with black PCB to stand out and complement the latest PC hardware designs.

SanDisk Corporation, a global leader in flash storage solutions, today introduced the 200GB SanDisk Ultra microSDXC UHS-I card, Premium Edition, the world's highest capacity microSD card for use in mobile devices. In just one year after introducing its record-breaking 128GB SanDisk Ultra microSDXC card, SanDisk has increased storage capacity by 56% within the same fingernail-sized form factor. Keeping up with the demands of today's mobile users, the new card provides the freedom to capture, save and share photos, videos and other files without worrying about storage limitations.

"Mobile devices are completely changing the game. Seven out of 10 images captured by consumers are now from smartphones and tablets. Consumers view mobile-first devices as their primary means for image capture and sharing, and by 2019 smartphones and tablets will account for nine out of 10 images captured," said Christopher Chute, Vice President, Worldwide Digital Imaging Practice, IDC. "As the needs of mobile users continue to change, SanDisk is on the forefront of delivering solutions for these demands as is clearly illustrated through their growing portfolio of innovative products, including the new 200GB SanDisk Ultra microSDXC card."

SanDisk Corporation, a global leader in flash storage solutions, today introduced two new, innovative mobile memory solutions that help consumers manage and transfer content captured on their favorite devices. The company's first Dual USB Drive with Type C connector, ideal for Type C-ready connected devices, and the 128GB iXpand Flash Drive, designed for iPhone and iPad, both enable consumers to quickly and easily transfer content directly from a mobile device to a Mac or PC computer.

According to a recent industry report from IDC, this year people will capture and share an estimated 1.6 trillion images, and seven out of 10 of those images will be captured on a mobile device. With this rising trend, users want to be able to easily share and store their content across multiple devices and operating systems - in a seamless, intuitive and secure way.

SanDisk Corporation, a global leader in flash storage solutions, today introduced the company's first high endurance microSDXC memory card built to withstand up to 10,000 hours of Full HD Video recording.

Leveraging its deep expertise in NAND flash and systems technology capabilities, SanDisk developed a proprietary technology and process to enable high-intensity recording. Through rigorous testing, the new technology has proven itself to enable the company to reach a new milestone -- a 64GB microSDXC card that allows consumers to write and rewrite up to 10,000 hours of Full HD video recording.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it is now mass producing the industry's first 128-gigabyte (GB) ultra-fast embedded memory based on the much-anticipated Universal Flash Storage (UFS) 2.0 standard for next-generation flagship smartphones. The new embedded memory's UFS 2.0 interface is the most advanced JEDEC-compliant, next-generation flash memory storage specification in the world.

"With our mass production of ultra-fast UFS memory of the industry's highest capacity, we are making a significant contribution to enable a more advanced mobile experience for consumers," said Jee-ho Baek, Senior Vice President of Memory Marketing, Samsung Electronics. "In the future, we will increase the proportion of high-capacity memory solutions, in leading the continued growth of the premium memory market."

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD84-B51: Embedded MultiMediaCard (e.MMC), Electrical Standard (5.1). e.MMC v5.1 defines new features and updates for this embedded mass-storage flash memory that is widely used in smartphones and other mobile devices. Intended to facilitate an enhanced end user experience, the new version of e.MMC offers command queueing for the first time, and also defines important security updates. JESD84-B51 is available for free download from the JEDEC website.

The new revision of the standard defines e.MMC Command Queueing, which supports the optimized execution of commands within the device, versus the single thread protocol defined in prior versions of the standard. Command Queueing will enable the device to analyze commands before executing them, thereby maximizing effectiveness of the e.MMC memory storage. This will result in a positive effect on random read performance and read latency, thereby improving the end user experience.

We haven't heard the last of NVIDIA's GeForce GTX 970 memory allocation controversy, not by a long shot. Owners of the card, after having compiled technical information and details over weeks, filed a class-action lawsuit in a US Court (District Court for the Northern District of California). The lawsuit, titled "Andrew Ostrowsky (and others in similar situation) vs. NVIDIA Corporation and GIGABYTE Global Business Corporation," accuses the defendants of unfair, unlawful, and deceptive business practices, in three separate charges, and misleading advertising, demanding for Jury Trial.

The lawsuit goes on to read that the amount in controversy exceeds US $5 million, and encompasses over 100 Class members, meeting the minimal diversity clause, with the plantiff and numerous Class members being citizens of different states than the defendants. The lawsuit accuses the defendants of misleading buyers of the GeForce GTX 970 graphics cards with memory amount (being 3.5 GB with a 0.5 GB "spillover," and not the advertised 4 GB), ROP count being 56 and not 64 (as communicated to the media at launch, and to buyers through them); and L2 cache amount being 1.75 MB and not 2 MB. If you are eligible to be a Class member, find details of the law firms involved in the lawsuit document.