Alongside its big Radeon Pro Duo flagship graphics card launch, AMD unveiled its GPU architecture roadmap that looks as far into the future as early-2018. By then, AMD will have launched as many as three new GPU architectures. It begins with the launch of its 4th generation Graphics CoreNext architecture, codenamed "Polaris," in mid-2016. Built on the 14 nm FinFET process, "Polaris" is expected to offer a whopping 2.5x increase in performance-per-Watt for AMD, compared to its current GCN 1.2 architecture on 28 nm.

Hot on Polaris' heels, in early-2017, AMD plans to launch the "Vega" GPU architecture. While this appears to offer a 50% increase in performance-per-Watt over Polaris, its highlight is HBM2 memory. Does this mean that AMD plans to skip HBM2 on Polaris, and stick to GDDR5X? Could AMD be opting for a similar approach to NVIDIA, by launching its performance-segment GPU first as an enthusiast product, giving it a free run on the markets till early-2017, and then launching a Vega-based big-chip with HBM2 memory, taking over as the enthusiast-segment product? Some time in early-2018, AMD will launch the "Navi" architecture, which appears to offer a 2.5x performance-per-Watt lead over Polaris, taking advantage of an even newer memory standard.

It looks like NVIDIA's next GPU architecture launch will play out much like its previous two generations - launching the second biggest chip first, as a well-priced "enthusiast" SKU that outperforms the previous-generation enthusiast product, and launching the biggest chip later, as the high-end enthusiast product. The second-biggest chip based on NVIDIA's upcoming "Pascal" architecture, the "GP104," which could let NVIDIA win crucial $550 and $350 price-points, will be a lean machine. NVIDIA will design the chip to keep manufacturing costs low enough to score big in price-performance, and a potential price-war with AMD.

As part of its efforts to keep GP104 as cost-effective as possible, NVIDIA could give exotic new tech such as HBM2 memory a skip, and go with GDDR5X. Implementing GDDR5X could be straightforward and cost-effective for NVIDIA, given that it's implemented the nearly-identical GDDR5 standard on three previous generations. The new standard will double densities, and one could expect NVIDIA to build its GP104-based products with 8 GB of standard memory amounts. GDDR5X breathed a new lease of life to GDDR5, which had seen its clock speeds plateau around 7 Gbps/pin. The new standard could come in speeds of up to 10 Gbps at first, and eventually 12 Gbps and 14 Gbps. NVIDIA could reserve HBM2 for its biggest "Pascal" chip, on which it could launch its next TITAN product.

Samsung Electronics, the world leader in advanced memory technology, announced that it is now mass producing the industry's first 256-gigabyte (GB) embedded memory based on the Universal Flash Storage (UFS) 2.0 standard, for next-generation high-end mobile devices. The newly introduced embedded memory features outstanding performance for mobile devices that exceeds that of a typical SATA-based SSD for PCs.

"By providing high-density UFS memory that is nearly twice as fast as a SATA SSD for PCs, we will contribute to a paradigm shift within the mobile data storage market," said Joo Sun Choi, Executive Vice President, Memory Sales and Marketing, Samsung Electronics. "We are determined to push the competitive edge in premium storage line-ups - OEM NVMe SSDs, external SSDs, and UFS - by moving aggressively to enhance performance and capacity in all three markets."

SanDisk Corporation, a global leader in flash storage solutions, today introduced the SanDisk Ultra USB Type-C Flash Drive designed specifically for next-generation devices. The sleek, new drive features a versatile and powerful USB Type-C connector for quick file transfer between USB Type-C enabled mobile devices, laptops, tablets and future devices.

"We expect to see many new USB Type-C supported devices released in 2016," said Dinesh Bahal, vice president, product marketing, SanDisk. "As more consumers purchase ultra-mobile PCs, smartphones and tablets that feature this new, more advanced USB standard, it is critical to offer a complete ecosystem of compatible products. New offerings, like our SanDisk Ultra USB Type-C Flash Drive, will give consumers the capabilities they've come to expect from traditional Type A ports, but with the added benefit of better performance."

Toshiba Corporation's Semiconductor & Storage Products Company today announced the launch of the "SG5 series" of client SSDs integrating NAND chips fabricated with 15nm TLC process technology. The new products, which include high capacity 1024GB models, will be available in 2.5-type and M.2 2280 (single- and double-sided) form factors, to meet various mounting requirements from the expansion of SSD application fields. Sample shipments start from today.

The SG5 series is equipped with Toshiba's proprietary QSBC (Quadruple Swing-By Code) error correction technology, a highly efficient error correction code (ECC) which helps protect customer data from corruption and improves reliability. Toshiba will continue strengthening its SSD lineup, meeting the various needs of users and leading the continuously expanding SSD market.

Apacer is pleased to announce its groundbreaking achievement in DDR history, BLADE FIRE DDR4 with heartbeat LED, perfectly for gaming, overclocking, and M.O.D enthusiasts. It is astonishing to see speed at 3200 MHz with LED pulsing at 44 beats per minute yet it is still consuming low voltage at 1.35V. It is compatible with Intel Z170 platforms, providing unprecedented performance and energy-saving efficiency. Backed by the world's best technology in industrial memory module and storage, BLADE FIRE DDR4 makes users on fire in the gaming/ overclocking star-war.

The world-class BLADE FIRE DDR4 is an advanced generation of Blade DDR4 which was published in Feb 2015, featured a sensational armory design on heat spreader as well as LED lights heartbeat effect. The meticulously screened ICs allow the optimized stability and compatibility while playing in the heavy workload games. BLADE FIRE is available in 4 GB, 8 GB, and 16 GB capacities in dual-module package and comes equipped with total capacity of 32 GB (16 GB x2). The fastest memory kit available is clocked at 3200 MHz, and BLADE FIRE kits are ranged in four different clock speeds from 2400 MHz 1.2V to 3200 MHz 1.35V with 16-16-18-38. The XMP 2.0 support for simple overclocking setup delivers instant top-level performance for motherboards with Intel's 100 Series. Not only low latency for outstanding DDR4 performance but also lower power consumption with less heat and higher reliability provides users the fastest speeds and the highest stability when it comes to gaming and overclocking.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is truly excited to announce yet another breakthrough in high-performance, high-capacity DDR4 memory kit by taking a full 128GB (16GBx8), the maximum supported capacity on an X99 motherboard, to an searing speed of DDR4-3200MHz CL14-14-14-34 under 1.35V.

Not only does this massive memory kit manage to max out on supported capacity at high speeds, its latency is also improved to CL14-14-14-34, which is also more efficient than the standard DDR4-2133MHz latency of CL15-15-15-35. At this point, there's nowhere else to go but faster.

MSI proudly presents the upgraded Gaming All-in-One PC: MSI Gaming 24. Equipped with more powerful hardware than its predecessor, this system is capable and ready to run the newest PC games in full glory. The large 24" Full HD display offers an outstanding gaming experience with fast response times for improved gaming performance. By using the HDMI input, the display can also be used to connect a game console. The display also comes with MSI Anti-flicker technology, to prevent screen flickering and blue light emission through a smartly stabilized power current, thereby reducing eyestrain and fatigue.

The MSI Gaming 24 utilizes Intel's new Skylake-H platform enabling a better CPU performance with reduced power consumption. It supports up to 32 GB dual-channel DDR4 memory to take care of the most demanding tasks. To run the newest games, the system is equipped with a NVIDIA GeForce GTX 950M or 960M graphics chip. This time with 4GB GDDR5 memory, which is twice as much as its predecessor. The Gaming 24 features the next generation Intel Wireless-AC 3165 Wi-Fi adapter and Killer E2400 Ethernet. Ensuring faster network speeds and prioritization of network traffic for online games.

Samsung Electronics Co., Ltd., announced today that it has begun mass producing the industry's first 4-gigabyte (GB) DRAM package based on the second-generation High Bandwidth Memory (HBM2) interface, for use in high performance computing (HPC), advanced graphics and network systems, as well as enterprise servers. Samsung's new HBM solution will offer unprecedented DRAM performance - more than seven times faster than the current DRAM performance limit, allowing faster responsiveness for high-end computing tasks including parallel computing, graphics rendering and machine learning.

"By mass producing next-generation HBM2 DRAM, we can contribute much more to the rapid adoption of next-generation HPC systems by global IT companies," said Sewon Chun, senior vice president, Memory Marketing, Samsung Electronics. "Also, in using our 3D memory technology here, we can more proactively cope with the multifaceted needs of global IT, while at the same time strengthening the foundation for future growth of the DRAM market."

The newly introduced 4GB HBM2 DRAM, which uses Samsung's most efficient 20-nanometer process technology and advanced HBM chip design, satisfies the need for high performance, energy efficiency, reliability and small dimensions making it well suited for next-generation HPC systems and graphics cards.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of an update to JESD235 High Bandwidth Memory (HBM) DRAM standard. HBM DRAM is used in Graphics, High Performance Computing, Server, Networking and Client applications where peak bandwidth, bandwidth per watt, and capacity per area are valued metrics to a solution's success in the market. The standard was developed and updated with support from leading GPU and CPU developers to extend the system bandwidth growth curve beyond levels supported by traditional discrete packaged memory. JESD235A is available for free download from the JEDEC website.

JESD235A leverages Wide I/O and TSV technologies to support up to 8 GB per device at speeds up to 256 GB/s. This bandwidth is delivered across a 1024-bit wide device interface that is divided into 8 independent channels on each DRAM stack. The standard supports 2-high, 4-high and 8-high TSV stacks of DRAM at full bandwidth to allow systems flexibility on capacity requirements from 1 GB - 8 GB per stack.

Team Group Inc., the world's leading memory brand, today announced the launch of the all new generation of overclocking memory for gaming - Dark Pro Series. Since every motherboard manufacturer is focusing on competing in Skylake platform, besides model for the mainstream Z170 motherboard, we also provide other advanced models for overclocking enthusiasts and gamers to test their passion. Team Group is pushing the overclocking limit of our all new Dark Pro series for targeted overclocking enthusiasts & gamers. Combining extreme performance and stability that hardcore gaming required, we will provide gamers the finest gaming experience with our solid technology strength.

Dark Pro's all new cooling design combines the low key style of the Dark series and the multi colors design of the Vulcan series. The reinforced aluminum heat spreader with a punched dots design concept is used to express the hidden strength within. It also matches with the word of Dark Pro printed on the black Tungsten steel heat spreader. No matter it's for assembling or upgrading, gamers will be satisfied with the excellent performance and the overall visual design.

Rambus Inc. (NASDAQ: RMBS) today announced it will collaborate with Microsoft researchers in the exploration of future memory requirements for quantum computing. The expertise of Rambus in high-bandwidth, power-efficient memory architectures, combined with Microsoft researchers' knowledge of advanced system and data center design will be applied to drive new technology platforms.

"Existing computer architectures are reaching limits due to the ever increasing demands of real-time data consumption, which is driving the need to explore new high-performance, energy-efficient computer systems," said Gary Bronner, vice president of Rambus Labs. "By working with Microsoft on this project, we can leverage our vast expertise in memory systems to identify new architectural models."

Apacer, one of the world leaders in memory and SSD products unveils its latest gaming DDR4 memory module, PANTHER, specially produced for support of next generation Intel' Skylake platform. The design of the PANTHER gaming DDR4 with aesthetic design on heat spreader and meticulously screened ICs indeed stands out from the rest of DDR4 memory offerings. Backed by the world's best technology in industrial memory module and storage, PANTHER DDR4 gives users much more than they expect in terms of functionality and stability, providing a budget-friendly gaming memory module.

PANTHER DDR4 is shipping single-module package and it comes in 4GB or 8GB capacity. The three available clock frequencies are 2133/2400/2666MHz with tight 15-15-15-36, 16-16-16-36 timings. It supports XMP 2.0 profiles for simple and easy overclocking with 2400MHz and the frequencies above. The operating low voltage of 1.2V greatly helps reduce power consumption, making the best out of it. PANTHER DDR4 guarantees fast speed as well as extreme stability on a high system load during long gaming session which allows gamers to perform the highest efficiency and to experience the most enjoyable game play. The most important of all, Apacer employs high quality and high-end ICs for PANTHER gaming DDR4, therefore users truly get more than they pay for.

Other World Computing (OWC), a leading zero emissions Mac and PC technology company, announced today that it has expanded its MaxRAM memory upgrade options for the newest Apple iMac 27" with Retina 5K display (Late 2015 iMac) to the maximum capacity of 64GB, twice the capacity of the factory-available options of up to 32GB.

After being the first vendor to provide aftermarket memory options for the new 27" iMac, OWC now offers the OWC MaxRAM Certified Upgrade kit of 64GB. This option provides buyers of the new iMac with greater choice, performance, savings and flexibility in their memory configuration choices.

Other World Computing (OWC), a leading zero emissions Mac and PC technology company, announced today a new OWC Memory Upgrade Kit with up to 32GB of memory for the Late 2015 Apple iMac 27" with Retina 5K display announced today by Apple. OWC 1867Mhz DDR3 memory, compatible with the new iMacs, will begin shipping on Friday, October 16. While the new iMacs are available in configurations up to 32GB of memory, OWC is testing for support of up to 64GB of memory.

New iMac owners seeking to max-out their RAM can select the 32GB OWC memory upgrade from OWC and save $336 compared to the 32GB factory cost of $600. For even more savings, iMac with Retina 5K display owners can trade-in the two factory base 4GB memory modules.

Patriot, a leading manufacturer of computer memory, USB/flash memory, SSDs, and mobile accessories, today announced the extension of their Viper 4 series of DDR4 memory with a new 3600MHz dual kit designed for the latest Intel Skylake core processor utilizing the 100 series platform.

Designed with a high performance custom heat shield structured to withstand the most taxing PC environments and provide continuous stable performance, the Patriot Viper 4 3600MHz dual kit clocks in with impressive timings of 17-18-18-36 while pulling 1.35V of power. The 3600MHz Viper 4 dual kit has become Patriot's fastest kit since the release of the 3400MHz dual kit at the start of September. The ideal addition for PC enthusiasts looking to update their system, the Viper 4 3600MHz dual kit will deliver unparalleled performance for the ultimate gaming rig.

HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced the launch of HyperX Savage DDR4 memory. With its fast speeds and aggressive timings, HyperX Savage DDR4 offers ultra-responsive multitasking and an overall faster system making it perfect for advanced gamers, overclockers and power users.

With speeds up to 3000MHz, HyperX Savage DDR4 allows for faster video editing, 3D rendering and gaming. The built in XMP ready profiles are optimized for Intel Core i5 and i7 processors, as well as Z170 on 100 Series and X99 chipsets enabling users to easily overclock just by selecting a memory profile without any adjustments in BIOS. Available in single modules and kits up to 64GB, Savage DDR4 runs as low as 1.2V and at max 1.35V resulting in less power consumption than DDR3 and higher reliability.

Intel plans to launch the first consumer SSD based on its new 3D Xpoint memory technology, a successor to NAND flash which promises exponential gains in performance and capacity, some time in 2016. The Intel-branded drive will be called Intel Optane, will come in modern form-factors such as M.2/NGFF, SATA-Express, PCI-Express (add-on card), and will take advantage of the new NVMe protocol.

Early prototypes of Optane demoed at IDF already offer up to 5.5 times the throughput of NAND flash-based DC P3700 series SSDs, and we're only talking about single-queue performance. Compared to the queue depth of just 32 commands for AHCI, NVMe offers command queue depth of a staggering 65,535 commands. Since Micron Technology is the co-developer of 3D Xpoint, it's likely that we'll also see Micron/Crucial branded drives based on this tech.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory solid state storage, power supplies, and gaming peripherals, demos two ultra-fast DDR4 memory kits at DDR4 4266MHz 8GB (2x4GB) and DDR4 4133MHz 8GB (2x4GB) extreme speed at the Intel IDF 2015 event this week.

Featuring the latest 6th Generation Intel Core processors and Z170 motherboards, G.SKILL is pushing dual channel DDR4 speed to new heights. The DDR4 4266MHz 8GB (2x4GB) kit is demoed on the Intel Core i7-6700K processor and ASRock Z170 OC Formula overclocking motherboard, while the DDR4 4133MHz kit is demoed on the Intel Core i7-6700K CPU and ASUS ROG Maximus VIII Hero motherboard. Both kits represent the fastest DDR4 memory speed ever seen on live air-cooling demo systems.

Team Group Inc., the world's leading memory brand, launched the overclocking memory - Xtreem DDR4 3466/3600 8GBx2 for Skylake. After it is unlocked on 8/6, Skylake Z170 platform, which was specifically designed for mainstream overclocking enthusiasts, has been the new focus of every gamer's attention around the world. In order to meet the needs of the market, Team Group launches a series of DDR4 memories that are all compatible with Skylake to ensure gamers have the most complete users' experience.

In addition of launching a series of Skylake compatible DDR4 memory, the gamers oriented Xtreem series lead the industry by releasing the large capacity 8GBx2 dual channel kit. With clock frequency of up to DDR4 3466/3600, it ensures smooth and stable performance even when hardcore gamers are playing the latest games. To achieve the best gaming experience, an extreme optimal performance must come with an awesome compatibility. The Team Group Xtreem series for Skylake is all compatible certified with ASUS ROG motherboards. By activating XPM, you will immediately have the ultimate gaming machine when you are heading into battle.

Innodisk, the service-driven flash and DRAM provider, announces higher capacity 16GB versions of its DDR4 embedded and server unbuffered DRAM series. These 2133MHz UDIMMs and SODIMMS now come in industry-leading 16GB capacities, allowing more memory to be installed within space constrained embedded systems, industrial PCs and servers. Offering higher performance with lower power consumption compared to DDR3, the new DRAM modules have ECC available for reliability, as well as industrial strength features from Innodisk such as 30µ" Gold Finger connectors, thermal sensors, and protective conformal coatings. The new 16GB modules make Innodisk's range of DDR4 products the most complete line of embedded and server DDR4 memory on the market.

"16GB is the highest capacity unbuffered DDR4 module available on the market," said Samson Chang, Vice President of Embedded DRAM Business Unit of Innodisk. "We're proud that Innodisk is able to provide this memory capacity while bringing the performance and low power benefits of DDR4 to the embedded and server markets. In addition, we're bringing extra value to our industrial customers with Innodisk features like onboard thermal sensors and protective coatings.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory, solid state storage, power supplies, and gaming peripherals, proudly announces the world record memory frequency has been broken with the G.SKILL Ripjaws 4 at DDR4-4795.8 MHz.

Surpassing the previous records at a mind-blowing 4795.8MHz under liquid nitrogen, extreme overclocker Chi-Kui Lam overclocked Ripjaws 4 memory made from Samsung IC to achieve this stunning feat on the new ASRock Z170 OC Formula motherboard and the very latest Intel i7-6700K processor. Check out the world record validation on HWBOT (validation) in the screenshot below.

MSI's brand new Z170 based motherboard, the MSI Z170A XPOWER GAMING TITANIUM EDITION, just showed off its outstanding overclocking performance in dual-channel DDR4 memory by achieving world's highest DDR4 Memory Frequency at a staggering 4605MHz clock speed. Indicating just how effective MSI's new DDR4 BOOST technology is in optimizing memory performance on Intel's latest Z170 based motherboards. This achievement shows that the new Z170A XPOWER GAMING TITANIUM EDITION not only pushes the boundaries of single-channel memory speed but also performs amazingly in dual-channel memory.

The new MSI Z170A XPOWER GAMING TITANIUM EDITION offers an arsenal of new features and improvements as well as technical ingenuity. This exceptional motherboard features the all new OC Dashboard, an independent panel for overclockers to tune settings. The new DDR4 Boost uses fully isolated circuitry to ensure memory signals stay pure for maximum performance and stability. Reinforced PCI slots with Steel Armor are forged to support the heaviest graphics cards in multi GPU setups.

PNY Technologies, world renowned manufacturing giant for USB and Memory products, has officially released the special & limited edition of 128GB in HP v220w. It offers an easy and extremely convenient way to transfer share and store. The HP v220w offer intelligent storage in the sleek metallic with classic silver color. HP v220w features a generous storage capacity of 128GB, so you can comfortably share and transfer your favorite images, music, videos, movies or office documents on this HP USB flash drive.

Whether you want to grab and move with your digital files, the HP v220w is the best solution for any outdoor ventures, it has ample storage space to ensure all your files stored in a safe and secure manner and may never have to worry about running out of memory space, thanks to the massive 128 GB storage space. It has a high-quality durable metallic casing with silver and a sleek streamlined appearance with dust and water-resistant, the sturdy build of the drive makes it apt for people who are constantly on the go.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory, solid state storage, power supplies, and gaming peripherals, is extremely thrilled to announce the first retail memory kit to break through the 4000MHz barrier and two brand new memory series - the Trident Z and Ripjaws V series - with updated performance specifications designed for the latest 6th generation Intel Core Processors and Z170 motherboards.

The new Trident Z DDR4 memory is the successor to the high-end Trident memory series and making its debut on the latest DDR4 standard, designed and tested for the next generation Skylake-S platform! For the first time in the history of extreme memory kits, Trident Z is entering the arena with a 4000MHz memory kit, built with highest-end Samsung IC memory chips and validated on the ASRock Z170 OC Formula motherboard.