Western Digital Corporation, a global data storage technology and solutions leader, today announced its 400 GB SanDisk Ultra microSDXC UHS-I card, the world's highest-capacity microSD card for use in mobile devices. Two years after introducing its record-breaking 200 GB SanDisk Ultra microSDXC card, Western Digital has doubled the capacity within the same tiny form factor. Keeping up with the demands of today's mobile-centric lifestyle, the new SanDisk microSD card provides consumers with the freedom to capture, save and share photos, videos and apps, and enjoy offline content - all without worrying about storage limitations.

"Mobile devices have become the epicenter of our lives, and consumers are now accustomed to using their smartphones for anything from entertainment to business. We are collecting and sharing massive amounts of data on smartphones, drones, tablets, PCs, laptops and more. We anticipate that storage needs will only continue to grow as people continue to expect more sophisticated features on their devices and desire higher quality content," Jeff Janukowicz, research vice president, IDC. "We estimate mobile device users worldwide will install over 150 billion applications alone this year, which require a ton of memory on all of our favorite devices."

GALAX has seemingly found itself in a profitable market position with its products marketed for the premium enthusiast, with their (perspective depending) bold good looks and out of the ordinary propositions for new products. Now, the company has announced an extremely limited edition kit (really; there are just 50 of these) of DDR4 memory, aptly named the HOF Extreme Limited Edition. The "Extreme Performance" engraving on the aluminum heat spreaders serves as a psychological reminder for the kits that they just "gotta go fast", and should put to rest concerns regarding memory performance.

Under the heatspreaders rest handpicked Samsung B-die chips, which should guarantee better performance and stability compared to other memory dies (particularly in the AMD Ryzen platform). The modules are available for direct purchase from the GALAX store, and the company is currently offering a 20% discount for users who have previously acquired one of the company's GALAX GTX 1080Ti OC Lab Edition. The kits are available in 16 GB (2x 8GB) dual-channel pairs, and orders will receive free shipping with an estimated shipping date towards the end of the month. The kits run at particularly impressive speeds of 4133MHz, with CL 19-21-21-41 timings, at 1.35V. Pricing is slightly less limited in this product, though; a dual-channel kit will set you back some $368 (around $294 if you have previously bought the OC Lab Edition GTX 1080 Ti.)

GALAX is apparently on the verge of launching two GPU overclocking-specific products, materialized in the HOF Power Board and an LN2 memory pot kit. Built to increase overclockability in your graphics card of choice, the GALAX power board will allow you to feed the GPU with way more power than it is designed to receive - provided you have decent cooling for the increased temperatures and operating voltages. And with the caveat of whether or not your GPU manufacturer of choice allows such changes in voltage.

Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, today unveiled the development of two new flagship enterprise solid state drive (SSD) solutions, the TMC PM5 12 Gbit/s SAS series and the CM5 NVM Express (NVMe) series. Development is expected to be completed in the fourth quarter. Both product lines are built with TMC's latest 64 layer, 3-bit-per-cell enterprise-class TLC (triple-level cell) BiCS FLASH2, making it possible for today's demanding storage environments to expand the use of flash with cost-optimized 3D flash memory. With all-new, advanced features, the innovative CM5 and PM5 series raise the bar in performance capabilities and create new opportunities for businesses to leverage the power of flash storage.

Offering up to 30.72TB in a 2.5-inch form factor, the TMC PM5 series introduces a full range of endurance and capacity SAS SSDs enabling data centers to effectively address big data demands while streamlining storage deployments. With the industry's first MultiLink SAS architecture, the PM5 series is able to deliver the fastest performance the market has seen from a SAS-based SSD with up to 3,350 MB/s of sequential read and 2,720 MB/s of sequential write6 in MultiLink mode and up to 400,000 random read IOPS in narrow or MultiLink mode. The PM5 series' 4-port MultiLink design is an additional technology to achieve high performance, close to PCI EXPRESS (PCIe)8 SSDs, enabling legacy infrastructures to increase productivity without having to be re-architected from the ground up. Furthermore, PM5 SSDs support multi-stream write technology, a feature that intelligently manages and groups data types to minimize write amplification and minimize garbage collection, translating into reduced latency, improved endurance, increased performance and Quality of Service (QoS).

Western Digital Corp. today announced its successful development of four bits per cell, X4, flash memory architecture offering on 64-layer 3D NAND, BiCS3, technology. Building on its pioneering innovation of X4 for 2D NAND technology and past success in commercializing it, the company has now developed X4 for 3D NAND by leveraging its deep vertical integration capabilities. These include silicon wafer processing, device engineering to provide sixteen distinct data levels in every storage node, and system expertise for overall flash management. BiCS3 X4 technology delivers an industry-leading storage capacity of 768 gigabits on a single chip, a 50 percent increase from the prior 512 gigabit chip that was enabled with the three bits per cell (X3) architecture. Western Digital will showcase removable products and solid-state drives built with BiCS3 X4 and systems capabilities in August at the Flash Memory Summit in Santa Clara, California.

"The implementation of X4 architecture on BiCS3 is a significant development for Western Digital as it demonstrates our continued leadership in NAND flash technology, and it also enables us to offer an expanded choice of storage solutions for our customers," said Dr. Siva Sivaram, executive vice president, Memory Technology, Western Digital. "The most striking aspect in today's announcement is the use of innovative techniques in the X4 architecture that allows our BiCS3 X4 to deliver performance attributes comparable to those in BiCS3 X3. The narrowing of the performance gap between the X4 and X3 architectures is an important and differentiating capability for us, and it should help drive broader market acceptance of X4 technology over the next several years."

GEIL's EVO Spear joins the company's DDR4 memory line-up with some inconspicuous looks and lack of LED lighting. The new series from GEIL also features something that's not all that common nowadays - a standard DIMM-sized heat spreader, which doesn't add much volume to the parts. This means these kits shouldn't pose many clearance problems (if any), which is a good thing in some smaller form-factor builds.

The new Kits from GEIL are available in both Intel and AMD-compatibility kits, and the new series is fully compatible with the Intel X299 HEDT platofrm (it remains to be see if the AMD-compatible parts will have the same compatibility towards the company's X399 Threadripper platform.). GEIL offers the module in speeds of 2133MHz up to 3466MHz, in single, dual or quad-channel kits. GEIL didn't release pricing information as of yet, but says that "EVO Spear Series is designed for PC gamers looking for well-performed standard-height gaming memory without high price tag." This probably means these kits will sell for less than comparable GEIL kits from other series. Expect these to hit the streets this July.

TechPowerUp and Patriot Memory brought you the 4th of July Giveaway to celebrate America's 241st Independence Day. Up for grabs were three of Patriot's finest Viper Gaming peripherals, including the latest Viper Gaming V770 gaming keyboard, V570 gaming mouse, V370 gaming headset, V530 gaming mouse, and V361 gaming headset with stand. Open to residents of the US and Canada, the giveaway concluded today, and without further ado, here are the winners:

• 1st prize - Sam from Worcester MA: Wins a Viper Gaming V770 keyboard + Viper V570 mouse + Viper V370 headset
• 2nd prize - Colton from Pittston PA: Wins a Viper V361 headset with headset stand and USB 3.0 hub
• 3rd prize - Victor from Machias ME: Wins a Viper V530 mouse

A huge congrats to you guys! TechPowerUp and Patriot Memory Viper Gaming will return with more such interesting giveaways!

GIGABYTE today announced its latest generation of servers based on Intel's Skylake Purley architecture. This new generation brings a wealth of new options in scalability - across compute, network and storage - to deliver solutions for any application, from the enterprise to the data center to HPC. (Jump ahead to system introductions).

This server series adopts Intel's new product family - officially named the 'Intel Xeon Scalable family' and utilizes its ability to meet the increasingly diverse requirements of the industry, from entry-level HPC to large scale clusters.. The major development in this platform is around the improved features and functionality at both the host and fabric levels. These enable performance improvements - both natively on chip and for future extensibility through compute, network and storage peripherals. In practical terms, these new CPUs will offer up to 28 cores, and 48 PCIe lanes per socket.

Patriot, a global leader in performance memory, SSDs, gaming peripherals and flash storage solutions, announces the compatibility of its Viper 4, Viper Elite and Signature Line DDR4 with the new AMD Ryzen and AM4 platforms. After extensive compatibility testing on X370 and B350 chipsets, using the AMD Ryzen R5 and R7 processors, and in partnership with key motherboard vendors, Patriot has developed a list of Ryzen compatible DDR4 parts.

"After working closely with our motherboard partners, these compatible kits will deliver maximum performance at factory-tested speeds," said Victor Chiu, DRAM Product Manager for Patriot. Offering compatible dual, quad and single configurations, with capacities ranging from 4GB to 64GB and speeds between 2133MHz and 3400MHz, Patriot Viper Elite, Viper 4 and Signature Line DDR4 Memory will provide both the every-day consumer as well as the PC enthusiast looking to upgrade their system to the new AMD Ryzen platform with reliable, award-winning, memory.

You must remember the ongoing house of horrors that is Toshiba's financial situation. Granted, it isn't that bad - the company is still managing to push the envelope on its semiconductor production business. Still, I'm sure the company would have liked to not be on the verge of selling out 20% of its memory business production stake - which is one of the company's most profitable divisions to begin with.

TEAMGROUP's gaming brand T-FORCE has once again shined with the launch of the all-new luminous DDR4 memory module: the DELTA RGB. Making its debut at COMPUTEX 2017, the DELTA RGB has captured everyone's attention during the exhibition with its dazzling ultra wide angle and full-range spectrum lighting effect. The DELTA RGB memory module features black or white heat spreaders, created by the TEAMGROUP design team with all new concepts. The heat spreaders are made with improved, high-quality metal that creates better dissipation and now are lighter and thinner than anything before it. The R on the DELTA RGB represents not only RGB but also revolution which symbolizes the company's creative concept with uncompromised spirit. To further highlight this symbolism, the effect of R is also amazingly showcasing the excellent illumination of DELTA RGB.

The DELTA RGB's unibody, geometric design gives the metal heat spreader a simple yet aggressive look. The embossed lines on the surface not only increase the heat dissipation area and also effectively enhance cooling of the memory module, so the quality of the operation can be finely stabilized. DELTA RGB is using full color, dazzling ultra wide angle RGB LED lighting with Force Flow effect. Moreover, the full range, 120° ultra wide angle luminous area at the top emits colorful bright light. It offers a vibrant array of colors that dazzle onlookers. Like a beam saber, it's a weapon to cut through the gaming world wielded by the player.

Graphene has been hailed for some time now as the next natural successor to silicon, today's most used medium for semiconductor technology. However, even before such more exotic solutions to current semiconductor technology are employed (and we are still way off that future, at least when it comes to mass production), engineers and researchers seem to be increasing their focus in one specific part of computing: internal communication between components.

Typically, communication between a computer's Central Processing Unit (CPU) and a system's memory (usually DRAM) have occurred through a bus, which is essentially a communication highway between data stored in the DRAM, and the data that the CPU needs to process/has just finished processing. The fastest CPU and RAM is still only as fast as the bus, and recent workloads have been increasing the amount of data to be processed (and thus transferred) by orders of magnitude. As such, engineers have been trying to figure out ways of increasing communication speed between the CPU and the memory subsystem, as it is looking increasingly likely that the next bottlenecks in HPC will come not through lack of CPU speed or memory throughput, but from a bottleneck in communication between those two.

PNY Technologies (PNY) considered one of the worldwide leaders in consumer electronics market and flash memory products, is ready to take on the gaming industry by storm with the launch of the Gaming Series to Asia market. The PNY Gaming Series offers best-in-class PC components to deliver gaming performance ranging from affordable to the most intense for die-hard gamers. Scheduled to be released in the 2nd half of 2017, the product categories will include gaming grade graphics cards, SSDs, and PC memory products that promise to deliver the competitive edge advantage in PC gaming.

Toshiba America Electronic Components, Inc. (TAEC) today announced the latest generation of its BiCS FLASH three-dimensional (3D) flash memory. The newest BiCS FLASH device features 4-bit-per-cell, quadruple-level cell (QLC) technology and is the first 3D flash memory device to do so. Toshiba's QLC technology enables larger (768 gigabit) die capacity than the company's third-generation 512Gb 3-bit-per-cell, triple-level cell (TLC), and pushes the boundaries of flash memory technology.

Toshiba's new QLC BiCS FLASH device features a 64-layer stacked cell structure and achieves the world's largest die capacity (768Gb/96GB). QLC flash memory also enables a 1.5-terabyte (TB) device with a 16-die stacked architecture in a single package - featuring the industry's largest capacity. This is a fifty percent increase in capacity per package when compared to Toshiba's earlier announcement of a 1TB device with a 16-die stacked architecture in a single package - which also offered the largest capacity in the industry at the time.

Toppc Pushes the X299 Gaming Pro Carbon AC Motherboard to Reach New DDR4 Frequency Milestone
One year ago, MSI's in-house overclocker, Toppc, broke the DDR4 5GHz barrier using G.SKILL memory and the MSI Z170I GAMING PRO AC motherboard. Today, 1 year later, he raises the bar once again and became the first ever to push DDR4 speeds to 5.5GHz under liquid nitrogen cooling using the new MSI X299 GAMING PRO CARBON AC motherboard. With the MSI X299 GAMING PRO CARBON AC, MSI's most customizable high-performance Intel X299 based motherboard, Toppc was running G.SKILL DDR4 memory with an unbelievable DDR4-SDRAM clock speed of 5500MHz. This world record shows MSI's dominant position on performance for X299 by using MSI's unique and patented DDR4 Boost technology. The MSI X299 GAMING PRO CARBON AC is not only feature packed for gamers and great for case modding, it is also perfectly suited to deliver power for heavy gaming & overclocking sessions.

Micron, who has been at the forefront in graphics memory production, has recently announced in a blog post their commitment to achieving ever increasing speeds and performance gains with their products (which isn't all that uncommon.) What this announcement has that better carves it as different and newsworthy, though, is that the company has seemingly achieved 16 Gbps speeds on GDDR5X memory - which up to now, ticked at up to 12Gbps. Some NVIDIA cards you probably know about actually had their GDDR5X memory clocked up to 12.4 Gbps.

The new achievements under GDDR5X will aid the company in better executing their vision for GDDR6 and its speed goals. Micron expects to have functional silicon of their G6 program very soon, being confident they can push products to market on early 2018. GDDR6 will bring some specific differences in regards to GDDR5X, such as dual-channel memory (GDDR5X is single-channel) and the introduction of a FBGA180 ball package with increased pitch, to accommodate these fundamental differences.

G.Skill Memory and TechPowerUp brought you a chance to win a kit of arguably the best memory for AMD Ryzen processors, with our Game Faster with Flare X Giveaway. Three lucky winners chosen at random stand a chance to win a G.Skill Flare X DDR4-3200 16 GB (2x 8 GB) dual-channel memory kit, each. We're thrilled to announce the winners:

• Jason from The Philippines
• Kevin from Halen, Belgium
• Amanda from Bloomington, United States

A huge congrats to you, Jason, Kevin, and Amanda! TechPowerUp and G.Skill will return with more such interesting giveaways!

GeIL showed off its AMD Ryzen-optimized EVO-X AMD Edition DDR4 memory, with integrated RGB LED lighting. The modules feature Ryzen-friendly DRAM chips (although we're not sure if they're Samsung b-die), coupled with an SPD profile that's readable by prominent third-party one-click optimization standards such as ASUS DOCP, MSI A-XMP, and XMP-translation. The modules have been tested for stability in sustaining their advertised clocks and timings on motherboards of various brands.

The RGB LED lighting on the EVO-X series supports various RGB LED control software such as ASUS/ASRock Aura Sync, MSI Mystic Light RGB, BIOSTAR Vivid LED DJ, and GIGABYTE RGB Fusion. You can also manually set the color and brightness physically on the module itself, using a slider button-set called "Sliding Hot Switch." The EVO-X AMD Edition runs at DDR4-3466 MHz, with timings of 16-18-18-38. They are available in module densities of 8 GB, and in dual-channel kits of 16 GB. The modules are available in white and black heatspreader colors. The company could launch quad-channel kits in the wake of the Ryzen Threadripper TR4 platform.

Ballistix has announced the DDR4 version of their Tactical Tracer memory modules, with the new memory type allowing for the usual DDR4 speeds, starting at 2,666 MHz. Since these share the same brains as the non-RGB tactical modules the company already distributes, one can expect timings (CAS latencies of 15 and 16), speeds and voltages (starting at 1.20V) to be in-line with previous offerings. These include the usual tactical Tracer specs, including XMP profiles, a black PCB, and customizable heat spreaders. The RGB lighting allows users to tailor the look of their memory according to their chosen rig color scheme, while offering at-a-glance temperature control (blue is cool, red is not.) All RGB features are controlled through yet another RGB controller software: in this case, the Ballistix M.O.D. (Memory Overview Display) software.

The customizable heat spreaders don't stop on the RGB lighting options, though; actually, Ballistix is offering a removable module for the heat-spreaders that users can customize by 3D printing substitute parts. The company is providing the 3D printer design files on its website, though you should be able to build upon them with your own. This is one of the most interesting features of these modules, though I wager we'll see a much higher 3D printing penetration once those little machines that can get their pricing further reduced (make no mistake - 3D printing is one of the most promising consumer technologies. Pricing information is currently unavailable, though Ballistix said the Tactical Tracer DDR4 RGB modules will be available in Q3 - with a limited lifetime warranty to boot.

ADATA showed off its Gammix D10 line of upper-mainstream DDR4 Memory modules. Available in module heatspreader colors of gray and red, the lineup consists of modules with DDR4-2400, DDR4-2800, and DDR4-3000 speeds, with module voltage ranging between 1.2V-1.35V, and density ranging from 4 GB, to 8 GB, 16 GB, and if we're reading the specs sheet correctly, even 32 GB! The modules feature Intel XMP which enables the advertised speeds.

You've probably heard of AMD's AGESA updates by now - the firmware updates that are ironing out the remaining kinks in AMD's Ryzen platform, which really could have used a little more time in the oven before release. However, kinks have been disappearing, the platform has been maturing and evolving, and AMD has been working hard in improving the experience for consumers and enthusiasts alike. As a brief primer, AGESA is responsible for initializing AMD x86-64 processors during boot time, acting as something of a "nucleus" for the BIOS of your motherboard. Motherboard vendors take the core capabilities of AGESA updates and build on them with their own "secret sauce" to create the BIOS that ultimately populate your motherboard of choice. The process of cooking up BIOS updates built on the new AGESA will vary from manufacturer to manufacturer, but AMD's Robert Hallock says you should be seeing BIOSes based on this version halfway through the month of June - if your vendor isn't already providing a Beta version of some kind.

This new AGESA update code, version 1.0.0.6, should be just up the alley of enthusiasts, however, in that it adds a grand total of 26 new parameters for memory configuration, improving the compatibility and reliability of DRAM, especially for memory that does not follow the industry-standard JEDEC specifications (e.g. faster than 2667, manual overclocking, or XMP2 profiles). Below you'll find the 26 parameters that were introduced.

AMD, in an interview with Forbes, confirmed that it is working to improve DDR4 memory support of its Ryzen series processors, to enable higher memory clocks. AMD Ryzen users find it difficult to get DDR4 memory clocks to run above 3000 MHz reliably. With memory clock being linked with the chip's Infinity Fabric clock (the interconnect between two CCX units on the "Summit Ridge" silicon), the performance incentives for higher memory clocks are just that much more.

AMD confirmed that its AGESA update for May improves DDR4 memory compatibility, although it also stressed on the need for motherboard manufacturers to improve their board designs in the future, with more PCB layers and better copper traces between the DIMM slots and the SoC socket. The company assures that more updates to AGESA are in the pipeline, and would improve performance of Ryzen processors at various levels. The AGESA updates are dispensed through motherboard vendors as BIOS updates.

South Korean DRAM and NAND flash giant SK Hynix updated its product catalog to feature its latest GDDR6 memory, besides HBM2. The company had April announced its first GDDR6 memory products. The first GDDR6 memory chips by SK Hynix come in 8 Gb (1 gigabyte) densities, and data-rates of 14 Gbps and 12 Gbps, with DRAM voltages of 1.35V. The company is giving away small quantities of these chips for product development, mass production will commence soon, and bulk availability is slated for Q4-2017. This would mean actual products implementing these chips could be available only by very-late Q4 2017, or Q1-2018.

A graphics card with 14 Gbps GDDR6 memory across a 256-bit memory bus (8 chips) features 448 GB/s of memory bandwidth. A card with 384-bit (12 chips), should have 672 GB/s at its disposal. Likewise, the 12 Gbps memory chips offer 384 GB/s in 256-bit (8-chip) setups, and 576 GB/s in 384-bit (12-chip) setups. Meanwhile, SK Hynix also updated its HBM2 catalog to feature a 32 Gb (4 gigabyte) HBM2 stack, with a clock speed of 1.60 Gbps. The 2.00 Gbps stack which featured in the Q4-2016 version of this catalog is no longer available. At 1.60 Gbps, a GPU with four stacks has 819.2 GB/s of memory bandwidth. A chip with two stacks, such as the purported "Vega 10" prototype that has made several media appearances, hence has 409.6 GB/s.

CORSAIR, a world leader in enthusiast memory, high-performance gaming hardware and PC components today announced the immediate availability of its new DOMINATOR PLATINUM Special Edition Torque DDR4 memory. Inspired by those for whom speed is an obsession, each module features a uniquely heat-treated effect top bar, combining the iconic DOMINATOR PLATINUM design with the aesthetic of high-performance engines.


Completed by a brushed black aluminum heatsink, stunning built-in lighting and orange accents, each kit is individually numbered using high precision laser engraving, guaranteeing exclusivity. Available in limited quantities, DOMINATOR PLATINUM Special Edition Torque DDR4 memory is built for speed - inside and out.

In case Intel's DC P4800X SSD (you know, the Optane-based SSD that sells for $1,520 for 375 GB) is too expensive for your wallet, Intel has now announced availability of the much more cost-effective Optane Memory accelerator, which is available in 16GB or 32GB single-sided M.2 2280 form factor drives. Just keep in mind that while you can order yours today, it's not meant to ship out until April 29th - but that's not too far off in any case.

If you're thinking of integrating one of these babies on your system (which actually do wonders for mechanical drives' performance, it seems, putting out 1.4GB/s data transfer speeds, as well as a 204MB/s low 4K read performance), just keep in mind compatibility is... iffy, as in, limited to the latest and greatest platform Intel has to offer. If you're not rocking something better than a Kaby Lake i3, and a 200 series chipset, you're out of luck. This seems like a strange occurrence, given that users with older, mechanical drive-based systems were looking to reap the greatest benefits from installing one of these puppies into their system, but this choice from Intel looks to stand more on platform support and the requirements of having such a technology in place than a way of artificially limiting compatibility. The 16GB model MEMPEK1W016GAXT starts at $45, and the 32GB model is expected to go for around $77.