Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, today introduced a new class of 1 GHz, 2-gigabit (Gb) and 4 Gb, 30-nanometer (nm) DDR3 devices, strengthening the company's comprehensive DDR3 portfolio. Designed for the high- performance networking and discrete graphics markets, the new devices feature industry-leading low power use while delivering speeds up to 2133 megatransfers per second (MT/s).

Micron supports its customers in highly competitive market segments with a broad portfolio of DRAM and nonvolatile memory devices that meet the demand for high-performance, cost-efficient memory solutions. "Micron has been successful in creating a complete DRAM portfolio, and this product offering rounds out the broadest DRAM offering in the industry," said Mike Howard, senior principal analyst, DRAM and Memory at iSuppli.

Apacer is presenting their entire product line of state-of-the-art storage solutions for consumer and industrial usages at Computex Taipei 2012, June 5 to 9, at booth T202A on the 2nd floor of Taipei International Convention Center. Apart from their very comprehensive USB 3.0 line-up including SuperSpeed flash drives, external hard drives as well as card readers, this year Apacer will also be showing their leading overclocking memory modules in live demonstrations.

G.SKILL - manufacturer of world leading high performance memory and SSD, debuts the largest memory computer system that runs a total of 96GB (8GBx 12) RipjawsZ DDR3 1600MHz kit on the latest EVGA SR-X motherboard at Computex 2012.

G.SKILL also displays the fastest memory of G.SKILL's TridentX which achieved the amazing speed over DDR3 3000MHz CL11 16GB (4GBx4) on both ASUS Z77 MAXIMUS V FORMULA and GIGABYTE Z77A-UD5 motherboards.

Silicon Power showed off its newest line of DDR3 modules for overclocking, named XPower. The modules will ship with high clock-speed XMP profiles (≥1866 MHz). The one pictured below does DDR3-2400 MHz. Available in module densities of 4 GB and 8 GB, the XPower modules with make up single-module, dual-channel, triple-channel, and quad-channel kits. Seeing as how these modules are also available in triple-channel kits, it's likely that some, if not all, support older versions of Intel XMP, for compatibility with older platforms (eg: triple-channel Nehalem and Westmere supporting XMP 1.2). Key selling features here are thoroughly tested modules, and chunky aluminum heatsinks.

Corsair is finally giving its high-end DRAM family some love, with the new Dominator Platinum family of high-speed DDR3 memory modules. With it, the company also came up with its newest DRAM module heatsink design. The new DHX heatsink uses a revamped design that extracts heat from the DRAM chips more efficiently. At its top portion, the module features a user-swappable "light bar", which is purely an aesthetic touch. Further, the modules support Corsair Link, which lets the user monitor temperatures and voltages of each module via software, in real-time. Pictured below is a DDR3-3000 MHz variant of the Dominator Platinum. The module packs an XMP 1.4 profile for 3000 MHz (1500 MHz actual), with CAS latency of 12T.

Patriot Memory, a global pioneer in high-performance memory, NAND flash, storage and enthusiast computer products today introduces their new Viper 3 memory series.

Specifically engineered for rock solid performance in the most demanding computer environments, Patriot Memory's Viper 3 Series is designed with true power users in mind. Available in a customized four color line up with specific performance variants, the Viper 3 Series will offer a wide range of performance solutions. Leading the pack, the Black Mamba will feature speeds from 1600 MHz up to 2133 MHz at 1.5 volts for increased stability and endurance. Providing speeds of 1600 MHz up to 2133 MHz, the Venom Red and Sapphire Blue modules will offer true killer high performance for enthusiast gaming and the most demanding applications. With full Intel XMP certification, the Sapphire Blue will be the ultimate gaming solution for use with Intel platforms and overclocking profiles. Offering an eco-friendly solution, the Jungle Green modules will feature a power draw of only 1.35 volts.

PNY Technologies, Inc. ("PNY") today announced the release of the Verto GeForce GT 640 1024MB DDR3 graphics card. This new entry-level NVIDIA 28nm Kepler card features dedicated graphics performance from this powerful next-generation GeForce architecture.

The GT 640 delivers premium multimedia performance and reliable entry-level gaming, for a faster, more immersive experience. Harnessing PhysX technology, bring your HD videos, photos, web, and games to life; edit your photos and videos; or play the latest DirectX 11 games with GPU-accelerated tessellation. Accelerate your desktop's performance with cutting-edge features, such as CUDA technology to handle the most demanding system tasks -- such as photo editing -- and delivering incredible performance improvements over traditional CPUs. Adding to the incredible performance and power efficiency of the GT 640 is the new -- built from the ground up -- SMX unit, available only on Kepler. The revolutionary Kepler GPU has taken graphics to the next level and allows the GT 640 to simultaneously run up to three monitors with NVIDIA Surround technology -- expanding your viewing perspective and increasing productivity.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced it is shipping HyperX dual-channel kits engineered especially for the new Intel third-generation Core i7 and i5 processors (Ivy Bridge). Kingston HyperX memory is available in 16GB and 8GB kits of two at 1600MHz, 2133MHz, 2400MHz and soon to be speedy 2666 MHz frequencies.

"The new 22nm architecture of this processor allows significant performance gains for benchmarkers, enthusiasts and overclockers," said Mark Tekunoff, senior technology manager, Kingston. "Enthusiasts who want to push the performance boundaries of the new processors will want to pair it with Kingston HyperX memory. Our 2666 MHz kit combined with the top CPU in the Ivy Bridge family will allow unparalleled performance."

Samsung Electronics Co., Ltd., a global leader in advanced semiconductor technology solutions, announced today that it has begun producing the industry's first four gigabit (Gb), low power double-data-rate 2 (LPDDR2) memory using 20 nanometer (nm) class* technology. The mobile DRAM (dynamic random access memory) chip, which went into mass production last month, will help the market to deliver advanced devices that are faster, lighter and provide longer battery life than today's mobile devices.

"Samsung began expanding the market for 4Gb DRAM last year with the first mass-produced 30nm-class DRAM, and now we are working on capturing most of the advanced memory market with our new 20nm-class 4Gb DRAM," said Wanhoon Hong, executive vice president, memory sales & marketing, Samsung Electronics. "In the second half of this year, we expect to strongly increase the portion of 20nm-class DRAM within our overall DRAM output to make the 4Gb DRAM line-up the mainstream product in DRAM production, and therefore keeping the leadership position in the premium market and strengthening our competitive edge."

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD209-3 LPDDR3 Low Power Memory Device Standard, designed to satisfy the performance and memory density demands of the latest generation of mobile devices such as smartphones, tablets, ultra-thin notebooks and similar connected devices on the newest, high-speed 4G networks.

LPDDR3 offers a higher data rate, improved bandwidth and power efficiency, and higher memory densities over its groundbreaking predecessor, LPDDR2. Developed by JEDEC's JC-42.6 Subcommittee for Low Power Memories, the LPDDR3 Low Power Memory Device Standard is available for free download from the JEDEC website: www.jedec.org/sites/default/files/docs/JESD209-3.pdf.

Crucial, a leading global brand of memory and storage upgrades, today announced the immediate availability of Crucial Load-Reduced DIMM (LRDIMM) server memory in support of the new Intel Xeon processor E5 family.

The rise of data center virtualization, cloud computing, and transactional databases has put additional strain on enterprise servers, causing them to struggle to meet user demands. Crucial LRDIMM server memory supports higher memory densities than standard DDR3 RDIMMs, allowing the addition of more DIMMs per channel, and providing flexible, scalable memory that allows applications to perform more effectively. By reducing the electrical loads presented to the CPU, Crucial LRDIMMs deliver up to twice the installed memory capacity for Intel Xeon processor E5 family-based servers, and increase memory bandwidth by up to 35 percent over standard DDR3 RDIMM modules, helping improve overall data center performance and efficiency.

The Hybrid Memory Cube Consortium (HMCC), led by Micron Technology, Inc., and Samsung Electronics Co., Ltd., today announced that Microsoft Corp. has joined the consortium. The HMCC is a collaboration of original equipment manufacturers (OEMs), enablers and integrators who are cooperating to develop and implement an open interface standard for an innovative new memory technology called the Hybrid Memory Cube (HMC). Micron and Samsung, the initial developing members of the HMCC, are working closely with Altera, IBM, Open-Silicon, Xilinx and now Microsoft to accelerate widespread industry adoption of HMC technology.

The technology will enable highly efficient memory solutions for applications ranging from industrial products to high-performance computing and large-scale networking. The HMCC's team of developers plans to deliver a draft interface specification to a growing number of "adopters" that are joining the consortium. Then, the combined team of developers and adopters will refine the draft and release a final interface specification at the end of this year.

Team Group Inc. has been invested a great deal of efforts in developing commercial products that catch up with global trends. Now we are expanding our spectrum to industrial markets and dedicate ourselves in the development of industrial products that features high standard and resistance to extreme environmental conditions. This year, Team Group rolls out the new industrial control memory module series, including Registered DIMM, ECC U-DIMM, VLP U-DIMM and Micro-DIMM, in the largest embedded system exhibition, the ESEC, in Japan.

The "industrial control wide-temperature series," the point in the show, is the "mighty warrior" that is able to operate in an environment at a temperature ranging from -40°C to 95°C. It is like operating stably in an extreme environment in the Arctic Circle or a scorching desert. This is absolutely the top choice for your industrial control memories and server memories.

Following the release of its new extreme DDR3 lineup, TridentX, G.SKILL is thrilled to host an extreme overclocking contest at HWBOT, the widely recognized authority in the field of overclocking. The G.SKILL CUP OC competition will start May 1st and run until May 30th and consists of three different stages with 14 G.SKILL Memory kits offered to the winners. For more detail, please refer to the event page.

Embedded System Expo (ESEC) Japan 2012 will hold during May 9th to May 11th in Tokyo, and KINGMAX will demonstrate its series of industrial grade of FLASH storage products - SSD (Solid Sate Drive), memory cards, DRAM and embedded memory - on the booth WEST11-65. Leveraging more than 20 years of DRAM and FLASH expertise in R&D and manufacturing, KINGMAX will present a complete series of industrial solution which is not only at latest specification but also has been undergone strict reliability test and verification to ensure the most stable quality.

KINGMAX Group is the world first memory module manufacturer owning IC packaging and testing facilities, and has long been committed to the innovation of the best memory module solutions. Leveraging years of R&D and manufacturing competency, KINGMAX first-launched Industrial products include three categories: Industrial Storage, Industrial Memory and Embedded Memory. First, KINGMAX will exhibit a series of industrial SSD, including SATA III and SATA II SSD-both withstand wide operation temperature(-40℃~ 85 ℃. KINGMAX will also release mSATA SSD and Half-Slim SSD for Ultrabook and small form factor embedded systems.

G.SKILL, the worldwide leading high performance memory designer, has announced the new TridentX DDR3 memory kit for 3rd Generation Intel Core Processors and Z77 platform.

The ultimate speed up to DDR3 2800 MHz 16 GB(4 GBx4) & DDR3 2666 MHz 32 GB(8 GBx4)

Designed for overclocking enthusiasts, the TridentX series includes a complete lineup of extreme performance DDR3 memory, starting from 2400 MHz 8 GB to 2800 MHz 16 GB. The following screens show the TridentX 2800 MHz 16 GB kit has successfully achieved DDR3 3320 MHz speed, while the 32 GB 2666 MHz kit has achieved DDR3 2933 MHz speed, both results are with 4 DIMMs fully installed under LN2.

Fusion-io announced the first software development kit (SDK) to provide software developers with native access to the ioMemory flash platform. By integrating applications directly with this new persistent memory tier, developers will be able to optimize enterprise, web, and big data applications through direct programmatic access to the ioMemory computing layer for the first time.

"Our January demonstration of one billion IOPS running on Auto Commit Memory, and Atomic Writes demonstrated the potential power of running applications natively on ioMemory. With our SDK, we are now making these tools available to software developers," said David Flynn, Fusion-io CEO and Chairman. "The ioMemory SDK and APIs reduce application complexity and speed development while accelerating time to market with fewer engineering requirements. When you get rid of that complexity, the resulting application is much more reliable and can leverage the full potential of ioMemory to run much faster."

Kingston launched a fleet of new system-specific SO-DIMM memory packages. Each of these packages contain memory that's tested for 100% compatibility and rated performance on the notebook makes they're specific to. These include HP, Dell, Apple, Lenovo, Sony, and Toshiba. The new packages make it easy for ground-store buyers to pick the right memory for their notebooks off the rack, with minimal help from the storekeepers. Newer batches of Kingston DDR3 SO-DIMM memory for notebooks will implement the new packaging.

An anonymous overclocker cracked a staggering DRAM speed (for dual-channel), using Intel Core i7-3770K processor (engineering sample) and ASUS Maximus V Gene motherboard, at DDR3-3256 MHz. The overclocker started off at DDR3-3153 (~1576 MHz actual) on boot, and carefully notched it up to DDR3-3256 (1628 MHz actual) in Windows. 16 GB of memory of an unknown make, was used.

What makes the feat impressive is that such DRAM clock speeds are difficult for dual-channel/multiple-module setups, and reserved only for single-module feats. Ahead of the launch of the 3rd Generation Core "Ivy Bridge" platform, every motherboard vendor is covertly showing off similar overclocking feats.A video recording of the feat follows.

G.Skill unveiled its newest line of memory for extreme overclocking, the Trident X. Its launch is timed to follow that of Intel's Core "Ivy Bridge" processor family, and is optimized for 7-series chipset motherboards (due to their support of latest Intel XMP 1.3 specification). Pictured below is what Trident X series modules look like: a black PCB with a slightly long black metal heatsink, which has a detachable crown heatsink (red). One can notice a slot for heat pipes in the juncture between the crown heatsink and the module's main heatsink.

Aesthetically, the Trident X series modules don a black+red color scheme, which goes well with the black+red motherboard in the background (in the press-shot). Pictured below are the DDR3-2400 MHz (PC3-19200) modules in dual-channel configuration. The XMP profile runs the module at its 2400 MHz DDR (1200 MHz real) speed, with timings of 10-12-12-31T, and DRAM voltage of 1.65V. The modules will be available in various other speed/timing configurations, and in densities of 4 GB and 8 GB, making up for 8 GB and 16 GB dual-channel kits, for the new "Ivy Bridge" platform; 16 GB and 32 GB quad-channel kits for the Sandy Bridge-E platform. The older Sandy Bridge LGA1155 platform might not be 100% compatible, since it lacks XMP 1.3 support. G.Skill Trident X will be formally announced on May 4.

Patriot Memory, a global pioneer in high-performance memory, NAND flash, storage, and enthusiast computer products today announces the launch of their Extreme Performance SDHC/SDXC UHS-I flash storage. Featuring ultra-fast transfer rates and expanded storage capacities, the Patriot Memory EP Series SDHC/SDXC cards are perfect for stunning high resolution digital photography and increased high definition video recording times.

Designed to provide twice the transfer speeds of previous Class 10 solutions, when used with UHS-I compatible devices, the Patriot Memory EP Series SDHC/SDXC cards deliver the performance necessary for capturing and broadcasting in true real-time. With capacities of up to 128 GB, these EP Series SDHC/SDXC cards offer a greatly improved maximum volume when compared to standard SDHC solutions. At the 128 GB capacity, the Patriot Memory EP Series SDHC/SDXC card is capable of storing up to 2,560 minutes of 1080p video and well over 26,000 high definition photos.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced that its JC-64 Committee for Embedded Memory Storage and Removable Memory Cards has formed a Subcommittee focused on the standardization of non-volatile wireless memory. To be chaired by Nokia and vice-chaired by Micron Technology and Samsung Semiconductor, the JC-64.9 Subcommittee for Wireless Memory welcomes interested companies worldwide to participate by joining JEDEC or calling 703-907-7560 for more information.

Wireless memory is rapidly emerging as the next generation in data transfer technology, and is intended to enable fast, wireless connectivity with read/write capability between mobile devices (Wireless Memory Hosts) and battery-free memory tags (Wireless Memory Tags).

Centon Electronics is proud to announce the release of a high density memory upgrade. Centon is rolling out a 16 GB ECC Registered DIMM that comes in a single module or in kit of two 8 GB's. This high powered module comes in a VLP and LP form which reaches a voltage of 1.35. This family of DDR3 products is available in a 240 pin and 204 pin SODIM. These high density DDR3 memory modules range from Non-ECC to ECC to ECC Registered.

G.SKILL, the worldwide leading high performance memory designer, has released the 32 GB DDR3 1333 MHz laptop memory kit for Apple iMac 2011.

The G.SKILL 32 GB Mac laptop memory kit, consists of 4 matched 8 GB DDR3 sticks, has passed G.SKILL's rigorous compatibility and reliability tests with the latest Apple iMac 2011 machines for guaranteed performance. Taking the full advantage of 4 memory slots on iMac 2011 machines, G.SKILL 32 GB Mac memory kit is the best-in-class memory solution for Professional graphic, video and audio editing and other professional applications.

The computing industry will see its next transition to a new memory standard only by 2014, and enterprise processors based on the "Haswell" microarchitecture will drive the change, according to a VR-Zone report. While client processors based on the Haswell architecture will retain current DDR3 memory standard with a possibility of higher DDR3 clock speeds, enterprise processors under the "Haswell-EX" family will feature the industry's first DDR4 memory controllers for x86. Following that, DDR4 will filter down to future client platforms. Pictured below, is a DDR4 UDIMM by Samsung.