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Mushkin Announces New Stealth and Redline 2800 MHz DDR3 Memory Kits

Mushkin Inc., a leading designer and manufacturer in high-performance computer innovations and solutions, unveils new additions to its already-powerful Stealth and Redline memory series. The latest models for the Stealth and Redline series will offer speeds of 2800Mhz. Both releases will come in DDR3 4GB, 8GB, and 16GB memory kits with 12-14-14-35 latency at 1.65V.

The Stealth memory line is a sleek matte black designed with value and performance in mind without compromising quality. Redline is distinctive for its iconic red ridgeback heatsink that leaves room for greater overclocking potential. Computer enthusiasts will be capable of efficiently overclocking their memory to even greater speeds for the ultimate high-performance machine.

New Avexir Memory Modules Put Up A Lightshow

Avexir memory modules always caught our eyes at tradeshows for being extremely 'boutique' in their approach to the market. Not that we're complaining. They didn't disappoint this time either, showing off some colorful, shiny, and glowy modules of many shapes and sizes. The first kind below are Core Gold, with tops that light up gold, which should go well with ASUS' mainline Z87 motherboards, and ECS' Golden Boards. These modules are available at speeds ranging all the way from PC3-10600 (DDR3-1333) to PC3-22400 (DDR3-2800), in 4 GB and 8 GB densities, and in single-, dual-, and quad-channel kits. Some of these ship with two XMP profiles.

Moving on, the next kind are Platinum Red. These black beauties lack headspreaders, use high-grade Elpida-made DRAM chips, and feature pairs of tiny red LEDs lining the top portions on one of their sides. These modules are available in speeds ranging from PC3-10600 to PC3-12800 (DDR3-1600), and are available in the same densities and packages as the Core series. There are plenty of motherboards that look good with black and red. Next up, are the same modules with glowy heatspreaders on. These heatspreaders pack an acrylic bar that disperse light from these LEDs, and look awesome when installed. The last exhibit is an example of just how far Avexir will go to live up to its boutique reputation. It shows modules with tiny fluorescent lamps lining the top, which work at low voltages, probably using external power. Starting a florescent lamp takes additional circuitry, and you can find that in the picture.

Corsair Launches Vengeance Pro Series DDR3 Memory

Corsair, a worldwide designer of high-performance components to the PC hardware market, today announced the Corsair Vengeance Pro Series of high-performance DDR3 computer memory for PC overclockers, enthusiasts, and system builders. Available initially in capacities up to 64 GB and speeds up to 2933 MHz, the Vengeance Pro Series memory modules are designed to set new levels of value and overclocking performance with the 4th generation Intel Core processor family (codenamed Haswell) and previous generation Intel and AMD platforms.

Vengeance Pro Series memory modules are built with eight-layer PCBs and RAM ICs specially selected for speed and overclocking headroom, and like all Vengeance memory, incorporate XMP 1.3 profiles allow for automatic, reliable overclocking. The memory kits are designed with new aggressively styled, aluminum heat spreaders for superior cooling. The memory kits are available in black with silver, red, blue, or gold accents to enable enthusiasts, gamers, and modders to customize the look of their PCs.

Xbox One Chip Slower Than PlayStation 4

After bagging chip supply deals for all three new-generation consoles -- Xbox One, PlayStation 4, and Wii U, things are looking up for AMD. While Wii U uses older-generation hardware technologies, Xbox One and PlayStation 4 use the very latest AMD has to offer -- "Jaguar" 64-bit x86 CPU micro-architecture, and Graphics CoreNext GPU architecture. Chips that run the two consoles have a lot in common, but also a few less-than-subtle differences.

PlayStation 4 chip, which came to light this February, is truly an engineer's fantasy. It combines eight "Jaguar" 64-bit x86 cores clocked at 1.60 GHz, with a fairly well spec'd Radeon GPU, which features 1,156 stream processors, 32 ROPs; and a 256-bit wide unified GDDR5 memory interface, clocked at 5.50 GHz. At these speeds, the system gets a memory bandwidth of 176 GB/s. Memory isn't handled like UMA (unified memory architecture), there's no partition between system- and graphics-memory. The two are treated as items on the same 8 GB of memory, and either can use up a majority of it.

Silicon Power Presents the New Generation of Xpower DDR3 Memory

Silicon Power, the world's leading provider of memory storage solutions today unveils the new generation of Xpower DDR3 Overclocking series memory module. Built in a special-made metallic heat sink, the new Xpower DDR3 is able to provide a better cooling solution and increase the heat dissipation area, maintaining a powerful speed and stability to meet the needs of overclocking enthusiasts and hardcore gamers.

Silicon Power new Xpower DDR3 Overclocking series are available in various duel channel kits in DDR3-1600, 1866, 2133, and 2400 MHz variants, reaching the high capacity from 8 GB (4 GBx2) to 16 GB (8 GBx2). Compatible with Intel Core Gen 3 and the latest Z77 platform, Xpower Overclocking series can maximize the transfer speed, unleashing the extreme system performance to the next level.

AMD Announces Memory Series Designed With Gamers in Mind

AMD today launched the AMD Radeon RG2133 Gamer Series Memory and Radeon RAMDisk 4.1. AMD Radeon RG2133 Gamer Series Memory is the only memory on the market that offers both XMP and AMP memory profiles in one package, enabling ultimate ease in overclocking on both platforms.

AMD Radeon RG2133 Gamer Series Memory will ship with a free AMD Radeon RAMDisk 64 GB, which features enhanced load-and-save functionality. When paired with an AMD A10 Series APU, AMD Radeon RG2133 Gamer Series Memory will improve frames-per-second (FPS) by up to 22 percent. Gamer Series Memory is part of AMD's Unified Gaming Strategy initiative that places AMD technology at the heart of digital gaming and plays a critical role that enables top performance, an outstanding experience and maximum value for PC gamers everywhere.

PNY Launches New HP Portable Hard Drives

PNY Technologies, Technologies, considered one of a worldwide leaders in Memory and Flash products, announced its authorized HP portable hard drive p2050/p2100 to take care of your portable data storage requirements. It sports a SuperSpeed USB 3.0 port that supports speeds up to 4x faster than USB 2.0, thus saving you a lot of time while transferring data. Of course, the drive is backward compatible with USB 2.0 and can therefore be used with older computers. With a single USB port, it doesn't require a separate power cable, thus saving you the trouble of carrying along a power adapter.

The drive has a unique book-style design that lends it elegance and it won't look out of place if you stack several on top of each other in a bookshelf. The casing is made of durable aluminum and has a nice brushed finish. The slim drive is light and portable. Encased within is a 2.5" hard drive, usually found inside laptops, running at 5400 RPM. Available capacities are 500 GB and 1 TB, thus providing ample storage space for your data.

IDF 2013 Transforming Computing Experiences from the Device to the Cloud

During her keynote at the Intel Developer Forum today in Beijing, Diane Bryant, senior vice president and general manager of Intel's Datacenter and Connected Systems Group, discussed how her company is helping users harness powerful new capabilities that will improve the lives of people by building smarter cities, healthier communities and thriving businesses.

Bryant unveiled details of upcoming technologies and products that show how Intel aims to transform the server, networking and storage capabilities of the datacenter. By addressing the full spectrum of workload demands and providing new levels of application optimized solutions for enterprise IT, technical computing and cloud service providers, unprecedented experiences can be delivered.

Kingston Technology Ships HyperX Memory Kits with Black PCB

Kingston Technology Company Inc., the independent world leader in memory products, continues to celebrate its 10th HyperX anniversary by announcing all-new black printed circuit boards (PCB) on two of its product lines. Kingston's high-performance HyperX Beast and entry-level enthusiast 'black' lines will incorporate black PCB under the signature heatspreader designs.

HyperX Beast, a part of the Predator family, matches large capacity with ultra-fast frequencies. Now featuring black PCB, HyperX Beast is available in various dual- and quad-channel kits in capacities from 8GB to 64GB and speeds up to an ultra-fast 2400MHz. It is perfect for hardcore gamers, PC modders, content creators and overclockers. The 2133 MHz, 64GB and 2400 MHz, 32GB Beast memory are the fastest and highest capacity certified Intel XMP-ready kits on the market.

Intel Introduces SSD 525 mSATA Solid-State Drive for Ultrabook and Embedded Devices

Intel Corporation announced today the Intel Solid-State Drive 525 Series (Intel SSD 525 Series) in a small mSATA form factor with 6-gigabit-per-second (Gb/s) performance. The Intel SSD 525 Series gives OEM customers, channel and tech enthusiasts an ultra-portable, low-power storage solution in one-eighth the space of a traditional 2.5-inch hard disk drive (HDD) to drive innovative Ultrabook, tablet and embedded applications.

The Intel SSD 525 is the latest entry to the Intel 500 Series SSD Family aimed at higher-performance, enthusiast solutions. Measuring 3.7 mm x 50.8 mm x 29.85 mm and weighing 10 grams, the mSATA with PCI Express (PCIe) mini-connector delivers the performance of the company's Intel SSD 520 Series client drive. This makes the Intel SSD 525 suitable for All-in-One desktops, notebooks, Ultrabooks and workstation upgrades, as well as automotive, digital signage, embedded video and retail solutions.

Corsair Announces Dominator Platinum Light Bar Upgrade Kits

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the release of the Dominator Platinum Light Bar Upgrade Kits. The new kits allow PC enthusiasts to enhance and customize the lighting of their Dominator Platinum DDR3 PC memory kits.

Each Dominator Platinum Light Bar Upgrade Kit includes two light bars which replace the existing bars on the memory modules, and translucent colored inserts (in Cerulean Blue and Arctic White) which allow users to customize the lighting color. The light bars are designed with new top openings to radiate more light upwards. A supplied installation tool allows users to install the kits in a matter of minutes.

Mushkin Announces Stealth Series PC Memory Modules

Mushkin, Inc., an industry-leading designer and manufacturer of high-performance and mission-critical computer products, announced today at CES 2013 that its new line of memory modules, code named Stealth, are scheduled for worldwide release mid-February. The new family of modules includes high-performance specifications for professional s and tech enthusiasts who want the best possible computing experience.

"Along with this latest product line announcement, we're excited to announce that Mushkin has partnered with Meteor Entertainment's highly-anticipated video game HAWKEN to celebrate this launch," said Nicolas Villalobos, Head of Global Marketing at Mushkin Inc. "Starting in January 2013, gaming fans who purchase select Mushkin products through authorized partners will receive a twenty-five dollar game code -- free.*"

Mushkin Unveils Hottest Lineup Ever at Consumer Electronics Show 2013

Mushkin Inc., An industry-leading designer and manufacturer of high-performance and mission-critical computer products, unveils its latest and most exciting range of products ever at the world's largest consumer electronics show, CES 2013.

Mushkin will host meetings at their 1,800 square foot suite, where they will showcase their entire lineup of next generation products. On-site pr esentations will be held to introduce the new and coming product lines. Mushkin representatives from the product, sales, and global teams will be on hand to answer any questions regarding these new and upcoming products for the digital home, office, and beyond.

Kingston Unveils HyperX 10th Anniversary Edition Memory

Kingston Technology Company, Inc., the independent world leader in memory products, continues to celebrate its 10th HyperX anniversary with two announcements at 2013 International CES: the launch of the Kingston HyperX 10th Anniversary Edition Memory and the finale of the HyperX 10th Anniversary StarCraft II Tournament.

With its elegant silver heatspreader, the new high performance Kingston HyperX 10th Anniversary Edition Memory complements the latest PC hardware and takes on serious workloads or the most intensive games. It is perfect for gamers, enthusiasts, overclockers and PC modders. With its low profile, HyperX 10th Anniversary Edition Memory fits under oversized CPU coolers and offers enhanced thermal dissipation for long-term reliability. The Intel XMP ready memory easily achieves best performance optimization by simply selecting a speed profile in BIOS - with no need for manual adjustments.

Micron and Elpida Announce Clearance of Transaction by Japan Fair Trade Commission

Micron Technology, Inc. (Nasdaq:MU) ("Micron") and Elpida Memory, Inc. ("Elpida") today announced that the Japan Fair Trade Commission has cleared Micron's previously announced acquisition of Elpida. Clearance under Japan's Act on Prohibition of Private Monopolization and Maintenance of Fair Trade (Act No. 54 of April 14, 1947) satisfies one of the conditions necessary for consummation of the transaction. The transaction has also cleared premerger review in the United States, Czech Republic and Korea.

The closing of the transaction remains subject to other conditions-including approval by Elpida creditors, the Tokyo District Court and regulatory approvals in other countries-and is expected to be completed in the first half of calendar 2013. Elpida's proposed reorganization plan was submitted to the Tokyo District Court on Aug. 21, 2012, and the Tokyo District Court's approved the submission of Elpida's proposed reorganization plan to creditors on October 31, 2012.

Micron Technology, Inc., Reports Results for the First Quarter of Fiscal 2013

Micron Technology, Inc., (NASDAQ: MU) today announced results of operations for its first quarter of fiscal 2013, which ended November 29, 2012. For the first quarter, the company had a net loss attributable to Micron shareholders of $275 million, or $0.27 per diluted share, on net sales of $1.8 billion. The results for the first quarter of fiscal 2013 compare to a net loss of $243 million, or $0.24 per diluted share, on net sales of $2.0 billion for the fourth quarter of fiscal 2012, and a net loss of $187 million, or $0.19 per diluted share, on net sales of $2.1 billion for the first quarter of fiscal 2012.

Revenues from sales of NAND Flash products were 4 percent lower in the first quarter of fiscal 2013 compared to the fourth quarter of fiscal 2012, due to a 9 percent decrease in sales volume, partially offset by a 5 percent increase in average selling prices. Trade NAND Flash sales volume in the first quarter of fiscal 2013 decreased compared to the fourth quarter of fiscal 2012 primarily as a result of lower production of NAND Flash products. Revenues from sales of DRAM products in the first quarter of fiscal 2013 were 9 percent lower compared to the fourth quarter of fiscal 2012 primarily due to an 11 percent decrease in average selling prices. Sales of NOR Flash products were relatively unchanged for the first quarter of fiscal 2013 compared to the fourth quarter of fiscal 2012.

OCMemory Launches Hynix-Based DDR3-2400 MHz Memory that Stays Cool without Heatsinks

Japanese PC memory maker OCMemory launched a new line of high-speed PC memory that stays cool without need fancy heatsinks or heatspreaders. The OCM2400CL10D-8GBN, launched in the series, takes advantage of Hynix high-density CFR DRAM chips to achieve DDR3-2400 MHz speeds, with timings of 10-12-12-31, and 1.65V, without needing any additional cooling components. In addition to a JEDEC-approved DDR3-1600 MHz fallback SPD profile, it includes an XMP profile to use its advertised speeds. The sticks use 8-layer black PCBs to improve signaling efficiency. The kit includes two 4 GB modules, and is priced at 6,000¥ ($72).

Crucial Unveils Ballistix Low Profile Memory

Crucial, a leading global brand of memory and storage upgrades, today announced the immediate availability of Crucial Ballistix Low Profile (LP) memory, which delivers a true low profile design to provide more clearance around high-end CPU coolers and improve airflow throughout the system. Designed for performance enthusiasts and small form factor computer builders with limited space, Crucial Ballistix LP memory features all the performance benefits of Ballistix memory without the height concerns of taller modules.

Since overclocked systems with power-hungry processors are often heat-intensive and require oversized CPU coolers to regulate temperatures, clearance for memory modules is often limited. To address this, Crucial Ballistix LP memory modules are between 15 percent and 35 percent lower profile than competing modules. Using up to 10 percent less power (1.35V) than standard modules (1.5V), Crucial Ballistix LP memory modules also help reduce the cooling problem in high-performance systems, resulting in a lower thermal profile and less fan noise, and enable easier overall system cooling.

New Memory OC Record of DDR3-3900 Set

Swiss overclocker Christian Ney set a new memory OC record, clocking in at 1950.3 MHz (actual), 3900.6 MHz DDR. The record was made possible (apart from great skills), by G.Skill F3-2666C11-4GTXD 4GB DDR3-2666 MHz memory, AMD A8-3870K APU, Gigabyte A75-UD4H motherboard, and a liquid nitrogen pot made by K|ngp|n Cooling. A top performing memory module was picked from nearly a dozen modules. The 1950.3 MHz DRAM clock was supported by timings of 14-14-14-36. DRAM voltage is kept under the wraps. The CPUID and HWBOT validations can be found here, and here.

Everspin Debuts First Spin-Torque MRAM for High Performance Storage Systems

Everspin Technologies leads the industry in commercializing the first Spin-Torque Magnetoresistive RAM (ST-MRAM), a new type of high performance and ultra-low latency memory that is expected to transform storage architecture and help drive the continuous evolution of Moore's Law.

ST-MRAM is a performance-optimized Storage Class Memory (SCM) that bridges the role of today's conventional memory with the demands of tomorrow's storage systems by providing non-volatility, high endurance and ultra-low latency. The 64 Mb device is the first product in Everspin's ST-MRAM roadmap that is planned to scale to gigabit density memories with faster speeds. Select customers are now evaluating samples of Everspin's EMD3D064M 64 Mb DDR3 ST-MRAM.

Kingston Releases HyperX Beast Enthusiast PC Memory

Kingston Technology Company, Inc., the independent world leader in memory products, today announced HyperX Beast, the latest addition to the HyperX product line. It matches high performance with the largest available capacities and is XMP ready. With its eye-catching aggressive heatspreader design, HyperX Beast is aimed at hardcore gamers, PC modders, content creators and overclockers who want high-performing hardware in an innovative design.

HyperX Beast is part of the Predator family, the premiere memory line offered by Kingston for power users. HyperX Beast features kits up to 2400MHz for faster processing times in applications requiring maximum performance, and is available in capacities from 8GB-64GB. The new heatspreader color and design adds diversity and character to the current HyperX memory offerings. It is designed to work with third-generation Intel Core i5 and i7 processors as well as the latest AMD A-Series processors. For added benefit, HyperX Beast is Intel XMP ready so users can easily achieve the best performance optimization by simply selecting a speed profile, hand-tuned by Kingston engineers.

Samsung Announces Its Fourth Generation Green Memory Solution

Samsung Electronics Co., Ltd, a global leader in advanced semiconductor technology solutions, today announced its fourth generation green memory solution at the annual Memory Solution CIO Forum at the Shilla hotel, Seoul, Korea. Designed to achieve superior system level performances, the new solution introduces a combination of its advanced 20 nanometer (nm) class DDR3 and 20 nm-class SSDs based on high-performance SATA 6.0 Gb/s and SAS interfaces respectively.

The new green memory solution addresses the benefits of green memory for next-generation enterprise servers, server storage solutions and personal computing solutions, broadening the benefits of green memory solutions even further throughout the IT industry. The reduced costs and optimized IT expenditure efficiencies are well in-line with the creating shared value (CSV) framework.

Crucial Supports Intel Demo Depot Program With High-Density Server Memory Modules

Crucial, a leading global brand of memory and storage upgrades, and Intel, a world leader in computing innovation, today announced the inclusion of Crucial server memory modules in the Intel Demo Depot Program. This service lends fully configured Intel Xeon-based servers to customers for evaluation and testing prior to final purchase. As a brand of Micron Technology, Inc., one of the largest memory manufacturers in the world, Crucial supplies the Intel Demo Depot Program with DDR3L registered DIMMs ranging from 8 GB to 16 GB densities, in speeds of 1600 MT/s and 1333 MT/s to support Intel's latest generation of servers.

The Intel Demo Depot Program consists of more than 200 servers and is available to interested customers throughout North America. Potential customers procure evaluation servers for 30-day periods to test equipment and proof-of-concept trials. Servers are also used by various technology manufacturers for demonstrations at tech-focused tradeshows and customer demos by Intel field account engineers.

Samsung Electronics Announces Third Quarter 2012 Earnings Results

Samsung Electronics Co., Ltd. today announced revenues of 52.18 trillion Korean won on a consolidated basis for the third quarter ended September 30, 2012, a 26-percent increase year-on-year. For the quarter, the company's consolidated operating profit reached an all-time high of 8.12 trillion won, representing a 91-percent increase year-on-year. Consolidated net profit for the July-September period was 6.56 trillion won.

In its earnings guidance disclosed on October 5, Samsung estimated third quarter consolidated revenues would reach approximately 52 trillion won with consolidated operating profit of approximately 8.1 trillion won. Samsung's solid performance is mainly attributed to increased sales of handheld phones and stronger demand for display panels. The Mobile Communications Business posted 26.25 trillion won in revenue for the quarter, accounting for more than half of Samsung's total revenue. As for the display panel segment, increased shipments of Organic Light-Emitting Diode (OLED) and Liquid Crystal Display panels used in tablets and smartphones, as well as TVs drove up profitability.

Patriot Memory Introduces Ultra-Low Power Memory For Ultrabook SODIMM Modules

Patriot Memory, a global pioneer in high-performance memory, NAND flash, storage and enthusiast computer products today announces the availability of its new Memory For Ultrabook SODIMM Modules. Compatible with 3rd generation Intel Core processors, these modules offers consumers a no hassle option to upgrade Ultrabook class laptops for increased performance and productivity.

Providing the most dynamic and powerful mobile computing platform, the Ultrabook delivers the highest levels of portability, performance, and entertainment. The Ultrabook is truly redefining the mobile computing experience. With this in mind, Patriot's Memory for Ultrabook SODIMM modules were designed to offer the perfect performance enhancement to the Ultrabook ecosystem.
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