Earlier in the week, online chatter pointed to a possible delay in the production of Panther Lake silicon. Well-known industry analyst—Ming-Chi Kuo—has kept tabs on the inner workings of several big semiconductor players. A previous insider tale revealed NVIDIA's allegedly revised "Blackwell" architecture roadmap. Kuo's latest insight focused on Intel and their 18A node process; rumored setbacks have reportedly pushed the launch of next-gen Panther Lake (PTL) mobile processors into 2026. Team Blue leadership has already reacted to the relatively fresh allegations—earlier in the week, John Pitzer sat down with Morgan Stanley Semiconductor Research's Joe Moore. During their conference fireside chat, Intel's Corporate Vice President of Investor Relations addressed recent internet whispers.

When asked about 18A being developed on schedule, Pitzer responded with: "yes, it is. I mean, I tend to wake up every morning trying to fish through rumors that are coming across on social media about Intel 18A. I want to be very clear. Panther Lake is on track to launch in the second half of this year. That launch date has not changed. We feel really good about the progress that we are making. In fact, if you look at where our yields are on Panther Lake today, they're actually slightly ahead at a similar point in time to Meteor Lake, if you look at the development process for Meteor Lake. I think a couple of weeks ago, there was a technical paper out that actually looked at our SRAM density on Intel 18A that compared well with TSMC's N2. Lots of different metrics you can compare technologies on. I think in general, we think about Intel 18A being an N3 type/N2 sort of comp with the external peers." Panther Lake is set to become the company's first product family that will utilize its own Foundry's 18A node process. Mid-way through February, we heard about the importance of PTL with Intel's portable gaming strategy.

MSI IPC, a global leader in computing and AI-driven solutions, is set to unveil its latest Edge AI Computing innovations at Booth No. 1-389, Embedded World 2025 in Nuremberg, Germany. Powered by the latest Intel platform, MSI's cutting-edge technologies will drive advancements in automation, digital signage management, and AI-driven customer interactions.

Several MSI's partners, including Alptech, Spo-comm, Spectra, and Elmark, are joining this event to showcase their cutting-edge solutions powered by MSI IPC products. Their demonstrations will feature a diverse range of applications, including 4U rackmount systems, Panel PCs (PPC), and KIOSK solutions, highlighting the versatility and performance of MSI's industrial computing technology in various sectors.

Leading provider of industrial PC solutions AAEON (stock code: 6579), has introduced the BOXER-6647-MTH, a fanless embedded computer powered by the Intel Core Ultra platform. Available with either the Intel Core Ultra 7 processor 155H or Intel Core Ultra 5 processor 125H, the BOXER-6647-MTH sports a broad variety of interfaces tailored for industrial robotics use.

The system hosts LAN ports providing up to 2.5GbE speed, six USB (four USB 3.2 Gen 2, two USB 2.0), and three serial ports that include dual RS-232/422/485 signals and an 8-bit DIO, the BOXER-6647-MTH's I/O provides a strong foundation with which systems integrators can install cameras, sensors (LIDAR, IMUs), and actuators for advanced robotics applications like AGVs and AMRs. Moreover, the system boasts a wealth of expansion options to accommodate Wi-Fi, 5G, and NVMe storage modules.

Advantech, a leader in edge computing solutions, is excited to announce the launch of the UBX-330M, a compact NUC-sized edge computer designed to power intelligent city services with advanced AI capabilities.

The UBX-330M is powered by Intel Core Ultra Processors (Meteor Lake H and U), which integrate a CPU, GPU, and NPU to deliver exceptional AI performance in a small form factor. Built as an AI-ready platform, the UBX-330M is perfect for applications requiring robust processing power across industries such as smart retail, hospitality, public spaces, education, entertainment, enterprise, and smart buildings.

Intel's Core Ultra 7 255H "Arrow Lake" processor has demonstrated impressive performance improvements in recent PassMark benchmarks, achieving a 32% higher single-core score compared to its "Meteor Lake" predecessor. The Arrow Lake-H chip recorded 4,631 points in single-threaded tests, significantly outpacing the Core Ultra 7 155H's 3,500 points while delivering a 15% overall improvement in CPU Mark ratings. The performance leap comes from Intel's architectural overhaul, implementing "Lion Cove" performance cores alongside "Skymont" efficiency cores on TSMC's N3B process node. This combination enables the 255H to achieve higher boost frequencies while maintaining the same core configuration as its predecessor—six P-cores, eight E-cores, and two Low Power Efficiency (LPE) cores.

Notable in this iteration is the absence of Hyper-Threading, resulting in 16 threads compared to the 155H's 22 threads. Arrow Lake-H maintains Intel's heterogeneous structure, incorporating up to eight Xe-LPG+ graphics cores derived from the Alchemist architecture. The neural processing unit (NPU) capabilities remain consistent with Meteor Lake, delivering 13 TOPS of INT8 performance. This positions the chip below Lunar Lake's 45 TOPS. Despite performance improvements, market success will largely depend on system integrators' ability to deliver compelling devices at competitive price points, particularly as AMD's Strix Point platforms maintain strong positioning in the $1,000 range. The battle of laptop chip supremacy is poised to be a good one in the coming quarters, especially as more Arm-based entries will force both Intel and AMD to compete harder.

AAEON an industry-leading provider of embedded solutions, has announced the latest addition to its 3.5" subcompact Board product line, the GENE-MTH6. Equipped with Intel Core Ultra processors and up to 96 GB DDR5 via SODIMM, the GENE-MTH6 is well-equipped to utilize the platform's Intel Arc Graphics and integrated NPU to execute complex AI and machine learning workloads on the edge.

AAEON is primarily marketing the board for smart city use, with applications such as smart traffic, environmental monitoring, and AI-powered surveillance applications being noted as particularly suitable. The GENE-MTH6's environmental specifications also make the board versatile in where it can be deployed, with a 9 V to 36 V power input range with ERP support being a key feature.

WEROCK Technologies GmbH, innovative manufacturer of industrial computer technology, announces the launch of two new rugged high-performance notebooks. According to the manufacturer, the laptops have been designed for professional, industrial use with complex tasks in a wide variety of locations where strong performance is required. They are delivered with Intel Core Ultra processors of the Meteor Lake generation, Intel AI Boost, Arc Graphics, with up to 16 cores, a 4.8
GHz turbo clock frequency and up to 64 GB RAM. Pioneering AI and machine learning functions including AI assistants set the course for modern computing and fast performance.

The new Rockbook X540 G3 and Rockbook X550 G3 laptops have been developed for field service professionals in numerous industries. They have numerous modern communication functions - including options for 4G LTE or 5G, have a dedicated uBlox GPS/GNSS sensor, Wi-Fi 6, Bluetooth 5.2 and also offer numerous other interfaces such as Thunderbolt 4, USB ports, HDMI and a serial port.

Intel is significantly expanding its desktop Core Ultra 200 "Arrow Lake-S" lineup with new 65 W models along the sidelines of the 2025 International CES, but more importantly, it is bringing the "Arrow Lake" microarchitecture to the mobile space. The company is planning to launch at least 22 processor models this January, but not all of them are based on "Arrow Lake." Tom's Hardware reports that the lineup broadly revolves around the "Core 2-series" processor model numbering.

The Core Ultra 200H series consists of H-segment (conventional thickness notebook) processors in the 28 W to 45 W class, and are based on the "Arrow Lake-H" silicon. The Core Ultra 200HX series targets premium gaming notebooks and portable workstations, and consists of 55 W to 65 W class processors, including CPU overclocking capabilities on certain models. Things get interesting with the Core Ultra 200U series. These chips are based on the "Meteor Lake Refresh" silicon—an older microarchitecture—targeting the 7 W to 28 W segments for ultraportables. Lastly, there's the Core H 200 and Core U 200 series (no "Ultra" in the branding), which are based on the older "Raptor Lake" monolithic silicon, targeting mainstream notebooks.

At AAEON Technology, we recognize growing demand for secure and reliable industrial systems. In collaboration with Canonical, AAEON Technology validates Ubuntu Pro across our Intel-based industrial systems. Each unit comes with a preinstalled Ubuntu image, an Ubuntu Pro license sticker, and 10 years of Canonical-backed updates for ongoing security and maintenance. "This collaboration means our customers benefit from cutting-edge hardware paired with the secure, long-term support offered with Ubuntu Pro enabled. With ongoing updates, they're always protected, allowing them to focus on their core goals," said Victor Lai, Managing Director at AAEON.

Ubuntu Pro provides enterprise-level security, compliance, and long-term stability for industrial and edge applications. It meets strict regulatory standards while delivering high performance in demanding environments.

Intel is expected to debut its next-generation Arc "Battlemage" discrete GPU in December 2024, or ahead of the 2025 CES, HotHardware reports, citing Golden Pig Upgrade, a reliable source with GPU leaks. The source says that they expect "wonderful performance" for the GPU. Intel has a lot invested in its PC graphics division, across not just its two-year-old Arc "Alchemist" discrete GPUs, but also the integrated graphics solutions it's been launching with its Core Ultra processor generations. It debuted the DirectX 12 Ultimate-capable Xe-LPG graphics architecture with Core Ultra "Meteor Lake" and Arc Graphics branding, which it carried forward to the Core Ultra Series 200 "Arrow Lake" on the desktop platform. Meanwhile, "Battlemage" got debuted as the iGPU of the Core Ultra 200V series "Lunar Lake" mobile processor, which posted gaming performance beating that of the Ryzen 8000 "Hawk Point" processor, but falling short of the Ryzen AI 300 series "Strix Point."

Intel is expected to tap into a fairly new foundry node for the Arc "Battlemage" discrete GPU series. Its chips could strike a performance/Watt and performance/price inflection point in the performance segment, that drives the most volumes for NVIDIA and AMD. It is this exact segment that AMD has withdrawn from the enthusiast segment to focus on, with its next-generation Radeon RDNA 4 generation. With "Alchemist," Intel already laid a strong foundation for hardware-accelerated ray tracing and AI, and the company is only expected to advance on these fronts further. Could "Battlemage" and "Granite Rapids" go down as the most exciting products from Intel in 2024? We should find out next month.

TechPowerUp has released version 2.60.0 of GPU-Z, a popular graphics sub-system information, monitoring, and diagnostic utility. This latest update brings significant enhancements, including full support for the Arm64 architecture and Qualcomm Snapdragon X Elite GPUs. The release also adds support for AMD Zen 5 CPU temperature monitoring and a wide range of new GPUs from NVIDIA, AMD, and Intel. Notable additions include the NVIDIA 4070 Ti Super (AD102), RTX 4070 (AD103), RTX 4060 Ti (AD104), RTX 4060 (AD106), as well as AMD Zen 5 (Strix Point and Granite Ridge), and Intel Raptor Lake U SKUs and Meteor Lake Intel Arc Graphics.

In addition to expanded hardware support, GPU-Z 2.60.0 addresses several important issues. The update fixes NVIDIA driver version reporting for some pre-2015 versions, resolves an installer problem that prevented closing running instances of GPU-Z, and corrects the "0 MHz" memory clock display on certain AMD RDNA GPUs without overclocking support. Other improvements include a small handle leak fix, added support for the Monster Notebook subvendor ID, and compatibility with new VMWare virtual GPU IDs. The installer now requires Windows 7 or newer, with appropriate messaging for unsupported systems. Users can download the latest version of TechPowerUp GPU-Z from the official TechPowerUp website to access these new features and improvements.

DOWNLOAD: TechPowerUp GPU-Z 2.60.0

Eurocom launches the Blitz Ultra, a 14-inch and 16-inch enterprise class laptop loaded with features related to security and manageability while carrying unmatched connectivity and expandability. It is powered by Intel's ultra-efficient 14th-gen Intel Ultra Meteor Lake Processor, a robust 73Wh 10hrs+ battery and a captivating 16:10 screen. Your productivity will soar to new heights. Heavy duty, yet lightweight 1.6 kg / 3.52 lbs design that meets military standard MIL-STD 810H. When it comes to security features, the Blitz Ultra has built-in TPM 2.0 data-encryption module, BIOS support for SED (Self Encrypting Drives) and a Kensington lock making it the ultimate enterprise-class laptop for security, connectivity and expandability.

"The Eurocom Blitz Ultra is designed for government, military, security, healthcare and corporate professionals engaged in mission-critical computing and/or handling corporate IP assets and/or customer's sensitive data. It provides secure access via data encryption via TPM 2.0 module. Blitz Ultra has a Factory- installed Offline Permanent Disconnect Option. This is an optional upgrade to physically remove all connectivity and communications components to ensure a 100% offline system for maximum security of sensitive data and protection of intellectual property. " - Mark Bialic, Eurocom President.

Vecow has launched its TGS-1000 series of mini PCs, featuring stackable expansion options for networking, wireless mobility, and additional capabilities. The Vecow TGS-1000 Series is an ultra-compact, fanless, stackable embedded computer lineup that includes the TGS-1000 and TGS-1500 models, powered by Intel Core Ultra Meteor Lake processors with integrated CPU, GPU, and NPU. This series supports up to 96 GB of DDR5 memory. Optimized for edge AI applications, it delivers up to a 14% boost in CPU performance and enhanced graphics capabilities.

The TGS-1000 Series can drive up to five independent displays through two HDMI and three DisplayPort (DP) ports. It features a variety of I/O connections, including up to five USB 3.0 ports (four Type-A and one Type-C) and a 2.5GbE LAN port with TSN support. Its modular design allows for flexible expansion with options for USB, isolated DIO, COM, LAN, or 4G/LTE, making it suitable for AI, smart retail, office communication, and gaming. The TGS-1500 model adds support for MXM graphics cards up to RTX 5000 Ada.

In a recent report by Mercury Research, AMD has shown significant progress in the CPU market during Q2 2024, particularly in the data center and laptop segments. AMD's most notable achievement comes in the server CPU space, where it now holds 24.1% of the market, a 5.6% increase year-over-year, and a 0.5% increase from the previous quarter. This growth is particularly impressive in terms of revenue, with AMD capturing 33.7% of server CPU revenue despite its lower unit share. This suggests that AMD's high-end EPYC processors carry premium prices in the data center market and are most of the unit volume. AMD has also made advancements in the laptop CPU segment, reaching a 20.3% market share. This represents a 1% increase from the previous quarter and a 3.8% rise year-over-year. The company's success in laptops can be attributed to solid demand for its existing products, propelled by Intel's reported supply issues with Meteor Lake processors.

However, AMD experienced a slight setback in the desktop CPU market, losing a 1% share to Intel quarter-over-quarter. AMD now controls 23% of this segment, compared to Intel's 77%. This dip may be due to AMD's preparation for the launch of its new Zen 5-based CPUs in August. Despite AMD's gains, Intel maintains its overall dominance in the CPU market. In the total client PC space, Intel holds a 78.9% market share, with AMD at 21.1%. Intel still holds the majority of revenue and market share on all fronts. However, AMD is executing well, and Intel's financial troubles could be a setback for team blue. More competition at every front is great to see, and we are curious to look at the data from upcoming quarters and analyze how well both of companies perform.

In a conversation with Intel's CEO Pat Gelsinger, industry analyst Patrick Moorhead revealed that Intel's Meteor Lake CPU platform suffers from some production issues. More specifically, Intel has been facing some yield and/or back-end production issues with its Meteor Lake platform, resulting in a negative impact on Intel's margins when producing the chip. The market is showing great demand for these chips, and Intel has been forced to run productions of "hot lots"-- batch production of silicon with the highest priority that gets moved to the front of the production line so they can get packaged as fast as possible. While this is a good sign that the demand is there, running hot lots increases production costs overall as some other wafers have to go back so Meteor Lake can pass.

The yield issues associated with Meteor Lake could be stemming from the only tile made by Intel in the MTL package: the compute tile made on the Intel 4 process. Intel 4 process is specific to Meteor Lake. No other Intel product uses it, not even the Xeon 6, which uses Intel 3, or any of the upcoming CPUs like Arrow Lake, which uses the Intel 20A node. So, Intel is doing multiple nodes for multiple generations of processors, further driving up costs as typical high-volume production with a single node for multiple processors yields lower costs. Additionally, the company is left with lots of "wafers to burn" with Intel 4 node, so even with Meteor Lake having yield issues, the production is ultimately fine, while the operating costs and margins take a hit.

Premier embedded computing provider AAEON (Stock Code: 6579), has announced the release of the PICO-MTU4, the smallest single-board computer to host the new Intel Core Ultra Processor platform. On the ultra-small 100 mm x 72 mm PICO-ITX form factor, the PICO-MTU4 leverages the disaggregated die design, hybrid CPU core architecture, and integrated VPU of the Intel Core Ultra series for a multi-thread performance increase of up to 24%, with a 50% reduction in SoC power consumption.
The board is available in SKUs featuring both Intel Core Ultra 7 and 5 Processors, all with a TDP of 15 W, maxing out at a total of 12 cores (2 P-cores, 8 E-cores, and a further 2 Low Power E-cores) and 14 threads of processing power.

Equipped with LPDDR5x, two LAN ports (2.5GbE and 1GbE), two USB 3.2 Gen 2 ports, and a variety of serial interfaces for industrial protocols like dual COM for RS-232/422/485, a 4-bit GPIO, and SMBus, AAEON have indicated the board will target the advanced industrial robotics market, with SCADA, MES, and system monitoring devices singled out as particularly suitable uses.

A CPU-Z screenshot of an alleged Intel Core Ultra 9 285K "Arrow Lake-S" desktop processor engineering sample is doing rounds on social media, thanks to wxnod. CPU-Z identifies the chip with an Intel Core Ultra case badge with the deep shade of blue associated with the Core Ultra 9 brand extension, which hints at this being the top Core Ultra 9 285K processor model, we know it's the "K" or "KF" SKU looking at its processor base power reading of 125 W. The chip is built in the upcoming Intel Socket LGA1851. CPU-Z displays the process node as 7 nm, which corresponds with the Intel 4 foundry node.

Intel is using the same Intel 4 foundry node for "Arrow Lake-S" as the compute tile of its "Meteor Lake" processor. Intel 4 offers power efficiency and performance comparable to 4 nm nodes from TSMC, although it is physically a 7 nm node. Likewise, the Intel 3 node is physically 5 nm. If you recall, the main logic tile of "Lunar Lake" is being built on the TSMC N3P (3 nm) node. This means that Intel is really gunning for performance/Watt with "Lunar Lake," to get as close to the Apple M3 Pro as possible.

Simply NUC, Inc., a leading custom computing company, proudly announced the launch of the Scorpion Canyon NUC 14 Performance device across their global websites, a revolutionary PC workstation designed to meet diverse computing needs. Featuring the latest Intel Core Ultra "Meteor Lake" CPUs, Intel Arc integrated graphics, and optional NVIDIA RTX 4060 or 4070 graphics, the NUC 14 Performance redefines computing in a compact form factor.

"Introducing the NUC 14 Performance is a significant milestone for us," said Aaron Rowsell, Founder & President of Simply NUC. "This product family ushers in advanced AI capabilities and top-tier graphics in computing power. With unmatched performance, AI-readiness, and a sleek tool-less design, the NUC 14 Performance sets a new standard for compact workstations."

Intel is preparing a complete refresh of its desktop platform this year, with the introduction of the Core Ultra 200 series processors based on the "Arrow Lake" microarchitecture. The company skipped a desktop processor based on "Meteor Lake," probably because it didn't meet the desired multithreaded performance targets for Intel as it maxed out at 6P+8E+2LP, forcing Intel to come up with the 14th Gen Core "Raptor Lake Refresh" generation to see it through 2H-2023 and at least three quarters of 2024. The company, in all likelihood, will launch the new "Arrow Lake-S" Core Ultra 200 series toward late-Q3 or early-Q4 2024 (September-October). The first wave will include the overclocker-friendly K- and KF SKUs, alongside motherboards based on the top Intel Z890 chipset. 2025 will see the series ramp to more affordable processor models, and mainstream chipsets, such as the B860. These processors require a new motherboard, as Intel is introducing the new Socket LGA1851 with them.

Core configurations of the "Arrow Lake-S" chip surfaced on the web thanks to Jaykihn, a reliable source with Intel leaks. In its maximum configuration, the chip is confirmed to feature 8 P-cores, and 16 E-cores. There are no low-power island E-cores. Each of the 8 P-cores is a "Lion Cove" featuring 3 MB of dedicated L2 cache; while each the E-cores are "Skymont," arranged in 4-core modules that share 4 MB L2 caches among them. Intel claims that the "Lion Cove" P-core offers a 14% IPC increase over the "Redwood Cove" P-core powering "Meteor Lake," which in turn had either equal or a 1% IPC regression compared to "Raptor Cove." This would put "Lion Cove" at a 13-14% IPC advantage over the "Raptor Cove" cores. It's important to note here, that the "Lion Cove" P-cores lack HyperThreading, so Intel will be banking heavily on the "Skymont" E-cores to shore up generational multithreaded performance increase. "Skymont" was a show-stopper at Intel's Computex event, with a nearly 50% IPC gain over previous generations of Intel E-cores, which puts it at par with the "Raptor Cove" cores in single-thread performance.

Intel's first three generations of client processors implementing hybrid CPU cores, namely "Alder Lake," "Raptor Lake," and "Meteor Lake," have them arranged along a ringbus, sharing an L3 cache. This usually sees the larger P-cores to one region of the die, and the E-core clusters to the other region. From the perspective of the bidirectional ringbus, the ring-stops would follow the order: one half of the P-cores, one half of the E-core clusters, iGPU, the other half of E-cores, the other half of the P-cores, and the Uncore, as shown in the "Raptor Lake" die-shot, below. Intel plans to rearrange the P-cores and E-core clusters in "Arrow Lake-S."

With "Arrow Lake," Intel plans to disperse the E-core clusters between the P-cores. This would see a P-core followed by an E-core cluster, followed by two P-cores, and then another E-core cluster, then a lone P-core, and a repeat of this pattern. Kepler_L2 illustrated what "Raptor Lake" would have looked like, had Intel applied this arrangement on it. Dispersing the E-core clusters among the P-cores has two possible advantages. For one, the average latency between a P-core ring-stop and an E-core cluster ring-stop would reduce; and secondly, there will also be certain thermal advantages, particularly when gaming, as it reduces the concentration of heat in a region of the die.

TSMC has commenced mass-production of chips for Intel on its 3 nm EUV FinFET foundry node, according to a report by Taiwan industry observer DigiTimes. Intel is using the TSMC 3 nm node for the compute tile of its upcoming Core Ultra 300 "Lunar Lake" processor. The company went into depth about "Lunar Lake" in its Computex 2024 presentation. While a disaggregated chiplet-based processor like "Meteor Lake," the new "Lunar Lake" chip sees the CPU cores, iGPU, NPU, and memory controllers sit on a single chiplet called the compute tile, built on the 3 nm node; while the SoC and I/O components are disaggregated the chip's only other chiplet, the SoC tile, which is built on the TSMC 6 nm node.

Intel hasn't gone into the nuts and bolts of "Arrow Lake," besides mentioning that the processor will feature the same "Lion Cove" P-cores and "Skymont" E-cores as "Lunar Lake," albeit arranged in a more familiar ringbus configuration, where the E-core clusters share L3 cache with the P-cores (something that doesn't happen on "Lunar Lake"). "Arrow Lake" also features a iGPU based on the same Xe2 graphics architecture as "Lunar Lake," and will feature an NPU that meets Microsoft Copilot+ AI PC requirements. What remains a mystery about "Arrow Lake" is the way Intel will go about organizing the various chiplets or tiles. Reports from February 2024 mentioned Intel tapping into TSMC 3 nm for just the disaggregated graphics tile of "Arrow Lake," but we now know from "Lunar Lake" that Intel doesn't shy away from letting TSMC fabricate its CPU cores. The first notebooks powered by "Lunar Lake" are expected to hit shelves within Q3-2024, with "Arrow Lake" following on in Q4.

The top-spec AMD Ryzen AI 9 300 series "Strix Point" processor, the Ryzen AI 9 HX 370, is expected to post a 20% performance improvement over both the CPU and integrated graphics fronts, over its predecessor, the Ryzen 9 8945HS "Hawk Point," according to leak by Golden Pig Upgrade. On the CPU front, the HX 370 packs a 12-core/24-thread CPU based on a combination of four "Zen 5" and eight "Zen 5c" cores. The single-thread performance gains on the basis of the "Zen 5" microarchitecture's generational IPC increase, besides higher clock speeds; while the multithreaded performance increases on account on more cores. This performance increase isn't linearly scaling with the 50% increase in core-count.

On "Hawk Point," all eight cores are "Zen 4," capable of boosting to high frequencies, with two of them being marked as CPPC preferred cores, capable of boosting the highest. On "Strix Point," however, only four cores are based on the "Zen 5" architecture and capable of boosting to high frequency bands; while the other eight are "Zen 5c," which don't boost as high. While the IPC of "Zen 5c" is identical to "Zen 5," the fact that it doesn't boost as high, means that the generational multithreaded performance gain from the core-count increase is expected to be closer to 20%, with Golden Pig Upgrade talking about a Cinebench R23 nT score of over 20000 points, with "Hawk Point" scoring around 16000 points.

AMD's upcoming Ryzen 9000 "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture won't beat the Ryzen 7000X3D series at gaming workloads, said Donny Woligroski, the company's senior technical marketing manager, in an interview with Tom's Hardware. The new "Zen 5" chips, such as the Ryzen 7 9700X and Ryzen 9 9950X, will come close to the gaming performance of the 7800X3D and 7950X3D, but won't quite beat it. The new processors, however, will offer significant generational performance uplifts in productivity workloads, particularly multithreaded workloads that use vector extensions such as VNNI and AVX512. The Ryzen 7 7800X3D remains the fastest gaming desktop processor you can buy, it edges out even Intel's Core i9-14900KS, in our testing.

Given this, we expect the gaming performance of processors like the Ryzen 7 9700X and Ryzen 9 9950X to end up closer to those of the Intel Core i9-13900K or i9-14900K. Gamers with a 7000X3D series chip or even a 14th Gen Core i7 or Core i9 chip don't have much to look forward to. AMD confirmed that it's already working on a Ryzen 9000X3D series—that's "Zen 5" with 3D V-cache technology, and is sounds confident of holding on to the title of having the fastest gaming processors. This doesn't seem implausible.

Acemagic, a German mini-PC developer, has an interesting product booth at Computex 2024. We stopped by to take a look and found the exciting world of mini-PC solutions. Among the first products, we looked at the Z1A dual-screen laptop solution. Featuring two 14.1-inch 1080p IPS displays sitting side by side, the Z1A laptop is powered by Intel's Alder Lake Core i7-1265U or i7-1255U CPUs with Intel Iris Xe graphics. Weighting 1.8 kg, the laptop has a 4000 mAh battery and accommodates two M.2 2280 NVMe drives in combination with LPDDR4 memory left empty for users to install. The computer features WiFi 6 and BlueTooth 5.2 connectivity options and has an IO port selection that includes a USB 3.0, HDMI 2.0, and two USB Type-C connectors (one for data and one for charging and data).

German PC OEM Schenker, along with its two brands—XMG targeted at high-performance mobile workstations and gaming notebooks; and Tuxedo, targeting Linux-friendly notebooks; made a splash at the 2024 Computex. We visited their pullout booth. The EVO 14 is a 14-inch class performance notebook powered by choices of Intel Core Ultra 7 155H "Meteor Lake" or AMD Ryzen 7 8845HS "Hawk Point" mobile processors; an innovative new dual-fan cooling solution, with 65 W sustained power delivery, and an 80 Wh battery pack. The 14-inch display features a 16:10 aspect ratio, 400 nits brightness, and 3K resolution. Memory options go all the way up to 96 GB, and I/O includes either USB4 or Thunderbolt 4, depending on the hardware platform. The EVO 15 is almost identical in terms of specs, but with a larger 99.8 Wh battery, and a 15.3-inch 500 nits display, and a full-sized edge-to-edge keyboard.Update 07:03 UTC: We have some pricing and availability details from Schenker.