Tokyo Electron announced that its development team at Tokyo Electron Miyagi—the development and manufacturing site for its plasma etch systems—has developed an innovative etch technology capable of producing memory channel holes in advanced 3D NAND devices with a stack of over 400 layers. The new process developed by the team has brought dielectric etch application to the cryogenic temperature range for the first time, producing a system with exceptionally high etch rates.

The innovative technology not only enables a 10-µm-deep etch with a high aspect ratio in just 33 minutes, but also can reduce the global warming potential by 84% compared with previous technologies. The geometry of the etched structure is quite well-defined as shown in the figure 1. Potential innovations enabled by this technology will spur creation of 3D NAND flash memory with even larger capacity.

Kioxia Corporation today commenced operation of two new R&D facilities - the Flagship Building at the Yokohama Technology Campus and the Shin-Koyasu Technology Front - strengthening the company's research and development capabilities in flash memory and solid-state drives (SSDs). Going forward, other R&D functions in Kanagawa Prefecture will be relocated to these new R&D hubs to improve research efficiency and promote further advancement in technological innovation.

With the addition of the new Flagship Building, the Yokohama Technology Campus will almost double in size, allowing Kioxia to expand its capabilities in evaluating flash memory and SSD products, thereby enhancing overall product development and product quality. Equipped with environmentally-friendly facilities, the Flagship Building has also acquired ZEB-Ready certification, which is given to buildings that reduce energy consumption by 50% or more through improved energy efficiency.

Chinese InnoGrit has proved to be something of a competent contender in the high-end SSD controller market and at Computex 2023 the company was displaying an early sample of its upcoming IG5666 consumer focused PCIe 5.0 NVMe SSD controller. At the moment the company has taped out the controller, but aren't happy with the physical size of the chip and will be doing another tape out for a more optimised chip. Innogrit is using a 16 nm node for the controller, which might be part of the reason why they're having a hard time to get it the right size, but there's also cost reasons that have to be taken into consideration.

Based on the early samples, InnoGrit is expecting it to reach sequential speeds of up to 14 GB/s read and 11 GB/s write. Random performance is said to reach 3 million read and 2.5 million write IOPs. The controller should support up to 16 TB of NAND flash and it supports all common types of NAND up to a speed of 2400 MT/s. The IG5666 is based on the same Tacoma architecture as InnoGrit's IG5669, which is targeting enterprise use, yet delivers similar performance.

A trend we've seen in the 2023 Computex is that SSD manufacturers aren't advertising their feisty Gen 5 NVMe SSDs with the elaborate cooling solutions that they sorely need, but rather as bare drives, with the cooling options marketed separately. In practice, manufacturers could get retailers to bundle Gen 5 SSDs with a selection of their coolers. This lets them trim some of the criticism of just how hot SSDs have gotten over just one generation. Team Group showed off its T-Force Cardea Z5 lines of M.2 Gen 5 NVMe SSDs. There are two distinct lines with the same names. One of these comes with a maximum sequential read speed of 12 GB/s, while the other comes with 14 GB/s. Both have their respective 1 TB, 2 TB, and 4 TB capacity variants. Both use 3D TLC NAND flash. The under-the-hood difference between the 12 GB/s and 14 GB/s versions of the Cardea Z5 is that while the 12 GB/s variant uses a Phison E26-series controller, the 14 GB/s one uses an InnoGrit IG5666 controller. Team Group intends to eventually re-brand the 14 GB/s variant as the Cardea Z54A series.

Team Group also announced a handful cooling solutions to pair with these Gen 5 SSDs. The most striking of these is the T-Force Siren, an all-in-one (AIO) closed loop liquid M.2 NVMe SSD cooler, with as 120 mm radiator. The name is a bit of a misnomer, as SSD coolers with 20 mm fans is what a siren might sound like. Obviously, this cooler is overkill, and helps the SSD deliver its best performance, but there are other options from the company. The T-Force AirFlow I uses two copper heatpipes that run through the base-plate, pulling heat from the controller, NAND flash, and DRAM, and pushing it through an aluminium fin-stack arranged vertically. This is then ventilated by a 30 mm fan. The T-Force Airflow II uses a slightly different approach, with a single thicker heat pipe arranged in a C-shape, with radially-projecting finnage that have the appearance of a cylinder. At the other end of this is a 30 mm fan.

Global memory leader, Team Group, continues to develop and manufacture innovative, high-performance, and reliable industrial memory storage products, providing customers with convenient and flexible solutions. Today, it is releasing the brand new P845-M30 SSD, designed for the M.2 2230 form factor and PCIe Gen 4 interface. This compact, high-performance SSD is suitable for mini industrial PCs, handheld embedded applications, and AIoT-related tasks.

The P845-M30 comes with 112 layers of high-quality 3D NAND flash memory and uses page mapping technology to reduce its block P/E cycling frequency, extending its lifespan, and increasing its random access speeds. It is available in capacities ranging from 256 GB to 1 TB and measures only 30 mm in length. In addition, its support of the PCIe Gen 4 interface allows it to provide high-speed transfers with low power consumption. The P845-M30 can upgrade your device's performance without taking up space, making it the ideal SSD solution for mini industrial computers, which require a small form factor and large capacities.

Solidigm, a leading global provider of innovative NAND flash memory solutions, is expanding its D5 Product Series with the Solidigm D5-P5430, a new QLC solid-state storage drive (SSD) optimized for mainstream and read-intensive workloads. With most of today's enterprise applications read-dominant, the D5-P5430—a 4th gen PCIe QLC SSD—offers substantial storage density and Total Cost of Ownership (TCO) opportunities while delivering read performance that is equivalent to the most widely-adopted TLC SSDs.

The D5-P5430 is optimized for mainstream workloads (e.g., email/unified communications, decision support systems, object storage, and virtual desktop infrastructure) and read-intensive workloads (e.g., content delivery networks, data lakes/pipelines, video-on-demand). These workloads are typically 80% reads or higher and need to move massive amounts of data at high throughput.

SK Hynix seems to be getting into being a retail brand in the storage market space and its latest addition to its product range looks pretty interesting, in more ways than one. The compact 74 x 46 x 14.8 mm (WxDxH) SSD goes under the name of Beetle X31 and judging by the packaging, it's meant to look like a golden Egyptian scarab, although SK Hynix was clearly not bold enough to follow through with the housing design. Regardless, the small golden puck looks pretty nifty, but it also hides some rather interesting technology under its shell.

Fortunately for us, a Korean YouTuber has already disassembled the drive and based on the specs, it appears to have an ASMedia ASM2362 PCIe 3.0 x2 to USB 3.1 Gen 2 (10 Gbps) bridge chip, which allows the internal NVMe drive to interface with the USB Type-C port on the device. The internal NVMe SSD is also rather intriguing and it'll most likely be found in some other devices. It appears to follow the M.2 2242 form factor, but it's only equipped with a single chip, which is said to house not only the NAND flash, but also the SSD controller and some kind of DRAM, as this is not a DRAM-less SSD. The Beetle X31 will be available in 512 GB and 1 TB sizes, with the 1 TB model retailing for 138,000 Korean won, or around US$103. An optional protective case is also available as an accessory.

Due to the current lack of demand for NAND flash, the merger talks between Kioxia and Western Digital have picked up pace once again. The two companies have been at it since 2021 and it was reported back in January that the two companies once again wanted to try and combine their NAND production business. According to Reuters, the two have been pushed into the meeting room once again, largely due to the two NAND giants wanting to cut costs in a market where demand for their products isn't what it once was.

Kioxia and Western Digital are the second and fourth largest manufacturers of NAND flash, although all the memory is made in Kioxia's facilities. A merger of the two would create a company that is said to be owned at 43 percent by Kioxia and 37 percent by Western Digital, with current shareholders of the two companies getting the remaining 20 percent. However, a potential merger isn't without hurdles, as it's likely to be scrutinised by both the US and the PRC due to potential antitrust issues, with the combined company owning a third of the global NAND flash market. Kioxia has even shelved plans for a public offering, due to the sluggish demand for NAND flash. Time will tell if the two can come to an agreement, but it doesn't look like the best of times for a merger either.

Silicon Motion Technology Corporation ("Silicon Motion", the "Company" or "we") today announced its financial results for the quarter ended March 31, 2023. For the first quarter of 2023, net sales (GAAP) decreased sequentially to $124.1 million from $200.8 million in the fourth quarter of 2022. Net income (GAAP) decreased to $10.2 million, or $0.30 per diluted American Depositary Share ("ADS") (GAAP), from net income (GAAP) of $23.5 million, or $0.71 per diluted ADS (GAAP), in the fourth quarter of 2022.

For the first quarter of 2023, net income (non-GAAP) decreased to $11.2 million, or $0.33 per diluted ADS (non-GAAP), from net income (non-GAAP) of $41.1 million, or $1.22 per diluted ADS (non-GAAP), in the fourth quarter of 2022.

Solidigm, a leading global provider of innovative NAND flash memory solutions, has announced the launch of Solidigm Synergy 2.0 software. The Solidigm Synergy software suite improves overall system performance and delivers a better user experience than hardware alone can provide. This free download includes two elements, both optional, but highly recommended: the Solidigm Synergy Driver, which automatically improves the performance of Solidigm SSDs, and the Solidigm Synergy Toolkit, which offers useful SSD health reporting and tools for SSDs from any manufacturer.

Solidigm is the only company today that is investing in a solution with software built on top of the SSD that understands system behavior and adapts based on the user's needs. The latest Solidigm Synergy software improves the PC user experience for all SSD users. It increases performance where it matters most on Solidigm SSDs, and offers a host of useful drive management features for all SSDs, regardless of manufacturer. Solidigm is combining breakthrough SSD products with revolutionary software solutions and plans to introduce further innovations to deliver additional improvements to end-users.

Yesterday SK Hynix reported its Q1 2023 results and to say that they were abysmal is being kind, as the company reported a 3.4 trillion won operating loss, or just over US$2.5 billion. That's no small hit to take for any company, especially when it's only the performance for a single quarter. However, SK Hynix is apparently trying to see its situation from a positive perspective and believes that the memory chip market will rebound in the second half of this year. The positive outlook isn't just based on what SK Hynix believes though, as various analysts and securities companies believe in an upswing in the second half of the year.

That said, Micron, one of SK Hynix main competitors, has a more drab outlook for the remainder of 2023 and is expecting a tough year ahead. SK Hynix is expecting production cuts by itself, Micron and Samsung to start to take effect sometime in the second quarter this year, which should see inventory drop to more normal levels for all three companies. SK Hynix is also expecting to see a higher demand for DDR5 DRAM later this year, especially in the mobile and server market space. Finally, SK Hynix is hoping that its customers will buy higher density memory products this year, replacing older, lower density solutions, be that DRAM or NAND flash related. SK Hynix is expecting to launch its Gen 5 10 nm DRAM and 238-layer NAND sometime next year, which the company is also hoping will bring more income to its coffers, but the company still has to make it through the rest of 2023 first.

According to the South China Morning Post (SCMP) sources, Yangtze Memory Technologies Corp (YMTC) has been plotting to manufacture its advanced 3D NAND flash using locally sourced equipment. As the source notes, YMTC has placed big orders from local equipment makers in a secret project codenamed Wudangshan, named after the Taoist mountain in the company's home province of Hubei. Last year, YTMC announced significant progress towards creating 200+ layer 3D NAND flash before other 3D NAND makers like Micron and SK Hynix. Called X3-9070, the chip is a 232-layer 3D NAND based on the company's advanced Xtacking 3.0 architecture.

As the SCMP finds, YTMC has placed big orders at Beijing-based Naura Technology Group, maker of etching tools and competitor to Lam Research, to manufacture its advanced flash memory. Additionally, YTMC has reportedly asked all its tool suppliers to remove all logos and other marks from equipment to avoid additional US sanctions holding the development back. This significant order block comes after the state invested 7 billion US Dollars into YTMC to boost its production capacity, and we see the company utilizing those resources right away. However, few industry analysts have identified a few "choke points" in YTMC's path to independent manufacturing, as there are still no viable domestic alternatives to US-based tool makers in areas such as metrology tools, where KLA is the dominant player, and lithography tools, where ASML, Nikon, and Canon, are noteworthy. The Wuhan-based Wudangshan project remains secret about dealing with those choke points in the future.

Analyst firm Yole Group has predicted that SSD sales revenues will grow to $67 billion in the year 2028, generated by 472 million unit sales - indicating a very healthy outlook in the long term. However, their predictions for market performance in 2023 appear to be less cheerful for manufacturers of NAND flash memory. The SSD market dynamic was positive in 2021 and the starting months of 2022, but demand has dropped sharply since then due to a number of factors including global inflation, geopolitical tensions, and inventory digestion at electronics manufacturers. Sales revenues in 2022 totaled $29 billion (352 million units), down from $34 billion (400 million units) in 2021 - demonstrating a 14% year-to-year decline.

The continued weakening of global demand in 2023 will have an effect on SSD sales revenues, and the Yole Group has foreseen troublesome outcomes for manufacturers. The average selling price of NAND memory and solid-state drive units has been on the decline in the recent quarters, caused by sluggish demand and a surplus of stock. Despite the grim outlook in the short term, the research body is predicting a compounded annual growth rate (CAGR) of about 15% between 2022 and 2028 for the overall size of the SSD market.

Cervoz Technology, a leading supplier of industrial-grade storage and memory solutions, is excited to announce the new NVMe PCIe Gen 4x4 SSDs, the T441. Purposefully designed to cater to the growing automaticity trend of the industry, the T441 is the ideal choice for companies seeking cutting-edge technology in high-performance storage solutions.

Blazing Speeds with High Capacity
The Cervoz T441 SSDs leverage the power of 112-layer 3D TLC NAND flash technology, offering storage capacities of up to 3840 GB in a compact and energy-efficient design. In addition, the high-speed PCIe Gen 4x4 interface enables faster and more efficient data access, with Read/Write speeds of up to 7,100/6,190 MB/s and 4K random IOPS of up to 1,000K. This exceptional performance makes the T441 an ideal solution for applications requiring real-time processing of vast data, such as surveillance, machine vision, and edge AI, as well as those handling massive data sets like CAD, biomedical engineering, and atmospheric sciences.

The Chinese Government could retaliate to the U.S. ban on YMTC NAND flash memory products by banning American memory maker Micron Technology. This comes as the country initiated a "cybersecurity review" of Micron products to check if they conform to China's network security Laws. These are essentially the same grounds on which the US-FCC banned YMTC, forcing large customers like Apple to cancel orders of YMTC NAND flash products, derailing the company's growth. YMTC's 3D NAND flash products and their development roadmaps can be considered "contemporary," against those of Micron, Kioxia, SK hynix, and Samsung. If banned, China would force Chinese companies, such as Lenovo, HMD International, etc., to remove Micron from their qualified vendor lists.

Kioxia, at the 2023 China Flash Market conference (CFM), unveiled its next-generation enterprise SSD powered by 2nd Gen XL-NAND flash memory that promises up to 13.5 GB/s of sequential reads on drives with PCIe Gen 5 x4 interfaces. This puts it higher than the 12-12.5 GB/s offered by the first crop of Gen 5 SSDs, and a 118% over its current crop of Gen 4 x4 SSDs. The drive also offers up to 9.7 GB/s of sequential writes.

4K random-access performance is of a lot more importance to enterprise customers, and here, the drive is said to offer up to 3 million IOPS random reads, with up to 1.06 million IOPS sequential writes. All this comes at a slightly reduced read-latency of 27 µs, compared to 29 µs for the previous generation. Kioxia also expects PCIe Gen 5 and CXL 1.0 to be the prominent I/O interfaces for enterprise SSDs from now until the end of 2025. It's only with 2026 that we could see the emergence of PCIe Gen 6 in the enterprise space, promising a doubling in interface bandwidth.

Pure Storage, a maker of various storage solutions and custom enterprise-grade SSDs, claims the company will produce SSDs with up to 300 TBs of capacity by 2026. In an interview with Pure Storage CTO Alex McMullan, Blocks & Files got exclusive information that the company targets SSD capacities of up to 300 TBs in 2026. Pure Storage creates proprietary Direct Flash Modules (DFM) SSDs which use 3D NAND chips controlled by a custom SSD controller, are used in the FlashArray systems, and run on a custom FlashBlade operating system. This level of customization allows Pure Storage to create SSD drives with remarkable capacities in the future as the 3D NAND technology advances.

In the coming years, 3D NAND flash manufacturers will switch from the current 200-layer chips to the 400/500-layer chips, driving storage density to new highs. As manufacturers update their technology, so does Pure with its DFM cards that use regular U.2 NVMe connectors in a custom ruler-style format made explicitly for Pure FlashArray systems. Compared to upcoming HDDs that Toshiba and Seagate will use, Pure Storage DFM SSDs will have much higher capacities and read/write speeds, especially as higher-density 3D NAND arrives. You can see the comparison of Pure's estimates for the future 300 TB SSDs with future HDD technology.

Today, KIOXIA America, Inc. announces its proud participation in the Hewlett Packard Enterprise (HPE) Spaceborne Computer-2 (SBC-2) program. As part of the program, KIOXIA SSDs provide robust flash storage in HPE Edgeline and HPE ProLiant servers in a test environment to conduct scientific experiments aboard the International Space Station (ISS).

"By bringing KIOXIA's expertise and its SSDs, one of the industry's leading NAND flash capabilities, with HPE Spaceborne Computer-2, together we are pushing the boundaries of scientific discovery and innovation at the most extreme edge."

It appears things are tougher at Micron than expected, as according to Boise State Public Radio, the company is looking at cutting an additional five percent of its workforce. Back in December, Micron announced it was planning to lay off around 10 percent of its global workforce, which at the time sat at around 49,000 employees, but it appears that cut wasn't enough, as company spokesman Tate Tran has confirmed the total headcount reduction is expected to around 15 percent, although that is for the entire year of 2023. This suggests that there might be several stages of layoffs, unless things improve and demand for Micron's products pick up.

The company is also lowering its capex, not just for 2023, but also for 2024, although the company is expecting more on building new fabs. Micron has already reduced its wafer starts, for both DRAM and NAND flash by around 20 percent. This is all taking place while the company is slowing down its tech node transitions and as such, its 1-gamma note will be moved to 2025. This means that Micron will be stuck at 232-layer 3D TLC NAND for longer than initially planned, which could lead to Micron losing market to its competitors, specifically SK Hynix and Samsung in this case, while allowing other competitors to catch up. Micron will reports is financial Q2 '23 results at the end of March, with previous quarters results indicating that Micron is expecting a drop in revenue of up to US$300 million compared to the previous quarter.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today announced the SM2268XT, its latest high-performance PCIe Gen 4 SSD controller solution optimized for higher speed NAND transfer rates. The SM2268XT's superior performance and robust reliability allows customers to accelerate development of next-generation SSDs using current and future TLC and QLC 3D NAND flash with comprehensive data integrity and correction without compromising throughput and latency.

The SM2268XT features a dual-core ARM R8 CPU with four lanes of 16 Gb/s PCIe data flow and supports four NAND channels with up to 3,200 MT/s per channel, enabling designers to take advantage of higher throughput next-generation high-speed TLC and QLC 3D NAND flash. Its multi-core design automatically balances the compute load to deliver industry-leading sequential read and write speeds of 7,400 MB/s & 6,500 MB/s, and random read & write speed of 1,200K IOPS. In addition, its advanced architecture enables lower power consumption and rigorous data protection, providing high performance and reliability in a cost-effective DRAM-less PCIe Gen 4 NVMe SSD solution.

One of the major issues with M.2 based NVMe SSDs today is the excessive heat they output, part of the reason most of them run so hot is because of the older fabrication node they're made on. Most current PCIe 4.0 NVMe SSD controllers are built on a 12 nm node of some kind, but based on data out of IT Home in the PRC, we now have details of Silicon Motion's SM2504XT PCIe 5.0 NVMe SSD controller, which appears to be one of the first, if not the first, to be made on a 7 nm node.

Although it's not mentioned specifically who Silicon Motion's manufacturing partner is, it's most likely going to be TSMC, as Silicon Motion is a Taiwanese company. The SM2504XT will be a mainstream 4-channel controller, but it'll support NAND flash rated at up to 3600 MT/s, which is a step up from any other currently announced NVMe SSD controller. It also supports the NVMe 2.0 protocol and will have a PCIe 5.0 x4 host system interface. The new controller is expected to have hit the engineering sample stage some time in September this year.

Silicon Motion Technology Corporation ("Silicon Motion" or the "Company") today announced its financial results for the quarter ended December 31, 2022. For the fourth quarter of 2022, net sales (GAAP) decreased sequentially to $200.8 million from $250.8 million in the third quarter of 2022. Net income (GAAP) decreased to $23.5 million, or $0.71 per diluted American Depositary Share ("ADS") (GAAP), from net income (GAAP) of $42.9 million, or $1.29 per diluted ADS (GAAP), in the third quarter of 2022.

For the fourth quarter of 2022, net income (non-GAAP) decreased to $41.1 million, or $1.22 per diluted ADS (non-GAAP), from net income (non-GAAP) of $51.2 million, or $1.53 per diluted ADS (non-GAAP), in the third quarter of 2022.

GIGABYTE formally launched its flagship AORUS Gen5 10000 series M.2 NVMe SSDs that take advantage of a PCI-Express 5.0 x4 interface. Currently, all AMD B650 series and X670 series motherboards offer a PCIe Gen 5 M.2 slot wired to the processor without eating into PEG bandwidth, while some Intel 700-series chipset motherboards offer Gen 5 M.2 slots by subtracting lanes from the PEG slot. AORUS Gen5 10000 for now comes in 1 TB and 2 TB capacities. The drives combine a Phison E26 series controller with 3D TLC NAND flash memory and LPDDR4 DRAM cache.

The 1 TB model offers sequential transfer speeds of up to 9.5 GB/s reads, with up to 8.5 GB/s writes, and 700 TBW endurance; whereas the 2 TB model is faster, with up to 10 GB/s sequential reads, up to 9.5 GB/s writes, and 1,400 TBW endurance. The drive's power consumption is under 10 W, and GIGABYTE has deployed a thoughtful fanless cooling solution for the drive that spares you from the annoying high-pitched noise of other upcoming Gen 5 M.2 SSDs that use fan-heatsinks. The company didn't reveal pricing, but mentioned that the drives are backed by 5-year warranties.

Transcend introduced the MTE400S, a value-ended M.2 NVMe SSD meant for the prebuilt OEM/SI channel. Built in the 42 mm-long M.2-2242 form-factor, the drive features a PCI-Express 3.0 x4 host interface. It comes in capacities of 256 GB, 512 GB, and 1 TB; and features a DRAM-less design, possibly using a Phison-sourced controller. The company didn't specify the type of 3D NAND flash used. The top-spec 1 TB variant offers transfer-speeds of up to 2000 MB/s reads, with up to 1700 MB/s writes; while the 512 GB variant writes at up to 1000 MB/s, and the 256 GB variant up to 900 MB/s; with endurance ratings of 100 TBW, 200 TBW, and 400 TBW, respectively. The company didn't reveal pricing, but these should be among the cheapest drives in the market, as they're sold in tray volumes.

In Japan, the first consumer focused PCIe 5.0 NVMe SSDs have gone on sale and one of these drives has been put through some quick synthetic benchmarks by @momomo_us on Twitter. We're not familiar with the CFD Gaming brand which the drive is sold under, but the CSSD-M2M2TPG5NFZ—as the drive is called—is based on Phison's E26 controller and it's paired with Micron's B58R 3D TLC NAND, suggesting it's based around a reference design from Phison. CFD Gaming offers the drive in 1, 2 and 4 TB sizes and @momomo_us tested the 2 TB version.

Before we go into the performance figures, there's one thing that needs to be highlighted about this drive, it produces a high pitch noise during use, thanks to its tiny 17x17 mm, 21,000 rpm fan from Sunon. @momomo_us provided a video on Twitter which is linked below, so you can hear it in action for yourself. Hopefully this isn't the future of NVMe SSDs, as it's going to put off many potential customers from getting one. @momomo_us only tested the drive with CrystalDiskMark 8.0.4, which shows that sequential write speeds are slightly faster than claimed by CFD Gaming, with the sequential write speeds being bang on the money. For those hoping for higher random performance, things aren't looking so great, as the drive only performs slightly better than the best PCIe 4.0 NVMe drives.