YMTC, China's premier NAND flash and DRAM memory manufacturer, is reportedly laying off 10 percent of its workforce as it sees demand drop from loss in sales to major American customers. The company has a cutting-edge lineup of NAND flash memory at competitive prices and quality enough to meet Apple's standards. It had scored a major NAND flash supply deal with the iPhone maker in 2020, which fell through in 2022 as the U.S. government placed trade embargoes on Chinese chipmakers. The company continues to supply NAND flash chips to many of the popular Chinese smartphone and PC manufacturers. YMTC identified 10 percent of its workforce that it categorized as "underperforming," and laid them off. This even ended incentives such as discounted apartments. One terminated employee was reportedly asked to cough up RMB 400,000 (this discount) to keep their home.

Corsair has teased its fastest PCIe 5.0 SSD yet in an M.2 form factor. The company published some initial details about its upcoming product in a short video. However, the video has been taken private, indicating that the launch date may be at a later stage of the year. Thanks to Overclock3D, we saw its looks and got a slight peek at the product. Called the MP700, the SSD is supposedly boasting a fantastic 10 GB/s read capability. The write section is also impressive, with the NVMe SSD capable of reaching around 9 GB/s of what we suppose is a sustained write speed. It uses 3D TLC NAND Flash and supports Microsoft DirectStorage technology for faster load time. Below is a quote from Corsair about the MP700.

CorsairExperience the performance of PCIe Gen5 storage in your system, with up to 10,000MB/sec sequential read and 9,500MB/sec sequential write speeds for amazingly fast save, boot, and load times.
The high-bandwidth NVMe 2.0 interface and high-density 3D TLC NAND flash memory offer outstanding performance and longevity. Slot the MP700 directly into your motherboard thanks to its M.2 2280 form-factor, while a stylish aluminum heatsink helps manage temperatures and reduce throttling. Microsoft DirectStorage enables unprecedented load times when playing compatible games.

According to a report from Bloomberg, Western Digital and Kioxia are holding new talks about a potential merger of both companies' flash production businesses. The merger appears to be quite complex, as not only does it involve Western Digital spinning off its flash production business unit, which is then said to be merged with Kioxia, into what will be a publicly traded company in the US, but there will also be a second listing in Japan for the company.

Considering that Kioxia came out of Toshiba's DRAM and NAND flash manufacturing business, in which Western Digital was a partner until Toshiba divested its business into Kioxia. This caused quite some tension between the two companies, but Western Digital and Kioxia kept producing NAND flash in the shared facilities. The report by Bloomberg suggests that a management team from Western Digital will be running the combined company, which could potentially lead to future issues between the US and Japanese sides of the company. Time will tell if a merger will actually take place or not, as the two companies failed to come to an agreement in 2021, but it's possible that something has changed since then. Back in 2021, the merger was valued at US$20 billion plus.

At the 2023 International CES, we caught a hold of Phison, makes or arguably the most popular SSD controllers, which sprung to prominence on being the first to market with PCIe Gen 4 NVMe controllers, and now hopes to repeat it with PCIe Gen 5. We'd been shown a reference-design Phison E26-powered M.2 SSD, along with some hardware specs of the controller itself. The drive itself isn't much to look at—a standard looking M.2-2280 drive with a PCI-Express 5.0 x4 host interface, and the Phison E26 controller with its shiny IHS being prominently located next to a DDR4 memory chip, and two new-generation Micron Technology 3D NAND flash memory chips.

The Phison E26 controller, bearing the long-form model number PS5026-E26, is an NVMe 2.0 spec client-segment SSD controller. It has been built on the TSMC 12 nm FinFET silicon-fabrication node. The controller features an integrated DRAM controller with support for DDR4 and LPDDR4 memory types for use as DRAM cache. Its main flash interface is 8-channel with 32 NAND chip-enable (CE) lines, support for TLC and QLC NAND flash, a dual-CPU architecture, and hardware-acceleration for AES-256, TCG-Opal, and Pyrite. The controller features Phison's 5th generation LPDC ECC and internal RAID engines. For its reference-design 2 TB TLC-based drive, Phison claims sequential transfer rates of up to 13.5 GB/s reads, with up to 12 GB/s writes. The 4K random-access performance is rated at up to 1.5 million IOPS reads, with up to 2 million IOPS writes.

Mushkin at the 2023 International CES showed off its Vortex Redline and Vortex LX M.2 NVMe SSDs. The Vortex Redline is the company's top PCIe Gen 4 drive, combining an Innogrit IG5236 NVMe 1.4 controller with 3D TLC NAND flash, to offer transfer speeds of up to 7415 MB/s. The Vortex Redline comes in capacities of 512 GB, 1 TB, and 2 TB. The Vortex LX is a more value-oriented product, based on an unnamed Innogrit-sourced DRAMless controller. This drive features a PCIe Gen 4 interface, but offers slightly lower performance that the company didn't disclose.

The star attraction at the Mushkin booth was its Epsilon SSD that features a PCI-Express 5.0 x4 + NVMe 2.0 interface, a Phison E26-series controller, and next generation 3D NAND flash memory (possibly 232-layer). The drive features active cooling from a fan-heatsink, and while the company didn't talk about performance, drives based on this controller are known to offer up to 12 GB/s of sequential transfers. Lastly, the company showed off its lineup of 2.5-inch SATA 6 Gbps SSDs in capacities ranging all the way up to 16 TB, which are meant to be HDD replacements, and "warm" storage devices.

KIOXIA is betting big on enterprise flash storage, and demoed several of its new and already-launched NVMe products based on the company's 162-layer 3D NAND flash memory, aka 6th Generation BiCS flash. Starting off, we see several single-chip solutions, namely the BiCS5 eTLC, the BiCS Industial TLC, and the BiCS5-QLC. These are complete NVMe SSDs on a single package, targeting embedded systems, industrial PCs, and the likes. They can even be directly embedded on server motherboards to serve as boot drives, freeing up precious chassis space for the main storage devices.

The EM6 is an enterprise network-attached SSD in a 2.5-inch form-factor. This is a NAS-on-a-stick that can be deployed at large scale, and accessible as a network resource, or as an NVMe-over-Fiber device. The CM7 is a high-capacity 2.5-inch (EDSFF E3.S) SSD that comes in sizes of up to 30 TB, and has PCI-Express 5.0 x4 interface with NVMe 2.0 protocol, with endurance of up to 3 DWPD and offering FIPS 140-33 security. We also see the XD6 line of EDSFF E1.S form-factor NVMe SSDs with PCIe 4.0 interfaces, up to 3.84 TB capacity, and 1 DWPD endurance.

Phison Electronics Corp., a global leader in NAND flash controller and storage solutions, today is demonstrating the company's latest PCIe Gen5 innovation that is transcending system-level performance to new heights at CES in Las Vegas. Phison is demonstrating the E26 with Phison's proprietary I/O+ Technology to usher a new evolution of gaming experiences. For enterprise, Phison is previewing the company's latest Gen5 X Series SSD enterprise controllers, which can provide twice the performance per watt (in comparison to X1, the previous generation). Following the success of the world's first PCI-SIG Association certified PCIe 5.0 Redriver PS7101, Phison is also introducing the PS7201 Retimer with industry-proven IP. Phison's Retimer is designed to solve performance and data integrity issues in enterprise and automotive applications and further enhances the Gen5 ecosystem.

"Phison is ecstatic to be ringing in the new year by showcasing our product milestones for the industry, our partners and enterprise customers because we are committed and dedicated to engineering next generation technologies through ecosystem excellence," said Michael Wu, GM & President of Phison Technology Inc. (USA). "As a proven category leader, Phison's E26 with I/O+ Technology, latest Enterprise PCIe Gen5 X Series, signal enhancing Redriver and Retimer are product breakthroughs that are a testament to our engineering success."

According to Reuters, Samsung is gearing up to increase the chip production capacity at its P3 factory in Pyeongtaek in South Korea, despite the fact that there's a general slowdown in the semiconductor industry, in addition to the general economic downturn. Samsung is apparently planning on adding 12-inch wafer capacity for DRAM, while also adding more 4 nm chip capacity. The P3 fab kicked off production of Samsung's most cutting-edge NAND flash chips earlier this year and is the company's largest fab overall. According to Reuters, Samsung is aiming to add at least 10 new EUV machines in 2023.

In related news via The Elec, Samsung has seen costs increase significantly when it comes to materials costs relating to the expansion of the P3 fab. So far, the company has racked up extra costs of over a trillion korean Won, or more than US$786 million, largely due to all of its contractors having raised their prices. The report also mentioned that some parts of the expansion of the P3 fab has been delayed by as much as a year, which isn't good news for Samsung and it likely means that the company will see further increases in costs before the expansions are finished.

MSI is announcing the launch of our new Gen4 PCIe NVMe models to its SSD category - SPATIUM M461, M452 & M453 in M.2 2280 form factors that can be easily installed into compatible desktop motherboards and laptops. These new products allow MSI to continue to refine its identity as a high-performance PC brand and grow its product ecosystem by expanding SPATIUM, our high-performance storage category. Our SSDs are built with high-quality, high-density 3D NAND flash that delivers astonishing performance and endurance for professionals, content creators, and gamers.

SPATIUM M461, The Competitive PCIe 4.0 SSD for Mainstream Segment.
SPATIUM M461 was developed to meet the expectations of mainstream SSD consumers. Blazing fast speeds up to 5000 MB/sec sequential read and 4200 MB/sec sequential write speeds allow users using the latest generation of PCs to enjoy the capabilities of the PCIe Gen4 interface. Available storage capacities are 500 GB, 1 TB, 2 TB, and 4 TB.

As we're nearing the end of 2022, there is more news about layoffs and this time around it's Micron that is looking at laying off some 10 percent of its workforce. The company announced its FQ1 '23 earnings today, or fiscal quarter one 2023, since not all companies follow the standard year when it comes to financial reporting. Micron saw revenues of US$4,085 billion for the quarter, down from US$6,643 billion in the previous quarter and down from US$7,687 billion the same quarter a year ago. However, the company made a net loss of US$195 million.

Micron's CEO Sanjay Mehrotra stated "Micron's strong technology, manufacturing and financial position put us on solid footing to navigate the near-term environment, and we are taking decisive actions to cut our supply and expenses. We expect improving customer inventories to enable higher revenue in the fiscal second half, and to deliver strong profitability once we get past this downturn." These decisive actions include cutting 10 percent of its workforce according to Reuters, although this won't take place until sometime in 2023. Micron is also planning a cut in its CAPEX plans for its fiscal 2024, i.e. the company won't be investing as heavily as planned in new fabs, despite being granted money to do so by the US government.

YMTC today at the Flash Memory Summit (FMS) 2022 unveiled its X3-9070 TLC 3D NAND flash powered by Xtacking 3.0 architecture. Since its debut show at FMS 2018, YMTC's Xtacking technology has become a hallmark of the company's vision for innovation, and the approach to hybrid bonding has been widely recognized as one of the key enablers of the industry's future growth. Built out to be a common growth platform that drives value and innovation in the semiconductor ecosystem, YMTC's Xtacking 3.0 architecture opens up a world of opportunities for diversified applications in 5G, AloT, and beyond.

From 1.0 to 3.0, YMTC's Xtacking technology, a heterogeneous 3D integration architecture, has established a proven track record of success, as evidenced by a diverse portfolio of Xtacking NAND-based system solutions, including SATA III, PCIe Gen3 & Gen4 SSDs, as well as eMMC & UFS for mobile and embedded applications, garnering recognition from leading OEMs.

Team Group, the global leader in industrial memory modules, launches the brand's first industrial grade PCIe Gen4x4 M.2 2280 SSD, P845-M80. With the adoption of the ultra-fast Gen 4 x4 interface, it delivers an exceptional reading/writing performance for a large data amount. Equipped with BiCS 5 112-layer 3D NAND flash memory, it is a highly cost-competitive solution that accelerates the development of biomedical innovation and digital medicine applications. P845-M80 comes in a maximum capacity of 2 TB and meets the NVMe 2.0 standards. Its bandwidth and data transmission speed are twice that of its predecessor PCIe Gen3, making it even more ideal for the transmission of large amounts of data. Meanwhile, its 3K P/E cycles make it the best memory solution in both performance and durability.

In the wake of the global pandemic, science and digital medicine is rapidly on the rise in innovative biomedical fields. In response to the significant increase in the demand for high-performance image processing and stable storage, Team Group introduces the PCIe Gen 4 x4 industrial grade SSD with the adoption of an 8-channel controller and optional patented graphene and aluminium fin heat dissipation technologies. It effectively reduces the thermal energy generated from high-speed reading and writing and maintains system stability. The patented graphene heat dissipation technology (US invention patent number: US 110,513,92 B2 / Taiwan invention patent number: I703921) features a small volume and agility in application, suitable for machines of smaller sizes. Whereas, the patented aluminium fin heat dissipation technology (Taiwan utility model patent number: M541645) enables maximum heat dissipation and prolongs product service life. Both technologies are novel options for biomedical innovators, offering stability, high speed, and low latency.

YMTC delivered on its roadmaps to achieve a mass-production 232-layer 3D NAND flash memory, beating entrenched players Kioxia, Micron Technology, Samsung Electronics, and SK Hynix, to the production 200+ layer feat. The Chinese memory and NAND flash giant announced this memory back in August 2022 as the YMTC X3-9070, along with its new Xtacking 3.0 architecture—a proprietary method by which the company can reliably stack a large number of NAND flash layers. Micron Technology is ready with a 232-layer 3D NAND flash of its own, although it hasn't hit a production ramp, yet. This is an incredible feat considering that YMTC only got into this business in 2016, compared to the other players that each have over two decades of market presence.

YMTC's ramp to 232-layer closely follows its unexpected 2020 feat of a production-grade 128-layer 3D NAND, which was groundbreaking enough to win a supply contract with Apple, before losing it in October 2022, due to political reasons (not technological reasons). The Xtacking 3.0 architecture involves back side source connect (BSSC) for the memory cell wafer, which leads to simpler process and lower cost compared to Xtacking 2.0 (up to 128-layers, which had introduced nickel silicide (NiSi) instead of tungsten silicide (WSi) for better device performance and I/O speed for CMOS wafer. The original Xtacking architecture from YMTC, which it debuted back in 2016, with layer counts going up to 64-layer, relied on cost-effective wafer-to-wafer bonding. The YMTC 232-layer 3D NAND flash should find plenty of takers in the consumer electronics industry, spanning smartphones, consumer storage devices, TVs, and other appliances. The high layer-count has a direct impact on density, which can help designers lower costs by using fewer chips, or increase capacity.

According to data from Gartner, the semiconductor market is expected to decline by up to 3.6 percent in 2023, from a growth of 4 percent this year and 26.3 percent in 2021. This might not be surprising to those that have followed recent developments in the semiconductor market, but it also looks like revenue for 2023 will be closer to that of 2021. This might in part be related to higher costs of manufacturing, but consumer demand is expected to be down in 2023, largely due to less disposable income, related to the current situation with rising inflation and increasing costs elsewhere.

Gartner claims that the enterprise market has been relatively stable and the consulting firm isn't expecting the enterprise market to decline as much as the consumer market when it comes to semiconductor demand. That said, Gartner is expecting the memory market to decline by up to 16.2 percent in 2023, as there's already an oversupply in the market. Likewise, it expects that the NAND flash market will see a decline by up to 13.7 percent in 2023. What isn't clear is how this weaker demand will affect retail prices, but as we've already seen, the DRAM and NAND flash manufacturers have already hit the brakes, to try and prevent a price crash.

We are announcing the latest addition to our PC enthusiast databases, the new TechPowerUp SSD Specs Database. Modeled along the lines of our immensely popular GPU Database, CPU Database, and hardware Reviews Database, the new SSD Specs Database, curated by Gabriel Ferraz, aims to be a definitive repository of information on solid-state drive (SSD) hardware specs, for all to freely access. Here, you'll find a growing collection of client SSD hardware specs across all relevant form-factors and information. The database also helps you identify multiple hardware revisions of the same SSD model, so you're aware of any bait-and-switch incidents, or vague specs by manufacturers.

The TechPowerUp SSD Specs Database has individual info pages on each capacity variant of an SSD model; besides any hardware variants it may have. You can have quick, actionable information on specs such as controller, NAND flash, DRAM cache, advanced NAND flash specs, interface, protocol, controller hardware specs, and known performance numbers from our testing. We are constantly adding new drives to this database, and you can help us grow, not just by suggesting improvements to the database itself, but for additions to the database, please reach out to the curator on the main page. But for now, enjoy what we've built for you!

TechPowerUp SSD Specs Database

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, as promised at Flash Memory Summit 2022 and Samsung Memory Tech Day 2022, announced today that it has begun mass producing a 1-terabit (Tb) triple-level cell (TLC) eighth-generation Vertical NAND (V-NAND) with the industry's highest bit density. At 1 Tb, the new V-NAND also features the highest storage capacity to date, enabling larger storage space in next-generation enterprise server systems worldwide.

"As market demand for denser, greater-capacity storage pushes for higher V-NAND layer counts, Samsung has adopted its advanced 3D scaling technology to reduce surface area and height, while avoiding the cell-to-cell interference that normally occurs with scaling down," said SungHoi Hur, Executive Vice President of Flash Product & Technology at Samsung Electronics. "Our eighth-generation V-NAND will help meet rapidly growing market demand and better position us to deliver more differentiated products and solutions, which will be at the very foundation of future storage innovations."

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today the latest PCIe 4.0 M.2 SSD - AORUS Gen4 5000E which comes in two capacities of 500 GB and 1000 GB with 5000 MB/s read speed and 30% lower on overall power consumption. The AORUS Gen4 5000E has passed several comprehensive performance and stability tests to ensure users the most stable SSD with next-level performance.

"PCIe M.2 SSD dominates the present market with its advantages of small size and premium performance, making it the perfect choice for users to enhance storage performance, especially in the case of speedy PCIe 4.0 SSDs", said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division. "Since the well-reputed PCIe 4.0 SSD first launched in 2019, GIGABYTE carries on with the belief in providing top-quality products to meet the needs of superior performance and ultra durability. AORUS Gen4 5000E SSD with 5000 MB/s read speed performs a key role in the improvement of storage performance."

In September, we reported that Apple, the world's most valuable company, would source some of its 3D NAND flash chips from the Chinese Yangtze Memory Technologies Corp (YMTC). However, according to the latest political pressure from the US government, Apple has reportedly canceled any contracts with the Chinese company and will not include their 3D NAND chips in the production of iPhones, iPads, and Mac computers. Even with YTMC's Xstacking 3.0 six-plane architecture that provides triple-level cell storage with I/O speeds of 2400 MT/s, Apple is not going to source any NAND Flash memory as US-China political relationship gets tighter regulations.

However, this could not be a deal breaker for both companies, as NAND Flash is in high demand, and new clients will emerge. As for Apple, the company has contracts with Kioxia, SK Hynix, Samsung, and possibly others that will ensure a steady supply of storage for the company's solutions.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today showcased a series of cutting-edge semiconductor solutions set to drive digital transformation through the decade, at Samsung Tech Day 2022. An annual conference since 2017, the event returned to in-person attendance at the Signia by Hilton San Jose hotel after three years.

This year's event, attended by more than 800 customers and partners, featured presentations from Samsung's Memory and System LSI business leaders—including Jung-bae Lee, President and Head of Memory Business; Yong-In Park, President and Head of System LSI Business; and Jaeheon Jeong, Executive Vice President and Head of Device Solutions (DS) Americas Office—on the company's latest advancements and its vision for the future.

MSI, the world's leading gaming PC hardware brand, is proud to announce the new SPATIUM M570 PCIe 5.0 NVMe M.2 HS, with blazing fast read speeds up to 10 GB/s that unites the latest in top-notch PCIe Gen 5 controller technology with high-quality 3D NAND flash, and advanced cooling. Sporting a bronze-coloredaluminiumm heatsink, the SPATIUM M570 PCIe 5.0 NVMe M.2 HS SSD takes a sensational leap in storage performance, bringing more than 1.5 times faster read/write speeds compared to current PCIe 4.0 SSDs. With compliance of NVMe 2.0 and M.2 2280 form factor, the SPATIUM M570 HS offers optimal performance and long-lasting durability in 1 TB, 2 TB, and 4 TB capacity variants for professionals, content creators, and gamers in an easy installation and extreme transfer speeds for multitasking workloads. The strong collaboration between MSI and Phison was showcased to convey innovations in the storage space area during CES 2022 mutually.

"K.S.Pua, CEO of Phison Electronics, said that the cooperation between Phison and MSI started from the SSD product line. Since both companies have their own expertise in NAND controller and computer system integration respectively, and in addition to SSD, MSI has also actively expanded its strategy in the fields of gaming, content creators, commercial, industrial, robotics, and even automotive in recent years, where the application markets are in line with Phison's long-term strategy, so the two companies hit it off. The SPATIUM PCIe 5.0 SSD launched by MSI this time adopted Phison's E26 SSD controller. Since the performance of PCIe 5.0 is much faster than the previous generation of PCIe 4.0, the two companies have conducted a lot of tests and discussions on power consumption and heat dissipation, which is a valuable cooperation experience. In the future, Phison will continue to support MSI through controller technology."

The first batch of PCIe 5.0 SSDs are all likely to be based on Phison's PS5026-E26 controller, which offers eight NAND channels, capable of supporting NAND speeds of up to 2400 MT/s. Phison's own figures for the controller are 13 GB/s writes and 12 GB/s reads, with up to 1.5 million random read IOPS and 2 million random write IOPS. However, as we've already seen from various SSD brands, many PCIe 5.0 SSDs won't exceed 10 GB/s when it comes to the sequential read/write speeds. This is because the current NAND flash simply isn't fast enough to saturate the PCIe 5.0 bus, which is capable of 15.75 GB/s. That said, Micron's 232-layer 3D NAND should be able to boost the performance up to 12.4 GB/s based on the numbers Gigabyte announced for their Aorus Gen 10000 SSD.

Based on an article over at Tom's Hardware, we shouldn't expect too many drives that exceed 10 GB/s sequential writes at launch, due to most drives using 176-layer 3D NAND flash, that is limited to 1600 MT/s. As such, it might be wise to hold off on buying the first generation of PCIe 5.0 drives and wait for better availability of 232-layer 3D NAND, as beyond Micron, SK Hynix is expected to have a 238-layer 3D NAND flash in the market sometime in the first half of 2023. If you're not really eager to have the fastest SSD out there for pure bragging rights, it would seem that mid 2023 might be the right time to get a PCIe 5.0 SSD.

As reported by BusinessKorea, Apple, one of the largest companies in the world, will source its 3D NAND from Chinese memory maker Yangtze Memory Technologies Corp (YMTC). Known for supplying 3D NAND to Chinese SSD makers, YTMC's reported contract with Apple will fuel the upcoming iPhone 14 SKU manufacturing. Whether or not this partnership will expand to other products, it is essential to have as many storage sources as possible, as Apple sells millions of devices per year. YTMC is on track to deliver 3D NAND flash with the latest Xstacking 3.0 six-plane architecture that provides triple-level cell storage with I/O speeds of 2400 MT/s.

YTMC has joined the list of 3D NAND flash vendors that Apple works with, including SK Hynix, Samsung, Kioxia, and possibly others. This partnership also highlights that the Chinese memory output is sufficient and significant enough to break into more markets worldwide, not remaining exclusive to domestic use.

MaxLinear, Inc, a leading provider of radio frequency (RF), analog and mixed-signal integrated circuits, and Silicon Motion Technology Corporation (NasdaqGS: SIMO) ("Silicon Motion"), a global leader in NAND flash controllers for solid state storage devices, today announced that at Silicon Motion's extraordinary general meeting (the "EGM") of shareholders, held on August 31, 2022, shareholders of Silicon Motion approved the previously announced merger agreement under which MaxLinear will, subject to the terms and conditions thereof, acquire Silicon Motion, and approved other proposals related to the transaction.

More specifically, at the EGM, securityholders of Silicon Motion approved, by the requisite vote, the acquisition of Silicon Motion by MaxLinear, including the approval of: (a) the Agreement and Plan of Merger, dated May 5, 2022 (as it may be amended from time to time, the "Merger Agreement"), by and among MaxLinear, Shark Merger Sub, an exempted company incorporated and existing under the laws of the Cayman Islands and a wholly-owned subsidiary of MaxLinear ("Merger Sub"), and Silicon Motion, pursuant to which Merger Sub will merge with and into Silicon Motion with Silicon Motion continuing as the surviving company and becoming a wholly-owned subsidiary of MaxLinear (the "Merger"); (b) the plan of merger required to be filed with the Registrar of Companies in the Cayman Islands; (c) the Merger itself, on the terms and subject to the conditions set forth in the Merger Agreement; and (d) all other transactions and arrangements contemplated by the Merger Agreement.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD220F: Universal Flash Storage 4.0. In addition, an update to the complementary JESD223E UFSHCI 4.0 standard, and a new companion standard for UFS version 3.1 and above, JESD231 File Based Optimization, have also been published. Developed for mobile applications and computing systems requiring high performance with low power consumption, UFS 4.0 introduces significant bandwidth and data protection improvements over the earlier version of the standard. All three standards are available for download from the JEDEC website.

Transcend Information, has recently introduced a whole series of 112-layer 3D NAND solid-state drives featuring wide-temperature tolerance, operating stably from -40°C to 85°C and demonstrating remarkable endurance. The form factors include 2.5", M.2, and mSATA types, suitable for embedded devices, vehicle systems, and slim servers. With up to 4 TB capacity, this rugged solution overcomes the challenges of extreme industrial environments, empowering applications in smart factories, modern infrastructures, and surveillance in the IoT era.

Transcend utilizes 112-layer 3D NAND flash to build wide-temp SSDs, which support the mainstream SATA III interface and the high-speed PCIe interface. With up to 4 TB capacity, proven performance is delivered between -40°C and 85°C thanks to an in-house sorting process and rigorous temperature tests which ensure the SSDs can adapt to rapid temperature change and thermal shock. Meanwhile, anti-sulfur technology, Corner Bond, and 30µ" gold fingers are incorporated to enhance key component protection and effectively prolong SSD lifespan. All these features create higher reliability for demanding applications like roadside monitoring systems which are exposed to long hours of high temperatures, or industrial computers that have to ensure non-stop high-speed operation.