The subsidiary of MiTAC Holdings Corp, MiTAC Computing Technology and its server brand TYAN, the leading manufacturer in server platform design worldwide, unveil their new server systems and motherboards optimized for today's AI, HPC, cloud, and enterprise workloads at COMPUTEX 2024, Booth # M1120 in Taipei, Taiwan from June 4 to June 7. Harnessing the power of the latest Intel Xeon 6 processor and 4th and 5th Gen Intel Xeon Scalable processors, these solutions deliver cutting-edge performance.

"For over a decade, MiTAC has worked with Intel at the forefront of server technology innovation, consistently delivering cutting-edge solutions tailored for AI and high-performance computing (HPC). The integration of Intel's latest Xeon 6 processors into our MiTAC and TYAN server platforms transforms computational capabilities, significantly enhancing AI performance, boosting efficiency, and scaling cloud operations. These advancements empower our customers with a competitive edge through superior performance and optimized total cost of ownership," said Rick Hwang, President of MiTAC Computing Technology Corporation.

MSI also brought plenty of SSD products to the Computex 2024 show, including the new SPATIUM M560 PCIe 5.0 NVMe M.2 SSD based on the Phison E31T controller and Kioxia's 218-layer BiCS 3D TLC NAND, the new SPATIUM non-metal Vapor Chamber SSD Thermal Solution, and a couple of SSD accessories, including the DATAMAG Magnetic Portable SSD and the DATAVAULT SSD Enclosure.

As said, the new SPATIUM M560 PCIe 5.0 NVMe M.2 SSD will use the Phison 7 nm E31T controller paired up with Kioxia 8th generation 218-layer BiCS 3D TLC NAND and offer transfer rates of up to 10,000 MB/s. The controller, according to MSI, should bring up to a 15 percent reduction in power consumption as well as "maximize bandwidths and link efficiency". It will be available in 1 TB, and 2 TB capacities, and MSI will probably have a version that will include the new SPATIUM non-metal Vapor Chamber SSD Thermal Solution which has been also showcased at the Computex 2024 show. MSI says that this is yet another world's first, which uses "a two-phase flow transition of gas and liquid with minimal signal interference, ensuring rapid and silent heat exchange." According to MSI, the new SPATIUM non-metal Vapor Chamber SSD Thermal Solution should provide up to 11 degrees lower temperature compared to a standard aluminium heatsink.

Lexar puts up on display two new M.2 2280 PCIe Gen 5 x4 NVMe SSDs at Computex, the NM1090 Pro and NM990. Both are capable of achieving up to 14 GB/s read, and 12 GB/s write performance. This makes it nearly twice as fast as PCIe Gen 4. A test system featuring the Lexar NM1090 Pro 2 TB model was available for live testing to support read/write performance claims. Alongside these two, we spotted another model of the Lexar NM1090 featuring a large heatsink with RGB lighting and 8 TB capacity to further extend existing family.

Lexar NM1090 Pro and NM990 are going to be available in Q4 2024 with 1 TB, 2 TB, and 4 TB capacities respectively.

Getac today announced the launch of its brand-new AI-ready S510 rugged laptop, enabling organizations across industries such as utilities, public safety, manufacturing and automotive to utilise the power of edge AI on a daily basis. The new S510 enables workers to capitalise on the significant productivity benefits of AI-based applications. An Intel Core Ultra 5/7 processor with Intel AI Boost and Intel Graphics put powerful performance at users' fingertips, while a dedicated Microsoft Copilot key quickly awakens AI capabilities whenever needed.

The S510 combines this innovative feature set with MIL-STD-810H and IP53 certifications, alongside 3ft (0.9 m) drop and vibration resistance, giving users the peace of mind they need to work with confidence. The S510 also boasts a 15.6-inch display with 1,000 nits of brightness and Getac sunlight readable technology for optimal versatility in a variety of light conditions. In addition, the device provides robust connectivity options including WiFi 6E and Bluetooth 5.3 as standard, with optional 4G-LTE and 5G Sub-6 capabilities to keep users connected.

Acer today debuted two new premium Chromebook Plus laptops - the Acer Chromebook Plus Spin 714 and Acer Chromebook Plus 516 GE - that combine versatile designs with a 2x faster Intel Core processor and up to double the memory and storage, giving people the power to do even more all at once.

As Chromebook Plus devices, the two new models support enhanced generative AI features for connectivity, creativity, and collaboration, such as a "help me write" feature available with just a right click, Google Photos' Magic Editor, Gemini, and more. The Acer Chromebook Plus Spin 714 is a slim convertible optimized for on-the-go productivity and connectivity with a 360-degree hinge that allows it to be used in myriad ways and places, and the Acer Chromebook Plus 516 GE is a next-generation cloud-gaming Chromebook with the latest gaming-centric hardware to stream and play AAA games with NVIDIA GeForce NOW, Xbox Cloud Gaming, Boosteroid, Amazon Luna and more.

BoostR is an Indiegogo crowdfunded project that seeks to integrate a multi-functional I/O dock with an external GPU. It's a rather brilliant idea—the dock draws connectivity from a USB4 (40 Gbps) connection, which it uses to connect an AMD Radeon RX 7600M GPU, an M.2-2280 NVMe SSD slot, a 1 GbE networking interface, an SD 4.0 card reader, and a bunch of USB 3.2 downstream ports.

The device comes with a power brick, and by default draws 100 W for all its functions, including the eGPU. You can boost the power limit to 120 W, which should improve the GPU's performance. The GPU puts out a couple of HDMI 2.1 and DisplayPort 2.0 connectors. BoostR was briefly available on Indiegogo at an early-bird price of $499, at which it would undercut the Ayaneo OneXGPU, a similar contraption of an eGPU+M.2+port dock that's priced at $699. One area where the BoostR has an edge over the OneXGPU is its 120 W mode that give the GPU improved boost frequency residency. It remains to be seen what the regular price of BoostR will be, but the company is offering a 5% discount on the final price if you sign up for their newsletter.

The Sabrent USB-C Enclosure for M.2 2230 PCIe NVMe SSDs is a simple and easy solution for managing your short-form factor drives. Need to prepare your M.2 2230 SSD for installation into your Steam Deck, ASUS ROG Ally, Surface Pro 9, or other portable device? Pop it into this enclosure and secure the latch, plug it in via USB-C, and off you go. The enclosure supports all major operating systems, including Windows, macOS, and anything built on Linux. The experience is simplified with an integrated cable and plug-and-play operation, as it is bus-powered with no drivers required.

The enclosure specifically supports M.2 2230 PCIe NVMe SSDs, not SATA, so be sure to check your drive beforehand - drives like our Rocket 2230 and Rocket Q4 2230 are a perfect pairing for this enclosure.

IRDM, a European brand of computer memory dedicated to gamers and enthusiasts, owned by Wilk Elektronik SA, proudly introduces the latest addition to its product range—the SSD IRDM PRO NANO. This revolutionary data storage device, designed with cutting-edge mobile technologies in mind, offers unmatched performance parameters and the highest reliability in an extremely compact M.2-2230 format, making it an ideal solution not only for professionals and new technology enthusiasts, but also for gamers using handheld consoles and ultrabooks.

Featuring branded components and PCIe NVMe Gen. 4 x4 technology, the IRDM PRO NANO SSD delivers an unparalleled read speed of up to 7300 MB/s and write speeds of up to 6000 MB/s! Such performance enables lightning-fast game and application loading, enhancing overall system smoothness. Both gamers and professionals will appreciate reduced downtime and faster data processing, crucial when working with large files and demanding applications.\

JMicron Technology Corporation, in collaboration with Vinpower, Inc., have developed the first of its kind Enhanced 10Gbps Portable SSD (PSSD), using the collaboratively developed iVP817 IC Chip, that's compatible with Apple iOS devices supporting the iPhone iAP2. The PSSD offers super-fast Read/Write (R/W) data transfer speeds and is the first of its kind to provide Secure, High Powered, High-Speed backup and storage across all computing platforms, which includes the Apple iOS platform, as well as Android, PC, MacBook, Chromebook and more. While the R/W transfer speeds for USB flash storage devices compatible with smartphones and tablets typically range from 20 MB/sec to 80 MB/sec, the enhanced PSSD achieved verifiable R/W transfer speeds at more than 800 MB/sec with an iPhone 15Pro and 15Pro Max. That means, when using the enhanced PSSD with Vinpower's iAP2 based App, one could backup a 10 GB video, from an iPhone 15Pro or 15Pro Max, in around 12 seconds. On top of that, the PSSD will accommodate a range of NVMe SSD with varying form factor lengths and capacities up to and exceeding 8 TB of secure storage.

JMicron is a leading IC design company specialized in high-speed data and signal interfaces bridge controllers including NVMe to USB bridges, while Vinpower is a leader in designing IC chip firmware, circuit design, and manufacturing Apple iOS backup and storage devices and related Apps. The two companies recognized the enormous untapped market potential for a new solution that can perform smooth, fast, and secure data transfer and backup for portable mobile devices, especially for the Apple iOS platform, such as iPhones and iPads.

BIWIN is a rather large OEM of consumer NAND flash and DRAM products for some of the largest PC brands, including HP and Acer, among several others. It is based out of Shenzhen, China, and trades as 688525 on the Shanghai Stock Exchange. The company has been making retail overclocking PC memory; high performance M.2 NVMe and SATA SSDs; as well as portable SSDs and USB flash drives for several years now. We've reviewed several of these including. BIWIN now wants to break cover, and sell these products under its own brand in the retail channel. BIWIN is planning to make a big splash at the 2024 Computex next month, where it will showcase not just the products it's making for the big PC brands, but also those it plans to directly market under its own marquee.

From what we gather, BIWIN will continue to be an OEM for the big ticket brands it's serving, but will also run a first-party product stack. This would give its product managers freedom to come up with original product designs and specifications for their products, and choose where and how to sell them. The company in its LinkedIn post announcing this move, also posted teasers from its upcoming Computex booth, showcasing BIWIN-branded PC overclocking memory, portable SSDs, USB flash drives, memory cards, and M.2 NVMe SSDs. We'll be sure to give you a detailed tour of this booth from Computex.

Acer today launched its first Copilot+ PC with the Swift 14 AI laptop, in collaboration with Microsoft and Qualcomm Technologies, Inc., ushering in a new AI era with brand new user experiences and AI capabilities on Windows 11. The Swift 14 AI has multiple device models, powered by Snapdragon X Elite and Snapdragon X Plus platforms, and both feature one of the world's fastest NPUs for laptops to enable on-device AI processing. Users can streamline everyday tasks with smarter PC functions and tackle complex workloads more effectively.

"Engineered for AI from the inside out, the Swift 14 AI is the first among many Acer Copilot+ PCs to come," said Jerry Kao, COO, Acer Inc. "These next-generation AI PCs see significant leaps in AI processing power, unlocking brand new experiences that we know users will love."

Courtesy of ASUS Vietnam (via @rquandt on X/Twitter), we now have an idea of what ASUS' first Qualcomm Snapdragon X Elite notebook will look like, but also what the main specifications are. It will share the Vivobook S 15 OLED branding with other notebooks from ASUS, although the leaked model carries the model number S5507QA-MA089WS. At its core is a Qualcomm Snapdragon X Elite X1E-78-100 SoC which is the base model from Qualcomm. The SoC consists of 12 Oryon cores, of which eight are performance cores and four are energy efficient cores. A peak, multi-threaded clock speed of 3.4 GHz and 42 MB of cache, as well as a 75 TOPs AI engine rounds off the SoC specs. The SoC is also home to a Qualcomm Adreno GPU, but so far Qualcomm hasn't released any useful specs about the GPU in the Snapdragon X Elite series of chips.

ASUS has paired the SoC with 32 GB of LPDDR5X memory of an unknown clock speed, although Qualcomm officially supports speed of up to 8,448 MT/s in a to PC users unusual configuration of eight channels at 16-bit wide, for a bandwidth of up to 135 GB/s. For comparison, Intel's latest Core Ultra processors max out at LPDDR5X 7,467 MT/s and up to 120 GB/s memory bandwidth. Other features include a 1 TB PCIe 4.0 NVMe SSD, a glossy 15.6-inch 2,880 x 1,620 resolution, 120 Hz OLED display with 600 nits peak brightness and a 70 WHr battery. It's unclear what connectivity options will be on offer, but judging by the screenshot below, we can at least expect an HDMI out as well as a pair of USB Type-C ports, a micro SD card slot and a headphone jack. As far as pricing goes, Roland Quandt is suggesting a €1,500 base price on X/Twitter, but we'll have to wait for the official launch to find out what these Arm based laptops will retail for. ASUS Vietnam has already removed the page from its website.

Corsair today announced the launch of the Corsair ONE i500 PC, a compact powerhouse packed with cutting-edge components and boasting high-end performance for content creators, AI-savvy professionals, and gamers. The sleek, space-saving design houses up to an NVIDIA GeForce RTX 4090 graphics card and Intel Core i9-14900K processor—both liquid cooled. Combined with next-gen DDR5 memory and 2 TB of NVMe SSD storage, the Corsair ONE i500 delivers the speed, storage, and reliability you'd expect from a high-end PC.

The Corsair ONE i500 PC is 30% smaller than a full-sized desktop PC but doesn't compromise on power. Modern liquid cooling delivers top-tier thermal efficiency, minimizing CPU and GPU temperatures while achieving faster performance, all while being noticeably quieter than traditional cooling. NVIDIA GeForce RTX 4090 and 4080 SUPER graphics cards power a quantum leap in framerates and AI-powered graphics, while Intel 14th Gen CPU architecture makes sure you game and multitask without compromise.

Radxa is a Chinese manufacturer of various Arm based devices and something of a minor competitor to the Raspberry Pi Foundation. The company has just launched its latest product which is called the ROCK 5 ITX. As the name implies, it's a Mini-ITX form factor motherboard, which in itself is rather unusual for Arm based hardware to start with. However, Radxa has designed the ROCK 5 ITX to be a NAS motherboard and this is the first time we've come across such a product, as most Arm based boards are either intended for hobby projects, software development or routers. This makes the ROCK 5 ITX quite unique, at least based on its form factor, as it'll be compatible with standard Mini-ITX chassis.

The SoC on the board is a Rockchip RK3588 which sports four Cortex-A76 cores at up to 2.4 GHz and four Cortex-A55 cores at 1.8 GHz. This is not exactly cutting edge, but should be plenty fast enough for a SATA drive based NAS. The board offers four SATA 6 Gbps connectors via an ASMedia ASM1164 controller, each with an individual power connector next to it. However, Radxa seems to have chosen to use fan-header type power connectors, which means it'll be hard to get replacement power cables. The board also has a PCIe 3.0 x2 M.2 slot for an NVMe drive. The OS boots from eMMC and Radxa supports its own Roobi OS which is Debian Linux based.

Renowned global memory brand Team Group Inc. is committed to providing consumers with diverse and optimal storage solutions. Today, it proudly unveils the Team Group MP44Q M.2 PCIe 4.0 Solid State Drive, featuring the latest 3D QLC NAND technology, combining cutting-edge technology with the trend of demanding high storage capacity to meet daily system and file storage needs.

Team Group MP44Q M.2 PCIe 4.0 SSD utilizes the latest 3D QLC NAND, offering capacities of up to 4 TB. With the PCIe Gen 4 x4 interface and SLC Caching technology, it achieves maximum sequential read and write speeds of up to 7,400 MB/s and 6,500 MB/s, respectively. The MP44Q SSD operates with low power consumption, catering to all document processing and storage applications, significantly enhancing work efficiency. Paired with Team Group's exclusively patented graphene heat dissipation sticker, whose thickness is less than 1 mm, eliminating the potential for mechanical interference in any assembly, coupled with the native heat sink of the motherboard, such an arrangement effectively addresses the heat generated by high performance, extending the SSD's lifespan.

KLEVV today announced the CRAS C925 line of mid-range M.2 NVMe SSDs. Built in the M.2-2280 form-factor, these drives take advantage of the PCI-Express 4.0 x4 host interface, to provide sequential transfer speeds of up to 7400 MB/s reads, and up to 6500 MB/s sequential writes, depending on the model. There are three of these based on capacity—500 GB, 1 TB, and 2 TB. All three offer up to 7400 MB/s sequential reads, while the maximum write speeds are up to 6200 MB/s for the 500 GB model, up to 6300 MB/s for the 1 TB model, and up to 6500 MB/s for the 2 TB model. Both the 500 GB and 1 TB models offer up to 670,000 IOPS 4K random reads, and up to 980,000 IOPS random writes; while the 2 TB model does up to 700,000 IOPS random reads, with up to 1 million IOPS random writes.

The KLEVV CRAS C925 combines a MaxioTech MAP1602 DRAMless controller with an unspecified brand of 3D TLC NAND flash memory. The drive features a single-sided design, in that even the top 2 TB model has all its components on one side of the PCB. You can use the included aluminium heat-spreader that reduces temperatures by 12%, or the heatsink your motherboard includes. KLEVV rates the write endurance of these drives at 600 TBW for the 500 GB model, 1,200 TBW for the 1 TB model, and 2,400 TBW for the 2 TB model. The company is backing the drives with a 5-year warranty. The company didn't reveal pricing, but mentioned that the drives will be available from May 2024.

MSI, a leading global server provider, is showcasing its latest GPU servers powered by AMD processors at the 2024 NAB Show, Booth #SL9137 in the Las Vegas Convention Center from April 14-17. These servers are designed to meet the evolving needs of modern creative projects in Media and Entertainment industry. "As AI continues to reshape the Media and Entertainment industry, it brings unprecedented speed and performance to tasks such as animation, visual effects, video editing, and rendering," said Danny Hsu, General Manager of Enterprise Platform Solutions. "MSI's GPU platforms empower content creators to execute every project with efficiency, speed, and uncompromising quality."

The G4101 is a 4U 4GPU server platform, purpose-built to unleash the full potential of creative professionals in the Media and Entertainment industry. It supports a single AMD EPYC 9004 Series processor equipped with a liquid cooling module, along with twelve DDR5 RDIMM slots. Additionally, it features four PCIe 5.0 x16 slots tailored for triple-slot graphic cards with coolers, ensuring increased airflow and sustained performance. With twelve front 2.5-inch U.2 NVMe/SATA drive bays, it offers high-speed and flexible storage options, catering to the diverse needs of AI workloads. The G4101 combines air flow spacing and liquid closed-loop cooling, making it the optimal thermal management solution for even the most demanding tasks.

Sabrent today debuted the Rocket 4 line of DRAMless M.2 NVMe Gen 4 SSDs. Built in the M.2-2280 form-factor, these drives take advantage of the PCI-Express 4.0 x4 host interface, and provide sequential transfer speeds of up to 7.4 GB/s reads, with up to 6.4 GB/s writes. The drives also offer 4K random access performance of up to 1 million IOPS reads, and 0.95 million IOPS writes. For now, Sabrent is launching 1 TB and 2 TB capacity variants of the Rocket 4, but the company is preparing to launch a larger 4 TB variant soon.

The Sabrent Rocket 4 combines a Phison E27T series DRAMless controller with Kioxia 162-layer 3D TLC NAND flash memory (also known as the BiCS 6). There's just a copper foil heat spreader to keep things cool. The 12 nm E27T doesn't run anywhere near as hot as the E18, so you can make do with the heatsink your motherboard includes, or run it the way it is. The 1 TB variant is priced at $99.99, and the 2 TB variant at $199.99. The company didn't reveal pricing of the unreleased 4 TB variant.

Intel Core Ultra "Lunar Lake-MX" will be the company's bulwark against Apple's M-series Pro and Max chips, designed to power the next crop of performance ultraportables. The MX codename extension denotes MoP (memory-on-package), which sees stacked LPDDR5X memory chips share the package's fiberglass substrate with the chip, to conserve PCB footprint, and give Intel greater control over the right kind of memory speed, timings, and power-management features suited to its microarchitecture. This is essentially what Apple does with its M-series SoCs powering its MacBooks and iPad Pros. Igor's Lab scored the motherlode on the way Intel has restructured the various components across its chiplets, and the various I/O wired to the package.

When compared to "Meteor Lake," the "Lunar Lake" microarchitecture sees a small amount of "re-aggregation" of the various logic-heavy components of the processor. On "Meteor Lake," the CPU cores and the iGPU sat on separate tiles—Compute tile and Graphics tile, respectively, with a large SoC tile sitting between them, and a smaller I/O tile that serves as an extension of the SoC tile. All four tiles sat on top of a Foveros base tile, which is essentially an interposer—a silicon die that facilitates high-density microscopic wiring between the various tiles that are placed on top of it. With "Lunar Lake," there are only two tiles—the Compute tile, and the SoC tile.

A Chinese Topton company has brought new life to the AMD Vega graphics architecture by integrating it into a Network Attached Storage (NAS) motherboard. The Topton N9 NAS motherboard features the Intel Core i7-8705G processor, a unique chip that combines Intel CPU cores with AMD's RX Vega M GL graphics. The Intel Core i7-8705G, initially released in 2018, is an unusual choice for a NAS system. This 14 nm processor features four cores, eight threads, and a boost clock of up to 4.1 GHz. What sets it apart is the integrated AMD RX Vega M GL GPU with 20 Compute Units and 4 GB of HBM2 memory.

The Topton N9 NAS motherboard is designed for the 17×17 cm ITX form factor and offers a range of features like maximum support for 64 GB of DDR4 RAM, M.2 NVMe/SATA and SATA 3.0, eight Intel i226-V controllers for 2.5 Gbit networking, USB 3.0, USB Type-C, and HDMI 2.0 connectivity. While the Intel Core i7-8705G may not be the most obvious choice for a NAS system, the Topton N9 motherboard demonstrates how this unique processor can be repurposed to provide affordable computing power. The integrated AMD RX Vega graphics offer capabilities beyond typical NAS requirements, making this motherboard suitable for various applications, such as home firewalls and routers. The collaboration between Intel and AMD in creating the Kaby Lake-G processors was a rare occurrence in the industry. The Topton N9 starts at $288.56 without a fan/cooler, and adding another $20 bumps the price to $308.46.

Cervoz brings its new storage solution to industrial applications with the launch of its new T425 Series M.2 NVMe SSDs-M.2 2230 (B+M) and M.2 2242 (B+M). Available in the compact 2230 and 2242 form factors, these PCIe Gen3x2 SSDs pack impressive performance into small footprints. Engineered for reliability and efficiency, the T425 Series provides industrial-grade solutions for embedded systems and space-constrained applications.

Space-Saving Form Factors for Seamless Integration
The tiny size of the T425 Series SSDs enables easy integration into small, fanless devices where internal space is limited. From in-vehicle systems and handheld scanners to medical equipment and industrial PCs, these SSDs allow seamless upgrades without compromising capacity or performance.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today introduced the new generation FerriSSD NVMe PCIe Gen 4 x4 BGA SSD. This latest solution features support for i-temp and integrates advanced IntelligentSeries technology, delivering robust data integrity in extreme temperature environments that meet the rigorous demands of industrial embedded systems and automotive applications.

The latest FerriSSD BGA SSD supports PCIe Gen 4 x4 and uses high density 3D NAND within a compact 16 mm x 20 mm BGA chip-scale package. With storage capacities up to 1 TB, these high-performance embedded SSDs utilize Silicon Motion's latest innovations to achieve high sequential read speeds exceeding 6 GB/s and sequential write speeds exceeding 4 GB/s. Equipped with Silicon Motion's proprietary IntelligentSeries data protection technology that enhances reliability and performance through the use of encryption, data caching, data scanning and protect features, as well as supporting the i-temp requirements of operating in extreme temperatures from -40°C to + 85°C. This latest FerriSSD offers a high performance and highly reliable embedded storage solution for a broad range of applications and operating environments including in-car computing, thin client computing, point-of-sale terminals, multifunction printers, telecommunications equipment, factory automation tools, and a wide range of server applications.

Other World Computing, the leading provider of computer hardware, accessories, and software that bring artistic expression and the digital world together for creative professionals and consumers of technology, today unveiled SoftRAID 8, a groundbreaking new software release that redefines RAID management for Mac and Windows environments.

Quickly accessing data with the right safeguards is a difficult balance. Whether it is enhancing multimedia production workflows, protecting critical business files, or ensuring uninterrupted access to valuable data, OWC's SoftRAID is the ideal solution to manage RAID arrays. SoftRAID implements the latest performance technology unleashing remarkable speeds on a RAID system. Simply connect the drive array, format the preferred RAID level, and experience the breakneck speeds first-hand. RAID management has never been this powerful and easy to use.

Thermaltake USA, the leading PC Case, Cooling, Power, and memory solutions, proudly announces the launch of twelve innovative models in the LCGS (Liquid Cooled Gaming System) Reactor series, available exclusively at Best Buy. This launch marks a significant milestone for Thermaltake, introducing the next generation of gaming PCs, meticulously designed with the newly unveiled The Tower 300 Micro Tower Chassis. These gaming powerhouses are equipped with the latest high-performance components, including the cutting-edge Intel Core 14th Gen i9/i7 processors, NVIDIA GeForce RTX 40 Super Series/4090 graphics cards, 32 GB of DDR5 5600 MT/s memory, and expansive 2 TB NVMe M.2 SSD storage.

Each system in the LCGS Reactor series boasts a 360 mm radiator liquid cooling solution, ensuring exceptional cooling performance and stability during intense gaming sessions. The addition of vibrant color options such as Snow, Black, Hydrangea Blue, and Turquoise adds a personalized touch to these systems, catering to gamers' and content creators' diverse tastes and styles. Tailored for the most demanding gamers and creative professionals, these pre-built gaming desktop PCs are assembled and rigorously tested by Thermaltake's skilled engineers in the USA, ensuring unparalleled build quality and reliability.

MemVerge, a leader in AI-first Big Memory Software, has joined forces with Micron to unveil a groundbreaking solution that leverages intelligent tiering of CXL memory, boosting the performance of large language models (LLMs) by offloading from GPU HBM to CXL memory. This innovative collaboration is being showcased in Micron booth #1030 at GTC, where attendees can witness firsthand the transformative impact of tiered memory on AI workloads.

Charles Fan, CEO and Co-founder of MemVerge, emphasized the critical importance of overcoming the bottleneck of HBM capacity. "Scaling LLM performance cost-effectively means keeping the GPUs fed with data," stated Fan. "Our demo at GTC demonstrates that pools of tiered memory not only drive performance higher but also maximize the utilization of precious GPU resources."