A high-stakes trial between technology giants Arm and Qualcomm has revealed deeper tensions in the semiconductor industry, as Arm seeks the destruction of chip designs from Qualcomm's $1.4 billion Nuvia acquisition. The case, being heard in Delaware federal court, centers on a licensing dispute that could impact the future of AI-powered Windows PCs. Arm CEO Rene Haas took the stand Monday, adding allegations that Qualcomm violated licensing agreements following its 2021 acquisition of chip startup Nuvia. The issue is whether Qualcomm should pay Nuvia's higher royalty rates for using Arm's intellectual property rather than its own lower rates. Internal documents revealed Nuvia's rates were "many multiples" higher than Qualcomm's, with the acquisition potentially reducing Arm's revenue by $50 million.

During cross-examination, Qualcomm's legal team challenged Arm's motives, suggesting the dispute is part of a broader strategy to confront a customer increasingly viewed as a competitor. When presented with documents outlining potential plans for Arm to design its own chips, Haas downplayed these ambitions, emphasizing that Arm has never entered chip manufacturing. Allegedly, Arm sent letters to Qualcomm's customers, including Samsung, warning about possible disruption if Nuvia's IP design before acquisition in 2021 must be destroyed. Haas defended these communications, citing frequent inquiries from industry partners.

According to Bloomberg, Arm Holding PLC, the holding company behind the Arm instruction set and Arm chip designs, just issued a 60-day notice period of license retirement to Qualcomm, its long-time partner. The UK-based ISA provider has notified Qualcomm that it will cancel the Arm ISA architectural license agreement after the contract-mandated 60-day notice. The issues between the two arose in 2022, just a year after Qualcomm acquired Nuvia and its IP. Arm filed a lawsuit claiming that the reason was "Qualcomm attempted to transfer Nuvia licenses without Arm's consent, which is a standard restriction under Arm's license agreements." To transfer Nuvia core licensing, Qualcomm would need to ask Arm first and create a new licensing deal.

The licensing reworking came just in time when Qualcomm experienced its biggest expansion. The new Snapdragon 8 Elite is being used in the mobile sector, the Snapdragon X Elite/Plus is being used in Copilot+ PCs, and the automotive sector is also getting the new Snapdragon Cockpit/Ride Elite chipsets. Most of that is centered around Nuvia Oryon core IP, a high-performance, low-power design. Arm's representatives declined to comment on this move for Bloomberg, while a Qualcomm spokesman noted that the British company was trying to "strong-arm a longtime partner."

Qualcomm debuted its Snapdragon X Elite/Plus series of laptop processors a few months ago, and the company is already testing the next-generation Snapdragon X2 series. Interestingly, the new "SC8480XP" SoC is carrying a codename "project Glymur." Up until now, Qualcomm has exclusively used codenames of places in Hawaii. However, with the Snapdragon X2 series, it shifts to Iceland, with the highest waterfall name being used for this next-generation processor. While we have almost zero clue about core counts and clocks, we know that the CPU cores will be an iteration of Nuvia's Oryon design, likely being pre-designed before the acquisition of the Nuvia design team.

According to Winfuture, Qualcomm started testing the next-generation SC8480XP SoC in July and August, testing various RAM and storage configurations. The company will likely evaluate the best configurations for the upcoming platform, tune the RAM speed with the SoC, and decide on guidelines for storage configurations. We are still waiting to see meaningful hints about the next-generation platform, and we are especially curious about the clocks and core counts that Qualcomm is preparing.

A Qualcomm Snapdragon X Elite "X1E80100" processor model was leaked in late February—it is likely that several SKUs have been distributed for evaluation purposes. Geekbench Browser is normally a good source of pre-release information—a benched Lenovo "83ED" laptop was spotted last week. That entry outed a "Snapdragon X Elite-X1E78100" processor, sporting twelve cores with maximum frequencies of 3.42 GHz. The latest exposures arrive courtesy of a Baidu forum post. Qualcomm has publicly revealed its "X Elite" range of Nuvia-designed Oryon core CPUs, but insiders have uncovered an additional "X Plus" family—probably a series of less expensive/lower spec alternatives.

The leaked list of SKUs does not include any detailed information—it reconfirms the existence of Qualcomm's top-tier X1E80100 and X1E78100 models and the presence of Adreno iGPUs. Driver information points to Qualcomm's next-gen integrated graphics solutions being readied for modern APIs: DX11, DX12, and OpenGL. The firm's ARM-based mobile PC CPUs are expected to launch within a mid-2024 period, according to the company's official statements—insiders believe that the NPU-enhanced Snapdragon X processors are destined to debut within next-gen "Windows 12" AI-centric notebooks.

Qualcomm and its smartphone manufacturer partners are reported to be in a rush to get the Snapdragon 8 Gen 4 chipset released later this year—Digital Chat Station believes that a pioneering mobile device could enter a mass production phase around September of this year. Prototype devices are allegedly up and running—the tipster's insider sources have alluded to engineering samples being capable of reaching 4.0 GHz clocks on a high-powered Big Core (Nuvia's Oryon or Phoenix). Qualcomm's Snapdragon 8 Gen 3 SoC was revealed last October, and working hardware is slowly trickling out via retail avenues in early 2024—Digital Chat Station does not provide any reasoning behind the race to get the successor across the finish line within the same year.

An unnamed smartphone manufacturer is said to have outfitted a "dual-curved screen" model with a Snapdragon 8 Gen 4 chipset—Wccftech's report suggests that Xiaomi usually gets first dibs on cutting edge Qualcomm processor tech. The Nuvia engineering team has likely got their custom Oryon cores running to more than satisfactory levels—the article points out that: "a previous Geekbench 6 single-core and multi-core leak revealed that the (3 nm) Snapdragon 8 Gen 4 competes with Apple's M3 and is 46 percent faster than the Snapdragon 8 Gen 3 in multi-threaded workloads." Qualcomm is facing fierce flagship chip competition in 2024—MediaTek's Dimensity 9400 SoC could arrive at a cheaper price point, while offering comparable performance and efficiency.

Digital Chat Station has seemingly received insider information regarding the performance of Qualcomm's Snapdragon 8 Gen 4 mobile chipset—their source reports that a probable engineering sample is already exceeding its predecessor's Big core (Cortex-X4) maximum limit of 3.3 GHz. The rumor mill has Nuvia's custom Oryon cores linked to the next generation mobile processor, although some experts think that the Phoenix design was selected for Gen 4. Qualcomm's Snapdragon X Elite notebook SoC was unveiled last October—this ARM-based solution is set to deliver "a dramatic leap in innovation for computing" thanks to Nuvia's custom Oryon technology. Kedar Kondap, Senior Vice President & General Manager of Compute & Gaming stated that the Snapdragon X Elite offers: "super-charged performance that will delight consumers with incredible power efficiency and take their creativity and productivity to the next level."

Digital Chat Station's brief assessment of the prototype Snapdragon 8 Gen 4's Big core prowess is also glowing: "4.0 GHz is no longer a dream" on smartphones. Past reports have Qualcomm signed up with TSMC for an unspecified 3 nm production process—next generation silicon will benefit greatly in terms of power efficiency, with custom Oryon or Phoenix cores (allegedly) achieving greater clock speeds thanks to some extra headroom. As mentioned above, the previous-gen Kryo Prime core—using TSMC's advanced 4 nm node—is factory restricted to 3.3 GHz. Tipsters reckon that efficiency cores are not part of the Snapdragon 8 Gen 4 design, due to the innate benefits of 3 nm—according to Digital Chat Station, MediaTek is taking similar steps with its upcoming Dimensity 9400 SoC.

Thanks to the information from Windows Report, we have received numerous details regarding Qualcomm's upcoming Snapdragon Elite X chip for laptops. The Snapdragon Elite X SoC is built on top of Nuvia-derived Oryon cores, which Qualcomm put 12 off in the SoC. While we don't know their base frequencies, the all-core boost reaches 3.8 GHz. The SoC can reach up to 4.3 GHz on single and dual-core boosting. However, the slide notes that this is all pure "big" core configuration of the SoC, so no big.LITTLE design is done. The GPU part of Snapdragon Elite X is still based on Qualcomm's Adreno IP; however, the performance figures are up significantly to reach 4.6 TeraFLOPS of supposedly FP32 single-precision power. Accompanying the CPU and GPU, there are dedicated AI and image processing accelerators, like Hexagon Neural Processing Unit (NPU), which can process 45 trillion operations per second (TOPS). For the camera, the Spectra Image Sensor Processor (ISP) is there to support up to 4K HDR video capture on a dual 36 MP or a single 64 MP camera setup.

The SoC supports LPDDR5X memory running at 8533 MT/s and a maximum capacity of 64 GB. Apparently, the memory controller is an 8-channel one with a 16-bit width and a maximum bandwidth of 136 GB/s. Snapdragon Elite X has PCIe 4.0 and supports UFS 4.0 for outside connection. All of this is packed on a die manufactured by TSMC on a 4 nm node. In addition to marketing excellent performance compared to x86 solutions, Qualcomm also advertises the SoC as power efficient. The slide notes that it uses 1/3 of the power at the same peak PC performance of x86 offerings. It is also interesting to note that the package will support WiFi7 and Bluetooth 5.4. Officially coming in 2024, the Snapdragon Elite X will have to compete with Intel's Meteor Lake and/or Arrow Lake, in addition to AMD Strix Point.

Qualcomm is poised to significantly rebrand its PC chip lineup as it transitions from the existing 8cx series to the Snapdragon X Series, designed to differentiate its PC chips from Snapdragon processors in mobile devices. The new Snapdragon X Series will incorporate Qualcomm's Oryon CPU SKU, based on Nuvia's IP and praised for its advanced performance and power efficiency. In addition to the new CPU core, Qualcomm also plans to use a dedicated NPU for accelerating on-device AI applications. However, questions remain regarding the reactions of hardware partners, particularly in response to Qualcomm's request for proprietary power management integrated circuits (PMICs) to be used alongside Oryon SoCs.

This strategic rebranding also entails new logos and badges for the system, symbolizing the shift in the product lineup, and the company plans to introduce a simplified tiering structure for its PC ecosystem. Qualcomm currently holds a dominant position as an Arm-based SoC manufacturer for Windows-on-Arm devices. With this rebranding, Qualcomm hopes to position itself competitively in performance and in marketing as well, with established PC chip providers like AMD and Intel, potentially expanding Arm's market share in the PC industry. Further insights and details regarding the Snapdragon X Series will be revealed during the forthcoming Snapdragon Summit, scheduled from October 24 to 26.

According to SemiAccurate, Qualcomm is currently navigating through many challenges with its Oryon SoC for laptops. The current problem is that Qualcomm is insisting on integrating its own PMICs (Power Management Integrated Circuits), which are inherently designed for cell phones, causing significant compatibility and efficiency issues. This approach is reported to have led to escalated costs and disagreements with OEMs (Original Equipment Manufacturers), seemingly hindering Qualcomm's foothold in the laptop sector. These PMICs are highlighted as unsuitable and highly priced, requiring the adoption of high-density interconnect (HDI) PCBs engineered explicitly for cell phones, thus not designed to meet the current requirements of laptops optimally. The subsequent spike in production costs has ignited conflicts with OEMs, with several contemplating withdrawing from the project.

In response to the rising tensions, Qualcomm is allegedly providing financial compensation to the OEMs, potentially leading to selling SoCs at cost. The only good thing is the reported success of Nuvia-based Oryon SoC. The silicon is perfect at A0 stepping, and performance is reportedly good. However, power usage and efficiency are still in question. Forcing OEMs to use proprietary PMICs will likely have far-reaching impacts on Qualcomm's market strategies and relationships with OEMs. With disputes like this, we expect that Qualcomm-powered laptops are nearing availability, and we could see them in the coming months.

It appears it's not only AMD that is eyeing a move to Samsung, when it comes to fabricating upcoming chips, as reports are now suggesting that Qualcomm is considering a second attempt at making flagship mobile SoCs at Samsung's foundry. However, in this case, we're talking 3 nm chips in the shape of the Snapdragon 8 Gen 4, which is expected to launch in devices sometime in 2024. This is said to be Qualcomm's first chip based on cores built by Nuvia, a company that Qualcomm acquired in 2021.

That said, Qualcomm will apparently not rely on Samsung alone, but will also be making the Snapdragon 8 Gen 4 at TSMC. This might be because of past experience with Samsung, but the report out of Taiwan, suggests that the chips made by Samsung's foundry business will be used in Samsung branded phones, whereas the TSMC made chips might end up in devices by Qualcomm's other customers. It could also be a bet for Qualcomm to try and get better pricing by both foundries or a means of hedging their bets, to see which foundry produces the better chips. Then there's the situation between the PRC and the ROC, which could potentially put Qualcomm in a situation where it has no chips, so going with Samsung could be a means of covering for all potential risk scenarios.

A technology tipster has been dropping multiple tidbits this week about Qualcomm's upcoming Snapdragon 8 Gen 3 mobile chipset - this follows a leak (from a different source, going back to mid-April) about the next generation Adreno 750 GPU getting tuned up for a battle against Apple's Bionic A17 in terms of graphics benchmarks. The latest leak points to the GPU being clocked at 900 MHz, rather than the rumored higher figure of 1.0 GHz speed (garnered from tests at Qualcomm's labs). The focus has now turned to the next generation flagship Snapdragon's CPU aspect, with information emerging about core clock speeds and multiple cluster configurations.

Revegnus suggests that the Snapdragon 8 Gen 3 (SD8G3) chipset will be packing a large primary core in the shape of Arm's Cortex-X4 CPU with a reported maximum clock speed of 3.40 GHz. Leaks from the past have posited that the SD8G3 would feature a fairly standard 1x Large + 5x Big + 2x Small CPU core layout (with clocks predicted to be: large Cortex X4 at 3.2 GHz, big Cortex-A720 at 3.0 GHz, and small Cortex-A520 at 2.0 GHz). An insider source has provided Revegnus with additional information about two different CPU core configurations - 1+5+2 and 2+4+2 - it is theorized that smartphone manufacturers will be offered the latter layout as an exclusive option for special edition flagship phones. The more powerful 2+4+2 variant is said to sacrifice a big core (A720) in favor of a dual Cortex X4 headliner, although the resultant thermal output of twin large cores could prove to be problematic.

Benchmark results for Qualcomm's Snapdragon 8cx Gen 4 SoC appeared on Geekbench Browser early yesterday morning, under the designation Snapdragon 8cx Next Gen. This chipset is tipped to be a successor to the Snapdragon 8cx Gen 3, which was launched at the end of 2021 as the world's first 5 nm Arm-based SoC for Windows laptops. A tipster on Twitter has highlighted the very underwhelming results posted by the next gen chipset, and these figures would indicate that an engineering sample was the test subject, not final silicon. The 8-core Snapdragon 8cx Gen 3 is shown to outperform its supposed successor, and the clock frequencies for the latter appear to be lower than anticipated.

The Geekbench 5 database entry for Snapdragon 8cx Gen 4 also reveals details about its specifications - a 12-core configuration that is split into eight performance cores and four power-efficiency ones. The base core frequency is listed as being 2.38 GHz, and the benchmark was completed under a Balanced Power plan in Windows 11 Home Insider Preview. 16 GB of RAM was used in the test kit, although earlier leaks have indicated that the chipset can support up to a maximum of 64 GB LPDDR5 RAM.

Qualcomm has been working on its Snapdragon SoCs for quite some time now, with massive success in the mobile phone space. However, the company's processors needed to be up to the task regarding laptops. For a user to not look at x86 offerings, the only remaining performant alternatives are Apple's M processors. In 2021 Qualcomm purchased the Nuvia team that was developing massively efficient and high-performance IP for laptops, similar to Apple M processors. Today, according to the insights from Kuba Wojciechowski (@Za_Raczke) on Twitter, we have some potential information about the upcoming Nuvia-powered SoC codenamed Hamoa.

According to the Twitter thread, Qualcomm's Hamoa processors are part of the Snapdragon 8xc Gen 4 compute platform and feature up to eight high-performance P-cores and four low-power E-cores, all based on Nuvia's IP. Allegedly the P-cores are being tested at 3.4 GHz, while the E-cores are tested at 2.5 GHz. The SoC splits CPU cores into blocks, each being a four-core group with 12 MB of shared L2 cache. There is also an 8 MB L3 cache structure; it needs to be clarified whether it is per core block or for the entire SoC. The chip employs 12 MB of system-level cache, with 4 MB of memory for graphics-related tasks handled by iGPU. The iGPU of choice is Adreno 740, with all modern APIs supported. Discrete graphics solutions are supported by the top-end SKUs, which allow eight PCIe 4.0 lanes to be directed toward dGPU, along with an additional four PCIe 4.0 lanes for NVMe SSD. For RAM, the chip uses up to 64 GBs of LPDDR5X eight-channel memory with up to 4.2 GHz speeds. Chip's media engines are structured to support decoding up to 4K120 and encode up to 4K60 with AV1.

The world of semiconductor IP licensing is complex by nature. If you use a company's IP, you must agree to its licensing terms. Today, it is precisely those terms that are being breached in the event of Arm Ltd. filing a lawsuit against one of its biggest customers, Qualcomm. When Qualcomm acquired Nuvia Inc., regarded as one of the best CPU design teams in the industry, it transferred Arm-Nuvia license agreements as its own. It continued the development of Arm IP under Qualcomm's name. This is a standard restriction, as Arm's licensing prohibits these sorts of IP transfers among companies to protect the IP.

As the UK-headquartered company reports: "Because Qualcomm attempted to transfer Nuvia licenses without Arm's consent, which is a standard restriction under Arm's license agreements, Nuvia's licenses terminated in March 2022. Before and after that date, Arm made multiple good faith efforts to seek a resolution. In contrast, Qualcomm has breached the terms of the Arm license agreement by continuing development under the terminated licenses. Arm was left with no choice other than to bring this claim against Qualcomm and Nuvia to protect our IP, our business, and to ensure customers are able to access valid Arm-based products."

Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., has completed its acquisition of the world-class CPU and technology design company, NUVIA for $1.4 billion before working capital and other adjustments.

"The world-class NUVIA team enhances our CPU roadmap, extending Qualcomm's leading technology position with the Windows, Android and Chrome ecosystems," said Cristiano Amon, President and CEO-Elect, Qualcomm Incorporated. "The broad support of this acquisition from across industries validates the opportunity we have to provide differentiated products with leading CPU performance and power efficiency, as on-demand computing increases in the 5G era."

Qualcomm Incorporated today announced that its subsidiary, Qualcomm Technologies, Inc., has entered into a definitive agreement to acquire NUVIA for approximately $1.4 billion before working capital and other adjustments. The transaction is subject to customary closing conditions, including regulatory approval under the Hart-Scott-Rodino Antitrust Improvements Act of 1976, as amended.

5G is further accelerating the convergence of mobility and computing. The acquisition of NUVIA builds on Qualcomm Technologies' Snapdragon technology leadership, delivering step-function improvements in CPU performance and power efficiency to meet the demands of next-generation 5G computing. NUVIA comprises a proven world-class CPU and technology design team, with industry-leading expertise in high performance processors, Systems on a Chip (SoC) and power management for compute-intensive devices and applications. The addition of NUVIA CPUs to Qualcomm Technologies' already leading mobile graphics processing unit (GPU), AI engine, DSP and dedicated multimedia accelerators will further extend the leadership of Qualcomm Snapdragon platforms, and positions Snapdragon as the preferred platform for the future of connected computing.

NUVIA, a leading-edge silicon design company, today announced the close of its Series B funding round, raising $240M. The funding round was led by Mithril Capital in partnership with Sehat Sutardja and Weili Dai (founders of Marvell Technology Group), funds and accounts managed by BlackRock, Fidelity Management & Research Company LLC., and Temasek, with additional participation from Atlantic Bridge, Redline Capital, Capricorn Investment Group, Dell Technologies Capital, Mayfield, Nepenthe LLC and WRVI Capital. The closure of NUVIA's Series B round builds on a $53M Series A round, raised in November 2019. NUVIA was founded in February 2019 by John Bruno, Manu Gulati and Gerard Williams, with the vision to create the world's leading server processor.

Last year, in November of 2019, a startup company called NUVIA Inc. broke out of the stealth mode and decided to reveal itself to the public. Focused on "re-imagining silicon", the company is led by some of the brightest minds in the semiconductor industry. Some people like Gerard Williams III, the CEO of the company, previously served as a chief CPU architect at Apple and has spent over 10 years at Arm before that. Others like Manu Gulati and John Bruno serve as senior vice presidents of silicon and system engineering respectively. Together, their people are forming a company full of well-known industry names. Of course, there are more and you should check out this page.

NUVIA Inc. promises to deliver only the best performance and "re-imagine silicon" as they say. Today, we got some bold claims from the company regarding the performance of their upcoming Phoenix SoC. Using Geekbench 5, the company has provided some simulated results of how the Phoenix SoC will perform. Being that it runs on Arm ISA, the SoC can run at very low power and achieve good performance. NUVIA has run some simulations and it expects its Phoenix SoC to be 40-50% faster in single-threaded performance than Zen 2/Sunny Cove at just a third of the power, 33% of the percent of power to be precise. In the graph below, NUVIA has placed its SoC only in 5 W range, however, the company said that they have left the upper curve to be disclosed at later date, meaning that the SoC will likely compete in high-performance markets and at higher power targets. While these claims are to be taken with a grain of salt, it is now a waiting game to see how NUVIA realizes its plans.