Intel today announced the new Intel Xeon W-3400 and Intel Xeon W-2400 desktop workstation processors (code-named Sapphire Rapids), led by the Intel Xeon w9-3495X, Intel's most powerful desktop workstation processor ever designed. Built for professional creators, these new Xeon processors provide massive performance for media and entertainment, engineering and data science professionals. With a breakthrough new compute architecture, faster cores and new embedded multi-die interconnect bridge (EMIB) packaging, the Xeon W-3400 and Xeon W-2400 series of processors enable unprecedented scalability for increased performance.

"For more than 20 years, Intel has been committed to delivering the highest quality workstation platforms - combining high-performance compute and rock-solid stability - for professional PC users across the globe. Our new Intel Xeon desktop workstation platform is uniquely designed to unleash the innovation and creativity of professional creators, artists, engineers, designers, data scientists and power users - built to tackle both today's most demanding workloads as well as the professional workloads of the future." -Roger Chandler, Intel vice president and general manager, Creator and Workstation Solutions, Client Computing Group

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the availability of its new 6400 MT/s DDR5 Registering Clock Driver (RCD) and sampling to the major DDR5 memory module (RDIMM) manufacturers. With a 33% increase in data rate and bandwidth over Gen 1 4800 MT/s solutions, the Rambus Gen 3 6400 MT/s DDR5 RCD enables a new level of main memory performance for data center servers. Delivering industry-leading latency and power, it offers optimized timing parameters for improved RDIMM margins.

"Data center workloads have an insatiable thirst for greater memory bandwidth and capacity, and our mission is to advance the performance of server memory solutions that meet this need for each new server platform generation," said Sean Fan, chief operating officer at Rambus. "We were first in the industry to 5600 MT/s, and now we have raised the bar with our Gen 3 DDR5 RCD capable of 6400 MT/s to support a new generation of RDIMMs for server main memory."

Tachyum today announced that the IP components -DDR5 RAM controller and high-performance, low-power DSP-based PHY - incorporated into the Prodigy Universal Processor have allowed it to achieve speeds of 6400 MT/s at nominal voltage for Prodigy chip which provides headroom for expected speeds of up to, or even over, 7200 MT/s.

The critical components supplied by a global leader in high-speed DDR DRAM controllers and DDR DRAM PHYs for the world's technology infrastructure, have enabled Tachyum engineers to integrate its IP into Prodigy less than 7 months after entering into a technology partnership. The quality of this IP and the support provided by working closely with Tachyum engineers have allowed the company to close DDR5 timings in record time.

DFI, the global leading provider of high-performance computing technology across multiple embedded industries, unveils a server-grade ATX motherboard, designed for Intel Ice Lake platform, powered by the 3rd Generation Intel Xeon Scalable processors, and equipped with ultra-high speed computing that can support up to 205 W. ICX610-C621A also comes with built-in Intel Speed Select Technology (Intel SST), which provides an excellent load balancing between CPUs and multiple accelerator cards to effectively distribute CPU resource, stabilize computation loads and maximize computing power. As a result, it improves the performance by 1.46 times compared to previous generation.

Featuring powerful performance, the offers three PCIe x 16, two PCIe x8 slots and one M.2 Key and enables ultra-performance computing, AI workload and deep learning, specifically for high-end inspection equipment, such as AOI, CT, and MRI application. The ICX610 also supports ECC RDIMM up to 512 GB 3200 MHz enhances high end performance for advanced inspection equipment and improves efficiency.

DFI, the global leading provider of high-performance computing technology across multiple embedded industries, unveils a server-grade ATX motherboard, designed for Intel Ice Lake platform, powered by the 3rd Generation Intel Xeon Scalable processors, and equipped with ultra-high speed computing that can support up to 205 W. ICX610-C621A also comes with built-in Intel Speed Select Technology (Intel SST), which provides an excellent load balancing between CPUs and multiple accelerator cards to effectively distribute CPU resource, stabilize computation loads and maximize computing power. As a result, it improves the performance by 1.46 times compared to previous generation.

Featuring powerful performance, the offers three PCIe x16, two PCIe x8 slots and one M.2 Key and enables ultra-performance computing, AI workload and deep learning, specifically for high-end inspection equipment, such as AOI, CT, and MRI application. The ICX610 also supports ECC RDIMM up to 512 GB 3200 MHz, enhances high end performance for advanced inspection equipment and improves efficiency.

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the expansion of its DDR5 memory interface chip portfolio with the addition of the Rambus SPD (Serial Presence Detect) Hub and Temperature Sensor, complementing the industry-leading Rambus Registering Clock Driver (RCD). DDR5 achieves greater memory bandwidth and capacity by employing a new module architecture with an expanded chipset. The SPD Hub and Temperature Sensors improve DDR5 Dual Inline Memory Module (DIMM) system management and thermal control to deliver higher performance within the desired power envelope for servers, desktops and laptops.

"The new performance levels of DDR5 memory place an increased premium on signal integrity and thermal management for server and client DIMMs," said Sean Fan, chief operating officer at Rambus. "With over 30 years of memory subsystem design experience, Rambus is ideally positioned to deliver DDR5 chipset solutions which enable breakthrough bandwidth and capacity for advanced computing systems."

Axiomtek - a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency - is pleased to announce the IMB760, a server-grade extended ATX motherboard (330 mm x 305 mm) powered by the dual LGA4189 socket 3rd Gen Intel Xeon scalable processors (code name: Ice Lake-SP) with the Intel C627A chipset. It comes with an effective load balancing between two CPUs and multiple accelerator cards to stabilize computation loads and maximize computing power. Featuring optimized performance, more PCI Express Card slots, and high-density memory expansion, this EATX server motherboard enables high level computing, AI workload and deep learning for the data-fueled future.

"Performance, security, and flexibility are indispensable for AI in next-gen computing. As the first and flagship EATX motherboard of Axiomtek, the IMB760 features built-in AI and crypto acceleration functions as well as advanced security capabilities to meet the specific needs of automated manufacturing, robotics, image or video analytics, and other AIoT applications. This server-grade motherboard has sixteen DDR4-3200 RDIMM sockets with a memory capacity of up to 1 TB. Ready for the demands of massive data storage and high-speed data transmission, the industrial motherboard supports two NVMe SSD, one IPMI LAN, and two 10GbE LAN ports. Rich expansions with enough PCIe x16 slots and PCIe x8 slots for GPU acceleration, making IM760 a perfect solution for computationally intensive imaging, intelligent video analytics, and heavy workload processing," said Wayne Chung, the product manager of AIoT Team at Axiomtek.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives, and hybrid storage products, announces its new SMART Kestral PCIe Optane Memory Add-in-Card (AIC), which is able to add up to 2 TB of Optane Memory expansion on a PCIe-Gen4-x16 or PCIe-Gen3-x16 interface independent of the motherboard CPU. SMART's Kestral AICs accelerate selected algorithms by offloading software-defined storage functions from the host CPU to the Intel FPGA on the AIC. SMART's Kestral memory AICs are ideal for hyperscale, data center, and other similar environments that run large memory applications, and would benefit from memory acceleration or system acceleration through computational storage.

"With the advancement of new interconnect standards such as CXL and OpenCAPI, SMART's new family of SMART Kestral AICs addresses the industry's need for a variety of new memory module form factors and interfaces for memory expansion and acceleration," stated Mike Rubino, SMART Modular's vice president of engineering. "SMART is able to leverage our many years of experience in developing and productizing controller-based memory solutions to meet today's emerging and continually evolving memory add-on needs of server and storage system customers."

SMART Modular Technologies, Inc., a division of SGH and a global leader in memory solutions, solid-state drives, and hybrid storage products announces its new DDR5 32 GB Very Low Profile Registered Dual In-Line Memory Module (VLP RDIMM). SMART's new DuraMemory DDR5 32 GB VLP RDIMM is the industry's first DDR5 VLP RDIMM form factor.

The 32 GB VLP RDIMM addresses applications with space constraints, such as embedded 1U blade compute and storage, enterprise networking, telecom, and industrial single-board computers (SBCs). The space savings also equates to improved heat dissipation and energy savings, reducing business costs. The DDR5 32 GB VLP RDIMM is the newest addition to SMART's broad portfolio of VLP and ULP (Ultra Low Profile) modules that are suitable for all types of dense computing, storage, networking and telecom applications. For ruggedized and harsh operating conditions, SMART also offers retention clips to secure the socket latches in place, and industrial grade temperature operation of -40°C to +85°C.

At this year's Hot chips 33 conference, Samsung has presented its works on the upcoming DDR5 memory standard. The company has managed to achieve a lot of new developments, as the newer standard pairs with new technologies to deliver higher speeds and better capacity. The Korean company designed its DDR5 modules as 8-high (8H) stacked TSV (through silicon via) dies. In the previous DDR4 implementations, Samsung used 4-high (4H) stacked TSV dies, which are actually thicker than the latest 8-high implementations. To achieve the new thin design, Samsung has used thin wafer handling techniques, which resulted in a 40% reduction in gab between stacked dies. The new 8H DDR5 modules are only 1.0 mm thick, compared to the 1.2 mm of the older 4H modules.

When it comes to performance, Samsung expects the new DDR5 modules to deliver big. Running at 7.2 Gbps speeds, the Samsung-made RDIMM/LRDIMM modules can reach up to 512 GB in capacity. This is, of course, limited to the server/enterprise market. Regular consumers/PC users can expect to have UDIMMs with up to 64 GB of capacity. The aforementioned 7.2 Gbps speed is achieved at the specified 1.1 Volts of power, meaning that Samsung's implementation is very efficient. According to some estimations made by the company, the DDR5 crossover for the mainstream market is not expected before 2023/2024, meaning that there is still a lot of time for memory makers to refine their DDR5 products.

While the server industry transitions to the latest generation of processors based on the x86 platform, the Intel Ice Lake and AMD Milan CPUs entered mass production earlier this year and were shipped to certain customers, such as North American CSPs and telecommunication companies, at a low volume in 1Q21, according to TrendForce's latest investigations. These processors are expected to begin seeing widespread adoption in the server market in 3Q21. TrendForce believes that Ice Lake represents a step-up in computing performance from the previous generation due to its higher scalability and support for more memory channels. On the other hand, the new normal that emerged in the post-pandemic era is expected to drive clients in the server sector to partially migrate to the Ice Lake platform, whose share in the server market is expected to surpass 30% in 4Q21.

Today, AMD (NASDAQ: AMD) announced the full portfolio of AMD Ryzen 5000 Series Mobile Processors, bringing the highly-efficient and extremely powerful "Zen 3" core architecture to the laptop market. New AMD Ryzen 5000 Series Mobile Processors provide unprecedented levels of performance and incredible battery life for gamers, creators, and professionals. New laptops powered by Ryzen 5000 Series Mobile processors will be available from major PC manufacturers including ASUS, HP and Lenovo, starting in Q1 2021. Expanding its leadership client computing product portfolio featuring the "Zen 3" core, AMD also announced the AMD Ryzen PRO 5000 Series Mobile Processors, delivering enterprise-grade security and seamless manageability to commercial users. Throughout the course of 2021, AMD expects a broad portfolio of more than 150 consumer and commercial notebooks based on the Ryzen 5000 Series Mobile Processors.

"As the PC becomes an even more essential part of how we work, play and connect, users demand more performance, security and connectivity," said Saeid Moshkelani, senior vice president and general manager, Client business unit, AMD. "The new AMD Ryzen 5000 Series Desktop and Mobile Processors bring the best innovation AMD has to offer to consumers and professionals as we continue our commitment to delivering best-in-class experiences with instant responsiveness, incredible battery life and fantastic designs. With our PC partners, we are delivering top-quality performance and no-compromise solutions alongside our record-breaking growth in the notebook and desktop space in the previous year."

Micron Technology, Inc., today announced a comprehensive enablement program which will provide early access to technical resources, products and ecosystem partners. The Technology Enablement Program will aid in the design, development and qualification of next-generation computing platforms that use DDR5, the most technologically advanced DRAM available.

Today's news builds on Micron's January announcement of DDR5 RDIMM samples and brings the industry one step closer to unlocking the value in next-generation, data-centric applications. Companies joining Micron in the DDR5 Technology Enablement Program include Cadence, Montage, Rambus, Renesas and Synopsys.

Today, AMD announced the new AMD Ryzen Threadripper PRO Processor line-up, with up to 64 cores and unrivaled bandwidth built with enterprise-grade AMD PRO technologies. Designed for professional workstations from OEMs and system integrators, AMD Ryzen Threadripper PRO Processors uniquely offer full spectrum compute capabilities with unmatched core counts for multi-threaded workloads plus high frequency single core performance for lightly threaded workloads. This combination makes AMD Ryzen Threadripper PRO Processors the best choice for artists, architects, engineers and data scientists.

"AMD Ryzen Threadripper PRO Processors are purpose-built to set the new industry standard for professional workstation compute performance," said Saeid Moshkelani, senior vice president and general manager, AMD Client business unit. "The extreme performance, high core counts and bandwidth of AMD Ryzen Threadripper Processors are now available with AMD PRO technology features including seamless manageability and unique built-in data protection. Even the most demanding professional environment is addressed with the new AMD Ryzen Threadripper PRO line-up, from artists and creators developing breathtaking visual effects, to architects and engineers working with large datasets and complex visualizations, all brought to life on the most advanced professional workstation platform in the world.

Videocardz seems to have snagged some official AMD slides detailing their upcoming Threadripper PRO lineup. AMD is tiering its Threadripper CPU offerings between the Threadripper and Threadripper PRO via added functionality that AMD considers is better suited to the prospective buyers of a PRO-branded Threadripper: professional studios, designers, engineers and data scientists. AMD's positioning for these creatives or scientists is to offer a much improved platform throughput compared to Threadripper: the PRO version supports up to 128 PCIe 4.0 lanes (64 in non-PRO); up to 2 TB of ECC memory support (either in UDIMM (Unbuffered DIMM), RDIMM (Registered DIMM), LRDIMM (Load-Reduced DIMM) and 3DS (three-dimensional stacking) RDIMM vi an 8-channel configuration (4-channel in non-PRO); as well as professional-oriented tools and features such as Pro Security, Pro manageability, and PRO business ready support.

Four different CPUs will reportedly be offered in the Threadripper PRO lineup: the 64-core 3995WX is a relatively known quantity by now; likewise, the 3975WX will mirror consumer parts core counts (32 cores), both with reduced clocks by 100-200 MHz compared to their non-PRO counterparts. AMD seems to also be launching 12 and 16-core PRO Threadrippers in the form of the 3955WX (16-core) and 3945WX (12-core), both with boost clocks being set to 4.3 GHz.

Micron has today announced that it started sampling RDIMMs based on DDR5 technology to its industry partners. Designed for server operations, these DDR5 modules come in RDIMM form-factor and feature Error-Correcting Code (ECC) technology for removing any error that occurs inside electronic circuits. The new DDR5 standard offers a massive performance uplift compared to the previous generation of DDR4 memory. For starters, DDR5 will double the MT/s transfer rate to 6400 MT/s, double the speed of the original 3200 MT/s speed for DDR4 that was established by JEDEC. The bandwidth of the new DDR memory is supposed to be 32 GB/s, which is 25% faster than the original 25.6 GB/s bandwidth of DDR4.

With DDR5, the SDRAM prefetch buffer data size is being doubled to 16 data words per memory access, making for a 16n prefetching throughput. Another improvement is that the highest possible density for DDR5 chips is now being up to 64 Gb per chip. Additionally, DDR5 is supposed to bring the power needed for chip operation down to 1.1 volts, which is around 8% lower than what DDR4 achieved. There are also features like MIR (Mirror Pin) which provides better DIMM signaling, and more options for PRECHARGE and REFRESH commands that can now operate on a per bank basis, so specific banks can be refreshed in bank group. It is also worth pointing out that DDR5 chips are manufactured using 1znm memory manufacturing process.

Samsung Electronics, Ltd., has taken its leadership position in the memory market a step further today by announcing support of the Samsung PM1733 PCIe Gen4 Solid State Drive (SSD) and high density RDIMM and LRDIMM dynamic random access memory (DRAM) for the AMD EPYC 7002 Generation Processors. AMD launched the 2nd Gen AMD EPYC processor in San Francisco yesterday.

"AMD has listened to the needs of its customers in developing the 2nd Gen AMD EPYC processors and has worked closely with us to integrate the best of our cutting-edge memory and storage products," said Jinman Han, senior VP of Memory Product Planning, Samsung Electronics. "With these new datacenter processors, AMD is providing customers with a processor that enables a new standard for the modern datacenter."

Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced its 32GB, 16GB and 8GB Server Premier DDR4-2933 Registered DIMMs have received validation on the Intel Purley Platform, featuring the Intel Xeon Scalable processor family (formerly known as "Cascade Lake-SP"). A link to the validation page can be found here.

Kingston's Purley-validated Server Premier modules are specifically engineered to unleash the power of Intel's six-channel server microarchitecture. At 2933MT/s - the next-generation memory frequency supported in the latest Intel Xeon Scalable processor family - each DIMM provides peak bandwidth of 23.46 GB/s. When grouped for multi-channel performance, this provides a significant boost in performance for today's memory intensive server applications.

ASUS announced the Gaming Station GS50, which its product managers refer to as a "gaming station," so someone at big oil can blow steam off on Battlefield after a long day's work exploring shale (at least that's a use-case we can imagine). The GS50 is powered by an Intel Xeon W-2155 processor, which is a 10-core/20-thread chip clocked at 3.30 GHz to 4.50 GHz (turbo), packing 13.75 MB of L3 cache. This processor is essentially a Core i9-7900X with Xeon-exclusive features such as up to 512 GB ECC memory support, MPX, TXT, Boot Guard, etc. ASUS is offering RDIMM memory options all the way up to 512 GB.

Adding to its "gaming" credentials is NVIDIA GeForce RTX 2080 graphics. Quadro RTX series is not even provided as an option. For storage, you get a 512 GB M.2-2280 SATA 6 Gbps SSD, and a 3 TB HDD for recovery and cold storage. Among the storage expansion options are additional M.2-NVMe slots, five more SATA ports, and a U.2 port. Networking includes two 1 GbE interfaces pulled by two Intel "server class" Ethernet controllers. A 700W 80 Plus Gold-certified PSU powers the machine. ASUS didn't reveal pricing.

QNAP Systems, Inc. introduces the brand-new TS-2888X AI-Ready NAS, an all-in-one AI solution combining robust storage and a ready-to-use software environment that simplifies AI workflows with high cost-efficiency. Built using next-gen Intel Xeon W processors with up to 18 cores and employing a hybrid storage architecture with eight hard drives and twenty high-performance SSDs (including 4 U.2 SSDs), the TS-2888X also supports installing up to 4 high-end graphics cards and runs QNAP's AI developer package "QuAI". The TS-2888X packs everything required for machine learning AI to help organizations quickly and easily implement AI applications.

"Compared with typical AI workstations, the TS-2888X combines high-performance computing with huge-capacity storage to greatly reduce latency, accelerate data transfer, and to eliminate performance bottlenecks caused by network connectivity," said David Tsao, Product Manager of QNAP, adding "integrating AI-focused hardware and software reduces the time and complexity for implementing and managing AI tasks, making the TS-2888X the ideal AI solution for most organizations."

Crucial , a leading global brand of memory and storage upgrades, today announced the immediate availability of DDR4 2933 MT/s Registered DIMM server modules, a new offering in its server memory product portfolio. Designed to keep servers running at full speed and peak efficiency in support of Intel's next-generation Xeon processor product families, the new RDIMM modules enable IT users to get the most out of their server infrastructure deployments.

"Our new DDR4 2933 MT/s RDIMMs are designed to deliver the speed required to maximise the memory throughput in the next generation of servers," says Teresa Kelley, VP & GM, Micron Consumer Products Group. "Today's data centres are running memory intensive applications that require a higher degree of overall system performance, and our new RDIMM modules were designed to meet this next level of system performance."

Samsung Electronics, announced today that it is the first in the industry to begin volume production of modules containing a 16 gigabit (Gb) monolithic 64 gigabyte (GB) DDR4 memory solution. The new registered dual in-line memory module (RDIMM), which is designed primarily for use in enterprise and cloud server applications, will be shown at the HPE Discover Las Vegas conference and exhibition June 19-21 at the Venetian-Palazzo Resort Center in Booth #170.

"Large data centers are increasingly embracing Big Data, high-speed mobility, IoT, deep learning, AI and cloud-native technologies, with Samsung and other leaders like HPE and AMD delivering integrated solutions that are faster, denser, more scalable, and more power-conserving," said Sewon Chun, senior vice president of memory marketing at Samsung Electronics. "At Samsung, we are taking the industry to new horizons with our 16Gb, 64GB RDIMMs and other leading-edge memory and storage solutions in helping to fully enable the real-time needs of leading enterprise OEMs (original equipment manufacturers) worldwide," he added.

In a response to AMD's current uptake in the consumer, HEDT and server markets with its vertical slice of the Zen architecture, Intel has started rebranding their products and image, changing product names and placement in a bid to increase the "freshness" factor of its offerings. E5 and E7 Xeons are gone, with the introduction of a metallic naming scheme: Bronze, Silver, Gold and Platinum are now Intel's Xeon products, and Xeon-W takes the spot as Intel's workstation-oriented product stack. They do this by being - essentially - a conversion of Intel's Core i9 X299 family of processors towards the professional market with inclusion of professional-geared features. And as is usual with Intel, a new chipset - C422 - is needed in order for these to properly function.

The new Xeon-W product family will still make use of the LGA 2066 socket, bringing with them ECC and vPro support. The Xeon-W CPU family will feature 4 to 18 cores, support up to 512GB of ECC RDIMM/LRDIMM memory, support dual 512-bit FMAs, and peak clocks of 4 GHz base and 4.5 GHz Turbo. All the parts will support 48 PCIe 3.0 lanes from the processor,and CPUs in the Xeon-W stack are rated at 140W TDP: with exception of the quad cores, which come in at at 120W. Xeon-W processors only support Turbo Boost 2.0, instead of their Core i9 counterparts' Turbo 3.0.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced its 32GB, 16GB and 8GB Server Premier DDR4-2666 Registered DIMMs have received validation on the Intel Purley Platform, featuring the Intel Xeon Scalable processor family (formerly known as "Skylake-SP"). A link to the validation page can be found here. This validation also marks the launch of Kingston's new Server Premier product line, which is focused on the latest server architectures making their debut in 2017. Kingston's new Server Premier builds on a legacy of class-leading server memory quality that target system builders, SMB and data centres with a fully locked build solution for guaranteed consistency.

Kingston's Purley-validated Server Premier modules are specifically engineered to unleash the power of Intel's new six-channel server microarchitecture, without memory frequency clock down restrictions experienced in previous platforms. At 2666MT/s - the next-generation performance frequency for DDR4 memory - each DIMM provides peak bandwidth of 21.3GB/s. When grouped for multi-channel performance, this provides a significant boost in performance for today's memory intensive server applications.

Innodisk, the service driven flash and DRAM provider, introduces the new DDR4 2666 memory modules designed for server applications on the upcoming Purley platform that Intel intends to release in 2017. The DDR4 2666 RDIMM is equipped with a Samsung chip which is designed with a new system circuit architecture to deliver even higher performance with lower power consumption.

"For years, Innodisk has been dedicated to developing and manufacturing industrial grade memory modules, and we have never stopped introducing industry leading products," said Samson Chang, Vice President of Embedded DRAM Business Unit of Innodisk. "We are proud to introduce the industry's first DDR4 RDIMM with an initial speed 2666 MT/s. It will optimize the Purley platform and maximize its performance. Innodisk will continue to develop more advanced product specifications in the future, allowing us to have the most complete product line amongst our competitors. Our goal is to support our customers various needs and lead the industrial systems upgrade."