In a response to AMD's current uptake in the consumer, HEDT and server markets with its vertical slice of the Zen architecture, Intel has started rebranding their products and image, changing product names and placement in a bid to increase the "freshness" factor of its offerings. E5 and E7 Xeons are gone, with the introduction of a metallic naming scheme: Bronze, Silver, Gold and Platinum are now Intel's Xeon products, and Xeon-W takes the spot as Intel's workstation-oriented product stack. They do this by being - essentially - a conversion of Intel's Core i9 X299 family of processors towards the professional market with inclusion of professional-geared features. And as is usual with Intel, a new chipset - C422 - is needed in order for these to properly function.

The new Xeon-W product family will still make use of the LGA 2066 socket, bringing with them ECC and vPro support. The Xeon-W CPU family will feature 4 to 18 cores, support up to 512GB of ECC RDIMM/LRDIMM memory, support dual 512-bit FMAs, and peak clocks of 4 GHz base and 4.5 GHz Turbo. All the parts will support 48 PCIe 3.0 lanes from the processor,and CPUs in the Xeon-W stack are rated at 140W TDP: with exception of the quad cores, which come in at at 120W. Xeon-W processors only support Turbo Boost 2.0, instead of their Core i9 counterparts' Turbo 3.0.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced its 32GB, 16GB and 8GB Server Premier DDR4-2666 Registered DIMMs have received validation on the Intel Purley Platform, featuring the Intel Xeon Scalable processor family (formerly known as "Skylake-SP"). A link to the validation page can be found here. This validation also marks the launch of Kingston's new Server Premier product line, which is focused on the latest server architectures making their debut in 2017. Kingston's new Server Premier builds on a legacy of class-leading server memory quality that target system builders, SMB and data centres with a fully locked build solution for guaranteed consistency.

Kingston's Purley-validated Server Premier modules are specifically engineered to unleash the power of Intel's new six-channel server microarchitecture, without memory frequency clock down restrictions experienced in previous platforms. At 2666MT/s - the next-generation performance frequency for DDR4 memory - each DIMM provides peak bandwidth of 21.3GB/s. When grouped for multi-channel performance, this provides a significant boost in performance for today's memory intensive server applications.

Innodisk, the service driven flash and DRAM provider, introduces the new DDR4 2666 memory modules designed for server applications on the upcoming Purley platform that Intel intends to release in 2017. The DDR4 2666 RDIMM is equipped with a Samsung chip which is designed with a new system circuit architecture to deliver even higher performance with lower power consumption.

"For years, Innodisk has been dedicated to developing and manufacturing industrial grade memory modules, and we have never stopped introducing industry leading products," said Samson Chang, Vice President of Embedded DRAM Business Unit of Innodisk. "We are proud to introduce the industry's first DDR4 RDIMM with an initial speed 2666 MT/s. It will optimize the Purley platform and maximize its performance. Innodisk will continue to develop more advanced product specifications in the future, allowing us to have the most complete product line amongst our competitors. Our goal is to support our customers various needs and lead the industrial systems upgrade."

MSI, industry leading motherboard brand, is proud to announce its latest addition to its X99 portfolio, the X99A WORKSTATION. Dedicated towards users demanding perfect stability & performance for optimal productivity while in search of a wide variety in connectivity & storage options, the new X99A WORKSTATION is sure to impress. Built from the ground up using Military Class 5 components, the X99A WORKSTATION is optimized to use ECC Registered DIMM (RDIMM) memory while benefiting from enhanced performance & stability through the presence of DDR4 Boost. The X99A WORKSTATION supports the latest Intel processors out of the box, both Broadwell-E and XEON based models. The X99A WORKSTATION motherboard is the perfect multi-tasking powerhouse to cater even the most demanding professional.

To be qualified as a true workstation motherboard, optimal & stable data handling needs to be guaranteed, no matter what. By using industries' highest quality components combined with an unmatched R&D design and extreme QA testing, the X99A WORKSTATION motherboard PCB design has been optimized to do just that. To protect the PCB and its components, besides looking cool an IO & audio cover ensures worry free use. The data and audio signals are also shielded against EMI. Heavy plated heatsinks, with a touch of grey, green and white, are used to ensure perfect operation at even the most extreme conditions. To transfer countless data, a wide variety of storage connecters such as U.2 , M.2 and SATA ports are demanded by most workstation users. The X99A WORKSTATION allows any of the latest and greatest HDD, SSD or other storage devices to be connected.

QNAP Systems, Inc. today announced the official release of the Enterprise ZFS NAS ES1640dc - a whole-new product line for mission-critical tasks and intensive virtualization applications. Representing a milestone for QNAP's step into the enterprise storage market, the ES1640dc delivers business-class cloud computing data storage with Intel Xeon E5 processors, dual active controllers, and full support for virtualization environments. The ES1640dc runs the new FreeBSD-based QES operating system that assists businesses in building the most cost-efficient VDI platform and storage for critical data with near-limitless snapshots, block-level data deduplication, and thin provisioning with reclaim.

The ES1640dc is powered by Intel Xeon E5-2420 v2 processors with 32GB RAM and features dual active-active controllers, providing businesses with near-zero downtime high availability. Other features include battery-protected DRAM write cache, dual 10GbE ports, optional 40GbE NIC, redundant power supplies, and a field-replaceable design for easier maintenance. The new FreeBSD-based QES operating system also provides advanced features including flexible storage pools, simplified management, high-performance SSD cache, near-limitless snapshots, SnapSync, block-based data deduplication, in-line compression and thin provisioning with reclaim for optimized utilization in virtual machine storage.

Crucial, a leading global brand of memory and storage upgrades, today announced the availability of Nonvolatile DIMM (NVDIMM) server memory to help companies protect data in the event of a system power loss. Historically, companies have used uninterruptible power supplies, solid state drives (SSDs), mechanical hard drives (HDDs) or other devices to ensure the security of critical data. While this method of preserving critical data has been effective, the backup and restore times have been very long due to the latency and write times of the SSD and HDD. Today's applications such as relational databases, scale-out storage, data analytics, and in-memory databases require much faster backup and restore times.

Crucial NVDIMM server memory combines DRAM and NAND onto a single module, providing the performance of DRAM with the persistence of NAND. In the event of a power loss, the NVDIMM will back up all DRAM data to the NAND while utilising a backup power source, known as an ultracapacitor. The DRAM on the NVDIMM ensures critical data can be operated on from a low-latency memory space without the risk of losing it. The NAND on the module ensures that the contents of the DRAM are not lost during a power failure, making the DRAM persistent. When power is restored to the system, the data in the NAND is restored on the DRAM.

Crucial, a leading global brand of memory and storage upgrades, today announced the availability of two new offerings in its server memory product portfolio: 32 GB DDR4 VLP RDIMMs and 64 GB DDR4 LRDIMMs. With speeds of 2400 MT/s and engineered to enable higher densities by implementing a dual stack of 8 Gb DDR4 DRAM die to engineer a single 16 Gb component, these new DDR4 server memory modules allow for increased memory density, performance and bandwidth.

The 32 GB VLP RDIMMs are the highest density server memory modules Crucial offers for that module form factor, and are almost half the height (40 percent shorter) of a standard RDIMM module. These high density modules help enable memory dense systems like blade servers and microservers without compromising performance. Additionally, they can be installed at a 90-degree angle to the motherboard in these height-constrained systems, which enables better airflow to keep the system cool..

QNAP Systems, Inc. today announced the release of the powerful Double Server TDS-16489U that integrates an application server and storage server into one chassis. Distinguishably powered by dual Intel Xeon E5 processors with up to 1TB RAM, the server-grade TDS-16489U supports Qtier Technology, 12Gb/s SAS and 10GbE/40GbE networks to provide unrivaled performance for Big Data computing and to assist enterprises in mission-critical tasks as a one-device solution for applications, storage and virtualization.

"The TDS-16489U resolves the difficulty of building virtualization environment infrastructures for businesses," said David Tsao, Product Manager of QNAP. "Its unrivaled power from its dual processors also facilitates Big Data computing to process the data deluge created by Internet of Things applications." With its server-grade hardware design, the TDS-16489U features two Intel Xeon E5-2600 v3 processors (with 4-core, 6-core and 8-core configurations), up to 1TB DDR4 2133MHz RDIMM/LRDIMM RAM (16 DIMM) and three independent SAS 12Gb/s controllers that deliver outstanding performance for data transmission and applications.

Crucial, a leading global brand of memory and storage upgrades, today announced the availability of Crucial DDR4 2400MT/s 8Gb-based RDIMM, LRDIMM and ECC UDIMM server modules. Engineered to enable higher density modules, 8Gb-based DDR4 enables increased performance, bandwidth and energy efficiency. The modules are available for immediate purchase through select global channel partners and at www.crucial.com.

Higher-density, 8Gb-based modules allow for greater channel bandwidth and channel density and are also up to 20 percent more energy efficient than 4Gb-based modules. Ultimately, these benefits provide more value per gigabit than current 4Gb-based offerings, making it easy to scale up server deployments in the future. Designed for Intel's next generation processor product families, Crucial's 8Gb-based server memory is extensively tested to mission-critical standards and is backed by a limited lifetime warranty.

Samsung Electronics Co., Ltd., announced today that it is mass producing the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules, for enterprise servers and data centers. Following Samsung's introduction of the world-first 3D TSV DDR4 DRAM (64GB) in 2014, the company's new TSV registered dual inline memory module (RDIMM) marks another breakthrough that opens the door for ultra-high capacity memory at the enterprise level. Samsung's new TSV DRAM module boasts the largest capacity and the highest energy efficiency of any DRAM modules today, while operating at high speed and demonstrating excellent reliability.

"We are pleased that volume production of our high speed, low-power 128GB TSV DRAM module will enable our global IT customers and partners to launch a new generation of enterprise solutions with dramatically improved efficiency and scalability for their investment," said Joo Sun Choi, executive vice president, Memory Sales and Marketing, Samsung Electronics. "We will continue to expand our technical cooperation with global leaders in servers, consumer electronics and emerging markets, where consumers can benefit from innovative technology that enhances their productivity and the overall user experience."

Crucial, a leading global brand of memory and storage upgrades, is now sampling Crucial DDR4 2400MT/s 8Gb-based RDIMM, LRDIMM, and ECC UDIMM server modules through its Technology Enablement Program. Engineered to enable higher density modules, 8Gb-based DDR4 memory allows for increased performance, bandwidth, and energy efficiency.

Higher density modules, when combined with the next DDR4 speed increase of 2400MT/s, create greater channel bandwidth and channel density, as well as increased energy efficiency. Ultimately, these benefits provide more value per gigabit than current 4Gb-based offerings. Taken together, the increase in density, bandwidth, and value deliver a lower total cost of ownership for users.

Transcend Information, Inc. (Transcend), a leading manufacturer of industrial-grade products, is proud to announce the launch of the DDR4 memory module series. The series includes DDR4 2133 MHz UDIMMs, RDIMMs, ECC-DIMMs and ECC SO-DIMMs, which are fully compatible with the latest Intel Xeon E5-2600 v3 server family processor, Haswell-E CPU with X99 chipset and micro servers. Transcend's DDR4 series boasts superior performance, 1.2V ultra-low power consumption, and increased reliability. All these features make it perfect for cloud computing, virtualization, and high-performance computing technologies.

Transcend's DDR4 memory modules are constructed with top-quality DRAM chips that deliver stable performance and durability. With advanced DDR4 technologies, Transcend's DDR4 memory modules utilize higher density components, allowing capacity options ranging from 4GB to 32GB. Offering high speed transmission of 2133MHz and up to 17GB/s of memory bandwidth, Transcend's DDR4 DIMMs comprehensively promote the system performance.

Transcend Information, Inc. (Transcend ), a leading manufacturer of industrial-grade products, is proud to announce the launch of three new DDR4 server-grade memory modules: 8GB and 16GB DDR4 2133MHz Registered DIMMs (RDIMMs), and 16GB DDR4 Very Low Profile (VLP) RDIMMs. Fully compatible with the latest Intel Xeon E5-2600 v3 server family processor, Transcend's DDR4 series features high capacities, superior performance, 1.2V ultra-low power consumption, and increased reliability; perfect for cloud computing, virtualization, and high-performance computing technologies.

Transcend's server-grade DDR4 RDIMMs and VLP RDIMMs are constructed with top-quality DRAM chips that deliver stable performance and durability. With advanced DDR4 technologies, Transcend's DDR4 memory modules utilize higher density components, allowing capacity options of 8GB and 16GB. Offering high speed transmission of 2133MHz and up to 17GB/s of memory bandwidth, Transcend's DDR4 RDIMMs comprehensively promote the system performance.

SMART Modular Technologies, Inc., a global leader in specialty memory solutions, today announced that it has expanded its lineup of Enterprise Memory products to include DDR4 modules. SMART has attained an exceptional reliability level of sub-two hundred DPPM with its DDR3 RDIMM Enterprise Memory and is achieving similar levels with DDR4 during its internal development process for these enterprise grade modules.

This superior DPPM rate is accomplished utilizing a SMART proprietary Ultra-Reliability Test (URT) burn-in process. Early life failures and weak modules are eliminated through SMART's URT lab where every enterprise grade module undergoes a rigorous triple-stress process entailing hours of burn-in at high speed operation while running custom software at 99% DRAM utilization.

Virtium, the embedded industry's trusted supplier of highly reliable infrastructure SSDs and industrial memory modules, today expanded its embedded infrastructure market support with two new DDR4 VLP UDIMM and VLP RDIMM memory module form factors.

Virtium was one of the first to offer DDR4 memory modules, and the company's latest modules give embedded-industrial OEMs increased performance, lower power and higher bandwidth advantages thanks to the latest evolution in DRAM technology. Offering power savings of up to 40% and as much as twice the bandwidth compared to previous-generation DDR3 modules, Virtium's DDR4 modules are ideal solutions for server blades, networking and telecom applications.

Crucial, a leading global brand of memory and storage upgrades, has expanded its DDR4 memory portfolio with LRDIMM and VLP RDIMM modules. Designed to enable next-generation enterprise environments with increased speed, bandwidth, and energy efficiency, Crucial DDR4 load reduced DIMMs (LRDIMMs) and very low profile registered DIMMS (VLP RDIMMs) are available for immediate purchase through select global channel partners.

By utilising a memory buffer chip that helps reduce the electrical load presented to the memory bus, Crucial DDR4 LRDIMMs allow for more DIMMs per channel and are up to 50 percent more energy efficient and deliver up to 50 percent more memory bandwidth than DDR3 LRDIMMs. Furthermore, by using less voltage and standby current, Crucial DDR4 LRDIMMs transmit power in a more efficient manner to the CPU, allowing for additional power savings and lower total cost of ownership.

Samsung Electronics, Ltd. announced today that it has started mass producing the industry's first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) "through silicon via" (TSV) package technology. The new high-density, high-performance module will play a key role in supporting the continued proliferation of enterprise servers and cloud-based applications, as well as further diversification of data center solutions.

The new RDIMMs include 36 DDR4 DRAM chips, each of which consists of four 4-gigabit (Gb) DDR4 DRAM dies. The low-power chips are manufactured using Samsung's most advanced 20-nanometer (nm) class* process technology and 3D TSV package technology.

Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, today announced the introduction of a monolithic 8 Gb DDR3 SDRAM component, enhancing its leadership position as a diverse memory solutions provider for enterprise applications such as data analytics. This new design is based on Micron's latest-generation 25 nm DRAM manufacturing process.

DDR3 is the mainstream DRAM technology for the enterprise market, and the addition of an 8 Gb monolithic component will enable cost-effective, high-capacity solutions optimized to support large-scale, data-intensive workloads.

Virtium, a leading provider of embedded SSD and industrial memory modules, today announced its embedded infrastructure market support for DDR4, and the company's initial DDR4 RDIMM products. As one of the first to offer DDR4 memory modules, Virtium's embedded industrial OEM customers are able to have early test and development access to the lower power, high bandwidth and density benefits of this latest DRAM technology. Delivering significant power savings of up to 40% and up to twice the bandwidth over DDR3, the new DDR4 modules from Virtium are excellent solutions for server blades, networking and telecom applications.

Virtium is a proven innovator of VLP (Very Low Profile - 0.72-inch or 0.738-inch) and ULP (Ultra Low Profile - 0.70-inch) memory modules for space-constrained applications. Continuing Virtium's exclusive support for the embedded infrastructure market, these first DDR4 modules are offered in the lower profile ULP RDIMM height in capacities ranging from 4 to 16 gigabytes (GB). The new DDR4 modules feature low 1.2 V configurations with data transfer speeds of 1866 MT/s.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, said today that it is accelerating its production ramp up of DDR4 memory modules to accommodate an anticipated strong market demand along with the approaching introduction of the new Intel Xeon processor E5-2600 v3 product family. DDR4 is the most advanced memory for server and high-performance computing applications.

"At Samsung, we are taking the lead in readying the DDR4 market to coincide with the introduction of the next-generation Intel Xeon processor E5-2600 v3 product family, and plan to contribute to creating a bigger market for DRAM in the second half of 2014," said Jim Elliott, corporate vice president, Memory Marketing, Samsung Semiconductor, Inc. "We will continue to introduce high-density DDR4 modules for global OEMs that will facilitate the launch of next-generation enterprise servers and will maximize IT investment efficiency."

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, has announced the launch of new DDR4 modules. Working in close cooperation with Intel, ADATA has successfully developed and launched DDR4 RDIMM (ECC Registered DIMM) that are fully compatible with the newly announced, next generation platform of Intel Xeon processor E5-2600 v3 product family.

Coming in densities of 4, 8 & 16 gigabytes, the new modules run at 1.2 volts, and at a frequency of 2133 MHz. The higher clock frequencies, faster data transfer rates, and low voltage operation of DDR4 memory make it especially suited for use in the growing cloud server, storage and networking application fields.

Transcend Information, Inc., a worldwide leader in storage and multimedia products, is proud to announce its launch of 16 GB and 32 GB DDR3 Registered DIMM (RDIMM) modules aimed at maximizing memory in Apple Mac Pro 2013 systems. With four user-upgradeable memory slots available, Transcend's latest high-performance DDR3 RDIMMs can boost Mac Pro 2013 Intel Xeon E5 3.5 GHz 6-Core, 3.0 GHz 8-Core, and 2.7 GHz 12-Core models to 64 GB, 96 GB, and even 128 GB total memory capacity.

"The new Mac Pro 2013 is advertised to support up to 64 GB of memory, and we understand that pro users running applications that place high demands on RAM have a need to meet and most likely exceed this threshold," said Angus Wu, Director of Research and Development at Transcend. "For this reason, we have developed and fully tested higher density modules to give users the option of raising their Mac Pro system memory to the advertised 64 GB right up to 128 GB."

Innodisk is proud to be among the first to supply (DDR4) registered DIMM product samples to key server companies for their next-generation systems. With this announcement, Innodisk, an industry leader in DRAM modules for industrial applications and embedded systems, will continue to offer the most advanced technology to its customers. The result of almost eight years of development, DDR4 (Double Data Rate 4) technology improves on the previous generation, DDR3, in every way. These new memory products provide users with greater performance, but can still cut costs by saving power and space, and reducing waste heat.

DDR4 offers a giant leap in peak performance over DDR3 technology, with a 3.2 Gbps data transfer rate. In fact, DDR4 could eventually even surpass this already high rate, according to standards organization JEDEC, in the same way that DDR3 surpassed its initial ceiling of 1.6 Gbps. DDR4 memory bus speeds start at 2133MHz, which already offers a huge jump in potential performance from the average bus speed of 1333MHz and 1666MHz offered by DDR3.

SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, today announced the addition of a 24GB CoolFlex RDIMM to its product lineup. The 24GB DDR3-1333 1.35V RDIMM helps solve unique memory capacity constraints in servers. SMART's CoolFlex module product family uses state-of-the-art flexible substrate technology to increase system memory capacity.

Servers configured with two processors and sixteen registered DIMMs are generally limited to a maximum memory capacity of 256GB. When using 16GB DDR3-1333 RDIMMs these systems can be fully populated. However, when switching to 32GB four-rank RDIMMs, the maximum number of DIMMs per Channel (DPC) drops down to one. A system configured with two channels per processor and four DIMMs per channel can only be populated with one 32GB RDIMM per channel for a total memory capacity of 128GB. SMART's new 24GB Coolflex RDIMM solves this constraint by allowing these systems to be fully populated with sixteen 24GB RDIMMs totaling 384GB and representing a 50% increase in memory capacity.

Transcend Information, Inc., a worldwide leader in storage and multimedia products, today announced the arrival of its 32GB DDR3 Load-Reduced DIMM (LRDIMM) memory module. An important component of today's powerful servers, LRDIMMs use a specially designed buffer to minimize the load on the server memory bus, allowing administrators to maximize memory capacity, increase performance, and reduce the power consumption of their systems.

In standard RDIMM technology, the data bus connects directly to the multiple ranks of DRAM chips on the module, which increases electrical load and limits system speed as more modules are added. In contrast, Transcend's DDR3 Low Voltage LRDIMMs feature a full memory buffer chip on the module, which acts as a go-between for all signals sent from the host to the DRAM chips, reducing the electrical load on all interfaces. Compared to standard RDIMMs or UDIMMs, a system using Transcend LRDIMMs can support more modules per channel and higher maximum memory capacity without sacrificing speed.