At this year's Hot chips 33 conference, Samsung has presented its works on the upcoming DDR5 memory standard. The company has managed to achieve a lot of new developments, as the newer standard pairs with new technologies to deliver higher speeds and better capacity. The Korean company designed its DDR5 modules as 8-high (8H) stacked TSV (through silicon via) dies. In the previous DDR4 implementations, Samsung used 4-high (4H) stacked TSV dies, which are actually thicker than the latest 8-high implementations. To achieve the new thin design, Samsung has used thin wafer handling techniques, which resulted in a 40% reduction in gab between stacked dies. The new 8H DDR5 modules are only 1.0 mm thick, compared to the 1.2 mm of the older 4H modules.

When it comes to performance, Samsung expects the new DDR5 modules to deliver big. Running at 7.2 Gbps speeds, the Samsung-made RDIMM/LRDIMM modules can reach up to 512 GB in capacity. This is, of course, limited to the server/enterprise market. Regular consumers/PC users can expect to have UDIMMs with up to 64 GB of capacity. The aforementioned 7.2 Gbps speed is achieved at the specified 1.1 Volts of power, meaning that Samsung's implementation is very efficient. According to some estimations made by the company, the DDR5 crossover for the mainstream market is not expected before 2023/2024, meaning that there is still a lot of time for memory makers to refine their DDR5 products.

While the server industry transitions to the latest generation of processors based on the x86 platform, the Intel Ice Lake and AMD Milan CPUs entered mass production earlier this year and were shipped to certain customers, such as North American CSPs and telecommunication companies, at a low volume in 1Q21, according to TrendForce's latest investigations. These processors are expected to begin seeing widespread adoption in the server market in 3Q21. TrendForce believes that Ice Lake represents a step-up in computing performance from the previous generation due to its higher scalability and support for more memory channels. On the other hand, the new normal that emerged in the post-pandemic era is expected to drive clients in the server sector to partially migrate to the Ice Lake platform, whose share in the server market is expected to surpass 30% in 4Q21.

Today, AMD (NASDAQ: AMD) announced the full portfolio of AMD Ryzen 5000 Series Mobile Processors, bringing the highly-efficient and extremely powerful "Zen 3" core architecture to the laptop market. New AMD Ryzen 5000 Series Mobile Processors provide unprecedented levels of performance and incredible battery life for gamers, creators, and professionals. New laptops powered by Ryzen 5000 Series Mobile processors will be available from major PC manufacturers including ASUS, HP and Lenovo, starting in Q1 2021. Expanding its leadership client computing product portfolio featuring the "Zen 3" core, AMD also announced the AMD Ryzen PRO 5000 Series Mobile Processors, delivering enterprise-grade security and seamless manageability to commercial users. Throughout the course of 2021, AMD expects a broad portfolio of more than 150 consumer and commercial notebooks based on the Ryzen 5000 Series Mobile Processors.

"As the PC becomes an even more essential part of how we work, play and connect, users demand more performance, security and connectivity," said Saeid Moshkelani, senior vice president and general manager, Client business unit, AMD. "The new AMD Ryzen 5000 Series Desktop and Mobile Processors bring the best innovation AMD has to offer to consumers and professionals as we continue our commitment to delivering best-in-class experiences with instant responsiveness, incredible battery life and fantastic designs. With our PC partners, we are delivering top-quality performance and no-compromise solutions alongside our record-breaking growth in the notebook and desktop space in the previous year."

Micron Technology, Inc., today announced a comprehensive enablement program which will provide early access to technical resources, products and ecosystem partners. The Technology Enablement Program will aid in the design, development and qualification of next-generation computing platforms that use DDR5, the most technologically advanced DRAM available.

Today's news builds on Micron's January announcement of DDR5 RDIMM samples and brings the industry one step closer to unlocking the value in next-generation, data-centric applications. Companies joining Micron in the DDR5 Technology Enablement Program include Cadence, Montage, Rambus, Renesas and Synopsys.

Today, AMD announced the new AMD Ryzen Threadripper PRO Processor line-up, with up to 64 cores and unrivaled bandwidth built with enterprise-grade AMD PRO technologies. Designed for professional workstations from OEMs and system integrators, AMD Ryzen Threadripper PRO Processors uniquely offer full spectrum compute capabilities with unmatched core counts for multi-threaded workloads plus high frequency single core performance for lightly threaded workloads. This combination makes AMD Ryzen Threadripper PRO Processors the best choice for artists, architects, engineers and data scientists.

"AMD Ryzen Threadripper PRO Processors are purpose-built to set the new industry standard for professional workstation compute performance," said Saeid Moshkelani, senior vice president and general manager, AMD Client business unit. "The extreme performance, high core counts and bandwidth of AMD Ryzen Threadripper Processors are now available with AMD PRO technology features including seamless manageability and unique built-in data protection. Even the most demanding professional environment is addressed with the new AMD Ryzen Threadripper PRO line-up, from artists and creators developing breathtaking visual effects, to architects and engineers working with large datasets and complex visualizations, all brought to life on the most advanced professional workstation platform in the world.

Videocardz seems to have snagged some official AMD slides detailing their upcoming Threadripper PRO lineup. AMD is tiering its Threadripper CPU offerings between the Threadripper and Threadripper PRO via added functionality that AMD considers is better suited to the prospective buyers of a PRO-branded Threadripper: professional studios, designers, engineers and data scientists. AMD's positioning for these creatives or scientists is to offer a much improved platform throughput compared to Threadripper: the PRO version supports up to 128 PCIe 4.0 lanes (64 in non-PRO); up to 2 TB of ECC memory support (either in UDIMM (Unbuffered DIMM), RDIMM (Registered DIMM), LRDIMM (Load-Reduced DIMM) and 3DS (three-dimensional stacking) RDIMM vi an 8-channel configuration (4-channel in non-PRO); as well as professional-oriented tools and features such as Pro Security, Pro manageability, and PRO business ready support.

Four different CPUs will reportedly be offered in the Threadripper PRO lineup: the 64-core 3995WX is a relatively known quantity by now; likewise, the 3975WX will mirror consumer parts core counts (32 cores), both with reduced clocks by 100-200 MHz compared to their non-PRO counterparts. AMD seems to also be launching 12 and 16-core PRO Threadrippers in the form of the 3955WX (16-core) and 3945WX (12-core), both with boost clocks being set to 4.3 GHz.

Micron has today announced that it started sampling RDIMMs based on DDR5 technology to its industry partners. Designed for server operations, these DDR5 modules come in RDIMM form-factor and feature Error-Correcting Code (ECC) technology for removing any error that occurs inside electronic circuits. The new DDR5 standard offers a massive performance uplift compared to the previous generation of DDR4 memory. For starters, DDR5 will double the MT/s transfer rate to 6400 MT/s, double the speed of the original 3200 MT/s speed for DDR4 that was established by JEDEC. The bandwidth of the new DDR memory is supposed to be 32 GB/s, which is 25% faster than the original 25.6 GB/s bandwidth of DDR4.

With DDR5, the SDRAM prefetch buffer data size is being doubled to 16 data words per memory access, making for a 16n prefetching throughput. Another improvement is that the highest possible density for DDR5 chips is now being up to 64 Gb per chip. Additionally, DDR5 is supposed to bring the power needed for chip operation down to 1.1 volts, which is around 8% lower than what DDR4 achieved. There are also features like MIR (Mirror Pin) which provides better DIMM signaling, and more options for PRECHARGE and REFRESH commands that can now operate on a per bank basis, so specific banks can be refreshed in bank group. It is also worth pointing out that DDR5 chips are manufactured using 1znm memory manufacturing process.

Samsung Electronics, Ltd., has taken its leadership position in the memory market a step further today by announcing support of the Samsung PM1733 PCIe Gen4 Solid State Drive (SSD) and high density RDIMM and LRDIMM dynamic random access memory (DRAM) for the AMD EPYC 7002 Generation Processors. AMD launched the 2nd Gen AMD EPYC processor in San Francisco yesterday.

"AMD has listened to the needs of its customers in developing the 2nd Gen AMD EPYC processors and has worked closely with us to integrate the best of our cutting-edge memory and storage products," said Jinman Han, senior VP of Memory Product Planning, Samsung Electronics. "With these new datacenter processors, AMD is providing customers with a processor that enables a new standard for the modern datacenter."

Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced its 32GB, 16GB and 8GB Server Premier DDR4-2933 Registered DIMMs have received validation on the Intel Purley Platform, featuring the Intel Xeon Scalable processor family (formerly known as "Cascade Lake-SP"). A link to the validation page can be found here.

Kingston's Purley-validated Server Premier modules are specifically engineered to unleash the power of Intel's six-channel server microarchitecture. At 2933MT/s - the next-generation memory frequency supported in the latest Intel Xeon Scalable processor family - each DIMM provides peak bandwidth of 23.46 GB/s. When grouped for multi-channel performance, this provides a significant boost in performance for today's memory intensive server applications.

ASUS announced the Gaming Station GS50, which its product managers refer to as a "gaming station," so someone at big oil can blow steam off on Battlefield after a long day's work exploring shale (at least that's a use-case we can imagine). The GS50 is powered by an Intel Xeon W-2155 processor, which is a 10-core/20-thread chip clocked at 3.30 GHz to 4.50 GHz (turbo), packing 13.75 MB of L3 cache. This processor is essentially a Core i9-7900X with Xeon-exclusive features such as up to 512 GB ECC memory support, MPX, TXT, Boot Guard, etc. ASUS is offering RDIMM memory options all the way up to 512 GB.

Adding to its "gaming" credentials is NVIDIA GeForce RTX 2080 graphics. Quadro RTX series is not even provided as an option. For storage, you get a 512 GB M.2-2280 SATA 6 Gbps SSD, and a 3 TB HDD for recovery and cold storage. Among the storage expansion options are additional M.2-NVMe slots, five more SATA ports, and a U.2 port. Networking includes two 1 GbE interfaces pulled by two Intel "server class" Ethernet controllers. A 700W 80 Plus Gold-certified PSU powers the machine. ASUS didn't reveal pricing.

QNAP Systems, Inc. introduces the brand-new TS-2888X AI-Ready NAS, an all-in-one AI solution combining robust storage and a ready-to-use software environment that simplifies AI workflows with high cost-efficiency. Built using next-gen Intel Xeon W processors with up to 18 cores and employing a hybrid storage architecture with eight hard drives and twenty high-performance SSDs (including 4 U.2 SSDs), the TS-2888X also supports installing up to 4 high-end graphics cards and runs QNAP's AI developer package "QuAI". The TS-2888X packs everything required for machine learning AI to help organizations quickly and easily implement AI applications.

"Compared with typical AI workstations, the TS-2888X combines high-performance computing with huge-capacity storage to greatly reduce latency, accelerate data transfer, and to eliminate performance bottlenecks caused by network connectivity," said David Tsao, Product Manager of QNAP, adding "integrating AI-focused hardware and software reduces the time and complexity for implementing and managing AI tasks, making the TS-2888X the ideal AI solution for most organizations."

Crucial , a leading global brand of memory and storage upgrades, today announced the immediate availability of DDR4 2933 MT/s Registered DIMM server modules, a new offering in its server memory product portfolio. Designed to keep servers running at full speed and peak efficiency in support of Intel's next-generation Xeon processor product families, the new RDIMM modules enable IT users to get the most out of their server infrastructure deployments.

"Our new DDR4 2933 MT/s RDIMMs are designed to deliver the speed required to maximise the memory throughput in the next generation of servers," says Teresa Kelley, VP & GM, Micron Consumer Products Group. "Today's data centres are running memory intensive applications that require a higher degree of overall system performance, and our new RDIMM modules were designed to meet this next level of system performance."

Samsung Electronics, announced today that it is the first in the industry to begin volume production of modules containing a 16 gigabit (Gb) monolithic 64 gigabyte (GB) DDR4 memory solution. The new registered dual in-line memory module (RDIMM), which is designed primarily for use in enterprise and cloud server applications, will be shown at the HPE Discover Las Vegas conference and exhibition June 19-21 at the Venetian-Palazzo Resort Center in Booth #170.

"Large data centers are increasingly embracing Big Data, high-speed mobility, IoT, deep learning, AI and cloud-native technologies, with Samsung and other leaders like HPE and AMD delivering integrated solutions that are faster, denser, more scalable, and more power-conserving," said Sewon Chun, senior vice president of memory marketing at Samsung Electronics. "At Samsung, we are taking the industry to new horizons with our 16Gb, 64GB RDIMMs and other leading-edge memory and storage solutions in helping to fully enable the real-time needs of leading enterprise OEMs (original equipment manufacturers) worldwide," he added.

In a response to AMD's current uptake in the consumer, HEDT and server markets with its vertical slice of the Zen architecture, Intel has started rebranding their products and image, changing product names and placement in a bid to increase the "freshness" factor of its offerings. E5 and E7 Xeons are gone, with the introduction of a metallic naming scheme: Bronze, Silver, Gold and Platinum are now Intel's Xeon products, and Xeon-W takes the spot as Intel's workstation-oriented product stack. They do this by being - essentially - a conversion of Intel's Core i9 X299 family of processors towards the professional market with inclusion of professional-geared features. And as is usual with Intel, a new chipset - C422 - is needed in order for these to properly function.

The new Xeon-W product family will still make use of the LGA 2066 socket, bringing with them ECC and vPro support. The Xeon-W CPU family will feature 4 to 18 cores, support up to 512GB of ECC RDIMM/LRDIMM memory, support dual 512-bit FMAs, and peak clocks of 4 GHz base and 4.5 GHz Turbo. All the parts will support 48 PCIe 3.0 lanes from the processor,and CPUs in the Xeon-W stack are rated at 140W TDP: with exception of the quad cores, which come in at at 120W. Xeon-W processors only support Turbo Boost 2.0, instead of their Core i9 counterparts' Turbo 3.0.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced its 32GB, 16GB and 8GB Server Premier DDR4-2666 Registered DIMMs have received validation on the Intel Purley Platform, featuring the Intel Xeon Scalable processor family (formerly known as "Skylake-SP"). A link to the validation page can be found here. This validation also marks the launch of Kingston's new Server Premier product line, which is focused on the latest server architectures making their debut in 2017. Kingston's new Server Premier builds on a legacy of class-leading server memory quality that target system builders, SMB and data centres with a fully locked build solution for guaranteed consistency.

Kingston's Purley-validated Server Premier modules are specifically engineered to unleash the power of Intel's new six-channel server microarchitecture, without memory frequency clock down restrictions experienced in previous platforms. At 2666MT/s - the next-generation performance frequency for DDR4 memory - each DIMM provides peak bandwidth of 21.3GB/s. When grouped for multi-channel performance, this provides a significant boost in performance for today's memory intensive server applications.

Innodisk, the service driven flash and DRAM provider, introduces the new DDR4 2666 memory modules designed for server applications on the upcoming Purley platform that Intel intends to release in 2017. The DDR4 2666 RDIMM is equipped with a Samsung chip which is designed with a new system circuit architecture to deliver even higher performance with lower power consumption.

"For years, Innodisk has been dedicated to developing and manufacturing industrial grade memory modules, and we have never stopped introducing industry leading products," said Samson Chang, Vice President of Embedded DRAM Business Unit of Innodisk. "We are proud to introduce the industry's first DDR4 RDIMM with an initial speed 2666 MT/s. It will optimize the Purley platform and maximize its performance. Innodisk will continue to develop more advanced product specifications in the future, allowing us to have the most complete product line amongst our competitors. Our goal is to support our customers various needs and lead the industrial systems upgrade."

MSI, industry leading motherboard brand, is proud to announce its latest addition to its X99 portfolio, the X99A WORKSTATION. Dedicated towards users demanding perfect stability & performance for optimal productivity while in search of a wide variety in connectivity & storage options, the new X99A WORKSTATION is sure to impress. Built from the ground up using Military Class 5 components, the X99A WORKSTATION is optimized to use ECC Registered DIMM (RDIMM) memory while benefiting from enhanced performance & stability through the presence of DDR4 Boost. The X99A WORKSTATION supports the latest Intel processors out of the box, both Broadwell-E and XEON based models. The X99A WORKSTATION motherboard is the perfect multi-tasking powerhouse to cater even the most demanding professional.

To be qualified as a true workstation motherboard, optimal & stable data handling needs to be guaranteed, no matter what. By using industries' highest quality components combined with an unmatched R&D design and extreme QA testing, the X99A WORKSTATION motherboard PCB design has been optimized to do just that. To protect the PCB and its components, besides looking cool an IO & audio cover ensures worry free use. The data and audio signals are also shielded against EMI. Heavy plated heatsinks, with a touch of grey, green and white, are used to ensure perfect operation at even the most extreme conditions. To transfer countless data, a wide variety of storage connecters such as U.2 , M.2 and SATA ports are demanded by most workstation users. The X99A WORKSTATION allows any of the latest and greatest HDD, SSD or other storage devices to be connected.

QNAP Systems, Inc. today announced the official release of the Enterprise ZFS NAS ES1640dc - a whole-new product line for mission-critical tasks and intensive virtualization applications. Representing a milestone for QNAP's step into the enterprise storage market, the ES1640dc delivers business-class cloud computing data storage with Intel Xeon E5 processors, dual active controllers, and full support for virtualization environments. The ES1640dc runs the new FreeBSD-based QES operating system that assists businesses in building the most cost-efficient VDI platform and storage for critical data with near-limitless snapshots, block-level data deduplication, and thin provisioning with reclaim.

The ES1640dc is powered by Intel Xeon E5-2420 v2 processors with 32GB RAM and features dual active-active controllers, providing businesses with near-zero downtime high availability. Other features include battery-protected DRAM write cache, dual 10GbE ports, optional 40GbE NIC, redundant power supplies, and a field-replaceable design for easier maintenance. The new FreeBSD-based QES operating system also provides advanced features including flexible storage pools, simplified management, high-performance SSD cache, near-limitless snapshots, SnapSync, block-based data deduplication, in-line compression and thin provisioning with reclaim for optimized utilization in virtual machine storage.

Crucial, a leading global brand of memory and storage upgrades, today announced the availability of Nonvolatile DIMM (NVDIMM) server memory to help companies protect data in the event of a system power loss. Historically, companies have used uninterruptible power supplies, solid state drives (SSDs), mechanical hard drives (HDDs) or other devices to ensure the security of critical data. While this method of preserving critical data has been effective, the backup and restore times have been very long due to the latency and write times of the SSD and HDD. Today's applications such as relational databases, scale-out storage, data analytics, and in-memory databases require much faster backup and restore times.

Crucial NVDIMM server memory combines DRAM and NAND onto a single module, providing the performance of DRAM with the persistence of NAND. In the event of a power loss, the NVDIMM will back up all DRAM data to the NAND while utilising a backup power source, known as an ultracapacitor. The DRAM on the NVDIMM ensures critical data can be operated on from a low-latency memory space without the risk of losing it. The NAND on the module ensures that the contents of the DRAM are not lost during a power failure, making the DRAM persistent. When power is restored to the system, the data in the NAND is restored on the DRAM.

Crucial, a leading global brand of memory and storage upgrades, today announced the availability of two new offerings in its server memory product portfolio: 32 GB DDR4 VLP RDIMMs and 64 GB DDR4 LRDIMMs. With speeds of 2400 MT/s and engineered to enable higher densities by implementing a dual stack of 8 Gb DDR4 DRAM die to engineer a single 16 Gb component, these new DDR4 server memory modules allow for increased memory density, performance and bandwidth.

The 32 GB VLP RDIMMs are the highest density server memory modules Crucial offers for that module form factor, and are almost half the height (40 percent shorter) of a standard RDIMM module. These high density modules help enable memory dense systems like blade servers and microservers without compromising performance. Additionally, they can be installed at a 90-degree angle to the motherboard in these height-constrained systems, which enables better airflow to keep the system cool..

QNAP Systems, Inc. today announced the release of the powerful Double Server TDS-16489U that integrates an application server and storage server into one chassis. Distinguishably powered by dual Intel Xeon E5 processors with up to 1TB RAM, the server-grade TDS-16489U supports Qtier Technology, 12Gb/s SAS and 10GbE/40GbE networks to provide unrivaled performance for Big Data computing and to assist enterprises in mission-critical tasks as a one-device solution for applications, storage and virtualization.

"The TDS-16489U resolves the difficulty of building virtualization environment infrastructures for businesses," said David Tsao, Product Manager of QNAP. "Its unrivaled power from its dual processors also facilitates Big Data computing to process the data deluge created by Internet of Things applications." With its server-grade hardware design, the TDS-16489U features two Intel Xeon E5-2600 v3 processors (with 4-core, 6-core and 8-core configurations), up to 1TB DDR4 2133MHz RDIMM/LRDIMM RAM (16 DIMM) and three independent SAS 12Gb/s controllers that deliver outstanding performance for data transmission and applications.

Crucial, a leading global brand of memory and storage upgrades, today announced the availability of Crucial DDR4 2400MT/s 8Gb-based RDIMM, LRDIMM and ECC UDIMM server modules. Engineered to enable higher density modules, 8Gb-based DDR4 enables increased performance, bandwidth and energy efficiency. The modules are available for immediate purchase through select global channel partners and at www.crucial.com.

Higher-density, 8Gb-based modules allow for greater channel bandwidth and channel density and are also up to 20 percent more energy efficient than 4Gb-based modules. Ultimately, these benefits provide more value per gigabit than current 4Gb-based offerings, making it easy to scale up server deployments in the future. Designed for Intel's next generation processor product families, Crucial's 8Gb-based server memory is extensively tested to mission-critical standards and is backed by a limited lifetime warranty.

Samsung Electronics Co., Ltd., announced today that it is mass producing the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules, for enterprise servers and data centers. Following Samsung's introduction of the world-first 3D TSV DDR4 DRAM (64GB) in 2014, the company's new TSV registered dual inline memory module (RDIMM) marks another breakthrough that opens the door for ultra-high capacity memory at the enterprise level. Samsung's new TSV DRAM module boasts the largest capacity and the highest energy efficiency of any DRAM modules today, while operating at high speed and demonstrating excellent reliability.

"We are pleased that volume production of our high speed, low-power 128GB TSV DRAM module will enable our global IT customers and partners to launch a new generation of enterprise solutions with dramatically improved efficiency and scalability for their investment," said Joo Sun Choi, executive vice president, Memory Sales and Marketing, Samsung Electronics. "We will continue to expand our technical cooperation with global leaders in servers, consumer electronics and emerging markets, where consumers can benefit from innovative technology that enhances their productivity and the overall user experience."

Crucial, a leading global brand of memory and storage upgrades, is now sampling Crucial DDR4 2400MT/s 8Gb-based RDIMM, LRDIMM, and ECC UDIMM server modules through its Technology Enablement Program. Engineered to enable higher density modules, 8Gb-based DDR4 memory allows for increased performance, bandwidth, and energy efficiency.

Higher density modules, when combined with the next DDR4 speed increase of 2400MT/s, create greater channel bandwidth and channel density, as well as increased energy efficiency. Ultimately, these benefits provide more value per gigabit than current 4Gb-based offerings. Taken together, the increase in density, bandwidth, and value deliver a lower total cost of ownership for users.

Transcend Information, Inc. (Transcend), a leading manufacturer of industrial-grade products, is proud to announce the launch of the DDR4 memory module series. The series includes DDR4 2133 MHz UDIMMs, RDIMMs, ECC-DIMMs and ECC SO-DIMMs, which are fully compatible with the latest Intel Xeon E5-2600 v3 server family processor, Haswell-E CPU with X99 chipset and micro servers. Transcend's DDR4 series boasts superior performance, 1.2V ultra-low power consumption, and increased reliability. All these features make it perfect for cloud computing, virtualization, and high-performance computing technologies.

Transcend's DDR4 memory modules are constructed with top-quality DRAM chips that deliver stable performance and durability. With advanced DDR4 technologies, Transcend's DDR4 memory modules utilize higher density components, allowing capacity options ranging from 4GB to 32GB. Offering high speed transmission of 2133MHz and up to 17GB/s of memory bandwidth, Transcend's DDR4 DIMMs comprehensively promote the system performance.