Samsung Electronics Co., Ltd., announced today that it is mass producing the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules, for enterprise servers and data centers. Following Samsung's introduction of the world-first 3D TSV DDR4 DRAM (64GB) in 2014, the company's new TSV registered dual inline memory module (RDIMM) marks another breakthrough that opens the door for ultra-high capacity memory at the enterprise level. Samsung's new TSV DRAM module boasts the largest capacity and the highest energy efficiency of any DRAM modules today, while operating at high speed and demonstrating excellent reliability.

"We are pleased that volume production of our high speed, low-power 128GB TSV DRAM module will enable our global IT customers and partners to launch a new generation of enterprise solutions with dramatically improved efficiency and scalability for their investment," said Joo Sun Choi, executive vice president, Memory Sales and Marketing, Samsung Electronics. "We will continue to expand our technical cooperation with global leaders in servers, consumer electronics and emerging markets, where consumers can benefit from innovative technology that enhances their productivity and the overall user experience."

Crucial, a leading global brand of memory and storage upgrades, is now sampling Crucial DDR4 2400MT/s 8Gb-based RDIMM, LRDIMM, and ECC UDIMM server modules through its Technology Enablement Program. Engineered to enable higher density modules, 8Gb-based DDR4 memory allows for increased performance, bandwidth, and energy efficiency.

Higher density modules, when combined with the next DDR4 speed increase of 2400MT/s, create greater channel bandwidth and channel density, as well as increased energy efficiency. Ultimately, these benefits provide more value per gigabit than current 4Gb-based offerings. Taken together, the increase in density, bandwidth, and value deliver a lower total cost of ownership for users.

Transcend Information, Inc. (Transcend), a leading manufacturer of industrial-grade products, is proud to announce the launch of the DDR4 memory module series. The series includes DDR4 2133 MHz UDIMMs, RDIMMs, ECC-DIMMs and ECC SO-DIMMs, which are fully compatible with the latest Intel Xeon E5-2600 v3 server family processor, Haswell-E CPU with X99 chipset and micro servers. Transcend's DDR4 series boasts superior performance, 1.2V ultra-low power consumption, and increased reliability. All these features make it perfect for cloud computing, virtualization, and high-performance computing technologies.

Transcend's DDR4 memory modules are constructed with top-quality DRAM chips that deliver stable performance and durability. With advanced DDR4 technologies, Transcend's DDR4 memory modules utilize higher density components, allowing capacity options ranging from 4GB to 32GB. Offering high speed transmission of 2133MHz and up to 17GB/s of memory bandwidth, Transcend's DDR4 DIMMs comprehensively promote the system performance.

Transcend Information, Inc. (Transcend ), a leading manufacturer of industrial-grade products, is proud to announce the launch of three new DDR4 server-grade memory modules: 8GB and 16GB DDR4 2133MHz Registered DIMMs (RDIMMs), and 16GB DDR4 Very Low Profile (VLP) RDIMMs. Fully compatible with the latest Intel Xeon E5-2600 v3 server family processor, Transcend's DDR4 series features high capacities, superior performance, 1.2V ultra-low power consumption, and increased reliability; perfect for cloud computing, virtualization, and high-performance computing technologies.

Transcend's server-grade DDR4 RDIMMs and VLP RDIMMs are constructed with top-quality DRAM chips that deliver stable performance and durability. With advanced DDR4 technologies, Transcend's DDR4 memory modules utilize higher density components, allowing capacity options of 8GB and 16GB. Offering high speed transmission of 2133MHz and up to 17GB/s of memory bandwidth, Transcend's DDR4 RDIMMs comprehensively promote the system performance.

SMART Modular Technologies, Inc., a global leader in specialty memory solutions, today announced that it has expanded its lineup of Enterprise Memory products to include DDR4 modules. SMART has attained an exceptional reliability level of sub-two hundred DPPM with its DDR3 RDIMM Enterprise Memory and is achieving similar levels with DDR4 during its internal development process for these enterprise grade modules.

This superior DPPM rate is accomplished utilizing a SMART proprietary Ultra-Reliability Test (URT) burn-in process. Early life failures and weak modules are eliminated through SMART's URT lab where every enterprise grade module undergoes a rigorous triple-stress process entailing hours of burn-in at high speed operation while running custom software at 99% DRAM utilization.

Virtium, the embedded industry's trusted supplier of highly reliable infrastructure SSDs and industrial memory modules, today expanded its embedded infrastructure market support with two new DDR4 VLP UDIMM and VLP RDIMM memory module form factors.

Virtium was one of the first to offer DDR4 memory modules, and the company's latest modules give embedded-industrial OEMs increased performance, lower power and higher bandwidth advantages thanks to the latest evolution in DRAM technology. Offering power savings of up to 40% and as much as twice the bandwidth compared to previous-generation DDR3 modules, Virtium's DDR4 modules are ideal solutions for server blades, networking and telecom applications.

Crucial, a leading global brand of memory and storage upgrades, has expanded its DDR4 memory portfolio with LRDIMM and VLP RDIMM modules. Designed to enable next-generation enterprise environments with increased speed, bandwidth, and energy efficiency, Crucial DDR4 load reduced DIMMs (LRDIMMs) and very low profile registered DIMMS (VLP RDIMMs) are available for immediate purchase through select global channel partners.

By utilising a memory buffer chip that helps reduce the electrical load presented to the memory bus, Crucial DDR4 LRDIMMs allow for more DIMMs per channel and are up to 50 percent more energy efficient and deliver up to 50 percent more memory bandwidth than DDR3 LRDIMMs. Furthermore, by using less voltage and standby current, Crucial DDR4 LRDIMMs transmit power in a more efficient manner to the CPU, allowing for additional power savings and lower total cost of ownership.

Samsung Electronics, Ltd. announced today that it has started mass producing the industry's first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) "through silicon via" (TSV) package technology. The new high-density, high-performance module will play a key role in supporting the continued proliferation of enterprise servers and cloud-based applications, as well as further diversification of data center solutions.

The new RDIMMs include 36 DDR4 DRAM chips, each of which consists of four 4-gigabit (Gb) DDR4 DRAM dies. The low-power chips are manufactured using Samsung's most advanced 20-nanometer (nm) class* process technology and 3D TSV package technology.

Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, today announced the introduction of a monolithic 8 Gb DDR3 SDRAM component, enhancing its leadership position as a diverse memory solutions provider for enterprise applications such as data analytics. This new design is based on Micron's latest-generation 25 nm DRAM manufacturing process.

DDR3 is the mainstream DRAM technology for the enterprise market, and the addition of an 8 Gb monolithic component will enable cost-effective, high-capacity solutions optimized to support large-scale, data-intensive workloads.

Virtium, a leading provider of embedded SSD and industrial memory modules, today announced its embedded infrastructure market support for DDR4, and the company's initial DDR4 RDIMM products. As one of the first to offer DDR4 memory modules, Virtium's embedded industrial OEM customers are able to have early test and development access to the lower power, high bandwidth and density benefits of this latest DRAM technology. Delivering significant power savings of up to 40% and up to twice the bandwidth over DDR3, the new DDR4 modules from Virtium are excellent solutions for server blades, networking and telecom applications.

Virtium is a proven innovator of VLP (Very Low Profile - 0.72-inch or 0.738-inch) and ULP (Ultra Low Profile - 0.70-inch) memory modules for space-constrained applications. Continuing Virtium's exclusive support for the embedded infrastructure market, these first DDR4 modules are offered in the lower profile ULP RDIMM height in capacities ranging from 4 to 16 gigabytes (GB). The new DDR4 modules feature low 1.2 V configurations with data transfer speeds of 1866 MT/s.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, said today that it is accelerating its production ramp up of DDR4 memory modules to accommodate an anticipated strong market demand along with the approaching introduction of the new Intel Xeon processor E5-2600 v3 product family. DDR4 is the most advanced memory for server and high-performance computing applications.

"At Samsung, we are taking the lead in readying the DDR4 market to coincide with the introduction of the next-generation Intel Xeon processor E5-2600 v3 product family, and plan to contribute to creating a bigger market for DRAM in the second half of 2014," said Jim Elliott, corporate vice president, Memory Marketing, Samsung Semiconductor, Inc. "We will continue to introduce high-density DDR4 modules for global OEMs that will facilitate the launch of next-generation enterprise servers and will maximize IT investment efficiency."

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, has announced the launch of new DDR4 modules. Working in close cooperation with Intel, ADATA has successfully developed and launched DDR4 RDIMM (ECC Registered DIMM) that are fully compatible with the newly announced, next generation platform of Intel Xeon processor E5-2600 v3 product family.

Coming in densities of 4, 8 & 16 gigabytes, the new modules run at 1.2 volts, and at a frequency of 2133 MHz. The higher clock frequencies, faster data transfer rates, and low voltage operation of DDR4 memory make it especially suited for use in the growing cloud server, storage and networking application fields.

Transcend Information, Inc., a worldwide leader in storage and multimedia products, is proud to announce its launch of 16 GB and 32 GB DDR3 Registered DIMM (RDIMM) modules aimed at maximizing memory in Apple Mac Pro 2013 systems. With four user-upgradeable memory slots available, Transcend's latest high-performance DDR3 RDIMMs can boost Mac Pro 2013 Intel Xeon E5 3.5 GHz 6-Core, 3.0 GHz 8-Core, and 2.7 GHz 12-Core models to 64 GB, 96 GB, and even 128 GB total memory capacity.

"The new Mac Pro 2013 is advertised to support up to 64 GB of memory, and we understand that pro users running applications that place high demands on RAM have a need to meet and most likely exceed this threshold," said Angus Wu, Director of Research and Development at Transcend. "For this reason, we have developed and fully tested higher density modules to give users the option of raising their Mac Pro system memory to the advertised 64 GB right up to 128 GB."

Innodisk is proud to be among the first to supply (DDR4) registered DIMM product samples to key server companies for their next-generation systems. With this announcement, Innodisk, an industry leader in DRAM modules for industrial applications and embedded systems, will continue to offer the most advanced technology to its customers. The result of almost eight years of development, DDR4 (Double Data Rate 4) technology improves on the previous generation, DDR3, in every way. These new memory products provide users with greater performance, but can still cut costs by saving power and space, and reducing waste heat.

DDR4 offers a giant leap in peak performance over DDR3 technology, with a 3.2 Gbps data transfer rate. In fact, DDR4 could eventually even surpass this already high rate, according to standards organization JEDEC, in the same way that DDR3 surpassed its initial ceiling of 1.6 Gbps. DDR4 memory bus speeds start at 2133MHz, which already offers a huge jump in potential performance from the average bus speed of 1333MHz and 1666MHz offered by DDR3.

SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, today announced the addition of a 24GB CoolFlex RDIMM to its product lineup. The 24GB DDR3-1333 1.35V RDIMM helps solve unique memory capacity constraints in servers. SMART's CoolFlex module product family uses state-of-the-art flexible substrate technology to increase system memory capacity.

Servers configured with two processors and sixteen registered DIMMs are generally limited to a maximum memory capacity of 256GB. When using 16GB DDR3-1333 RDIMMs these systems can be fully populated. However, when switching to 32GB four-rank RDIMMs, the maximum number of DIMMs per Channel (DPC) drops down to one. A system configured with two channels per processor and four DIMMs per channel can only be populated with one 32GB RDIMM per channel for a total memory capacity of 128GB. SMART's new 24GB Coolflex RDIMM solves this constraint by allowing these systems to be fully populated with sixteen 24GB RDIMMs totaling 384GB and representing a 50% increase in memory capacity.

Transcend Information, Inc., a worldwide leader in storage and multimedia products, today announced the arrival of its 32GB DDR3 Load-Reduced DIMM (LRDIMM) memory module. An important component of today's powerful servers, LRDIMMs use a specially designed buffer to minimize the load on the server memory bus, allowing administrators to maximize memory capacity, increase performance, and reduce the power consumption of their systems.

In standard RDIMM technology, the data bus connects directly to the multiple ranks of DRAM chips on the module, which increases electrical load and limits system speed as more modules are added. In contrast, Transcend's DDR3 Low Voltage LRDIMMs feature a full memory buffer chip on the module, which acts as a go-between for all signals sent from the host to the DRAM chips, reducing the electrical load on all interfaces. Compared to standard RDIMMs or UDIMMs, a system using Transcend LRDIMMs can support more modules per channel and higher maximum memory capacity without sacrificing speed.

GIGABYTE is proud to announce two new models of workstation motherboards and one new model dedicated to mission critical server applications. All of them being based on the Intel Xeon processors E5-2600 product family, these new models are designed to answer demanding needs for computing resources across various usage models, form factors and scales. While these products have been naturally thought for scenarios requiring heavy computing power through GPUs or GPGPU / co-processors cards, from CAD/CAE to rendering, simulation and modeling, their most notable advantage relies in their unique memory performance capability. GIGABYTE motherboards support DDR3-1600 MHz speeds with 16 GB 1.35V RDIMMs.

Achieved through GIGABYTE's capabilities in design, PCB layout and BIOS fine-tuning, this feature will be most appreciated in the many workstation applications where improvements in memory frequency result in speeding up the user's productivity and in all the industries relying on server applications where each incremental improvement in memory performance results in significant benefits, such as in finance.

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions and DRAM memory modules, introduces its updated green memory modules.
With no tradeoffs in price or performance, choosing VLP DIMMs for computing can have an enormous environmental impact when the hundreds of thousands of memory modules produced monthly are taken into account.

"Decreasing overhead in a data center is an easy way for a company to reduce costs. With Super Talent's Green Memory, power and cooling costs can be easily cut while maintaining speed and reliability for a company," said Shimon, VP of Engineering, Super Talent Technology.

The rapidly developingcloud-based services have brought prospective impact on the enterprise-level storage device, network communication equipment and high-end server.To meet the enterprises' demand for powerful computing, Apacer, the global professional manufacturer of the memory module, launchesDDR3-1333 SO-RDIMM.It's the special memory module tailored for the Mission Critical Application and the Networking System device. As the product features compactness, high-processing speed and high stability brought by registering clock driver with parity chip, it can offer enterprises the multi-advantage storage device in a cloud-based operating environment.

Transcend Information, Inc. (Transcend), a worldwide leader in storage and multimedia products, today launched two new DDR3 memory modules: a 32GB DDR3 1333 MHz Registered DIMM (RDIMM) and a 16 GB DDR3 1600 MHz Very Low Profile (VLP) Registered DIMM. Featuring stable signal integrity at high frequency operation and an onboard thermal sensor for better system thermal control, these high capacity RDIMMs provide better expandability options to server administrators. Additionally, both new modules feature high quality aluminum heat spreaders to ensure optimal heat dispersion and stability.

Aimed at high-powered servers, Transcend's largest capacity 32 GB DDR3-1333 modules significantly increase memory density in servers that support 32 GB RDIMMs (up to a maximum 2 TB), such as IBM's System x3850/3950 X5 and BladeCenter HX5. The new modules are rated at 1333MHz with timings of 9-9-9-24, and operate at industry standard 1.5V. Comprised of high-quality 8 Gb DRAM chips that fully comply with rigorous JEDEC (Joint Electron Device Engineering Council) standards, Transcend's 32GB DDR3 memory offers unparalleled performance and stability.

Super Talent Technology, a leader of memory products and NAND Flash storage solutions, today introduced new DDR3 Mini-RDIMM, VLP RDIMM, and VLP ECC UDIMM modules designed for industrial, embedded, and sever systems.

These new memory modules all feature low operating voltages and a small form factor while delivering impressive 1600 MHz (PC3-12800) speeds in up to 8 GB densities. By running at 1.35V instead of the traditional 1.5V, these JEDEC standard modules reduce the voltage 10% and remain backward compatible in 1.5V DDR3 environments.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun sampling the industry's first 16-gigabyte (GB) double data rate-4 (DDR4), registered dual inline memory modules (RDIMMs), designed for use in enterprise server systems.

"By launching these new high-density DDR4 modules, Samsung is embracing closer technical cooperation with key CPU and server companies for development of next-generation green IT systems," said Wanhoon Hong, executive vice president, memory sales & marketing, Samsung Electronics. "Samsung will also aggressively move to establish the premium memory market for advanced applications including enterprise server systems and maintain the competitive edge for Samsung Green Memory products, while working on providing 20 nanometer (nm) class based DDR4 DRAM in the future."

As cloud computing becomes a more mature sector of the IT industry, most enterprises have already regarded this technology as a key point in the building of future information architectures to meet the needs of massive data processing. To better address the high demands for cloud computing, Apacer, a leading memory module manufacturer, has announced an industry-leading and enterprise-level 16GB bulk storage DDR3-1600 high-speed server memory module.

It uses both internal and external voltage reference (Vref.) circuits, allowing the storage system to directly use external Vref. with high efficiency while eliminating signal noise. It helps to facilitate continuous massive data processing and helps to optimize the cloud computing and storage performance in those environments, giving a more stable server storage experience.

Century Japan started selling a [relatively] affordable 16 GB DDR3-1600 MHz (PC3-12800) ECC Registered DIMM. The module runs at 1600 MHz with timings of 11-11-11, and has been tested on EVGA SR-X platform to achieve 192 GB (12 x 16 GB), scraping the address-space limits of Windows 7 64-bit client operating systems. The 240-pin RDIMM uses 36 Hynix-made DRAM chips. In Japan, Century's new 16 GB RDIMM is priced at 25,000 JPY (US $314) a pop. For reference, DDR3-1066 MHz 16 GB RDIMMs are priced around $300.

GIGABYTE recently rolled out the 6PXSV3, a workstation motherboard designed for Xeon E5-1600/2600 processors in the LGA2011 package. Based on the Intel C604 chipset, the motherboard is designed to provide essential modern and legacy connectivity to workstations in mission-critical environments. The LGA2011 socket is powered by a 6-phase VRM with CPL-made chokes, and IR-made FETs and VRM controller. It is wired to eight DIMM slots, which support up to 256 GB (RDIMM) and 64 GB (UDIMM) of quad-channel DDR3-1600 MHz memory.

There are just the three expansion slots, two PCI-Express 3.0 x16, and one open-ended PCI-Express 2.0 x4. The remainder of the processor and chipset's PCI-Express lane budgets are allocated PCI-Express DMI-assist, which helps drive the mini SAS with 4 x SAS ports (3Gb/s), apart from four SATA 3 Gb/s, and two SATA 6 Gb/s ports. An ASPEED 2300 provides display output (resolutions up to 1920x1200 supported), and remote management (iKVM, IPMI 2.0). There are two gigbit Ethernet interfaces, driven by Intel 82574L chips, a third management port is also available. The GA-6PXSV3 will be available shortly.