GIGABYTE announces the launch of a new high end workstation motherboard based on Intel's brand new Xeon E5-1600 CPU family and the Intel C604 chipset. This single socket board aimed at the extreme performance desktop and enterprise segments offers the features below:

Intel Xeon E5-1600 CPU Series

With up to 6 cores / 12 threads per socket, TDP up to 130W, cache size increased up to 15 MB, increased QPI frequency, and doubled inter-socket QPI links, this new Xeon generation brings a significant increase in computing power for demanding workstation applications.

Digital Power Control

The GA-6PXSV1 is equipped with a brand new digital PWM controller allowing the user to get full control of the power delivery steadiness to the CPU and the memory, in any given loading. The system stability can therefore be fully fine-tuned and optimized in the BIOS controls by adjusting parameters like voltage, phase and frequency. Moreover, this controller, its associated chokes, and all the board's capacitors are selected ultra high quality components chosen to deliver the best durability and reliability.

SMART Modular Technologies ("SMART Modular"), a leading independent manufacturer of memory modules and embedded flash products announces its 64GB DDR3 load-reduced DIMM (LRDIMM). SMART Modular's 64GB LRDIMM is optimized for high-end servers and will be launching in Q2'12 to serve scientific, engineering, and financial computing applications that require high memory capacity and performance. Specifically, this product targets next-generation Intel Sandy Bridge and Ivy Bridge server platforms for high-performance computing applications.

The new LRDIMM combines innovative module packaging technology leveraging off-the-shelf commodity DRAMs to provide the industry's highest density LRDIMM at the lowest possible cost. Highlighting SMART Modular's design expertise, the new 64GB LRDIMM utilizes a single JEDEC-compliant memory buffer chip, a dual PCB structure and a leading edge interconnect technology to provide maximum performance and density while achieving server-grade quality and reliability.

Super Talent Technology, a leading manufacturer of NAND flash storage solutions, today announces a new line of 1066 & 1333 MHz, quad-rank registered DDR3 RDIMM modules for servers.

Many of today's new servers support a new 16 core processors and now require a new type of RDIMMs called quad-channel DDR3. On the heels of their single and dual rank RDIMMs, Super Talent is pleased to announce a new Quad-Rank Quad-Channel RDIMM Module designed for those who require even more DRAM capacity.

Super Talent Technology, a leading manufacturer of NAND flash storage solutions, today announces a new line of 1333 MHz, quad rank registered DDR3 RDIMM modules for servers. Today's new motherboards that support the new 16 core processors, now require a new type of RDIMMs, quad-channel DDR3. On the heels of their single and dual rank RDIMMs, Super Talent is pleased to announce a new Quad-Rank Module for those who require even more DRAM capacity.

At 8 GB per module, today's servers can now support a maximum of 128 GB of RAM. These modules have passed vigorous testing using the new AMD Interlagos compatible motherboards and even support fully loaded configurations at speeds up to 1066 MHz. If you're deploying a new server and have been looking for RDIMMs to deliver maximum performance and capacity, you owe it to yourself to call SuperTalent. Products available and shipping now. Part Number: W13RC8G8x - 8GB RDIMM Module.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announces a new line of high speed, quad-channel Registered DDR3 RDIMM modules for servers running at 1600 MHz.

Super Talent is committed to bringing our customers the very the latest in technology. Today's new motherboards that support the new 16 core processors, now require a new type of RDIMMs, quad-channel DDR3. Super Talent is pleased to announce that theses new modules have passed extensive qualification testing and can support full speed at full loading.

Micron Technology, Inc., today announced a new portfolio of load reduced dual-inline memory modules (LRDIMMs) featuring a 64GB offering. In addition to the standard densities of 8GB, 16GB and 32GB, which are sampling in high volume to several customers, Micron is introducing a 64GB LRDIMM to meet the ever-growing density requirements of servers.

Micron continues its memory market leadership with modules that provide 50 percent higher memory capacity and a performance increase of 33 percent for server applications. Resulting improvements to system scalability can significantly enhance cloud computing, high-performance computing, Web servers, transactional databases, and data analytics while reducing power needs by nearly 10 percent per DIMM slot compared to standard modules.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed double data rate-3 (DDR3) registered dual inline memory modules (RDIMMs) designed for use in low-power enterprise server systems at a 1.25 voltage.

Utilizing four gigabit (Gb) DDR3 components based on 30 nanometer (nm) class process technology, Samsung's new DDR3 modules deliver greener memory solutions for servers than conventional 1.5 volts alternatives or the previous leading-edge 1.35V version, while providing higher performance.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of 32 gigabyte (GB) double data rate-3 (DDR3) registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) through silicon via (TSV) package technology.

Samsung's advanced 30 nanometer (nm) class technology leverages module performance and power features to deliver a substantially greener memory solution than the preceding 40nm-class based modules. Engineering samples have been released for evaluation.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it is the first in the industry to start mass producing 32 gigabyte (GB) memory modules, essential for cloud computing and advanced server systems, using 30 nanometer (nm) class* four gigabit (Gb) DDR3 DRAM chips.

"With this module, Samsung has secured the highest level of product and solution competitiveness in the DRAM market for PC, server and mobile applications," said Wanhoon Hong, executive vice president, memory sales & marketing, Samsung Electronics. "We also plan to ship more energy-efficient 4Gb DDR3 DRAM based on 20nm-class* process technology in the second half of this year, which will significantly expand the rapidly growing market for green IT memory solutions. Moreover, we intend to keep delivering the greenest memory products with optimal performance for customers," he added.

Lexar Media, a leading global provider of memory products for digital media, today introduced Crucial DDR3-1333MHz RDIMM BOM-controlled server DRAM for customers who require a Bill of Material (BOM), revision control, as well as Product Change Notices (PCNs). BOM-control applies to the DRAM component, register, and PCB of eligible Crucial server memory modules. The new BOM-controlled server memory is covered by the Crucial Reliance Server Program, and enables registered partners to stay ahead of product changes, reduce the frequency of memory qualifications that occur due to memory revisions, and ultimately optimize productivity. Participating customers with Crucial BOM-controlled server memory will receive at least 30 day advanced notification of pending module revisions.

Crucial DDR3-1333MHz RDIMM BOM-controlled server memory is halogen-free, RoHS compliant, and will be validated on Intel CPUs and platforms; 2GB, 4GB and 8GB densities are now available for sampling and qualification. For additional information on how to purchase BOM-controlled server memory, contact your Crucial memory provider, or visit this page for details and qualifications.

Viking Modular Solutions, a division of Sanmina-SCI Corporation (Nasdaq: SANM), and leading manufacturer of innovative DRAM modules and Solid State Drive (SSD) solutions, today announced its DDR3 8GB Very Low Profile (VLP) Registered DIMM is available for immediate qualification. Suitable for the most demanding environmental conditions, this high-density VLP RDIMM is optimal for Original Equipment Manufacturer (OEM) customers in the telecommunications, enterprise, cloud and embedded computing markets that need the benefit of high density in a very low profile form factor.

Viking Modular is a leader in creating innovative DRAM packaging solutions that offer excellent signal integrity and thermal management. This latest DDR3 8GB VLP RDIMM uses mainstream 2Gbit DDR3 DRAM to deliver a cost effective, reliable, high-density solution, ideally suited for blade servers, storage bridge bay (SBB), AdvancedTCA (ATCA) and multiple space constrained high performance computing environments.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced it had begun sample shipments of its new 32-gigabyte Load Reduced Dual In-Line Memory Module (LRDIMM), the DRAM industry's highest density memory module. The LRDIMM consists of 72 advanced 40nm process 4-gigabit DDR3 SDRAMs in a Double Density Package (DDP).

LRDIMM is a new standard for server memory modules that reduces I/O bus capacity by buffering the I/O bus line with the memory buffer (MB) to simultaneously enable higher system density and faster speed. JEDEC, a standardization body for the semiconductor industry, is studying the adoption of LRDIMM standards. Elpida is actively engaged in promoting its own standard.

Lexar Media, a leading global provider of memory products for digital media, today introduced 8GB Crucial DDR3-1066 (PC3-8500) CL9 very low-profile (VLP), ECC registered dual in-line memory modules (RDIMMs), enabling blade and low-profile server users to populate their systems with up to 144GB of memory, depending upon motherboard and processor configuration. Additionally, these new high-density, low-profile modules are guaranteed compatible with Intel Xeon processors based on the Nehalem architecture. The 8GB Crucial VLP RDIMM modules are available through select resellers worldwide and online.

VLP memory modules enable powerful and compact computing power within server systems, because they are designed to stand vertically in order to accommodate additional memory modules and enable improved system airflow. Blade servers, as well as servers utilized for virtualization, will benefit from these new high-density Crucial VLP modules.

A-DATA Technology Co., Ltd., the worldwide leading manufacturer in high-performance DRAM modules and flash application products, today announced its DDR3L ("L" for low voltage) 1066/1333 (1.35volt) MHz Registered DIMM and DDR3L 1066/1333 MHz (1.35volt) ECC DIMM low voltage server memories have been certified by Intel, that able to perform lower power consumption with great reliability to increase better efficiency on Westmere-EP processor-based server.

"Enterprise often requires 24x7 operations from server memory for data accessing and collecting with reliability and performance requirements," said Richard Shen, manager of A-DATA product management department. "We are proud to offer our DDR3L 1066/1333 MHz R-DIMM and DDR3L 1066/1333 MHz ECC DIMM low voltage server memory that has certified by Intel to enterprise customers, which delivers high performance and great reliability with less power consumption to meet enterprise's critical requirements, as well as to protect and to preserve the environment."

Lexar Media, a leading global provider of memory products for digital media, today introduced Crucial DDR3L-1333Mhz 1.35v energy-efficient server memory modules in support of the new Intel Xeon processor 5600 series. Available in 1GB, 2GB and 4GB RDIMM and VLP (very low profile) RDIMM modules, Crucial DDR3L memory modules are fully compatible and have been validated with the new Intel Xeon processor 5600 series. Servers across the enterprise, including those utilized for virtualization, data storage and processing, and blade servers will reap the benefits of new Crucial DDR3L memory. Crucial DDR3L memory is available through select resellers worldwide and online at Crucial.com/server.

"The benefits of energy-efficient DDR3L memory are clear - most notably the significant reduction in memory sub-system energy consumption and overall system cooling demands. Moreover, these benefits come without sacrificing the performance gains our customers expect from Intel's next-generation servers," said Jim Jardine, Lexar Media senior worldwide product manager. "Additionally, all Crucial DDR3L 1.35v memory has been fully validated and certified compatible with the Intel Xeon Processor 5600 series, so customers can rest assured their server infrastructure investment will perform reliably and efficiently with Intel's newest processors."

Transcend Information Inc., a worldwide leader in storage and multimedia products, is proud to announce its launch of 8GB DDR3-1066 Registered DIMM (RDIMM) and 4GB DDR3-1333 VLP (Very Low Profile) RDIMM modules. Featuring enhanced capacity, support for triple-channel memory configurations, and an onboard thermal sensor, these new high-density RDIMMs provide customers with cutting-edge support for higher data frequencies and significantly increase memory space.

As Transcend's highest density DDR3 module, the 8GB DDR3-1066 RDIMM is constructed with a robust ten-layer PCB that offers stable performance and durability, and also includes a high thermal efficiency aluminum heat sink to help maintain cool temperatures under load. Offering memory bandwidth up to 8.5GB/s and the flexibility to expand maximum capacity to 48GB (per processor), the 8GB DDR3-1066 RDIMM module allows administrators to create a robust infrastructure that runs memory-intensive applications such as virtualization and cloud computing with ease.

Hynix Semiconductor, Inc. has announced the Intel validation of 2Gb (Gigabit) DDR3 DRAM using 40nm class process technology.

Hynix's newly validated products are 2Gb DDR3 SDRAM component, 4GB (Gigabyte) DDR3 SODIMM (Small Outline Dual In-line Memory Module) and 2GB DDR3 UDIMM (Un-buffered Dual In-line Memory Module) at the operating speed of 1333MHz with 1.5V power supply.

The products can offer the maximum data transfer speed of 1867MHz with 16-bit I/O and 3.7GB/s (Gigabytes per second) bandwidth. The productivity of Hynix's 40nm class 2Gb DDR3 is increased by more than 60% over 50nm class process technology.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced a very low profile (VLP) DDR3-1333 Registered DIMM designed for use in servers with compact and low-profile enclosures.

This 2GB ECC registered module is only 0.72-inches tall, nearly half an inch shorter than standard height DDR3 modules. "We made this product for high density servers and embedded computers where space inside the chassis is severely constrained", explained Super Talent Director of Marketing, Joe James. VLP modules also make sense in 1U servers since their small stature improves airflow inside the chassis.

Micron Technology, Inc. today announced that it has produced the industry's first DDR3 load-reduced, dual-inline memory module (LRDIMM) and will begin sampling 16-gigabyte (GB) versions this fall. By reducing load on the server memory bus, Micron's LRDIMMs provide the option to support higher data frequencies and significantly increase memory capacity.

The new LRDIMMs will be manufactured using Micron's leading-edge 1.35-volt, 2-gigabit (Gb) 50-nanometer DDR3 memory chips, allowing the company to easily and cost-effectively increase server module capacity because of the chips' high-density and industry-leading small die size. Micron's 2Gb 50nm DDR3 product is currently in qualification with customers and is ramping toward high volume production.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced it is shipping both 1333- and 1066MHz DDR3 server memory modules validated by Intel for use on its Xeon processor-based motherboards. Kingston's registered ECC server DIMMs and unbuffered ECC DIMMs are optimized to take advantage of the triple-channel architecture for Intel's newest server platforms using the new Nehalem-based Xeon processors.

The 1333- and 1066MHz DDR3 server modules are available immediately. Kingston server memory is backed by a lifetime warranty and free, 24/7 technical support. For more detailed information visit www.kingston.com. For Intel validation information visit this page.

Samsung Electronics, the world leader in advanced memory technology, announced today that it has just made the initial shipment of the world's first and smallest high-density memory modules based on 2-gigabit (Gb), 50 nanometer (nm)-class DDR3.
Samsung is shipping 18 configurations of its high-density, high-performance DDR3-based modules, which are designed for servers. They include a 16-gigabyte (GB) registered inline memory module (RIMM) and an 8 GB RDIMM (registered dual inline memory module). Last September, a 50 nm-class 2 Gb DDR3 was introduced for PC applications.

Hynix Semiconductor today announced the validation of the HMT31GR7AUP4C, the world's first MetaRAM based 8 GB 2-rank DDR3 RDIMM, on Intel's Nehalem CPU based Tylersburg-EP platform
When fully populated with 3 DIMMs per channel, the Hynix 8 GB RDIMM operates at 1066 MHz speed. Competing industry standard modules exhibit performance degradation to 800 MHz when operating under full load. The Hynix 8 GB DDR3 RDIMM enables a maximum capacity of 144 GB operating at 1066 MHz in a dual processor Tylersburg-EP platform, not possible with industry standard DIMMs.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced immediate availability of DDR3 Registered DIMMs (RDIMMs) and DDR3 ECC Unbuffered DIMMs (ECC UDIMMs).

Super Talent's 1GB and 2GB ECC UDIMMs are immediately available in production volumes and support speeds up to 1333MT/s for single DIMM per channel operation and 1066MT/s for two DIMM per channel operation. Super Talent's 1GB x8 RDIMM is also immediately available in production volumes and supports speeds up to 1333MT/s for single DIMM per channel operation, 1066MT/s for two DIMM per channel operation, and 800MT/s for three DIMM per channel operation. All these products are designed to be compatible with Intel's upcoming Nehalem EP Server Platform.

Lexar Media, a subsidiary of Micron Technology, announced today the immediate availability of some new Crucial DDR3 RDIMM memory modules for servers. The DDR3-1066MHz and DDR3-1333MHz ECC (error detection and correction) RDIMMs are available now in 1GB and 2GB capacities at Crucial's official resellers worldwide. "We're committed to providing our customers with new memory solutions that address the ever-changing data center environment. Our new DDR3 RDIMM memory supports users as they transition to upcoming next-generation server platforms," said Jim Jardine, Lexar Media's senior DRAM product marketing manager. For qualified information, please visit this page here.

Hynix Semiconductor announced today the launch of 2-Rank 8GB PC2-4200 RDIMM, featuring MetaRAM's MetaSDRAM technology. The HYMP31GP72CUP4-C6 effectively doubles the memory capacity of AMD Opteron-based and Intel Xeon-based systems, while lowering power consumption by up to 30% when compared to industry standard 8GB 4-Rank or 4GB 2-Rank modules. The MetaRam technology allows the use of mainstream lower cost DRAM components in the manufacture of the next generation high density DIMMs, without increasing the number of memory ranks or the load on the CPU. The 8GB 2-Rank RDIMM is built with mainstream 1Gb DDR2 SDRAMs instead of the significantly more expensive 2Gb, thus lowering the cost of the module.