A-DATA Technology Co., Ltd., the worldwide leading manufacturer in high-performance DRAM modules and flash application products, today announced its DDR3L ("L" for low voltage) 1066/1333 (1.35volt) MHz Registered DIMM and DDR3L 1066/1333 MHz (1.35volt) ECC DIMM low voltage server memories have been certified by Intel, that able to perform lower power consumption with great reliability to increase better efficiency on Westmere-EP processor-based server.

"Enterprise often requires 24x7 operations from server memory for data accessing and collecting with reliability and performance requirements," said Richard Shen, manager of A-DATA product management department. "We are proud to offer our DDR3L 1066/1333 MHz R-DIMM and DDR3L 1066/1333 MHz ECC DIMM low voltage server memory that has certified by Intel to enterprise customers, which delivers high performance and great reliability with less power consumption to meet enterprise's critical requirements, as well as to protect and to preserve the environment."

Lexar Media, a leading global provider of memory products for digital media, today introduced Crucial DDR3L-1333Mhz 1.35v energy-efficient server memory modules in support of the new Intel Xeon processor 5600 series. Available in 1GB, 2GB and 4GB RDIMM and VLP (very low profile) RDIMM modules, Crucial DDR3L memory modules are fully compatible and have been validated with the new Intel Xeon processor 5600 series. Servers across the enterprise, including those utilized for virtualization, data storage and processing, and blade servers will reap the benefits of new Crucial DDR3L memory. Crucial DDR3L memory is available through select resellers worldwide and online at Crucial.com/server.

"The benefits of energy-efficient DDR3L memory are clear - most notably the significant reduction in memory sub-system energy consumption and overall system cooling demands. Moreover, these benefits come without sacrificing the performance gains our customers expect from Intel's next-generation servers," said Jim Jardine, Lexar Media senior worldwide product manager. "Additionally, all Crucial DDR3L 1.35v memory has been fully validated and certified compatible with the Intel Xeon Processor 5600 series, so customers can rest assured their server infrastructure investment will perform reliably and efficiently with Intel's newest processors."

Transcend Information Inc., a worldwide leader in storage and multimedia products, is proud to announce its launch of 8GB DDR3-1066 Registered DIMM (RDIMM) and 4GB DDR3-1333 VLP (Very Low Profile) RDIMM modules. Featuring enhanced capacity, support for triple-channel memory configurations, and an onboard thermal sensor, these new high-density RDIMMs provide customers with cutting-edge support for higher data frequencies and significantly increase memory space.

As Transcend's highest density DDR3 module, the 8GB DDR3-1066 RDIMM is constructed with a robust ten-layer PCB that offers stable performance and durability, and also includes a high thermal efficiency aluminum heat sink to help maintain cool temperatures under load. Offering memory bandwidth up to 8.5GB/s and the flexibility to expand maximum capacity to 48GB (per processor), the 8GB DDR3-1066 RDIMM module allows administrators to create a robust infrastructure that runs memory-intensive applications such as virtualization and cloud computing with ease.

Hynix Semiconductor, Inc. has announced the Intel validation of 2Gb (Gigabit) DDR3 DRAM using 40nm class process technology.

Hynix's newly validated products are 2Gb DDR3 SDRAM component, 4GB (Gigabyte) DDR3 SODIMM (Small Outline Dual In-line Memory Module) and 2GB DDR3 UDIMM (Un-buffered Dual In-line Memory Module) at the operating speed of 1333MHz with 1.5V power supply.

The products can offer the maximum data transfer speed of 1867MHz with 16-bit I/O and 3.7GB/s (Gigabytes per second) bandwidth. The productivity of Hynix's 40nm class 2Gb DDR3 is increased by more than 60% over 50nm class process technology.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced a very low profile (VLP) DDR3-1333 Registered DIMM designed for use in servers with compact and low-profile enclosures.

This 2GB ECC registered module is only 0.72-inches tall, nearly half an inch shorter than standard height DDR3 modules. "We made this product for high density servers and embedded computers where space inside the chassis is severely constrained", explained Super Talent Director of Marketing, Joe James. VLP modules also make sense in 1U servers since their small stature improves airflow inside the chassis.

Micron Technology, Inc. today announced that it has produced the industry's first DDR3 load-reduced, dual-inline memory module (LRDIMM) and will begin sampling 16-gigabyte (GB) versions this fall. By reducing load on the server memory bus, Micron's LRDIMMs provide the option to support higher data frequencies and significantly increase memory capacity.

The new LRDIMMs will be manufactured using Micron's leading-edge 1.35-volt, 2-gigabit (Gb) 50-nanometer DDR3 memory chips, allowing the company to easily and cost-effectively increase server module capacity because of the chips' high-density and industry-leading small die size. Micron's 2Gb 50nm DDR3 product is currently in qualification with customers and is ramping toward high volume production.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced it is shipping both 1333- and 1066MHz DDR3 server memory modules validated by Intel for use on its Xeon processor-based motherboards. Kingston's registered ECC server DIMMs and unbuffered ECC DIMMs are optimized to take advantage of the triple-channel architecture for Intel's newest server platforms using the new Nehalem-based Xeon processors.

The 1333- and 1066MHz DDR3 server modules are available immediately. Kingston server memory is backed by a lifetime warranty and free, 24/7 technical support. For more detailed information visit www.kingston.com. For Intel validation information visit this page.

Samsung Electronics, the world leader in advanced memory technology, announced today that it has just made the initial shipment of the world's first and smallest high-density memory modules based on 2-gigabit (Gb), 50 nanometer (nm)-class DDR3.
Samsung is shipping 18 configurations of its high-density, high-performance DDR3-based modules, which are designed for servers. They include a 16-gigabyte (GB) registered inline memory module (RIMM) and an 8 GB RDIMM (registered dual inline memory module). Last September, a 50 nm-class 2 Gb DDR3 was introduced for PC applications.

Hynix Semiconductor today announced the validation of the HMT31GR7AUP4C, the world's first MetaRAM based 8 GB 2-rank DDR3 RDIMM, on Intel's Nehalem CPU based Tylersburg-EP platform
When fully populated with 3 DIMMs per channel, the Hynix 8 GB RDIMM operates at 1066 MHz speed. Competing industry standard modules exhibit performance degradation to 800 MHz when operating under full load. The Hynix 8 GB DDR3 RDIMM enables a maximum capacity of 144 GB operating at 1066 MHz in a dual processor Tylersburg-EP platform, not possible with industry standard DIMMs.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced immediate availability of DDR3 Registered DIMMs (RDIMMs) and DDR3 ECC Unbuffered DIMMs (ECC UDIMMs).

Super Talent's 1GB and 2GB ECC UDIMMs are immediately available in production volumes and support speeds up to 1333MT/s for single DIMM per channel operation and 1066MT/s for two DIMM per channel operation. Super Talent's 1GB x8 RDIMM is also immediately available in production volumes and supports speeds up to 1333MT/s for single DIMM per channel operation, 1066MT/s for two DIMM per channel operation, and 800MT/s for three DIMM per channel operation. All these products are designed to be compatible with Intel's upcoming Nehalem EP Server Platform.

Lexar Media, a subsidiary of Micron Technology, announced today the immediate availability of some new Crucial DDR3 RDIMM memory modules for servers. The DDR3-1066MHz and DDR3-1333MHz ECC (error detection and correction) RDIMMs are available now in 1GB and 2GB capacities at Crucial's official resellers worldwide. "We're committed to providing our customers with new memory solutions that address the ever-changing data center environment. Our new DDR3 RDIMM memory supports users as they transition to upcoming next-generation server platforms," said Jim Jardine, Lexar Media's senior DRAM product marketing manager. For qualified information, please visit this page here.

Hynix Semiconductor announced today the launch of 2-Rank 8GB PC2-4200 RDIMM, featuring MetaRAM's MetaSDRAM technology. The HYMP31GP72CUP4-C6 effectively doubles the memory capacity of AMD Opteron-based and Intel Xeon-based systems, while lowering power consumption by up to 30% when compared to industry standard 8GB 4-Rank or 4GB 2-Rank modules. The MetaRam technology allows the use of mainstream lower cost DRAM components in the manufacture of the next generation high density DIMMs, without increasing the number of memory ranks or the load on the CPU. The 8GB 2-Rank RDIMM is built with mainstream 1Gb DDR2 SDRAMs instead of the significantly more expensive 2Gb, thus lowering the cost of the module.