GIGABYTE is proud to announce two new models of workstation motherboards and one new model dedicated to mission critical server applications. All of them being based on the Intel Xeon processors E5-2600 product family, these new models are designed to answer demanding needs for computing resources across various usage models, form factors and scales. While these products have been naturally thought for scenarios requiring heavy computing power through GPUs or GPGPU / co-processors cards, from CAD/CAE to rendering, simulation and modeling, their most notable advantage relies in their unique memory performance capability. GIGABYTE motherboards support DDR3-1600 MHz speeds with 16 GB 1.35V RDIMMs.

Achieved through GIGABYTE's capabilities in design, PCB layout and BIOS fine-tuning, this feature will be most appreciated in the many workstation applications where improvements in memory frequency result in speeding up the user's productivity and in all the industries relying on server applications where each incremental improvement in memory performance results in significant benefits, such as in finance.

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions and DRAM memory modules, introduces its updated green memory modules.
With no tradeoffs in price or performance, choosing VLP DIMMs for computing can have an enormous environmental impact when the hundreds of thousands of memory modules produced monthly are taken into account.

"Decreasing overhead in a data center is an easy way for a company to reduce costs. With Super Talent's Green Memory, power and cooling costs can be easily cut while maintaining speed and reliability for a company," said Shimon, VP of Engineering, Super Talent Technology.

The rapidly developingcloud-based services have brought prospective impact on the enterprise-level storage device, network communication equipment and high-end server.To meet the enterprises' demand for powerful computing, Apacer, the global professional manufacturer of the memory module, launchesDDR3-1333 SO-RDIMM.It's the special memory module tailored for the Mission Critical Application and the Networking System device. As the product features compactness, high-processing speed and high stability brought by registering clock driver with parity chip, it can offer enterprises the multi-advantage storage device in a cloud-based operating environment.

Transcend Information, Inc. (Transcend), a worldwide leader in storage and multimedia products, today launched two new DDR3 memory modules: a 32GB DDR3 1333 MHz Registered DIMM (RDIMM) and a 16 GB DDR3 1600 MHz Very Low Profile (VLP) Registered DIMM. Featuring stable signal integrity at high frequency operation and an onboard thermal sensor for better system thermal control, these high capacity RDIMMs provide better expandability options to server administrators. Additionally, both new modules feature high quality aluminum heat spreaders to ensure optimal heat dispersion and stability.

Aimed at high-powered servers, Transcend's largest capacity 32 GB DDR3-1333 modules significantly increase memory density in servers that support 32 GB RDIMMs (up to a maximum 2 TB), such as IBM's System x3850/3950 X5 and BladeCenter HX5. The new modules are rated at 1333MHz with timings of 9-9-9-24, and operate at industry standard 1.5V. Comprised of high-quality 8 Gb DRAM chips that fully comply with rigorous JEDEC (Joint Electron Device Engineering Council) standards, Transcend's 32GB DDR3 memory offers unparalleled performance and stability.

Super Talent Technology, a leader of memory products and NAND Flash storage solutions, today introduced new DDR3 Mini-RDIMM, VLP RDIMM, and VLP ECC UDIMM modules designed for industrial, embedded, and sever systems.

These new memory modules all feature low operating voltages and a small form factor while delivering impressive 1600 MHz (PC3-12800) speeds in up to 8 GB densities. By running at 1.35V instead of the traditional 1.5V, these JEDEC standard modules reduce the voltage 10% and remain backward compatible in 1.5V DDR3 environments.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun sampling the industry's first 16-gigabyte (GB) double data rate-4 (DDR4), registered dual inline memory modules (RDIMMs), designed for use in enterprise server systems.

"By launching these new high-density DDR4 modules, Samsung is embracing closer technical cooperation with key CPU and server companies for development of next-generation green IT systems," said Wanhoon Hong, executive vice president, memory sales & marketing, Samsung Electronics. "Samsung will also aggressively move to establish the premium memory market for advanced applications including enterprise server systems and maintain the competitive edge for Samsung Green Memory products, while working on providing 20 nanometer (nm) class based DDR4 DRAM in the future."

As cloud computing becomes a more mature sector of the IT industry, most enterprises have already regarded this technology as a key point in the building of future information architectures to meet the needs of massive data processing. To better address the high demands for cloud computing, Apacer, a leading memory module manufacturer, has announced an industry-leading and enterprise-level 16GB bulk storage DDR3-1600 high-speed server memory module.

It uses both internal and external voltage reference (Vref.) circuits, allowing the storage system to directly use external Vref. with high efficiency while eliminating signal noise. It helps to facilitate continuous massive data processing and helps to optimize the cloud computing and storage performance in those environments, giving a more stable server storage experience.

Century Japan started selling a [relatively] affordable 16 GB DDR3-1600 MHz (PC3-12800) ECC Registered DIMM. The module runs at 1600 MHz with timings of 11-11-11, and has been tested on EVGA SR-X platform to achieve 192 GB (12 x 16 GB), scraping the address-space limits of Windows 7 64-bit client operating systems. The 240-pin RDIMM uses 36 Hynix-made DRAM chips. In Japan, Century's new 16 GB RDIMM is priced at 25,000 JPY (US $314) a pop. For reference, DDR3-1066 MHz 16 GB RDIMMs are priced around $300.

GIGABYTE recently rolled out the 6PXSV3, a workstation motherboard designed for Xeon E5-1600/2600 processors in the LGA2011 package. Based on the Intel C604 chipset, the motherboard is designed to provide essential modern and legacy connectivity to workstations in mission-critical environments. The LGA2011 socket is powered by a 6-phase VRM with CPL-made chokes, and IR-made FETs and VRM controller. It is wired to eight DIMM slots, which support up to 256 GB (RDIMM) and 64 GB (UDIMM) of quad-channel DDR3-1600 MHz memory.

There are just the three expansion slots, two PCI-Express 3.0 x16, and one open-ended PCI-Express 2.0 x4. The remainder of the processor and chipset's PCI-Express lane budgets are allocated PCI-Express DMI-assist, which helps drive the mini SAS with 4 x SAS ports (3Gb/s), apart from four SATA 3 Gb/s, and two SATA 6 Gb/s ports. An ASPEED 2300 provides display output (resolutions up to 1920x1200 supported), and remote management (iKVM, IPMI 2.0). There are two gigbit Ethernet interfaces, driven by Intel 82574L chips, a third management port is also available. The GA-6PXSV3 will be available shortly.

As cloud computing becomes mature, most enterprises have already regarded this innovative management technology as the key point to building future information architecture so as to meet the needs for the massive data processing. To fully meet the stringent demands for cloud computing, Apacer, the leading memory module manufacturer, rolls out industry-leading enterprise-level 16GB bulk storage DDR3-1600 high-speed server memory module.

It uses both internal and external voltage reference(Vref.) circuits, allowing the storage system to directly use external Vref. with high efficiency while eliminating signal noise. It provides powerful computing to process on-going massive data, optimizes cloud computing and storage performance and realizes the most stable server storage environment.

Transcend Information, Inc. (Transcend), a worldwide leader in storage and multimedia products, is proud to announce its launch of 16 GB DDR3-1600 Registered DIMM (RDIMM) and 8GB DDR3L-1333 Low Voltage RDIMM modules. Fully compatible with the latest generation of Intel Xeon and Core i7 processors, the cost-effective DDR3 memory modules provide increased memory density and higher performance, while significantly reducing power consumption.

As Transcend's highest density DDR3 module, the 16GB DDR3-1600 RDIMM is constructed with top quality 4 Gb DDR3 1 Gbx4 35nm DRAM chips that deliver stable performance and durability. A single 16 GB memory module can lower power consumption by a staggering 75% compared with using four 4 GB modules, thereby saving energy and costs. The 16GB DDR3 module is rated at 1600 MHz with low latency of 11-11-11-28 and an operating voltage of a mere 1.5V. Offering memory bandwidth up to 12.8 GB/s and the flexibility to expand maximum capacity to 96 GB (per processor), the 16GB DDR3-1600 RDIMM module allows administrators to create a robust infrastructure that runs memory-intensive applications such as virtualization and cloud computing with ease.

GIGABYTE introduces its latest dual socket 1U rack server based on Intel's brand new Xeon E5-2600 generation. With the significant computing speed boost brought by these new processors, the GS-R12PE deploys powerful computing capabilities which, coupled together with a large and fast memory platform, makes it an ideal product for cloud computing and speed demanding applications such as finance or oil industries.

With up to 8 cores / 16 threads per socket, TDP up to 135W, cache size increased up to 20MB, increased QPI frequency, and doubled inter-socket QPI links, this new Xeon generation brings a significant increase in computing power for demanding server and datacenter applications.

GIGABYTE announces the launch of a new high end workstation motherboard based on Intel's brand new Xeon E5-1600 CPU family and the Intel C604 chipset. This single socket board aimed at the extreme performance desktop and enterprise segments offers the features below:

Intel Xeon E5-1600 CPU Series

With up to 6 cores / 12 threads per socket, TDP up to 130W, cache size increased up to 15 MB, increased QPI frequency, and doubled inter-socket QPI links, this new Xeon generation brings a significant increase in computing power for demanding workstation applications.

Digital Power Control

The GA-6PXSV1 is equipped with a brand new digital PWM controller allowing the user to get full control of the power delivery steadiness to the CPU and the memory, in any given loading. The system stability can therefore be fully fine-tuned and optimized in the BIOS controls by adjusting parameters like voltage, phase and frequency. Moreover, this controller, its associated chokes, and all the board's capacitors are selected ultra high quality components chosen to deliver the best durability and reliability.

SMART Modular Technologies ("SMART Modular"), a leading independent manufacturer of memory modules and embedded flash products announces its 64GB DDR3 load-reduced DIMM (LRDIMM). SMART Modular's 64GB LRDIMM is optimized for high-end servers and will be launching in Q2'12 to serve scientific, engineering, and financial computing applications that require high memory capacity and performance. Specifically, this product targets next-generation Intel Sandy Bridge and Ivy Bridge server platforms for high-performance computing applications.

The new LRDIMM combines innovative module packaging technology leveraging off-the-shelf commodity DRAMs to provide the industry's highest density LRDIMM at the lowest possible cost. Highlighting SMART Modular's design expertise, the new 64GB LRDIMM utilizes a single JEDEC-compliant memory buffer chip, a dual PCB structure and a leading edge interconnect technology to provide maximum performance and density while achieving server-grade quality and reliability.

Super Talent Technology, a leading manufacturer of NAND flash storage solutions, today announces a new line of 1066 & 1333 MHz, quad-rank registered DDR3 RDIMM modules for servers.

Many of today's new servers support a new 16 core processors and now require a new type of RDIMMs called quad-channel DDR3. On the heels of their single and dual rank RDIMMs, Super Talent is pleased to announce a new Quad-Rank Quad-Channel RDIMM Module designed for those who require even more DRAM capacity.

Super Talent Technology, a leading manufacturer of NAND flash storage solutions, today announces a new line of 1333 MHz, quad rank registered DDR3 RDIMM modules for servers. Today's new motherboards that support the new 16 core processors, now require a new type of RDIMMs, quad-channel DDR3. On the heels of their single and dual rank RDIMMs, Super Talent is pleased to announce a new Quad-Rank Module for those who require even more DRAM capacity.

At 8 GB per module, today's servers can now support a maximum of 128 GB of RAM. These modules have passed vigorous testing using the new AMD Interlagos compatible motherboards and even support fully loaded configurations at speeds up to 1066 MHz. If you're deploying a new server and have been looking for RDIMMs to deliver maximum performance and capacity, you owe it to yourself to call SuperTalent. Products available and shipping now. Part Number: W13RC8G8x - 8GB RDIMM Module.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announces a new line of high speed, quad-channel Registered DDR3 RDIMM modules for servers running at 1600 MHz.

Super Talent is committed to bringing our customers the very the latest in technology. Today's new motherboards that support the new 16 core processors, now require a new type of RDIMMs, quad-channel DDR3. Super Talent is pleased to announce that theses new modules have passed extensive qualification testing and can support full speed at full loading.

Micron Technology, Inc., today announced a new portfolio of load reduced dual-inline memory modules (LRDIMMs) featuring a 64GB offering. In addition to the standard densities of 8GB, 16GB and 32GB, which are sampling in high volume to several customers, Micron is introducing a 64GB LRDIMM to meet the ever-growing density requirements of servers.

Micron continues its memory market leadership with modules that provide 50 percent higher memory capacity and a performance increase of 33 percent for server applications. Resulting improvements to system scalability can significantly enhance cloud computing, high-performance computing, Web servers, transactional databases, and data analytics while reducing power needs by nearly 10 percent per DIMM slot compared to standard modules.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed double data rate-3 (DDR3) registered dual inline memory modules (RDIMMs) designed for use in low-power enterprise server systems at a 1.25 voltage.

Utilizing four gigabit (Gb) DDR3 components based on 30 nanometer (nm) class process technology, Samsung's new DDR3 modules deliver greener memory solutions for servers than conventional 1.5 volts alternatives or the previous leading-edge 1.35V version, while providing higher performance.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of 32 gigabyte (GB) double data rate-3 (DDR3) registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) through silicon via (TSV) package technology.

Samsung's advanced 30 nanometer (nm) class technology leverages module performance and power features to deliver a substantially greener memory solution than the preceding 40nm-class based modules. Engineering samples have been released for evaluation.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it is the first in the industry to start mass producing 32 gigabyte (GB) memory modules, essential for cloud computing and advanced server systems, using 30 nanometer (nm) class* four gigabit (Gb) DDR3 DRAM chips.

"With this module, Samsung has secured the highest level of product and solution competitiveness in the DRAM market for PC, server and mobile applications," said Wanhoon Hong, executive vice president, memory sales & marketing, Samsung Electronics. "We also plan to ship more energy-efficient 4Gb DDR3 DRAM based on 20nm-class* process technology in the second half of this year, which will significantly expand the rapidly growing market for green IT memory solutions. Moreover, we intend to keep delivering the greenest memory products with optimal performance for customers," he added.

Lexar Media, a leading global provider of memory products for digital media, today introduced Crucial DDR3-1333MHz RDIMM BOM-controlled server DRAM for customers who require a Bill of Material (BOM), revision control, as well as Product Change Notices (PCNs). BOM-control applies to the DRAM component, register, and PCB of eligible Crucial server memory modules. The new BOM-controlled server memory is covered by the Crucial Reliance Server Program, and enables registered partners to stay ahead of product changes, reduce the frequency of memory qualifications that occur due to memory revisions, and ultimately optimize productivity. Participating customers with Crucial BOM-controlled server memory will receive at least 30 day advanced notification of pending module revisions.

Crucial DDR3-1333MHz RDIMM BOM-controlled server memory is halogen-free, RoHS compliant, and will be validated on Intel CPUs and platforms; 2GB, 4GB and 8GB densities are now available for sampling and qualification. For additional information on how to purchase BOM-controlled server memory, contact your Crucial memory provider, or visit this page for details and qualifications.

Viking Modular Solutions, a division of Sanmina-SCI Corporation (Nasdaq: SANM), and leading manufacturer of innovative DRAM modules and Solid State Drive (SSD) solutions, today announced its DDR3 8GB Very Low Profile (VLP) Registered DIMM is available for immediate qualification. Suitable for the most demanding environmental conditions, this high-density VLP RDIMM is optimal for Original Equipment Manufacturer (OEM) customers in the telecommunications, enterprise, cloud and embedded computing markets that need the benefit of high density in a very low profile form factor.

Viking Modular is a leader in creating innovative DRAM packaging solutions that offer excellent signal integrity and thermal management. This latest DDR3 8GB VLP RDIMM uses mainstream 2Gbit DDR3 DRAM to deliver a cost effective, reliable, high-density solution, ideally suited for blade servers, storage bridge bay (SBB), AdvancedTCA (ATCA) and multiple space constrained high performance computing environments.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced it had begun sample shipments of its new 32-gigabyte Load Reduced Dual In-Line Memory Module (LRDIMM), the DRAM industry's highest density memory module. The LRDIMM consists of 72 advanced 40nm process 4-gigabit DDR3 SDRAMs in a Double Density Package (DDP).

LRDIMM is a new standard for server memory modules that reduces I/O bus capacity by buffering the I/O bus line with the memory buffer (MB) to simultaneously enable higher system density and faster speed. JEDEC, a standardization body for the semiconductor industry, is studying the adoption of LRDIMM standards. Elpida is actively engaged in promoting its own standard.

Lexar Media, a leading global provider of memory products for digital media, today introduced 8GB Crucial DDR3-1066 (PC3-8500) CL9 very low-profile (VLP), ECC registered dual in-line memory modules (RDIMMs), enabling blade and low-profile server users to populate their systems with up to 144GB of memory, depending upon motherboard and processor configuration. Additionally, these new high-density, low-profile modules are guaranteed compatible with Intel Xeon processors based on the Nehalem architecture. The 8GB Crucial VLP RDIMM modules are available through select resellers worldwide and online.

VLP memory modules enable powerful and compact computing power within server systems, because they are designed to stand vertically in order to accommodate additional memory modules and enable improved system airflow. Blade servers, as well as servers utilized for virtualization, will benefit from these new high-density Crucial VLP modules.