At CeBIT, ASRock already grabbed a lot of attention with its unveiling of the X79 Extreme11 motherboard. The motherboard was detailed to great lengths then. It appears like the design was still a work-in-progress, and the company has an even newer iteration. Pictured below is this latest iteration. You will notice how ASRock redid the CPU VRM. While the one shown at CeBIT packed a 16-phase VRM, this one steps it up to 24. On the obverse side of the PCB, it squeezed in chokes for all 24-phases, and compact Driver-MOSFET (DrMOS) chips for 12 (probably the other 12 are located on the reverse side of the PCB). The first iteration shown at CeBIT used LFPAK MOSFET design. A DrMOS combines up/down FETs and driver IC into a single, space-efficient package. Companies like Renesas have held interest in innovating with DrMOS chips, even compacting them further. The rest of the board is identical to the one pictured at CeBIT, except that the Creative Sound Core3D chip has the signature plastic cover over it, which can be found on Creative's Sound Core3D discrete sound cards.

Japanese store Kuroutoshikou listed USB3.0R-P4-PCIe, a reference design USB 3.0 host add-on card. Driven by Renesas μPD720201 chipset, the card gives out four USB 3.0 SuperSpeed ports. Three of these ports are wired out on the rear expansion bracket, while the fourth one is an internal port (type-A plug, not header). The card draws auxiliary power from a SATA power connector, it talks to the rest of the system over PCI-Express 2.0 x1. A part of the reason why not all four ports are located on the bracket, is that the card is just about capable of being low-profile, due to its half-height PCB. USB3.0R-P4-PCIe could be re-branded and sold through various major brands. Slated for late-March, it is priced at 3,000 JPY (US $36).

Japanese company RATOC Systems introduced a trio of products that lets users expand their data storage once they run out of drive bays and ports in their case. The first one is the RS-EC32PE-U3R, a bundle consisting of a 2-bay USB 3.0 to SATA 3 Gb/s RAID enclosure and a PCIe USB 3.0 addon card; the RS-EC32EX-U3R, which is a bundle including the same 2-bay RAID enclosure, but including a 2-port USB 3.0 expansion card in the ExpressCard34 form-factor; and REX-PEU3X, which is a standalone 2-port USB 3.0 expansion card in the PCIe form-factor.

The expansion cards in these bundles are based on new Renesas μPD720202 chipset. The RAID enclosure has two 3.5-inch SATA drive bays. Its controller provides a maximum data transfer performance of 372 MB/s. It supports disk organization modes of "single" (just a single disk connected), RAID JBOD, RAID 0, and RAID 1. Expected to launch mid-March, the RATOC RS-EC32PE-U3R and RS-EC32EX-U3R are priced at 11,130 JPY (US $138), the REX-PEU3X goes for 3,360 JPY (US $41.7).

OEMs are readying USB 3.0 PCIe add-on cards based on the reference design "USB3.0R-P2-PCIe", which will be sold through several vendors such as Buffalo. These cards take advantage of the new Renesas μPD720202 chipset, which is known to be more cost-effective, faster, and power-efficient than the μPD720200A, which it succeeds. The μPD720202 features a 40% performance boost over previous generation, the card has a redesigned circuit that reduces electrical leakage when in power-saving mode, when the chip consumes about 4.5 mW. The card gives out two USB 3.0 ports, and draws power from a 15-pin SATA power connector, instead of 4-pin Molex or Berg connectors. The PCB is compact, half-height, and hence low-profile capable. Cards should include low-profile brackets.

On Thursday, we got to see the first images of PowerColor's new Radeon HD 7970 Vortex Edition graphics card. At CES we got to take a closer look at its VRM. PowerColor carried forward the VRM design of its Radeon HD 6970 Devil 13 graphics card. At the heart of the VRM is a CHiL CHL8228 VRM controller, which allows software volt-modding using most of the popular tools out there. The card uses an 8+1+1 phase VRM. It uses High Current Power Beat chokes which offers PWM frequency range of up to 3 MHz.

Interestingly, while the HD 6970 Devil 13 itself, like the Radeon HD 7970 AMD reference board, used expensive International Rectifier DirectFETs in typical configuration, the HD 7970 Votex uses cost-effective driver-MOSFET (DrMOS) chips that appear to be made by Renesas. Cost effective doesn't necessarily mean "cheap", these chips, according to PowerColor, offer 93% efficiency with up to 1 MHz switching frequency. On the reverse side of the PCB, we can find the power stage to be complemented with SP capacitors that offer 40% lower ESR with and support higher switching frequencies.

Chinese company JEHE is launching its latest compact mini-ITX motherboard in Europe under the Giada brand, the MI-Z68. As the name suggests, it is based on Intel Z68 chipset, and supports Core i3/i5/i7 processors in the LGA1155 package. There is no TDP restriction, as the board features a full-fledged CPU VRM that draws power from a 4-pin 12V connector apart from a 20-pin ATX connector (any of today's PSUs with 24-pin connector will support it). The board uses a 4+1 phase CPU VRM, with single phase memory. There are two DDR3 DIMM slots, supporting dual-channel memory. The lone expansion slot is a PCI-Express 2.0 x16.

There's impressive storage connectivity, this includes two mSATA 3 Gb/s (on on either side of the slot), two SATA 6 Gb/s (blue), and two SATA 3 Gb/s (black). There are just two USB 3.0 ports, both on the rear panel, and driven by a Renesas-made controller. 8-channel HD audio with optical SPDIF output, one gigabit Ethernet connection (driven by Realtek-made PHY), display outputs that include DVI and HDMI, a number of USB 2.0 ports and PS/2 keyboard, make for the rest of the rear panel. The Giada MI-Z68 will be priced at €88.

Here are the first pictures of MSI's socket LGA2011 motherboard in the micro-ATX form-factor. Earlier this week, we got to see through ASRock's X79 Extreme4-M that LGA2011 micro-ATX boards were indeed possible. Called the MSI X79MA-GD45 (MS-7738 V1.1), this board offers all the connectivity possible on a board with such a tight footprint. The LGA2011 socket is powered by a 9-phase VRM. It is wired to four DDR3 DIMM slots, two on either sides of the socket, powered by 2-phase VRM. Expansion slots include two each of PCI-Express 3.0 x16 and PCI-Express 2.0 x1. 2-way SLI and CrossFire are supported.

SATA connectivity includes two SATA 6 Gb/s (white), four SATA 3 Gb/s (black). There are no eSATA ports, but four USB 3.0, two on the rear panel, two by internal header, driven by Renesas-made controllers. The rest of the connectivity is fairly standard: 8+2 channel HD audio driven by Realtek ALC892 CODEC with optical and coaxial SPDIF outputs, single gigabit Ethernet driven by Realtek 8111E, and a number of USB 2.0 ports. One of the front-panel USB 2.0 headers is designed for charging portable devices even with the system shut down (yet plugged in). The board will be driven by UEFI firmware, we're getting to see some nifty features for overclockers such as voltage measurement points across a wide range of voltage domains.

Foxconn's latest premium gamer-overclocker segment motherboard, the Quantum Force X79, has finally taken shape. Foxconn's Quantum Force motherboards are designed to offer good overclocking features at a great value. The Quantum Force X79 uses a 14-phase VRM to power the LGA2011 "Sandy Bridge-E" processor, plus a 2-phase VRM for the memory. There are four DDR3 DIMM slots, one per memory channel. Expansion slots include three PCI-Express 3.0 x16 (PCI-E1_x16, PCI-E3_x16, and PCI-E4_x16. The second black slot (PCI-E2_x16) is electrical PCI-Express 2.0 x8.

The board is packed with features that help overclockers, starting with triple redundant BIOS, voltage measurement points for manual voltage measurements (with a wide range of voltage domains), manual overclocking buttons on board, power, reset, clear-CMOS buttons, POST speaker, and plenty of fan headers.

ASUS unveiled a trio of socket LGA1155 motherboards based on the Intel Z68 chipset, which feature PCI-Express 3.0 x16 slots (electrical x8/x8 when both are populated). The new motherboards are PCI-Express Gen 3.0 specifications compliant, complete with switches and electrical components. Leading the pack is the P8Z68 DELUXE/Gen3 in the $250-segement, followed by the P8Z68-V PRO/Gen3 in the $200-segment, and the P8Z68-V/Gen3 in the sub-$200 segment.

All three feature 16-phase Digi+ CPU VRM, an Intel-made gigabit Ethernet controller, and Lucid Virtu support. All three feature the same expansion slot loadout, with two PCI-Express 3.0 x16 (x16/NC or x8/x8), one PCI-Express 2.0 x16 (electrical 2.0 x4), and two each of PCI-Express 2.0 x1 and legacy PCI wired to an ASMedia-made bridge chip.

Renesas Electronics Corporation, a premier provider of advanced semiconductor solutions, today announced the availability of its new SuperSpeed Universal Serial Bus (USB 3.0) SATA3 bridge system-on-chip ([SoC], part number, µPD720230) that enables data transfer between a USB3.0 host system and a Serial ATA (SATA) device in external USB storage equipment. The new SoC is the world's first USB 3.0 Bridge SoC that supports the UASP (USB Attached SCSI Protocol) protocol that significantly speeds up data throughput for large volumes of data.

USB 3.0 achieves data transfer speeds more than 10 times faster than the previous version of the standard, USB 2.0 (currently the mainstream data transfer technology) and therefore easily supports the growing need for increased data-recording media capacities. Renesas has led the industry by releasing the µPD720200 USB 3.0 host controller in May 2009 and began mass production in June that same year. Since then, the company's lineup of USB 3.0 host controllers has been widely adopted by customers worldwide. Total shipments of these products have already exceeded 40 million units since May 2010, and Renesas has ramped up production of its USB 3.0 host controllers to 6 million units per month. During this period, the company also released in December 2009 a UASP driver that achieves high-speed data transfers for storage devices by improving the performance limit of the BOT (Bulk-Only Transfer) standard used by USB 2.0, making it possible for external storage devices to take advantage of the increased speed offered by the new USB 3.0 standard.

Since neither Intel nor AMD have concrete plans in place to fully integrate USB 3.0 SuperSpeed controllers into their motherboard chipsets, at least not beyond a couple of ports, the market for third-party controllers is intact. Renesas is planning to make its 2-port PCI-Express 2.0 x1 controllers even more competitive in a market that is now seeing competition, a market which its controllers pioneered. Renesas acquired the USB 3.0 controller IP from NEC. By early 2012, Renesas will be in a position to price its controllers as low as US $1.20 per unit. Compare that to the $5 these controllers cost when they entered the market.

Renesas' mainstream USB 3.0 controllers, the µPD72020x series, are sold in the upstream supplier market for $2 per unit, as competitors' controllers are going for US$1.50-1.70. The company is facing competition from a number of new and established manufacturers, including VIA Labs (VLI), ASMedia, and Etron Technology. While most motherboard manufacturers have, at some point, used NEC/Renesas controllers, the major ones are beginning to move to its competitors. For instance, ASMedia controllers can be seen on newer motherboard models from ASRock and ASUS, Etron can be seen on Gigabyte ones. VLI is emerging as a favorite of USB 3.0 add-on cards.

Renesas Electronics today announced that the cumulative total shipment of the company's SuperSpeed Universal Serial Bus (USB 3.0) host controllers has reached 30 million units worldwide as of 19 May 2011. This achievement comes a year and a half after starting mass production of the world's first USB host controller (µPD720200) in September 2009. The company also announced that to further address increasing orders from customers, it plans to double production of USB 3.0 host controllers to a monthly production of six million units starting this June.

In May 2009, Renesas Electronics (then NEC Electronics) introduced the industry's first USB 3.0 xHCI host controller and, after four months of its release, the company became the world's first to earn the "Certified SuperSpeed USB (USB 3.0)" certification from the USB-IF, and also started mass production of the µPD720200 host controller. In the following year, the company released its second USB 3.0 xHCI host controller (µPD720200A) and passed the compliance and certification testing in only two months. These host controllers have become the de facto USB 3.0 host controller standard realising the best interoperability between PCs and PC peripherals that support USB 3.0.

Renesas Electronics Corporation, a premier provider of advanced semiconductor solutions, today announced the availability of its two new SuperSpeed Universal Serial Bus (USB 3.0) xHCI host controllers (part number, µPD720201 and µPD720202) for electronic devices such as PCs and digital TVs that feature faster effective data transfer speeds and reduced power consumption in low power mode.

The µPD720201 and µPD720202 devices make it easier for system designers to build electronic devices combining high-speed data transfer, compact size, and extended battery life. In addition, Renesas Electronics device drivers for Microsoft Windows with a proven track record, and device drivers with Linux support, are available for the µPD720201 and µPD720202 host controllers at no cost.

Rambus Inc., one of the world's premier technology licensing companies, announced today it has renewed its patent license agreement with Renesas Electronics Corporation (TSE:6723). Renesas Technology Corp. and NEC Electronics Corporation, merged in April 2010 to form Renesas Electronics. This agreement covers the use of Rambus patented innovations in a broad range of logic integrated circuit (IC) products offered by Renesas Electronics. Specific terms of the agreement are confidential.

"This license with a global leader of the semiconductor industry represents continued validation of the strength of our patent portfolio," said Sharon Holt, senior vice president and general manager of the Semiconductor Business Group at Rambus. "We have enjoyed a long and positive relationship with Renesas Electronics, and we are pleased to renew this important agreement with one of the top five semiconductor companies."

Originally slated for 22 November, AMD's upcoming Radeon HD 6900 series featuring the company's new enthusiast-grade "Cayman" GPU core reportedly ran into delays. A more recent report by VR-Zone suggests that these delays are not because of any yield-issue related to the GPU, but shortage of a new high-grade driver-MOSFET (DrMOS) chip used on the reference board, sourced from Texas Instruments. The said component looks to feature a more compact package compared to the ones commonly made by Renesas and the likes, which is why AMD seems to have chosen it. The TI-made component is in short supply, and is a very recent introduction by its makers. AMD has a knack of using exotic and high-grade components on PCBs of its high-end graphics cards. A driver-MOSFET is a component that combines the driver IC, and MOSFETs into a single package.

If you recall, at this year's Computex event held in Taipei, almost every motherboard vendor scuffled to show of their first motherboards based on the Intel P67 and H67 chipsets, that support new socket LGA1155 socket processors based on the next-generation Sandy Bridge architecture. The Intel Developer Forum (IDF) 2010 event is presenting many of them a second chance, and we're beginning to see some new designs that didn't make it to Computex. Intel's own Desktop Board division came up with a new Extreme Series motherboard, the DP67BG "Burrage". As with every other Intel Desktop Board, this one looks clean, and well spaced-out. While there's nothing fancy about the heatsinks, the glowing skull is there, and this time it's positioned properly.

The processor is powered by a 4+2 phase PWM circuit, it's wired to four DDR3 DIMM slots for dual-channel memory support. Among few of its kind, the Burrage makes room of all seven expansion slots in the ATX specification. There are two PCI-Express 2.0 x16 (x8, x8 when both are populated), three PCI-E x1, and two PCI. Apart from six SATA 3 Gb/s ports from the P67 PCH, there's an additional Marvell-made SATA controller that drives an eSATA port. Connectivity includes 8-channel HD audio, gigabit Ethernet, a number of USB 2.0 ports, FireWire, and eSATA. After being neophobic toward USB 3.0, Intel has finally embraced it on its Desktop Board brand, an NEC/Renesas controller gives out two ports on the rear-panel. This feature-set should put rest to rumors of Intel embedding USB 3.0 and SATA 6 Gb/s into its chipset. The DP67BG from Intel should be out when the first-wave of LGA1155 processors make it to the market.

Although USB 3.0 and SATA 6 Gb/s served as features central to new motherboard models by manufacturers for an entire year, their adoption by chipset vendors has been rather slow. While AMD has integrated SATA 6 Gb/s into its SB850 southbridge, which features a 6-port SATA 6 Gb/s RAID controller, neither Intel nor AMD have USB 3.0 integrated, with no real indication Intel doing so in the foreseeable future. Sources in the motherboard industry, however, reveal that AMD is designing a new southbridge that integrates a USB 3.0 controller, just like present chipsets have USB 2.0.

AMD's move follows a recent announcement of collaboration with Renesas, the company behind the popular NEC uPD720200 controller, to promote USB 3.0 as an industry standard, and a new universal UASP driver model for USB 3.0 controllers. The new southbridge is codenamed "Hudson D1", which will release along with AMD's 40 nm Ontario Fusion APUs in Q4-2010. The company also plans to release the Llano Fusion APU in 2011.

Renesas Electronics Corporation, a premier provider of advanced semiconductor solutions, today announced the availability of its new SuperSpeed Universal Serial Bus (USB 3.0) host controller (part number µPD720200A), featuring 85 percent reduced power consumption compared to the company's existing host controller (part number µPD720200) when peripheral devices, such as mice, are not connected to the ports.

Supporting fast data transfer rates of up to 5 gigabits per second (Gbps), the µPD720200A device achieves low power consumption of 50 milliwatts (mW) with no peripheral connection to the ports, reduced by 85 percent from the company's existing USB 3.0 host controller. The new host controller also has the same footprint as the previous host controller, which makes it possible for system designers to accommodate their designs on the same board used for the previous device, the µPD720200. These advancements enable system designers to develop notebook PCs that boast longer battery life, yet maintain high data transfer rates.

Renesas Electronics Corporation, a premiere provider of advanced semiconductor solutions, today announced its collaboration with AMD to promote the new SuperSpeed Universal Serial Bus (USB 3.0) standard.

In December 2009, Renesas Electronics (formerly NEC Electronics Corporation) released its USB Attached SCSI Protocol (UASP) driver, supporting the new industry-standard, highly efficient mass-storage protocol suitable for use on SuperSpeed USB to overcome the performance boundaries of the Bulk Only Transfer (BOT) protocol. The new UASP driver will be used with Renesas Electronics' USB 3.0 xHCI (eXtensible Host Controller Interface) host controller, which entered the market as the world's first USB 3.0 host controller in June 2009. Having shipped over three million units of the host controller, as a dedicated promoter of USB 3.0 standard, Renesas Electronics is now targeting monthly production of two million units starting April 2010 and aims to continually contribute to advancement and standardization of USB.

Armed with a creative engineering department, Zotac is in the news for innovating a new graphics card PCB design every now and then. For NVIDIA's GeForce GTX 200 series alone, the firm developed several performance and value oriented PCB designs. It decided to up the ante with a new single-GPU PCB design that is compatible with all GTX 200 series GPUs from NVIDIA, and is out with a GeForce GTX 260-based model out for the Chinese market. The new PCB focuses on strong power circuitry that allow high stability for overclocking. The 12-layered PCB is jam-packed with high-grade power circuitry, which ensures the GeForce GTX 260 GPU runs at 800 MHz out of the box, with even more overclocking headroom to spare.

To begin with, the vGPU portion consists of a lavish 12-phase digital PWM circuit with Renesas LFPAK MOSFETs, BL high-capacity PWM chokes, and Panasonic SP-CAP, flatbed capacitors and a dedicated VRM controller. The vMem portion has a 3-phase power circuit that uses the same kinds of components as the vGPU, and has its own VRM controller. The PCB draws auxiliary power from PCI-E 8 + 6 pin connectors. It holds place for two more memory chips indicating that the same PCB could be used for a GeForce GTX 285 based SKU in the future. On the outputs front, a DVI-D, HDMI, and D-Sub make for the card's connectivity. The new Zotac GeForce GTX 260 model will be cooled by an Arctic Cooling Accelero Xtreme GTX cooler. It is made exclusive for the Chinese market, with a price of RMB 1399 (US $205). Technical data from its electical-testing can be viewed here.

NEC Electronics Corporation (NEC Electronics), Renesas Technology Corp. (Renesas), NEC Corporation (NEC), Hitachi, Ltd. (Hitachi), and Mitsubishi Electric Corporation (Mitsubishi Electric) today agreed to enter into negotiations to integrate business operations at NEC Electronics and Renesas.
NEC Electronics was established in 2002, separating from NEC, and Renesas was established in 2003, integrating semiconductor units at Hitachi and Mitsubishi Electric. Both as leading semiconductor companies, NEC Electronics and Renesas provide a wide variety of semiconductor solutions, primarily specializing in microcontroller units (MCUs). In light of fierce global competition in the semiconductor market, NEC Electronics and Renesas have agreed to explore the possibility of business integration in order to further strengthen their business foundations and technological assets while increasing corporate value through enhanced customer satisfaction. By integrating the world's two largest MCU suppliers, the new company will provide one of the most competitive MCU product lineups throughout the world.