NVIDIA CEO Jensen Huang will be leading the keynote address at the coveted 2025 International CES in Las Vegas, which opens on January 7. The keynote address is slated for January 6, 6:30 am PT. There is of course no word from NVIDIA on what to expect, but we have some fairly easy guesswork. NVIDIA's refresh of the GeForce RTX product stack is due, and the company is expected to either debut or expand its next-generation GeForce RTX 50-series "Blackwell" gaming GPU stack, bringing in generational improvements in performance and performance-per-Watt, besides new technology.

The company could also make more announcements related to its "Blackwell" AI GPU lineup, which is expected to ramp through 2025, succeeding the current "Hopper" H100 and H200 series. The company could also tease "Rubin," which it referenced recently at GTC in May, "Rubin" succeeds "Blackwell," and will debut as an AI GPU toward the end of 2025, with a 2026 ramp toward customers. It's unclear if NVIDIA will make gaming GPUs on "Rubin," since GeForce RTX generations tend to have a 2-year cadence, and there was no gaming GPU based on "Hopper."

NVIDIA barely started shipping its "Blackwell" line of AI GPUs, and its next-generation architecture is already on the horizon. Codenamed "Rubin," after Vera Rubin, the new architecture will power NVIDIA's future AI GPUs with generational jumps in performance, but more importantly, a design focus on lowering the power draw. This will become especially important as NVIDIA's current architectures already approach the kilowatt range, and cannot scale boundlessly. TF International Securities analyst, Mich-Chi Kuo says that NVIDIA's first AI GPU based on "Rubin," the R100 (not to be confused with an ATI GPU from many moons ago); is expected to enter mass-production in Q4-2025, which means it could be unveiled and demonstrated sooner than that; and select customers could have access to the silicon sooner, for evaluations.

The R100, according to Mich-Chi Kuo, is expected to leverage TSMC's 3 nm EUV FinFET process, specifically the TSMC-N3 node. In comparison, the new "Blackwell" B100 uses the TSMC-N4P. This will be a chiplet GPU, and use a 4x reticle design compared to Blackwell's 3.3x reticle design, and use TSMC's CoWoS-L packaging, just like the B100. The silicon is expected to be among the first users of HBM4 stacked memory, and feature 8 stacks of a yet unknown stack height. The Grace Ruben GR200 CPU+GPU combo could feature a refreshed "Grace" CPU built on the 3 nm node, likely an optical shrink meant to reduce power. A Q4-2025 mass-production roadmap target would mean that customers will start receiving the chips by early 2026.