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NVIDIA's Next-Gen "Rubin" AI GPU Development 6 Months Ahead of Schedule: Report

The "Rubin" architecture succeeds NVIDIA's current "Blackwell," which powers the company's AI GPUs, as well as the upcoming GeForce RTX 50-series gaming GPUs. NVIDIA will likely not build gaming GPUs with "Rubin," just like it didn't with "Hopper," and for the most part, "Volta." NVIDIA's AI GPU product roadmap put out at SC'24 puts "Blackwell" firmly in charge of the company's AI GPU product stack throughout 2025, with "Rubin" only succeeding it in the following year, for a two-year run in the market, being capped off with a "Rubin Ultra" larger GPU slated for 2027. A new report by United Daily News (UDN), a Taiwan-based publication, says that the development of "Rubin" is running 6 months ahead of schedule.

Being 6 months ahead of schedule doesn't necessarily mean that the product will launch sooner. It would give NVIDIA headroom to get "Rubin" better evaluated in the industry, and make last-minute changes to the product if needed; or even advance the launch if it wants to. The first AI GPU powered by "Rubin" will feature 8-high HBM4 memory stacks. The company will also introduce the "Vera" CPU, the long-awaited successor to "Grace." It will also introduce the X1600 InfiniBand/Ethernet network processor. According to the SC'24 roadmap by NVIDIA, these three would've seen a 2026 launch. Then in 2027, the company would follow up with an even larger AI GPU based on the same "Rubin" architecture, codenamed "Rubin Ultra." This features 12-high HBM4 stacks. NVIDIA's current GB200 "Blackwell" is a tile-based GPU, with two dies that have full cache-coherence. "Rubin" is rumored to feature four tiles.

NVIDIA's Jensen Huang to Lead CES 2025 Keynote

NVIDIA CEO Jensen Huang will be leading the keynote address at the coveted 2025 International CES in Las Vegas, which opens on January 7. The keynote address is slated for January 6, 6:30 am PT. There is of course no word from NVIDIA on what to expect, but we have some fairly easy guesswork. NVIDIA's refresh of the GeForce RTX product stack is due, and the company is expected to either debut or expand its next-generation GeForce RTX 50-series "Blackwell" gaming GPU stack, bringing in generational improvements in performance and performance-per-Watt, besides new technology.

The company could also make more announcements related to its "Blackwell" AI GPU lineup, which is expected to ramp through 2025, succeeding the current "Hopper" H100 and H200 series. The company could also tease "Rubin," which it referenced recently at GTC in May, "Rubin" succeeds "Blackwell," and will debut as an AI GPU toward the end of 2025, with a 2026 ramp toward customers. It's unclear if NVIDIA will make gaming GPUs on "Rubin," since GeForce RTX generations tend to have a 2-year cadence, and there was no gaming GPU based on "Hopper."

NVIDIA "Blackwell" Successor Codenamed "Rubin," Coming in Late-2025

NVIDIA barely started shipping its "Blackwell" line of AI GPUs, and its next-generation architecture is already on the horizon. Codenamed "Rubin," after Vera Rubin, the new architecture will power NVIDIA's future AI GPUs with generational jumps in performance, but more importantly, a design focus on lowering the power draw. This will become especially important as NVIDIA's current architectures already approach the kilowatt range, and cannot scale boundlessly. TF International Securities analyst, Mich-Chi Kuo says that NVIDIA's first AI GPU based on "Rubin," the R100 (not to be confused with an ATI GPU from many moons ago); is expected to enter mass-production in Q4-2025, which means it could be unveiled and demonstrated sooner than that; and select customers could have access to the silicon sooner, for evaluations.

The R100, according to Mich-Chi Kuo, is expected to leverage TSMC's 3 nm EUV FinFET process, specifically the TSMC-N3 node. In comparison, the new "Blackwell" B100 uses the TSMC-N4P. This will be a chiplet GPU, and use a 4x reticle design compared to Blackwell's 3.3x reticle design, and use TSMC's CoWoS-L packaging, just like the B100. The silicon is expected to be among the first users of HBM4 stacked memory, and feature 8 stacks of a yet unknown stack height. The Grace Ruben GR200 CPU+GPU combo could feature a refreshed "Grace" CPU built on the 3 nm node, likely an optical shrink meant to reduce power. A Q4-2025 mass-production roadmap target would mean that customers will start receiving the chips by early 2026.
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