The RACING B450GT3 motherboard is built for gamers that require high-performance on a micro-ATX form factor. Fitted with the B450 chipset that supports AMD's Ryzen 3000 Series processors. The RACING B450GT3 motherboard is packed with loads of functions and features that are found in most high-end gaming AM4 motherboards and is designed with BIOSTAR's signature premium black Racing themed PCB style.

The RACING B450GT3 supports 4-DIMM DDR4-1866/2133/2400/2666/2933/3200 (OC) with up to 64G maximum capacity, 1x USB 3.2 Gen2 Type-C port (10 Gb/s), 1x USB 3.2 Gen2 Type-A port (10 Gb/s), 1x M.2 (32 Gb/s) and 6x SATA3 connectors. Gamers will also appreciate the Hi-Fi 7.1ch HD Audio for truly immersive sound quality that is enabled with the Realtek ALC1150 7.1-Channel Audio, Dual BIOS for auto-recovery, and Iron Slot Protection for a much more stable and durable port composition.

An independent study conducted by the European Hardware Association (EHA) has revealed that AMD now ranks higher than Intel in the CPU space. While we have seen this as recently as last week, where we reported on top sellers across some Amazon webstores in Europe, with AMD scoring most of the top sellers in both Germany and the UK, this is the first time a comprehensive study has put some verifiable, science-generated numbers for us to see.

According to the EHA, 60% of the European PC enthusiasts (in a sample of 10,000 respondents) showed a strong sentiment towards AMD as their favored manufacturer of CPUs, and would choose any sort of system with an AMD CPU over an Intel one (including APU, AMD + Radeon graphics cards and AMD + NVIDIA graphics cards). This is a far cry from the same time around last year, where AMD only held 40% of a similar sample's preferred buying intention, and up from the 50% shown in the same study, carried out in 2H2019. The same survey also shows a slightly increased preference for AMD's graphics cards, with the 1H2019 showing 19% preference compared to 23% in this latest study.

We've known for some time that AMD's mainstream-segment B550 chipset wouldn't bring all the bangs and whistles of its bigger, enthusiast-class cousin X570. For one, it wouldn't make sense to increase development and implementation costs of both the chipset and motherboards built for mainstream enthusiasts by adding PCIe 4.0 support and the more stringent signaling and power requirements the new standard entails. As such, B550 reportedly cuts down fully on PCIe 4.0 support, as well as on the latest USB standards, to offer a product that's sufficiently rounded up on I/O while offering overclocking support for users that demand it.

Reportedly, AMD's B550 will only support up to 2x USB 3.2 Gen2 devices, 6x USB 2.0, 4 + 4 SATA3 connections, and the interlink between the chipset and the CPU occurs via a 4x PCIe 3.0 interface, which means there's less bandwidth for communication between the CPU and the chipset than on X570 - not that that was a real problem on AMD's previous-gen Ryzen products, though, so that's more of a technicality at this point. Ryzen 3000 CPUs still offer 4x PCIe 4.0 ports, though, so these could be used for speeding up a PCIe 4.0 NVMe SSD, for instance. The launch of B550-bound products is expected towards October.

After AMD's Ryzen 3rd generation launch many users have reported that they are not seeing the advertised boost clocks that AMD promises in their specifications. This has been an ongoing issue, with various tweaks tried, with limited success. This lead to serious allegations about "false advertising", and all AMD had to say up to this point was that these clocks are "up to".

AMD has now issued a statement regarding these lower than expected clock frequencies on Zen 2 processors, and it looks like there is indeed an underlying BIOS issue that's responsible. Let's hope that this new firmware gets released quickly and is able to restore faith in AMD's otherwise excellent track-record.

PC builder Falcon Northwest today announced their new mid-sized tower PC, the Talon 20th Anniversary Edition. The culmination of a 2-year in-house case design project, Talon takes aim at winning over the Mac-using creator crowd with top-end components, careful thermal management and high-end metal exterior. It's also targeted at Falcon's game-playing clientele with options for glass sides, custom paintwork, and embracing the gaming trend Falcon has mostly resisted: RGB LED lighting.

"It's amazing!" said Chris Roberts, CEO of Roberts Space Industries and the creative genius behind Star Citizen and the Wing Commander game series. Chris was the recipient of the very first 20th Anniversary Talon. "It's butter smooth and super quiet. I love the beautiful artwork and that I can easily open up the sides to see the immaculate components, cabling and lighting."

Today an article was posted on Intel's internal employee-only portal called "Circuit News". The post, titled "AMD competitive profile: Where we go toe-to-toe, why they are resurgent, which chips of ours beat theirs" goes into detail about the recent history of AMD and how the company achieved its tremendous growth in recent years. Further, Intel talks about where they see the biggest challenges with AMD's new products, and what the company's "secret sauce" is to fight against these improvements.The full article follows:

GIGABYTE today officially launched its latest addition to the Aorus series of motherboards, made for the new generation of Ryzen 3000 series processors. The "Master" as it is called, is an impressive feat of engineering designed to handle even the most power-hungry Ryzen CPUs like the 16 core Ryzen 9 AMD recently showcased.

For starters, the board is featuring twice the amount of copper wires usually needed to implement a PCIe connection, which means less information loss on PCB. It has a 14 direct phases of Infineon digital IR 3556 PowIRstage MOSFETs VRMs that are capable of delivering 50A each, which means that the VRM is capable of delivering up to 700A of current, providing additional headroom for CPU overclock. To handle the large amount of VRMs effectively, the board is equipped with beefy heatsinks and a heat pipe that has direct contact with VRMs. Sandwiches between the heatsink and the board is a new generation of thermal pads designed by LAIRD, with 1.5 mm thickness and 5 W/mK thermal conductivity.

If a recent MSRP price-list leak is anything to go by, motherboards based on the AMD X570 chipset will cost a pretty penny, beating even Intel's premium Z390 Express chipset on average motherboard pricing. Those looking for an affordable motherboard for the Ryzen 3000 series processors have the option of choosing existing AMD 400-series chipset based motherboards, and taking advantage of the USB BIOS Flashback feature that's almost universally available on the AMD platform. You lose out on PCI-Express gen 4.0 with the older platforms, which may not be a big compromise when it comes to graphics cards, but would limit your M.2 NVMe SSD performance upgrade path. One possible option would be to wait for affordable variants of AMD's 500-series chipsets, which are sourced from ASMedia.

According to DigiTimes, ASMedia will tape out its next-generation AMD-platform chipset silicon, and is on track to shipping its new chipsets to motherboard manufacturers by Q4-2019. This would pin availability of the first motherboards based on these chipsets to at least Q1 2020. These chipsets not only feature PCI-Express gen 4.0 downstream lanes, but also boards based on these will be built to AMD's PCB requirements for the new platform, enabling a PCI-Express 4.0 x16 slot for discrete graphics, and revised CPU VRM and memory wiring specifications that improve overclocking over the previous generation platform. For now there are two SKUs in the works, the B550, which succeeds the B450, and the A520, succeeding the A320.Image Credit: Hardware.info

This shouldn't really need to be spelled out, but AMD clarified that you can't have PCI-Express gen 4.0 running an upcoming Ryzen 3000 "Matisse" processor on older socket AM4 motherboards based on AMD 300-series and 400-series chipsets, and that the processor's PCIe root-complex will run at PCI-Express gen 3.0 speeds. AMD's official reason for this is that the older motherboards can't guarantee reliable signaling needed for PCI-Express gen 4.0 and hence the company decided to blanket-disable PCIe gen 4.0 for the older platforms. This statement was put out by Robert Hallock, senior technical marketing head for CPUs and APUs, on Reddit.

Unofficially, though, we believe there are technological barriers standing in the way of PCI-Express gen 4.0 on the older motherboards, the least of which are the lack of external PCIe gen 4.0-certified re-driver/equalizer components, and lane-switching on boards that split one x16 PEG link to two x8 links. There may be other less technical issues such as PCI-SIG certification for the older platforms. Intel faced a similar challenge with its 3rd generation Core "Ivy Bridge" processors, which introduced PCI-Express gen 3.0 to the mainstream desktop platform, and were backwards-compatible with Intel 6-series chipset (eg: Z68 Express). The older 6-series motherboards could only put out PCIe gen 2.0 with the newer processors.

Motherboard vendors are betting big on the success of AMD's "Valhalla" desktop platform that combines a Ryzen 3000-series Zen 2 processor with an AMD X570 chipset motherboard, and have responded with some mighty premium board designs. GIGABYTE deployed its full spectrum of Aorus branding, including Ultra, Elite, ITX Pro, Master, and Xtreme. The X570 I Aorus Pro WiFi mini-ITX motherboard is an impressive feat of engineering despite its designers having to wrestle with the feisty new PCIe gen 4 chipset. It draws power from a combination of 24-pin and 8-pin connectors, and conditions power for the SoC with an impressive 8-phase VRM that uses high-grade PowIRstage components. A rather tall fan-heatsink cools the X570 chipset, with a 30 mm fan.

Connectivity options on the X570 I Aorus Pro WiFi are surprisingly aplenty. The sole expansion slot is a PCI-Express 4.0 x16, but the storage connectivity includes not one, but two M.2-2280 slots (reverse side of the PCB), each with PCI-Express 4.0 x4 and SATA 6 Gbps wiring. Four SATA 6 Gbps ports make for the rest of the storage connectivity. Networking options include 2.4 Gbps 802.11ax WLAN, Bluetooth 5.0 (Intel , and 1 GbE, all pulled by Intel-made controllers. USB connectivity includes six 5 Gbps USB 3.2 gen 1, and two 10 Gbps USB 3.2 gen 2 ports (of which one is type-C), and two 5 Gbps ports by headers. The onboard audio solution has 6-channel analog output, but is backed by a premium Realtek ALC1220VB Enhance CODEC (114 dBA SNR).

ECS has introduced a new model into their Liva series of Mini PCs - this time, powered by AMD Ryzen APUs. The ECS LIVA A320 is a 1-liter Mini Pc (book-sized, according to the company, but I guess that depends on the books you prefer to read), and makes use of either an AMD Ryzen 3 or Ryzen 5 APU with up to 35 W TDP.

There's a lot to like about this little Mini PC that could, which ECS is marketing at light gaming workloads and all other content consumption and office-related shenanigans. There is a tooless design for easy upgradeability, 2x DDR4 support in the SO-DIMM form factor, internal support for an M.2 drive (which helps save space in such a small enclosure, even though a 2.5" HDD or SSD is still supported). A VESA mount means this can be installed in the back of a monitor or television for your content consumption needs.

AMD X570 is the company's first in-house design socket AM4 motherboard chipset, with the X370 and X470 chipsets being originally designed by ASMedia. With the X570, AMD hopes to leverage new PCI-Express gen 4.0 connectivity of its Ryzen 3000 Zen2 "Matisse" processors. The desktop platform that combines a Ryzen 3000 series processor with X570 chipset is codenamed "Valhalla." A rough platform diagram like what you'd find in motherboard manuals surfaced on ChipHell, confirming several features. To maintain pin-compatibility with older generations of Ryzen processors, Ryzen 3000 has the same exact connectivity from the SoC except two key differences.

On the AM4 "Valhalla" platform, the SoC puts out a total of 28 PCI-Express gen 4.0 lanes. 16 of these are allocated to PEG (PCI-Express graphics), configurable through external switches and redrivers either as single x16, or two x8 slots. Besides 16 PEG lanes, 4 lanes are allocated to one M.2 NVMe slot. The remaining 4 lanes serve as the chipset bus. With X570 being rumored to support gen 4.0 at least upstream, the chipset bus bandwidth is expected to double to 64 Gbps. Since it's an SoC, the socket is also wired to LPCIO (SuperIO controller). The processor's integrated southbridge puts out two SATA 6 Gbps ports, one of which is switchable to the first M.2 slot; and four 5 Gbps USB 3.x ports. It also has an "Azalia" HD audio bus, so the motherboard's audio solution is directly wired to the SoC. Things get very interesting with the connectivity put out by the X570 chipset.Update May 21st: There is also information on the X570 chipset's TDP.
Update May 23rd: HKEPC posted what looks like an official AMD slide with a nicer-looking platform map. It confirms that AMD is going full-tilt with PCIe gen 4, both as chipset bus, and as downstream PCIe connectivity.

AMD is giving finishing touches to its Ryzen 3000 "Picasso" family of APUs, and Thai PC enthusiast TUM_APISAK has details on their CPU clock speeds. The Ryzen 3 3200G comes with 3.60 GHz nominal clock-speed and 4.00 GHz maximum Precision Boost frequency; while the Ryzen 5(?) 3400G ships with 3.70 GHz clock speeds along with 4.20 GHz max Precision Boost. The "Picasso" silicon is an optical shrink of the 14 nm "Raven Ridge" silicon to the 12 nm FinFET process at GlobalFoundries, the same one on which AMD builds "Pinnacle Ridge" and "Polaris 30."

Besides the shrink to 12 nm, "Picasso" features upgraded "Zen+" CPU cores that have improved Precision Boost algorithm and faster on-die caches, which contribute to a roughly 3% increase in IPC on "Pinnacle Ridge," but significantly improved multi-threaded performance compared to 1st generation Ryzen. Clock speeds of both the CPU cores and the integrated "Vega" iGPU are expected to increase. Both the 3200G and 3400G see a 100 MHz increase in nominal clock-speed, and 300 MHz increase in boost clocks, over the chips they succeed, the 2200G and 2400G, respectively. The iGPU is rumored to receive a similar 100-200 MHz increase in engine clock.

During AMD's annual shareholder meeting today, AMD president and CEO Dr. Lisa Su confirmed the launch of next-generation AMD Ryzen, EPYC CPUs and Navi GPUs for the third quarter of this year. The expected products are going to be manufactured on TSMC's 7 nm process and will be using new and improved architectures.

Ryzen 3000 series CPUs are rumored to have up to as much as 16 cores in Ryzen 9 SKUs, 12 cores in Ryzen 7 SKUs and 8 cores in Ryzen 5 SKUs. EPYC server CPUs will be available in models up to 64 cores. All of the new CPUs will be using AMD "Zen 2" architecture that will offer better IPC performance and, as rumors suggest for consumer models, are OC beasts. Navi GPUs are the new 7 nm GPUs that are expected to be very competitive both price and performance wise to NVIDIA's Turing series, hopefully integrating new technologies such as dedicated Ray Tracing cores for higher frame rates in Ray Tracing enabled games. No next generation ThreadRipper launch date was mentioned, so we don't yet know when and if that will that land.

AMD's 3rd generation Ryzen (3000-series) processors will overcome a vast number of memory limitations faced by older Ryzen chips. With Zen 2, the company decided to separate the memory controller from the CPU cores into a separate chip, called "IO die". Our resident Ryzen memory guru Yuri "1usmus" Bubliy, author of DRAM Calculator for Ryzen, found technical info that confirms just how much progress AMD has been making.

The third generation Ryzen processors will be able to match their Intel counterparts when it comes to memory overclocking. In the Zen 2 BIOS, the memory frequency options go all the way up to "DDR4-5000", which is a huge increase over the first Ryzens. The DRAM clock is still linked to the Infinity Fabric (IF) clock domain, which means at DDR4-5000, Infinity Fabric would tick at 5000 MHz DDR, too. Since that rate is out of reach for IF, AMD has decided to add a new 1/2 divider mode for their on-chip bus. When enabled, it will run Infinity Fabric at half the DRAM actual clock (eg: 1250 MHz for DDR4-5000).

We've all taken a look at AMD's March 2019 product roadmap, which showed us the upcoming 2019 tech the company would be bringing to the table in its "non-stop product momentum". However, it seems that this non-stop product momentum might be coming to an unexpected twist of fate that might delay it from entering the last station - the Zen 2-based Threadripper. In the company's latest May earnings call roadmap, the company silently removed the Zen 2 Threadripper from its product roadmap - where it used to sit right after the launch of Zen 2-based Ryzen products for consumers, is now just a big crop of the space it occupied.

This might mean many things, and a mistake on someone's part while cropping the PowerPoint slide could be the only thing going on here. However, the best and most plausible speculation that can be entertained when one considers this is simple - a supply problem. With the 7 nm node being the newest, most dense fabrication process possible, and with AMD having to share TSMC's 7 nm wafer production with a number of high profile companies - such as Qualcomm, for instance - may mean that supply is simply too tight to support Zen 2-based products across so many product stacks - Ryzen and Epyc - at the same time.

As we draw closer to the release of Rage 2, publisher Bethesda has released the official PC system requirements for the game. The original Rage pushed the boundaries of rendering technology with its Mega Texture technology (which featured some slight streaming issues as available textures were rendered visible according to the scene).

The least of the requirements are set at an Intel Core i5-3570 or an AMD Ryzen 3 1300X CPU, paired with 8 GB of RAM and the long-in-the-tooth GTX 780 3 GB or R9 280 3GB. Recommended configurations will have to pack, at least, an Intel Core i7-4770 or AMD Ryzen 5 1600X CPU with 8 GB of RAM and an Nvidia GTX 1070 8GB or AMD Vega 56 8GB graphics card. The 8 GB of RAM in the recommended settings is a welcome surprise, in that most games have now been requiring 16 GB of system RAM. Unfortunately, Bethesda didn't mention what gameplay experience can be expected from the recommended system configuration. RAGE 2 releases on May 14th.

ASUS today has posted a full listing of the motherboards that are receiving BIOS updates to allow for full compatibility with AMD's upcoming Ryzen 3000 series CPUs. These range across the B350, X370, B450, and X470 chipsets, with everything from ROG to TUF to Prime-branded motherboards receiving the support update. Conspicuously absent, though, are ASUS' A-series motherboards, based on the A320 chipset - despite it supporting the same electrical load as its B350 counterpart.

An ASUS remark claiming that "new models to be listed" gives some hope, but there have been unofficial rumors of A-series-based motherboards not supporting AMD's latest CPUs - and that ASUS claim could well be directed to some unlisted motherboards between the already mentioned chipsets.

TechPowerUp today released the latest version of GPU-Z, the definitive graphics subsystem information and diagnostic utility. Version 2.19.0 adds support for several new GPUs, improves user experience, and fixes bugs. To begin with, support is added for AMD Ryzen 3000-series "Picasso" iGPUs, besides NVIDIA GeForce GTX 1650, GTX 1650 Mobile, GTX 1660 Mobile, GTX 1660 Ti Mobile, GeForce MX250, and the TU117-B revision. Transistor counts were added for GeForce MX230 and GP108 chips. AMD Radeon Pro series graphics cards get a proper logo display.

TechPowerUp GPU-Z 2.19.0 also improves support for EVGA iCX technology with better detection of support, and improved accuracy. We've added the ability to detect support for DirectX Raytracing (DXR), Variable-rate shading, WDDM 2.6 (requires Windows 10 1903), and Shader Model 6.5, and Tiled Resources Tier 4 in the Advanced panel. The tab now also lists out new DirectX 12 capabilities incrementally rolled out through Windows 10 1803 and 1809. The ASIC Quality readout will now only display on GPUs that support the read-out. Among the fixes include faster startup on devices with AMD PowerXpress, a crash when no known cards are detected and driver info is sought by a mouse-hover, a startup crash on Windows XP machines, and the correct silicon display of GK210 for Tesla K80.DOWNLOAD: TechPowerUp GPU-Z 2.19.0

The change-log follows.

AMD Ryzen 3 3200G is an upcoming processor featuring integrated graphics, forming the tail-end of the company's 3rd generation Ryzen desktop processor family. A Chinese PC enthusiast with access to an early sample pictured and de-lidded the processor. We know from older posts that while the "Matisse" MCM will form the bulk of AMD's 3rd gen Ryzen lineup, with core counts ranging all the way from 6 to 12, and possibly 16 later, the APU lineup is rumored to be based on older "Zen+" architecture.

The Ryzen 3 3200G and possibly the Ryzen 5 3400G, will be based on a derivative of the "Raven Ridge" silicon built on the 12 nm process at GlobalFoundries, and comes with a handful innovations AMD introduced with "Pinnacle Ridge," such as an improved Precision Boost algorithm and faster on-die caches. The 12 nm shrink also allows AMD to dial up CPU and iGPU engine clock speeds, and improve DDR4 memory support to work with higher DRAM clock speeds. AMD has used thermal paste as the sub-IHS interface material instead of solder for its "Raven Ridge" chips, and the story repeats with the 3200G.

AMD will launch its 3rd generation Ryzen 3000 Socket AM4 desktop processors in 2019, with a product unveiling expected mid-year, likely on the sidelines of Computex 2019. AMD is keeping its promise of making these chips backwards compatible with existing Socket AM4 motherboards. To that effect, motherboard vendors such as ASUS and MSI began rolling out BIOS updates with AGESA-Combo 0.0.7.x microcode, which adds initial support for the platform to run and validate engineering samples of the upcoming "Zen 2" chips.

At CES 2019, AMD unveiled more technical details and a prototype of a 3rd generation Ryzen socket AM4 processor. The company confirmed that it will implement a multi-chip module (MCM) design even for their mainstream-desktop processor, in which it will use one or two 7 nm "Zen 2" CPU core chiplets, which talk to a 14 nm I/O controller die over Infinity Fabric. The two biggest components of the IO die are the PCI-Express root complex, and the all-important dual-channel DDR4 memory controller. We bring you never before reported details of this memory controller.

While AMD has enjoyed tremendous success in regards to their Ryzen, Threadripper, and EPYC processors penetration into the mobile market has been a bit slow. However, judging by the number of systems on display at CES 2019 that is about to change. Models from Honor, Acer, Samsung, Lenovo, Dell, ASUS, and HP. The one that immediately caught our eye was the Acer Nitro 5 which packs an AMD Ryzen 5 2500U CPU and an AMD Radeon RX 560X GPU. It also comes configured with 8 GB of memory, 256 GB SSD, IPS display and a backlit keyboard. Overall it looks to be a reliable entry level gaming system.

Next up was Dell's two offerings which were the Inspiron 5000 15 and 5000 14 2-in-1. The Inspiron 5000 15 was equipped with a 4c/8t Ryzen 5 3500U with Radeon Vega 8 graphics (512 shaders). It was also fully kitted out with 32 GB of DDR4 memory, 512 GB SSD, and a 1TB HDD making it an excellent option for productivity and heavy multitasking. Meanwhile, the 2-in-1 was equipped with a Ryzen 7 3700U which is a 4c/8t processor with Vega 10 graphics (640 shaders). It also came loaded with 16 GB of DDR4, 2 TB HDD and a 256 GB SSD giving it plenty of memory and storage space considering its more compact size.

QNAP Systems, Inc. today launched the TS-977XU AMD Ryzen NAS series, QNAP's first 1U hybrid-structure NAS. The series provides four 3.5-inch SATA drive bays for hard drives and five 2.5-inch SATA drive bays for SSDs, allowing users to enable caching and Qtier auto-tiering storage and to benefit from QNAP's revolutionary software-defined SSD extra over-provisioning technology. The TS-977XU also provides well-rounded virtualization applications, providing businesses and organizations with a highly-efficient and cost-effective storage solution.

"By combining AMD Ryzen processors with an advanced hybrid storage structure and 10GbE SFP+ connectivity, the TS-977XU packs tremendous performance into a compact 1U frame. The TS-977XU is further enhanced by PCIe expandability, allowing users to expand core NAS functionality as needed to accommodate changing requirements and business growth," said David Tsao, product manager of QNAP.

One of our readers tipped us off with a very plausible looking image that drops a motherlode of information about what AMD's 2nd generation Ryzen (aka Ryzen 3000 series) processor lineup could look like. This includes a vast selection of SKUs, their CPU and iGPU core configurations, clock-speeds, and OEM channel pricing. The list speaks of a reentry for 7th generation A-series "Excavator" as Duron X4 series, followed by Duron 300GE-series based on a highly cut down "Raven Ridge," Athlon 300GE 2-core/4-thread based on an implausible "Zen+ 12 nm" APU die, followed by quad-core Ryzen 3 3000 series processors with and without iGPUs, making up the company's entry-level product lineup.

The core counts seem to jump from 4-core straight to 8-core, with no 6-core in between, for the Ryzen 5 series. This is also where AMD's new IP, the 7 nm "Zen 2" architecture, begins. There appears to be a large APU die (or a 3-chip MCM) with an 8-core CPU and 20-CU iGPU, which makes up certain Ryzen 5 SKUs. These chips are either 8-core/8-thread or 8-core/16-thread. The Ryzen 7 series is made up of 12-core/24-thread processors that are devoid of iGPU. The new Ryzen 9 series extension caps off the lineup with 16-core/32-thread SKUs. And these are just socket AM4.

Bethesda has revealed the official minimum and recommended specs for gamers looking to dive once again into a post-apocalyptic game setting with Fallout 76. Interestingly, the system requirements call for at least an Intel Core i5-6600K or an AMD Ryzen 3 1300X CPU, both of which are four-core, four-thread processors from yesteryear, paired with 8 GB of system RAM. On the graphics side of the equation, an NVIDIA GTX 780 3GB or an AMD Radeon R9 285 2GB are enough. Storage space continues to be hefty as with most games coming out recently, with this asking for 60 GB on your PC.

The recommended specs are more in-line with what one would expect, even though this game certainly won't be a resource hog by any definition: the 8 GB of of system RAM remain in the recommended specs, but both listed CPUs see an upgrade to an 8-thread part in the form of the Intel Core i7-4790 and the AMD Ryzen 5 1500X. Graphics cards for the recommended experience are being defined as either an Nvidia GTX 970 4GB or an AMD R9 290X 4 GB. It seems the 8 GB system RAM has come here to stay in AAA gaming, folks, and number of required CPU threads has been steadily increasing. Now if only there aren't as many game-breaking bugs as is traditional in a Bethesda game... Especially not cazadors.