Tuesday, June 25th 2019
GIGABYTE Launches X570 Aorus Master Motherboard
GIGABYTE today officially launched its latest addition to the Aorus series of motherboards, made for the new generation of Ryzen 3000 series processors. The "Master" as it is called, is an impressive feat of engineering designed to handle even the most power-hungry Ryzen CPUs like the 16 core Ryzen 9 AMD recently showcased.
For starters, the board is featuring twice the amount of copper wires usually needed to implement a PCIe connection, which means less information loss on PCB. It has a 14 direct phases of Infineon digital IR 3556 PowIRstage MOSFETs VRMs that are capable of delivering 50A each, which means that the VRM is capable of delivering up to 700A of current, providing additional headroom for CPU overclock. To handle the large amount of VRMs effectively, the board is equipped with beefy heatsinks and a heat pipe that has direct contact with VRMs. Sandwiches between the heatsink and the board is a new generation of thermal pads designed by LAIRD, with 1.5 mm thickness and 5 W/mK thermal conductivity.
Here are the specifications of X570 Master board:
For starters, the board is featuring twice the amount of copper wires usually needed to implement a PCIe connection, which means less information loss on PCB. It has a 14 direct phases of Infineon digital IR 3556 PowIRstage MOSFETs VRMs that are capable of delivering 50A each, which means that the VRM is capable of delivering up to 700A of current, providing additional headroom for CPU overclock. To handle the large amount of VRMs effectively, the board is equipped with beefy heatsinks and a heat pipe that has direct contact with VRMs. Sandwiches between the heatsink and the board is a new generation of thermal pads designed by LAIRD, with 1.5 mm thickness and 5 W/mK thermal conductivity.
- Supports AMD 3rd Gen Ryzen / 2nd Gen Ryzen / 2nd Gen Ryzen with Radeon Vega Graphics/ Ryzen with Radeon Vega Graphics Processors
- Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
- Direct 14 Phases Infineon Digital VRM Solution with PowIRstage
- Advanced Thermal Design with Fins-Array Heatsink and Direct Touch Heatpipe
- Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Triple Thermal Guards
- Intel WiFi 6 802.11ax 2T2R & BT 5
- Rear 125dB SNR AMP-UP Audio with ALC1220-VB & ESS SABRE 9118 DAC with WIMA Audio Capacitors
- Realtek 2.5 GbE + Intel Gigabit LAN with cFosSpeed
- USB TurboCharger for Mobile Device Fast Charge Support
- RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Supports Addressable LED & RGB LED Strips
- Smart Fan 5 Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP and Noise Detection
- Front & Rear USB 3.2 Gen2 Type-C Headers
- Integrated Base Plate & I/O Shield Armor
- Q-Flash Plus Update BIOS Without Installing CPU, Memory and Graphics Card
29 Comments on GIGABYTE Launches X570 Aorus Master Motherboard
That said, like @Zareek noted, it comes with Realtek LAN and I can spot some non-solid caps in one corner (probably for sound and other crap like that).
It will all come down to price, of course.
If you're using copper, you shouldn't be using onboard anyway. It's an invitation to buy a new motherboard if you ever get hit by a significant electrical storm. Add-in cards tend to take the hit and save the system unless it's a really-hard hit.
But I agree. On a mATX/ATX or larger board, just get an add-in card. If it was mITX (or even some mATX), I could see the point w.r.t. onboard Ethernet (for a high end mITX board, I would absolutely demand it - TB3's P2P network mode has really opened my eyes to the benefits of a fast network connection).
I feel we are long past the point where 2.5G should be a baseline, and 1Gbe should be in the history books or cheap junk.
As for the electrical isolation, the design basis for the transformers was to allow Ethernet to work between devices with ground offsets. The obvious use case where that has a potential is when runs go between buildings with different grounding points. If I recall correctly, it's only designed to deal with something like a 50 volt offset between endpoints though. It does help, but it's not bulletproof.
It seems to me that there is only the extreme that doesn't have one.
cdn.tomshardware.fr/content/uploads/sites/3/2019/05/gigabyteaorus.png
Is it just my imagination, or are we FINALLY getting mobo's without those draconian, should-have-been-eliminated-10 yrs-ago PS/2 ports...nah, say it aint so, hehehehe :roll:
Oh, and I REALLY like that marketing-hype BS description on the m.2 slots:
- Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Triple Thermal Guards
As if we don't already know that pcie 4 doubles the bandwidth of pcie 3............- I like Gigabyte as a brand; AM3 790FX and AM3+ 990FX motherboards still going strong.
- I'll never buy a motherboard with WIFI on it.
- I'll never buy an AMD motherboard with Intel-anything on it.
- While all bronze colored audio IO ports look nice I do prefer at least some small tint of color; yes there are label.
- Built-in rear-IO panel is cool.
- Only one USB 3.1 type C port?
- Dual-LAN for the win! Granted LAN parties aren't as common any more though bridging dual-LAN ports was always a fun way when you ran out of switch ports.
- Three M.2 ports is good. My next build will have a solo C:\ and RAID 1 D:\.
- I'm looking for at least eight SATA ports on my AM4 build so I'll look at higher end boards.
- Front USB 3.2 Type-C connectors for the win!
I'm looking forward to motherboard stability with RAM and faster supported RAM speeds. The upside of getting onboard a new socket the first day is the upgradeability (if you didn't cheap out on the motherboard) while the downside is the less than stable environment. July 7th can't come fast enough!